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  • MXR9150MZ图
  • 深科创(香港)科技有限公司

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  • MXR9150MZ
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产品型号MXR9150MZ的Datasheet PDF文件预览

Low Cost  
±5 g Tri Axis Accelerometer with  
Ratiometric Outputs  
MXR9150G/M  
FEATURES  
Low cost  
RoHS compliant  
Xout  
Gain Adjust  
Gain Adjust  
Gain Adjust  
Temp  
Comp  
A/D  
A/D  
A/D  
D/A  
D/A  
D/A  
X
Sensor  
LPF  
LPF  
LPF  
Resolution better than 1 mg  
Tri-axis accelerometer in a single package.  
On chip mixed signal processing  
No moving parts  
Temp  
Comp  
Y
Sensor  
Yout  
Zout  
No loose particle issues  
Temp  
Comp  
Z
>50,000 g shock survival rating  
SMT package: 7mm X 7mm X 1.8mm  
2.7V to 3.6V single supply continuous operation  
No adjusting external components needed  
Sensor  
VSA1  
VSA2  
Reference  
Digital Interface  
Clock  
APPLICATIONS  
GPS Electronic Compass Tilt Correction/Navigation  
Consumer – LCD projectors, pedometers, blood pressure  
monitor, digital cameras/MP3 players  
VDD2  
VDD1  
VDD3  
DI1  
SCK1  
DI2  
SCK2  
FUNCTIONAL BLOCK DIAGRAM  
Information Appliances – Computer  
Peripherals/PDA’s/Mouse Smart Pens/Cell Phones  
Gaming – Joystick/RF Interface/Menu Selection/Tilt  
Sensing  
The MXR9150G/M provides three ratiometric analog  
outputs that are set to 50% of the power supply voltage at  
zero g.  
Security – Gas Line/Elevator/Fatigue Sensing  
GENERAL DESCRIPTION  
The MXR9150G/M is a low cost, tri axis accelerometer  
fabricated on a standard, submicron CMOS process. It is a  
complete sensing system with on-chip mixed signal  
processing. The MXR9150G/M measures acceleration with  
a full-scale range of ±5.0 g and a sensitivity of 150mV/g  
@3.0V at 25°C. It can measure both dynamic acceleration  
(e.g. vibration) and static acceleration (e.g. gravity). The  
MXR9150G/M design is based on heat convection and  
requires no solid proof mass. This eliminates stiction and  
particle problems associated with competitive devices and  
provides shock survival greater than 50,000 g, leading to  
significantly lower failure rate and lower loss due to  
handling during PCB assembly and at customer field  
application.  
The Max. noise floor is 1 mg/ Hz allowing signals below  
1mg to be resolved at 1 Hz bandwidth. The MXR9150G/M  
is packaged in a hermetically sealed, surface mount LCC  
16pins package (7 mm x 7 mm x 1.8 mm height) and is  
operational over a -40°C to +85°C (M) and 0°C to +70°C (G)  
temperature range.  
I2C fast mode interface is soon available in the next generation  
chip.  
Information furnished by MEMSIC is believed to be accurate and reliable. However,  
no responsibility is assumed by MEMSIC for its use, nor for any infringements of  
patents or other rights of third parties which may result from its use. No license is  
granted by implication or otherwise under any patent or patent rights of MEMSIC.  
©MEMSIC, Inc.  
One Technology Drive Suite 325,Andover MA01810,USA  
Tel: +1 978 738 0900  
www.memsic.com  
Fax: +1 978 738 0196  
MEMSIC MXR9150G/M Rev.D  
Page 1 of 8  
2/27/2007  
MXR9150G/M SPECIFICATIONS (Measurements @ 25°C, Acceleration = 0 g unless otherwise noted; VDD1, VDD3 = 3.0V unless  
otherwise specified)  
Parameter  
Measurement Range1  
Conditions  
Min  
Typ  
Max  
Units  
Each Axis  
g
±5.0  
Nonlinearity  
Best fit straight line  
X, Y-axis  
0.5  
± 1.0  
± 3.0  
± 2.0  
150  
15  
1.50  
0.0  
1.0  
% of FS  
degrees  
degrees  
%
mV/g  
%
Alignment Error2  
Z-axis  
Transverse Sensitivity3  
Sensitivity  
Sensitivity Change Over Temperature  
Zero g Offset Bias Level  
140  
160  
Δ from 25°C  
1.48  
-0.14  
1.52  
+0.14  
V
g
Zero g Offset TC  
Δ from 25°C, based on  
150mV/g  
1.0  
1.5  
X,Y-axis  
Z-axis  
Output High  
Output Low  
X,Y-axis  
mg/°C  
mg/°C  
V
Normal Output Range  
Noise Density, RMS  
2.8  
0.2  
1
V
0.6  
0.9  
mg/ Hz  
Z-axis  
mg/ Hz  
Resolution  
@1Hz BW  
0.5  
17  
mg  
Frequency Response  
Output Drive Capability  
Turn-On Time4  
Operating Voltage Range  
Supply Current  
@-3dB  
@2.7V-3.6V  
Hz  
μA  
mS  
V
100  
3.6  
75  
3.0  
3.5  
2.7  
mA  
Power Down Current  
Operating Temperature Range  
0.1  
+70  
+85  
uA  
°C  
°C  
MXR9150G  
MXR9150M  
0
-40  
NOTES  
1
Guaranteed by measurement of initial offset and sensitivity.  
