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深圳市中利达电子科技有限公司
NHQM501B325T10
数量-
厂家-
封装-
批号-
-
QQ：1902134819 复制
QQ：2881689472 复制
0755-83200645/13686833545

柒号芯城电子商务（深圳）有限公司
NHQM501B325T10
数量-
厂家-
封装-
批号-
-
QQ：2881677436 复制
QQ：2881620402 复制
18922803401

北京元坤伟业科技有限公司
NHQM501B325T10
数量-
厂家-
封装-
批号-
-
QQ：857273081 复制
QQ：1594462451 复制
010-62104931、62106431、62104891、62104791

深圳市芯福林电子有限公司
NHQM501B325T10
数量-
厂家-
封装-
批号-
-
QQ：2881495808 复制
QQ：308365177 复制
13418564337

首天国际（深圳）科技有限公司
NHQM501B325T10
数量-
厂家-
封装-
批号-
-
QQ：528164397 复制
QQ：1318502189 复制
0755-82807802/82807803

北京元坤伟业科技有限公司
NHQM501B325T10

数量5000
厂家GE Sensing / Thermometrics
封装贴/插片
批号16+
百分百原装正品，现货库存
QQ：857273081 复制
QQ：1594462451 复制
010-62106431

北京中其伟业科技有限公司
NHQM501B325T10

数量10381
厂家GE Sensing / Thermometrics
封装贴/插片
批号16+
特价,原装正品,绝对公司现货库存,原装特价!
QQ：2880824479 复制
010-62104891

北京元坤伟业（国际）科技有限公司
NHQM501B325T10

数量5000
厂家GE Sensing / Thermometrics
封装贴/插片
批号16+
百分百原装正品，现货库存
QQ：857273081 复制
QQ：1594462451 复制
010-62104578

深科创（香港）科技有限公司
NHQM501B325T10

数量5590
厂家Amphenol Advanced Sensors
封装原厂原装
批号19+
只做原装，只有原装
QQ：3350142453 复制
QQ：545433074 复制
83247290

产品型号NHQM501B325T10的Datasheet PDF文件预览

NTC Type SMD

Thermometrics Surface

Mount Devices

EIA Style 1206

Nickel barrier solder coated

3 sided wrap around

0.5 mm (0.02 in)

typical

1.27 mm

(0.05 in)

maximum

1.6 mm ±0.2 mm

(0.063 mm ±0.008 in)

3.2 mm ±0.2 mm

(0.126 in ±0.008 in)

Features

•

Nickel barrier tin plated terminations for

soldering

•

Suitable for standard soldering techniques

Excellent solderability without

“tombstoning”

•

High sensitivity to changes in temperature

Wide operating temperature range -40°F to

257°F (-40°C to 125°C)

•

Ceramic between electrodes glass coated

for improved stability

•

Rugged construction

Supplied in tape-and-reel packaging

Available in other material systems

Intended for temperature measurement,

control and compensation

Amphenol

Advanced Sensors

±.5 mm ±±.ꢀ mm

(±.±197 in ±±.±±0 in)

Type NHQ

Speciﬁcation

Surface mount chip 1206 size

Description

A range of 1206 size surface mount NTC chip

thermistors.The terminations are nickel barrier

with tin plating.

General

3.ꢀ mm ±±.ꢀ mm

(±.1ꢀ6 in ±±.±±0 in)

Soldering Recommendations

• Maximum storage time in closed package:

One year

NTC Type NHQ Outline Drawing

• Maximum storage time exposed to ambient

conditions of 59°F to 86°F (15°C to 30°C),

15% to 70% RH: 30 days

• Drying prior to soldering: Not to exceed 48h

at 176°F (80°C) or 16h at 212°F (100°C) or 8h

at 257°F (125°C)

Code

R25 W

2000

2200

2500

B (25/85)

