NCP360MUTBG应用文章市场行情现货热卖使用介绍供应商报价-中国IC网-芯三七

当前位置：IC37首页_>N字母起始型号索引_>N字母起始型号索引第135页更新时间：2024-10-25 17:36:59

产品型号NCP360MUTBG的概述

NCP360MUTBG芯片概述 NCP360MUTBG是一款高性能的线性稳压器，广泛应用于各种电子设备中，如消费电子、工业设备和汽车电子系统。该芯片具有低压差（LDO）的特性，能够在输入电压和输出电压之间保持一个小的电压差，从而确保在不需要额外的功率转换电路的前提下，提供一个稳定的输出电压。这种特性使得NCP360MUTBG在电源管理领域的需求持续增长。其小巧的封装和高效的电源转换能力，使得它在设计紧凑和高效率的电源系统中具有广泛的应用前景。 NCP360MUTBG的详细参数 1. 输入电压范围：NCP360MUTBG支持的输入电压范围为2.5V至5.5V，这使得其可以接受多种电源输入，适合不同的应用场合。 2. 输出电压：该芯片提供固定的输出电压，如1.2V、1.5V、1.8V和2.5V等用户可选择的选项。这使得用户能够根据具体应用的需求来选择合适的输出电压。 3. 最大输出电流：N...

产品型号NCP360MUTBG的Datasheet PDF文件预览

NCP360

USB Positive Overvoltage

Protection Controller with

Internal PMOS FET and

Status FLAG

NCP360 is able to disconnect the systems from its output pin in

case wrong VBUS operating conditions is detected. The system is

positive over-voltage protected up to +20ꢀV.

Thanks to this device using internal PMOS FET, no external

device is necessary, reducing the system cost and the PCB area of the

application board.

NCP360 is able to instantaneously disconnect the output from the

input if the input voltage exceeds the overvoltage threshold (OVLO).

NCP360 provides a negative going flag (FLAG) output, which

alerts the system that a fault has occurred.

http://onsemi.com

MARKING

DIAGRAMS

UDFN6

ZD M

TBD SUFFIX

CASE 517AB

M = Date Code

TSOP-5

TBD SUFFIX

CASE 483

In addition, the device has ESD-protected input (15ꢀkV Air) when

bypassed with a 1ꢀmF or larger capacitor.

SYAAYWG

Features

= Assembly Location

= Year

•ꢁVery Fast Protection, Up to 20ꢀV, with 25 mA Current Consumption

•ꢁOn-chip PMOS Transistor

•ꢁOvervoltage Lockout (OVLO)

•ꢁUndervoltage Lockout (UVLO)

•ꢁAlert FLAG Output

W = Work Week

= Pb-Free Package

(Note: Microdot may be in either location)

•ꢁEN Enable Pin

•ꢁThermal Shutdown

ORDERING INFORMATION

†

Device

Package

Shipping

3000/Tape & Reel

•ꢁCompliance to IEC61000-4-2 (Level 4)

NCP360MUTBG

NCP360MUTXG

NCP360SNT1G

UDFN6

(Pb-Free)

ꢂ8ꢀkV (Contact)

ꢂ15ꢀkV (Air)

UDFN6 10000/Tape & Reel

(Pb-Free)

•ꢁESD Ratings: Machine Model = B

ESD Ratings: Human Body Model = 3

•ꢁ6 Lead UDFN 2x2 mm Package

•ꢁ5 Lead TSOP 3x3 mm Package

•ꢁThese are Pb-Free Devices

TSOP-5

(Pb-Free)

3000/Tape & Reel

NCP360SNT3G

TSOP-5 10000/Tape & Reel

(Pb-Free)

Applications

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specification

Brochure, BRD8011/D.

•ꢁUSB Devices

•ꢁMobile Phones

•ꢁPeripheral

•ꢁPersonal Digital Applications

•ꢁMP3 Players

©ꢀ Semiconductor Components Industries, LLC, 2007

May, 2007 - Rev. 1

Publication Order Number:

NCP360/D

NCP360

PIN CONNECTIONS

OUT

GND

FLAG

OUT

PAD1

FLAG

TSOP-5

UDFN6

(Top Views)

PIN FUNCTION DESCRIPTION (UDFN6 Package)

Pin No.