2
Alignment error is specified as the angle between the true and indicated axis of  
sensitivity.  
3
Cross axis sensitivity is the algebraic sum of the alignment and the inherent  
sensitivity errors.  
4Output settled to within ±17mg.  
MEMSIC MXR9150G/M Rev.D  
Page 2 of 8  
2/27/2007  
ABSOLUTE MAXIMUM RATINGS*  
Supply Voltage (VDD ………………...-0.5 to +7.0V  
Storage Temperature ……….…………-65°C to +150°C  
Acceleration ……………………………………..50,000 g  
)
6
5
4
3
2
1
7
*Stresses above those listed under Absolute Maximum Ratings may cause permanent  
damage to the device. This is a stress rating only; the functional operation of the  
device at these or any other conditions above those indicated in the operational  
sections of this specification is not implied. Exposure to absolute maximum rating  
conditions for extended periods may affect device reliability.  
8
+X  
9
+Y  
16  
15  
Pin Description: LCC-16 Package  
+Z  
10  
Pin  
1
2
3
4
5
6
7
8
Name  
NC  
Zout  
VSA2  
VDD1  
DI1  
SCK1  
NC  
VSA1  
NC  
Description  
I/O  
NC  
O
I
I
I
Do Not Connect  
Z Channel Output  
Connect to Ground  
2.7V to 3.6V  
Power Down Pin  
Connect to Ground  
Do Not Connect  
Connect to Ground  
Do Not Connect  
Do Not Connect  
2.7V to 3.6V  
Y Channel Output  
X Channel Output  
2.7V to 3.6V  
Connect to Ground  
Power Down Pin  
14  
11  
12  
13  
(Top View)  
I
+X  
+Z  
NC  
I
NC  
NC  
I
O
O
I
9
(Side View)  
10  
11  
12  
13  
14  
15  
16  
NC  
Note: Small circle indicates pin one (1).  
VDD2  
Yout  
Xout  
VDD3  
SCK2  
DI2  
THEORY OF OPERATION  
The MEMSIC device is a complete tri-axis acceleration  
measurement system in a single package fabricated on  
CMOS IC process. The device operation is based on heat  
transfer by natural convection and operates like other  
accelerometers having a proof mass except it is a gas in  
MEMSIC sensor.  
I
I
Ordering Guide  
Model  
Temperature  
Range  
Package  
Heat source, centered in the silicon chip is suspended  
across a cavity. Equally spaced aluminum/polysilicon  
thermopiles (groups of thermocouples) are located  
equidistantly on all four sides of the heat source. Under  
zero acceleration, a temperature gradient is symmetrical  
about the heat source, so that the temperature is the same at  
all four thermopiles, causing them to output the same  
voltage.  
MXR9150GZ  
LCC16,  
RoHS compliant  
LCC16,  
0 to 70°C  
MXR9150MZ  
-40 to 85°C  
RoHS compliant  
All parts are shipped in tape and reel packaging.  
Caution: ESD (electrostatic discharge) sensitive device.  
Acceleration in any direction will disturb the temperature  
profile, due to free convection heat transfer, causing it to be  
asymmetrical. The temperature, and hence voltage output  
of the four thermopiles will then be different. The  
differential voltage at the thermopile outputs is directly  
proportional to the acceleration. Please visit the MEMSIC  
website at www.memsic.com for a picture/graphic  
description of the free convection heat transfer principle.  
