MIC4680
Micrel
Thermal Considerations
Minimum Copper/Maximum Current Method
The MIC4680 SuperSwitcher features the power-SOP-8.
This package has a standard 8-lead small-outline package
profile but with much higher power dissipation than a stan-
dardSOP-8.TheMIC4680SuperSwitcheristhefirstdc-to-dc
converter to take full advantage of this package.
UsingFigure3, foragiveninputvoltagerange, determinethe
minimum ground-plane heat-sink area required for the
application’s maximum output current. Figure 3 assumes a
constant die temperature of 75°C above ambient.
1.5
12V
8V
The reason that the power SOP-8 has higher power dissipa-
tion (lower thermal resistance) is that pins 5 though 8 and the
die-attach paddle are a single piece of metal. The die is
attached to the paddle with thermally conductive adhesive.
This provides a low thermal resistance path from the junction
of the die to the ground pins. This design significantly im-
proves package power dissipation by allowing excellent heat
transfer through the ground leads to the printed circuit board.
1.0
0.5
0
24V
34V
TA = 50°C
Minimum Current Limit = 1.3A
0
5
10
15
20
25
2
One of the limitation of the maximum output current on any
MIC4680 design is the junction-to-ambient thermal resis-
AREA (cm )
Figure 3. Output Current vs. Ground Plane Area
tance (θ ) of the design (package and ground plane).
JA
When designing with the MIC4680, it is a good practice to
connect pins 5 through 8 to the largest ground plane that is
practical for the specific design.
Examining θ in more detail:
JA
θ
= (θ + θ
)
CA
JA
JC
where:
Checking the Maximum Junction Temperature:
θ
θ
= junction-to-case thermal resistance
= case-to-ambient thermal resistance
JC
For this example, with an output power (P
) of 5W, (5V
OUT
output at 1A maximum with V = 12V) and 65°C maximum
CA
IN
ambient temperature, what is the maximum junction tem-
perature?
θ
θ
is a relatively constant 20°C/W for a power SOP-8.
JC
is dependent on layout and is primarily governed by the
CA
Referring to the “Typical Characteristics: 5V Output Effi-
ciency” graph, read the efficiency (η) for 1A output current at
connection of pins 5 though 8 to the ground plane. The
purpose of the ground plane is to function as a heat sink.
V
= 12V or perform you own measurement.
IN
θ
isideally63°C/Wbutwillvarydependingonthesizeofthe
JA
η = 79%
ground plane to which the power SOP-8 is attached.
The efficiency is used to determine how much of the output
Determining Ground-Plane Heat-Sink Area
power (P
) is dissipated in the regulator circuit (P ).
OUT
D
There are two methods of determining the minimum ground
plane area required by the MIC4680.
P
OUT
P =
−P
OUT
D
Quick Method
η
Make sure that MIC4680 pins 5 though 8 are connected to a
ground plane with a minimum area of 6cm . This ground
5W
2
PD =
− 5W
0.79
plane should be as close to the MIC4680 as possible. The
area maybe disributed in any shape around the package or
on any pcb layer as long as there is good thermal contact to
pins 5 though 8. This ground plane area is more than
sufficient for most designs.
P = 1.33W
D
A worst-case rule of thumb is to assume that 80% of the total
output power dissipation is in the MIC4680 (P
is in the diode-inductor-capacitor circuit.
) and 20%
D(IC)
P
P
P
= 0.8 P
D
D(IC)
D(IC)
D(IC)
= 0.8 × 1.33W
= 1.064W
SOP-8
Calculate the worst-case junction temperature:
T = P + (T – T ) + T
θ
J
D(IC) JC
C
A
A(max)
where:
T = MIC4680 junction temperature
J
P
= MIC4680 power dissipation
D(IC)
θJA
θ
= junction-to-case thermal resistance.
ground plane
heat sink area
JC
θJC
θCA
AM
BIENT
The θ for the MIC4680’s power-SOP-8 is
JC
approximately 20°C/W. (Also see Figure 1.)
T = “pin” temperature measurement taken at the
C
entry point of pins 6 or 7 into the plastic package
MIC4680
printed circuit board
Figure 2. Power SOP-8 Cross Section
June 2000
11