Name

Type

Description

INPUT

Enable Pin. The device enters in shutdown mode when this pin is tied to a high level. In this case the

output is disconnected from the input. To allow normal functionality, the EN pin shall be connected to

GND to a pull down or to a I/O pin. This pin does not have an impact on the fault detection.

GND

POWER Ground

POWER Input Voltage Pin. This pin is connected to the VBUS. A 1 mF low ESR ceramic capacitor, or larger,

must be connected between this pin and GND.

4, 5

OUT

FLAG

PAD1

OUTPUT Output Voltage Pin. The output is disconnected from the VBUS power supply when the input voltage is

above OVLO threshold or below UVLO threshold. A 1 mF capacitor must be connected to these pins.

The two OUT pins must be hardwired to common supply.

OUTPUT Fault Indication Pin. This pin allows an external system to detect a fault on VBUS pin. The FLAG pin

goes low when input voltage exceeds OVLO threshold. Since the FLAG pin is open drain functionality,

an external pull up resistor to V must be added.

POWER Exposed Pad. Can be connected to GND or isolated plane. Must be used to thermal dissipation.

PIN FUNCTION DESCRIPTION (TSOP-5 Package)

Pin No.

Name

Type

Description

POWER Input Voltage Pin. This pin is connected to the VBUS. A 1 mF low ESR ceramic capacitor, or larger,

must be connected between this pin and GND.

GND

POWER Ground

INPUT

Enable Pin. The device enters in shutdown mode when this pin is tied to a high level. In this case the

output is disconnected from the input. To allow normal functionality, the EN pin shall be connected to

GND to a pull down or to a I/O pin. This pin does not have an impact on the fault detection.

FLAG

OUT

OUTPUT Fault Indication Pin. This pin allows an external system to detect a fault on VBUS pin. The FLAG pin

goes low when input voltage exceeds OVLO threshold. Since the FLAG pin is open drain functionality,

an external pull up resistor to V must be added.

OUTPUT Output Voltage Pin. The output is disconnected from the VBUS power supply when the input voltage is

above OVLO threshold or below UVLO threshold. A 1 mF capacitor must be connected to this pin.

http://onsemi.com

NCP360

INPUT

OUTPUT

OUT

FLAG Power

1 mF 25 V X5R 0603

NCP360

FLAG

GND

FLAG_State

Figure 1. Typical Application Circuit (UDFN Pinout)

OUTPUT

INPUT

(2 out pins in

UDFN package)

Thermal Shutdown

Soft Start

FLAGV

UVLO

OVLO

LDO

REF

Figure 2. Functional Block Diagram

http://onsemi.com

NCP360

MAXIMUM RATINGS

Rating

Symbol

Vmin

Value

-0.3

Unit

MinimumVoltage (IN to GND)

Minimum Voltage (All others to GND)

Maximum Voltage (IN to GND)

Vmin

Vmax

Maximum Voltage (All others to GND)

Maximum Current from Vin to Vout (PMOS)

Thermal Resistance, Junction-to-Air (Note 1)

Vmax

Imax

7.0

600

°C/W

TSOP-5

UDFN

305

260

Operating Ambient Temperature Range

Storage Temperature Range

-40 to +85

-65 to +150

150

°C

stg

Junction Operating Temperature

ESD Withstand Voltage (IEC 61000-4-2)

Human Body Model (HBM), Model = 2 (Note 2)

Machine Model (MM) Model = B (Note 3)

Vesd

15 Air, 8.0 Contact

2000

200

Moisture Sensitivity

MSL

Level 1

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

RecommendedOperating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. R

is highly dependent on the PCB heat sink area (connected to PAD1, UDFN). See PCB Recommendations.

2. Human Body Model, 100 pF discharged through a 1.5 kW resistor following specification JESD22/A114.

3. Machine Model, 200 pF discharged through all pins following specification JESD22/A115.

4. Compliant with JEDEC Latch-up Test, up to maximum voltage range.

ELECTRICAL CHARACTERISTICS

(Min/Max limits values (-40°C < T < +85°C) and V = +5.0 V. Typical values are T = +25°C, unless otherwise noted.)