NHQ202B410T5

NHQ222B410T5

NHQ252B410T5

4100

• Flux type: R or RMA

NHQ302B410T5

NHQ472B355T5

NHQ502B355T5

NHQ103B375T5

NHQ153B400T5

NHQ203B400T5

NHQ223B400T5

NHQ303B400T5

NHQ333B400T5

NHQ473B400T5

NHQ503B400T5

NHQ104B425T5

NHQ154B425T5

NHQ304B435T5

NHQ474B435T5

NHQ504B435T5

3000

4100

3550

3750

4000

4250

4350

4700

Flow Soldering Conditions

• Preheat temperature: 176°F to 302°F (80°C to

150°C)

• Maximum rate of temperature change:

4.5°F/s or 2.5°C/s

• Maximum solder temperature: 509°F (265°C)

• Maximum dwell time: 10 seconds

• Cooling in ambient or air ﬂow of 5m/s

5000

10000

15000

20000

22000

30000

33000

47000

50000

100000

150000

300000

470000

500000

Reflow Soldering Conditions

• Method infrared, hot gas, vapor

• Maximum rate of preheat temperature

change: 4.5°F/s or 2.5°C/s

• Maximum temperature: 437°F (225°C)

• Maximum time above: 392°F (200°C) 30

seconds

• Maximum radiant ﬂux: (0.1 to 100 W µ) 5 W/

cm2

• Maximum hot air temperature: 527°F (275°C)

at 4 m/s

• Maximum vapor temperature: 419°F (215°C)

• Maximum rate of cooling: 4.5°F/s or 2.5°C/s

Data

• Resistance tolerance at 77°F (25°C) ±5%;

for ±10% replace T5 by T10 in code.

• Tolerance on B value ±200 K

• Minimum temperature: -40°F (-40°C)

• Maximum temperature: 257°F (125°C)

• Dissipation factor: 3 mW/K

Cleaning

Ultrasonic cleaning in methanol or isopropanol

not exceeding 40 kHz for 5 minutes, or

aqueous cleaning not exceeding 158°F (70°C)

for 7 minutes (recommended).

• Time constant: 8 seconds maximum

0.4 mm 0.ꢀ mm

(0.0157 in 0.00ꢁ in)

Type NHQM

Speciﬁcation

Surface mount chip 0805 size

Description

A range of 0805 size surface mount NTC chip

thermistors.The terminations are nickel barrier with tin

plating.

General

ꢀ mm 0.ꢀ mm

(0.07ꢁ7 in 0.00ꢁ in)

Soldering Recommendations

NTC Type NHQM Outline Drawing

• Maximum storage time in closed package: One year

• Maximum storage time exposed to ambient conditions

of 59°F to 86°F (15°C to 30°C), 15% to 70% RH: 30

days

Code

R25 W

2000

B (25/85°C)

• Drying prior to soldering: Not to exceed 48h at 176°F

(80°C) or 16h at 212°F (100°C) or 8h at 257°F (125°C)

• Flux type: R or RMA

NHQM202B410T5

NHQM252B410T5

NHQM272B410T5

NHQM302B410T5

NHQM472B355T5

NHQM502B355T5

NHQM682B375T5

NHQM103B375T5

NHQM153B400T5

NHQM203B400T5

NHQM223B400T5

NHQM273B400T5

NHQM303B400T5

NHQM333B400T5

NHQM473B415T5

NHQM503B415T5

NHQM104B425T5

NHQM154B425T5

NHQM304B425T5

NHQM474B435T5

NHQM504B435T5

4100

3550

3750

4000

4150

4250

4350

2500

2700

3000

Flow Soldering Conditions

4700

•

Preheat temperature: 176°F to 302°F (80°C to 150°C)

Maximum rate of temperature change: 4.5°F/s or

2.5°C/s

5000

6800

10000

15000

20000

22000

27000

30000

33000

47000

50000

100000

150000

300000

470000

500000

•

Maximum solder temperature: 509°F (265°C)

Maximum dwell time: 10 seconds

Cooling in ambient or air ﬂow of 5m/s

Reflow Soldering Conditions

• Method infrared, hot gas, vapor

• Maximum rate of preheat temperature change: 4.5°F/s

or 2.5°C/s

• Maximum temperature: 437°F (225°C)

• Maximum time above: 392°F (200°C) 30 seconds

• Maximum radiant ﬂux: (0.1 to 100 Wµ) 5 W µ/cm2

• Maximum hot air temperature: 527°F (275°C) at 4 m/s

• Maximum vapor temperature: 419°F (215°C)

• Maximum rate of cooling: 4.5°F/s or 2.5°Cs

Cleaning

Ultrasonic cleaning in methanol or isopropanol not

exceeding 40 kHz for 5 minutes, or aqueous cleaning not

exceeding 158°F (70°C) for 7 minutes (recommended).

