NBXSBA008LNHTAG中文资料应用文章市场行情现货热卖使用介绍-中国IC网-芯三七

产品型号NBXSBA008LNHTAG的Datasheet PDF文件预览

NBXSBA008

3.3 V, 161.1328 MHz

LVPECL Clock Oscillator

The NBXSBA008, single frequency, crystal oscillator (XO) is

designed to meet today’s requirements for 3.3 V LVPECL clock

generation applications. The device uses a high Q fundamental crystal

and Phase Lock Loop (PLL) multiplier to provide 161.1328 MHz,

ultra low jitter and phase noise LVPECL differential output.

This device is a member of ON Semiconductor’s PureEdget clock

family that provides accurate and precision clock solutions.

Available in 5 mm x 7 mm SMD (CLCC) package on 16 mm tape

and reel in quantities of 1,000.

http://onsemi.com

MARKING DIAGRAM

NBXSBA008

161.1328

AWLYYWWG

6 PIN CLCC

LN SUFFIX

CASE 848AB

Features

• LVPECL Differential Output

• Uses High Q Fundamental Mode Crystal and PLL Multiplier

• Ultra Low Jitter and Phase Noise − 0.4 ps (12 kHz − 20 MHz)

• Output Frequency − 161.1328 MHz

• Hermetically Sealed Ceramic SMD Package

• RoHS Compliant

NBXSBA008 = NBXSBA008 ( 50 PPM)

161.1328

= Output Frequency (MHz)

= Assembly Location

= Wafer Lot

= Year

= Work Week

= Pb−Free Package

• Operating Range 3.3 V 10%

• Total Frequency Stability − $50 PPM

• This is a Pb−Free Device

ORDERING INFORMATION

Applications

• Networking

• WAN

Device

Package

Shipping†

NBXSBA008LN1TAG CLCC−6 1000/Tape & Reel

(Pb−Free)

• IOGE

NBXSBA008LNHTAG CLCC−6 100/Tape & Reel

(Pb−Free)

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specification

Brochure, BRD8011/D.

CLK CLK

PLL

Clock

Multiplier

Crystal

GND

Figure 1. Simplified Logic Diagram

This document contains information on a product under development. ON Semiconductor

reserves the right to change or discontinue this product without notice.

Semiconductor Components Industries, LLC, 2009

Publication Order Number:

March, 2009 − Rev. 1

NBXSBA008/D

NBXSBA008

CLK

GND

Figure 2. Pin Connections (Top View)

Table 1. PIN DESCRIPTION

Pin No.

Symbol

I/O

Description

LVTTL/LVCMOS

Control Input

Output Enable Pin. When left floating pin defaults to logic HIGH and output is active.

See OE pin description Table 2.

GND

CLK

N/A

No Connect.

Power Supply

LVPECL Output

Ground 0 V

Non−Inverted Clock Output. Typically loaded with 50 W receiver termination resistor to

= V − 2 V.

CLK

LVPECL Output

Power Supply

Inverted Clock Output. Typically loaded with 50 W receiver termination resistor to

= V − 2 V.

Positive power supply voltage. Voltage should not exceed 3.3 V 10%.

Table 2. OUTPUT ENABLE TRI−STATE FUNCTION

OE Pin

Open

Output Pins

Active

HIGH Level

LOW Level

Active

High Z

Table 3. ATTRIBUTES

Characteristic

Internal Default State Resistor

ESD Protection Human Body Model

Machine Model

Meets or Exceeds JEDEC Standard EIA/JESD78 IC Latchup Test

1. For additional Moisture Sensitivity information, refer to Application Note AND8003/D.

Value

170 kW

2 kV

200 V

Table 4. MAXIMUM RATINGS

Symbol

Parameter

Condition 1

Condition 2

Rating

Units

Positive Power Supply

LVPECL Output Current

GND = 0 V

4.6

out

Continuous

Surge

Operating Temperature Range

Storage Temperature Range

Wave Solder

−40 to +85

−55 to +120

260

°C

stg

sol

See Figure 5

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

http://onsemi.com

NBXSBA008

Table 5. DC CHARACTERISTICS (V = 3.3 V 10%, GND = 0 V, T = −40°C to +85°C) (Note 2)

Symbol

Characteristic

Conditions

Min.

Typ.

Max.

Units

Power Supply Current

OE Input HIGH Voltage

OE Input LOW Voltage

Input HIGH Current

100

2000

GND − 300

800

FSEL

−100

+100

Input LOW Current

FSEL

−100

+100

Output HIGH Voltage

Output LOW Voltage

Output Voltage Amplitude

−1195

−945

= 3.3 V

2105

2355

−1945

−1600

= 3.3 V

1355

1700

680

OUTPP

NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit

board with maintained transverse airflow greater than 500 Ifpm. Electrical parameters are guaranteed only over the declared

operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit

values are applied individually under normal operating conditions and not valid simultaneously.

2. Measurement taken with outputs terminated with 50 W to V − 2.0 V. See Figure 4.

Table 6. AC CHARACTERISTICS (V = 3.3 V 10%, GND = 0 V, T = −40°C to +85°C) (Note 3)

Symbol

Characteristic

Conditions

Min.

Typ.

Max.