Characteristic

Symbol

Conditions

Min

Typ

Max

Unit

Input Voltage Range

1.2

2.85

3.15

Undervoltage Lockout Threshold

Uvervoltage Lockout Hysteresis

Overvoltage Lockout Threshold

Overvoltage Lockout Hysteresis

UVLO

falls down UVLO threshold

3.0

hyst

OVLO

rises up OVLO threshold

= 5 V, I charge = 500 mA

5.43

5.675

100

105

5.9

125

200

hyst

versus V Dopout

out

drop

Supply Quiescent Current

OVLO Supply Current

Output Off State Current

FLAG Output Low Voltage

FLAG Leakage Current

EN Voltage High

Idd

No Load, V = 5.25 V

= 7 V

uvlo

std

= 5.25 V, EN = 1.2 V

Vol

> OVLO, Sink 1 mA on FLAG pin

FLAG level = 5 V

400

flag

FLAG

5.0

leak

from 3.3 V to 5.25 V

1.2

EN Voltage Low

0.4

EN Leakage Current

EN = 5.5 V or GND

170

leak

TIMINGS

Start Up Delay

From V > UVLO to V = 0.8xV , See Fig 3

out

4.0

3.0

0.8

FLAG going up Delay

Output Turn Off Time

From V > UVLO to FLAG = 1.2 V, See Fig 3

start

off

From V > OVLO to V ≤ 0.3 V, See Fig 4

1.5

out

increasing from 5 V to 8 V at 1ꢀV/ms.

No output capacitor.

Alert Delay

From V > OVLO to FLAG ≤ 0.4 V, See Fig 4

1.0

2.0

stop

increasing from 5 V to 8 V at 3ꢀV/ms

Disable Time

From EN 0.4 to 1.2V to V ≤ 0.3 V, See Fig 5

out

dis

= 4.75 V. No output capacitor.

Thermal Shutdown Temperature

Thermal Shutdown Hysteresis

150

°C

sdhyst

NOTE: Thermal Shutdown parameter has been fully characterized and guaranteed by design.

http://onsemi.com

NCP360

<OVLO

UVLO

OVLO

off

- R

x I

DS(on)

out

0.8 V

- (R

DS(on)

out

0.3 V

start

FLAG

stop

FLAG

1.2 V

0.4 V

Figure 3. Start Up Sequence

Figure 4. Shutdown on Over Voltage Detection

1.2 V

dis

OVLO

UVLO

out

0.3 V

- R

x I

DS(on)

3 ms

FLAG

Figure 5. Disable on EN = 1

Figure 6. FLAG Response with EN = 1

CONDITIONS

OUT

> OVLO or V < UVLO

Voltage Detection

Figure 7.

CONDITIONS

OUT

UVLO < V < OVLO

Voltage Detection

Figure 8.

http://onsemi.com

NCP360

TYPICAL OPERATING CHARACTERISTICS

Figure 9. Startup

V_in= Ch1, V_out= Ch3

Figure 10. FLAG Going Up Delay

V_out= Ch3, FLAG = Ch2

Figure 11. Output Turn Off Time

V_in= Ch1, V_out= Ch2

Figure 12. Alert Delay

V_out= Ch1, FLAG = Ch3

Figure 13. Disable Time

EN = Ch1, V_out= Ch2, FLAG = Ch3

Figure 14. Thermal Shutdown

V_in= Ch1, V_out= Ch2, FLAG = Ch3

http://onsemi.com

NCP360

TYPICAL OPERATING CHARACTERISTICS

450

400

350

300

250

200

150

= 3.6 V

= 5 V

100

-50

TEMPERATURE (°C)

100

150

Figure 15. Direct Output Short Circuit

Figure 16. R_DS(on)vs. Temperature

(Load = 500 mA)

180

160

140

120

100

125°C

25°C

-40 °C

11 13 15

17 19 21

V , INPUT VOLTAGE (V)

Figure 17. Supply Quiescent Current vs. V_in

http://onsemi.com

NCP360

In Operation

EN Input

NCP360 provides overvoltage protection for positive

voltage, up to 20ꢀV. A PMOS FET protects the systems

(i.e.: VBUS) connected on the V pin, against positive

To enable normal operation, the EN pin shall be forced

to low or connected to ground. A high level on the pin

disconnects OUT pin from IN pin. EN does not overdrive

an OVLO or UVLO fault.

out

over-voltage. The Output follows the VBUS level until

OVLO threshold is overtaken.