Data

• Resistance tolerance at 77°F (25°C) ±5%; for

±10% replace T5 by T10 in code.

• Tolerance on B value ±200 K

• Minimum temperature: -40°F (-40°C)

• Maximum temperature: 257°F (125°C)

• Dissipation factor: 1.5 mW/K

• Time constant: 5 seconds maximum

0.3 mm 0.ꢀ mm

(0.01ꢀ in 0.00ꢁ in)

Type NHQMM

Speciﬁcation

Surface mount chip 0603 size

Description

A range of 0603 size surface mount NTC chip

thermistors.The terminations are nickel barrier

with tin plating.

General

1.6 mm 0.ꢀ mm

(0.063 in 0.00ꢁ in)

Soldering Recommendations

• Maximum storage time in closed package:

One year

NTC Type NHQMM Outline Drawing

• Maximum storage time exposed to ambient

conditions of 59°F to 86°F (15°C to 30°C),

15% to 70% RH: 30 days

• Drying prior to soldering: Not to exceed 48h

at 176°F (80°C) or 16h at 212°F (100°C) or

8h at 257°F (125°C)

Code

R25 W

B (25/85)

4100

3550

3750

3800

4000

4150

4250

NHQMM202B410T5

NHQMM222B410T5

NHQMM302B410T5

NHQMM332B410T5

NHQMM472B355T5

NHQMM502B355T5

NHQMM682B355T5

NHQMM103B375T5

NHQMM153B380T5

NHQMM203B380T5

NHQMM223B380T5

NHQMM303B400T5

NHQMM333B400T5

NHQMM473B400T5

NHQMM503B400T5

NHQMM683B400T5

NHQMM104B415T5

NHQMM154B425T5

NHQMM204B425T5

2000

2200

3000

• Flux type: R or RMA

3300

4700

Flow Soldering Conditions

• Preheat temperature: 176°F to 302°F (80°C

to 150°C)

• Maximum rate of temperature change:

4.5°F/s or 2.5°C/s

• Maximum solder temperature: 509°F

(265°C)

• Maximum dwell time: 10 seconds

• Cooling in ambient or air ﬂow of 5m/s

5000

6800

10000

15000

20000

22000

30000

33000

47000

50000

68000

100000

150000

200000

Reflow Soldering Conditions

• Method infrared, hot gas, vapor

• Maximum rate of preheat temperature

change: 4.5°F/s or 2.5°C/s

• Maximum temperature: 437°F (225°C)

• Maximum time above: 392°F (200°C) 30

seconds

• Maximum radiant ﬂux: (0.1 to 100 Wµ) 5

Wµ/cm²

• Maximum hot air temperature: 527°F

(275°C) at 4 m/s

Data

• Maximum vapor temperature: 419°F (215°C)

• Maximum rate of cooling: 4.5°F/s or 2.5°C/s

• Resistance tolerance at 77°F (25°C) ±5%;

for ±10% replace T5 by T10 in code

• Tolerance on B value ±200 K

• Minimum temperature: -40°F (-40°C)

• Maximum temperature: 257°F (125°C)

• Dissipation factor: 1.2 mW/K

Cleaning

Ultrasonic cleaning in methanol or

isopropanol not exceeding 40 kHz for 5

minutes, or aqueous cleaning not exceeding

158°F (70°C) for 7 minutes (recommended).