MEMSIC MXR9150G/M Rev.D  
Page 3 of 8  
2/27/2007  
TYPICAL CHARACTERISTICS, % OF UNITS (@ 25°C, VDD = 3.0V)  
Offset X&Y Distribution  
Offset Z Distribution  
50%  
45%  
40%  
X-axis  
Z-axis  
Y-axis  
35%  
40%  
30%  
25%  
35%  
30%  
25%  
20%  
15%  
10%  
5%  
20%  
15%  
10%  
5%  
offset(mg)  
113  
offset(mg)  
113  
0%  
0%  
-127 -100 -73  
-47  
-20  
7
33  
60  
87  
-127 -100 -73  
-47  
-20  
7
33  
60  
87  
0g X&Y Offset  
Deviation  
0g Z Offset Deviation  
Sensitivity Z Distribution  
Sensitivity X&Y Distribution  
35%  
35%  
30%  
25%  
20%  
15%  
10%  
5%  
X-axis  
Y-axis  
Z-axis  
30%  
25%  
20%  
15%  
10%  
5%  
Sen(mV/g)  
Sen(mV/g)  
159  
0%  
0%  
141 143 145 147 149 151 153 155 157 159  
141 143 145 147  
149 151 153 155 157  
X&Y Axis Sensitivity Distribution  
Z Axis Sensitivity Distribution  
MEMSIC MXR9150G/M Rev.D  
Page 4 of 8  
2/27/2007  
OVER TEMPERATURE CHARACTERISTICS  
OffsetX&Y vs. Temp  
1.54  
1.53  
1.52  
1.51  
1.50  
1.49  
1.48  
1.47  
1.46  
T(C)  
-50  
-30  
-10  
10  
30  
50  
70  
90  
OffsetZ vs. Temp  
1.54  
1.53  
1.52  
1.51  
1.50  
1.49  
1.48  
1.47  
1.46  
T(C)  
-50  
-30  
-10  
10  
30  
50  
70  
90  
Normalized Sensitivity X&Y vs. Temp  
1.10  
1.05  
1.00  
0.95  
0.90  
0.85  
0.80  
T(C)  
-50  
-30  
-10  
10  
30  
50  
70  
90  
MEMSIC MXR9150G/M Rev.D  
Page 5 of 8  
2/27/2007  
Normalized SenZ vs. Temp  
1.10  
1.05  
1.00  
0.95  
0.90  
0.85  
0.80  
-50  
-30  
-10  
10  
30  
50  
70  
T(C) 90  
MEMSIC MXR9150G/M Rev.D  
Page 6 of 8  
2/27/2007  
One capacitor is recommended for best rejection of power  
supply noise. The capacitor should be located as close as  
possible to the device supply pin (VDD1,VDD3). The  
capacitor lead length should be as short as possible, and  
surface mount capacitor is preferred. For typical  
applications, the capacitor can be ceramic 0.1 μF.  
MXR9150G/M PIN DESCRIPTIONS  
VDD1, VDD2, VDD3– These pins are the supply input for  
the circuits and the sensor heater in the accelerometer. The  
DC voltage should be between 2.7 and 3.6 volts. Refer to  
the section on PCB layout and fabrication suggestions for  
guidance on external parts and connections recommended.  
VSA1, VSA2– These pins are ground pin for the  
accelerometer.  
Power Supply  
SCK1, SCK2– These pins are for factory used only, should  
be connect to ground.  
VDD1  
VDD3  
DI1, DI2– These pins are the power down control pin. Pull  
these pins HIGH will put the accelerometer into power  
down mode. When the part goes into power down mode,  
the total current will be smaller than 0.1uA at 3V.  
In normal operation mode, this pin should be  
connected to Ground.  
MEMSIC  
Accelerometer  
Xout – This pin is the analog output of the X-axis  
acceleration sensor.  
PCB LAYOUT AND FABRICATION SUGGESTIONS  
Yout This pin is the analog output of the Y-axis  
acceleration sensor  
1. It is best to solder a 0.1uF capacitor directly across  
VDD1, VSA1 and VDD3, VSA2 pin.  
2. Robust low inductance ground wiring should be used.  
Zout This pin is the analog output of the Z-axis  
acceleration sensor.  
POWER SUPPLY NOISE REJECTION  
MEMSIC MXR9150G/M Rev.D  
Page 7 of 8  
2/27/2007  
PACKAGE DRAWING  
0.5x45  
MEMSIC MXR9150G/M Rev.D  
Page 8 of 8  
2/27/2007  
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