Internal PMOS FET

Undervoltage Lockout (UVLO)

NCP360 includes an internal PMOS FET to protect the

systems, connected on OUT pin, from positive

overvoltage. Regarding electrical characteristics, the

To ensure proper operation under any conditions, the

device has a built-in undervoltage lock out (UVLO)

circuit. During V positive going slope, the output remains

, during normal operation, will create low losses on

DSon

disconnected from input until V voltage is above 3.2ꢀV

V pin, characterized by V versus V dropout. (See

out in out

Figure 16).

nominal. The FLAGV output is pulled to low as long as V

does not reach UVLO threshold. This circuit has a 50ꢀmV

hysteresis to provide noise immunity to transient condition.

ESD Tests

NCP360 fully support the IEC61000-4-2, level 4 (Input

pin, 1 mF mounted on board).

(V)

That means, in Air condition, V has a 15ꢀkV ESD

protected input. In Contact condition, V has 8ꢀkV ESD

20 V

protected input.

Please refer to Fig 19 to see the IEC 61000-4-2

electrostatic discharge waveform.

OVLO

UVLO

out

OVLO

UVLO

Figure 18. Output Characteristic vs. V_in

Overvoltage Lockout (OVLO)

To protect connected systems on V

pin from

out

overvoltage, the device has a built-in overvoltage lock out

(OVLO) circuit. During overvoltage condition, the output

remains disabled until the input voltage exceeds OVLO -

Hysteresis.

FLAG output is tied to low until V is higher than

OVLO. This circuit has a 100ꢀmV hysteresis to provide

noise immunity to transient conditions.

Figure 19.

PCB Recommendations

FLAG Output

The NCP360 integrates a 500 mA rated PMOS FET, and

the PCB rules must be respected to properly evacuate the

heat out of the silicon. The UDFN PAD1 must be connected

to ground plane to increase the heat transfer if necessary

from an application standpoint. Of course, in any case, this

pad shall be not connected to any other potential.

NCP360 provides a FLAG output, which alerts external

systems that a fault has occurred.

This pin is tied to low as soon the OVLO threshold is

exceeded When V level recovers normal condition,

FLAG is held high. The pin is an open drain output, thus a

pull up resistor (typically 1 MW- Minimum 10 kW) must

be provided to V . FLAG pin is an open drain output.

battery

http://onsemi.com

NCP360

PACKAGE DIMENSIONS

UDFN6 2x2, 0.65P

CASE 517AB-01

ISSUE B

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. COPLANARITY APPLIES TO THE EXPOSED

PAD AS WELL AS THE TERMINALS.

MILLIMETERS

DIM

MIN

0.45

0.00

MAX

0.55

0.05

PIN ONE

REFERENCE

0.127 REF

0.25

1.50

0.35

2.00 BSC

1.70

0.10

2.00 BSC

0.80

1.00

0.65 BSC

0.20

0.25

---

0.10

0.35

SOLDERING FOOTPRINT*

0.10

0.47

0.95

0.08

0.40

SEATING

PLANE

1.70

0.65

PITCH

2.30

DIMENSIONS: MILLIMETERS

0.10

0.05

*For additional information on our Pb-Free strategy and soldering

details, please download the ON Semiconductor Soldering and

MountingTechniques Reference Manual, SOLDERRM/D.

BOTTOM VIEW

http://onsemi.com

NCP360

PACKAGE DIMENSIONS

TSOP-5

CASE 483-02

ISSUE G

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

NOTE 5

2. CONTROLLING DIMENSION: MILLIMETERS.

3. MAXIMUM LEAD THICKNESS INCLUDES

LEAD FINISH THICKNESS. MINIMUM LEAD

THICKNESS IS THE MINIMUM THICKNESS

OF BASE MATERIAL.

4. DIMENSIONS A AND B DO NOT INCLUDE

MOLD FLASH, PROTRUSIONS, OR GATE

BURRS.

5. OPTIONAL CONSTRUCTION: AN

ADDITIONAL TRIMMED LEAD IS ALLOWED

IN THIS LOCATION. TRIMMED LEAD NOT TO

EXTEND MORE THAN 0.2 FROM BODY.