Units

MHz

Output Clock Frequency

Frequency Stability

161.1328

CLKOUT

(Note 4)

ppm

Phase−Noise Performance

CLKout

(See Figure 3)

100 Hz of Carrier

1 kHz of Carrier

10 kHz of Carrier

100 kHz of Carrier

1 MHz of Carrier

10 MHz of Carrier

12 kHz to 20 MHz

1000 Cycles

−109

−125

−132

−141

−161

0.4

dBc/Hz

NOISE

= 161.1328 MHz

dBc/Hz

t (F)

jit

RMS Phase Jitter

0.9

Cycle to Cycle, RMS

Cycle to Cycle, Peak−to−Peak

Period, RMS

1.5

jitter

1000 Cycles

10,000 Cycles

Period, Peak−to−Peak

Output Enable/Disable Time

200

OE/OD

Output Clock Duty Cycle

(Measured at Cross Point)

DUTY_CYCLE

Output Rise Time (20% and 80%)

Output Fall Time (80% and 20%)

Start−up Time

250

400

start

Aging

Year

ppm

Every Year After 1

NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit

board with maintained transverse airflow greater than 500 Ifpm. Electrical parameters are guaranteed only over the declared

operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit

values are applied individually under normal operating conditions and not valid simultaneously.

3. Measurement taken with outputs terminated with 50 W to V − 2.0 V. See Figure 4.

4. Parameter guarantee 10 years aging. Includes initial stability at 25°C, shock, vibration, and first year aging.

http://onsemi.com

NBXSBA008

Figure 3. Typical Phase Noise Plot

Standard

Table 7. RELIABILITY COMPLIANCE

Parameter

Method

Shock

Mechanical

MIL−STD−833, Method 2002, Condition B

MIL−STD−833, Method 2003

Solderability

Mechanical

Environment

Vibration

MIL−STD−833, Method 2007, Condition A

MIL−STD−202, Method 215

Solvent Resistance

Thermal Shock

Moisture Level Sensitivity

MIL−STD−833, Method 1011, Condition A

MSL1 260°C per IPC/JEDEC J−STD−020D

http://onsemi.com

NBXSBA008

Z = 50 W

Receiver

Device

Driver

Device

Z = 50 W

50 W

= V − 2.0 V

Figure 4. Typical Termination for Output Driver and Device Evaluation

(See Application Note AND8020/D − Termination of ECL Logic Devices.)

temp. 260°C

20 − 40 sec. max.

Temperature (°C)

6°C/sec. max.

peak

260

3°C/sec. max.

217

ramp−up

cooling

175

150

pre−heat

reflow

Time

60ꢀ 180 sec.

60ꢀ 150 sec.

Figure 5. Recommended Reflow Soldering Profile

http://onsemi.com

NBXSBA008

PACKAGE DIMENSIONS

6 PIN CLCC, 7x5, 2.54P

CASE 848AB−01

ISSUE C

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

0.15 C

2. CONTROLLING DIMENSION: MILLIMETERS.

MILLIMETERS

DIM

MIN

1.70

NOM

1.80

0.70 REF

0.36 REF

0.10

MAX

1.90

H E1

TERMINAL 1

INDICATOR

0.08

1.30

0.12

1.50

1.40

7.00 BSC

6.20

6.81

5.08 BSC

5.00 BSC

4.40

6.17

6.66

6.23

6.96

TOP VIEW

4.37

4.65

4.43

4.95

0.10

4.80

3.49 BSC

2.54 BSC

1.80 REF

1.27

1.17

1.37

0.70 REF

SIDE VIEW

SEATING

PLANE

SOLDERING FOOTPRINT*

1.50

5.06

0.10

0.05

6X b

6X L

1.50

BOTTOM VIEW

2.54

PITCH

DIMENSION: MILLIMETERS

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

PureEdge is a trademark of Semiconductor Industries, LLC (SCILLC).

ON Semiconductor and

are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice

to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability

arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.

“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights

nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications

intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should

Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,

and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death

associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal

Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

PUBLICATION ORDERING INFORMATION

LITERATURE FULFILLMENT:

N. American Technical Support: 800−282−9855 Toll Free

USA/Canada

Europe, Middle East and Africa Technical Support:

Phone: 421 33 790 2910

Japan Customer Focus Center

Phone: 81−3−5773−3850

ON Semiconductor Website: www.onsemi.com

Order Literature: http://www.onsemi.com/orderlit

Literature Distribution Center for ON Semiconductor

P.O. Box 5163, Denver, Colorado 80217 USA

Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada

Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada

Email: orderlit@onsemi.com

For additional information, please contact your local

Sales Representative

NBXSBA008/D

http://onsemi.com

型号:	NBXSBA008LNHTAG
生命周期：	Active
IHS 制造商：	ROCHESTER ELECTRONICS INC
零件包装代码：	DLCC
包装说明：	SON,
针数：	6
Reach Compliance Code：	unknown
风险等级：	5.77
Is Samacsys：	N
JESD-30 代码：	R-CDSO-N6
长度：	7 mm
端子数量：	6
最高工作温度：	85 °C
最低工作温度：	-40 °C
最大输出时钟频率：	161.1328 MHz
封装主体材料：	CERAMIC, METAL-SEALED COFIRED
封装代码：	SON
封装形状：	RECTANGULAR
封装形式：	SMALL OUTLINE
认证状态：	COMMERCIAL
座面最大高度：	1.9 mm
最大供电电压：	3.63 V
最小供电电压：	2.97 V
标称供电电压：	3.3 V
表面贴装：	YES
温度等级：	INDUSTRIAL
端子形式：	NO LEAD
端子节距：	2.54 mm
端子位置：	DUAL
宽度：	5 mm
uPs/uCs/外围集成电路类型：	CLOCK GENERATOR, OTHER
Base Number Matches：	1

电子百科

产品导航

产品型号NBXSBA008LNHTAG的Datasheet PDF文件预览

NBXSBA008LNHTAG相关产品

NBXSBA008LNHTAG相关文章

IC37:专业IC行业平台