0.20 C A B

0.10

0.20

DETAIL Z

MILLIMETERS

DIM

MIN

3.00 BSC

1.50 BSC

MAX

DETAIL Z

0.90

0.25

1.10

0.50

SEATING

PLANE

0.05

0.95 BSC

0.01

0.10

0.20

1.25

0.10

0.26

0.60

1.55

3.00

2.50

SOLDERING FOOTPRINT*

1.9

0.074

0.95

0.037

2.4

0.094

1.0

0.039

0.7

0.028

inches

SCALE 10:1

*For additional information on our Pb-Free strategy and soldering

details, please download the ON Semiconductor Soldering and

MountingTechniques Reference Manual, SOLDERRM/D.

ON Semiconductor and

are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice

to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any

liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental

damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over

time. All operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under

its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body,

or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death

may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees,

subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of

personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part.

SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

PUBLICATION ORDERING INFORMATION

LITERATURE FULFILLMENT:

ꢁLiterature Distribution Center for ON Semiconductor

ꢁP.O. Box 5163, Denver, Colorado 80217 USA

N. American Technical Support: 800-282-9855 Toll Free

ꢁUSA/Canada

Europe, Middle East and Africa Technical Support:

ON Semiconductor Website: www.onsemi.com

Order Literature: http://www.onsemi.com/orderlit

ꢁPhone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada ꢁPhone: 421 33 790 2910

ꢁFax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada

ꢁEmail: orderlit@onsemi.com

For additional information, please contact your loca

Sales Representative

Japan Customer Focus Center

ꢁPhone: 81-3-5773-3850

NCP360/D

http://onsemi.com

NCP360MUTBG相关文章

配单直通车

北京元坤伟业科技有限公司服务专线: 010-62104931621064316210489162104791 在线联系:

QQ：857273081 复制

QQ：1594462451 复制

首天国际（深圳）科技有限公司服务专线: 0755-82807802/82807803 在线联系:

QQ：528164397 复制

QQ：1318502189 复制

深圳市芯福林电子有限公司服务专线: 13418564337 在线联系:

QQ：2881495808 复制

QQ：308365177 复制

柒号芯城电子商务（深圳）有限公司服务专线: 0755-83209937 在线联系:

QQ：2881677436 复制

QQ：2881620402 复制

深圳市中利达电子科技有限公司服务专线: 0755-83200645/13686833545 在线联系:

QQ：1902134819 复制

QQ：2881689472 复制

NCP360MUTBG产品参数

型号:	NCP360MUTBG
是否无铅：	不含铅
生命周期：	Active
IHS 制造商：	ROCHESTER ELECTRONICS LLC
零件包装代码：	DFN
包装说明：	2 X 2 MM, 0.65 MM PITCH, LEAD FREE, UDFN-6
针数：	6
Reach Compliance Code：	unknown
风险等级：	5.6
Is Samacsys：	N
内置保护：	TRANSIENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE
接口集成电路类型：	BUFFER OR INVERTER BASED PERIPHERAL DRIVER
JESD-30 代码：	S-XDSO-N6
JESD-609代码：	e3
长度：	2 mm
湿度敏感等级：	NOT SPECIFIED
功能数量：	1
端子数量：	6
最高工作温度：	85 °C
最低工作温度：	-40 °C
输出电流流向：	SOURCE
封装主体材料：	UNSPECIFIED
封装代码：	HVSON
封装形状：	SQUARE
封装形式：	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度（摄氏度）：	260
认证状态：	COMMERCIAL
座面最大高度：	0.55 mm
最大供电电压：	20 V
最小供电电压：	1.2 V
标称供电电压：	5 V
表面贴装：	YES
温度等级：	INDUSTRIAL
端子面层：	MATTE TIN
端子形式：	NO LEAD
端子节距：	0.65 mm
端子位置：	DUAL
处于峰值回流温度下的最长时间：	40
断开时间：	1.5 µs
宽度：	2 mm
Base Number Matches：	1

电子百科

产品导航

产品型号NCP360MUTBG的概述

产品型号NCP360MUTBG的Datasheet PDF文件预览

NCP360MUTBG相关产品

NCP360MUTBG相关文章

IC37:专业IC行业平台