• Time constant: 4 seconds maximum

0.2 mm 0.ꢀ mm

(0.078 in 0.00ꢁ in)

Type NHQT

Speciﬁcation

Surface mount chip 0402 size

Description

A range of 0402 size surface mount NTC

chip thermistors.The terminations are nickel

barrier with tin plating.

General

ꢀ mm 0.ꢀ5 mm

(0.039ꢁ in 0.006 in)

Soldering Recommendations

• Maximum storage time in closed package:

One year

NTC Type NHQT Outline Drawing

• Maximum storage time exposed to

ambient conditions of 59°F to 86°F (15°C

to 30°C), 15% to 70% RH: 30 days

• Drying prior to soldering: Not to exceed

48h at 176°F (80°C) or 16h at 212°F

(100°C) or 8h at 257°F (125°C)

• Flux type: R or RMA

Code

R25 W

B (25/85)

NHQT500B285T5

2850

NHQT202B410T5

NHQT252B410T5

2000

2500

4100

Flow Soldering Conditions

• Preheat temperature: 176°F to 302°F (80°C

to 150°C)

• Maximum rate of temperature change:

4.5°F/s or 2.5°C/s

• Maximum solder temperature: 509°F

(265°C)

• Maximum dwell time: 10 seconds

• Cooling in ambient or air ﬂow of 5m/s

NHQT332B410T5

NHQT352B410T5

NHQT402B410T5

NHQT652B410T5

NHQT153B380T5

NHQT203B380T5

NHQT223B380T5

NHQT303B400T5

NHQT473B400T5

NHQT683B400T5

NHQT154B425T5

3300

4100

3800

4000

4250

3500

4000

6500

15000

20000

22000

30000

47000

68000

150000

Reflow Soldering Conditions

• Method infrared, hot gas, vapor

• Maximum rate of preheat temperature

change: 4.5°F/s or 2.5°C/s

• Maximum temperature: 437°F (225°C)

• Maximum time above: 392°F (200°C) 30

seconds

• Maximum radiant ﬂux: (0.1 to 100 Wµ) 5

Wµ/cm2

• Maximum hot air temperature: 527°F

(275°C) at 4 m/s

Data

• Resistance tolerance at 77°F (25°C) ±5%;

for ±10% replace T5 by T10 in code

• Tolerance on B value ±200 K

• Maximum vapor temperature: 419°F

(215°C)

• Maximum rate of cooling: 4.5°F/s or

2.5°C/s

• Minimum temperature: -40°F (-40°C)

• Maximum temperature: 257°F (125°C)

• Dissipation factor: 1.5 mW/K

• Time constant: 4 seconds maximum

Cleaning

Ultrasonic cleaning in methanol or

isopropanol notexceeding 40 kHz for 5

minutes, or aqueous cleaning not exceeding

158°F (70°C) for 7 minutes (recommended).

www.amphenol-sensors.com

Other company names and product names used in this document are the registered trademarks or

trademarks of their respective owners.

Amphenol

Advanced Sensors

AAS-920-324F - 03/2017

NHQM501B325T10相关文章

配单直通车

深圳市中利达电子科技有限公司服务专线: 0755-83200645/13686833545 在线联系:

QQ：1902134819 复制

QQ：2881689472 复制

柒号芯城电子商务（深圳）有限公司服务专线: 18922803401 在线联系:

QQ：2881677436 复制

QQ：2881620402 复制

北京元坤伟业科技有限公司服务专线: 010-62104931621064316210489162104791 在线联系:

QQ：857273081 复制

QQ：1594462451 复制

深圳市芯福林电子有限公司服务专线: 13418564337 在线联系:

QQ：2881495808 复制

QQ：308365177 复制

首天国际（深圳）科技有限公司服务专线: 0755-82807802/82807803 在线联系:

QQ：528164397 复制

QQ：1318502189 复制

NHQM501R10产品参数

型号:	NHQM501R10
生命周期：	Contact Manufacturer
IHS 制造商：	THERMOMETRICS
包装说明：	,
Reach Compliance Code：	unknown
ECCN代码：	EAR99
HTS代码：	8533.40.80.70
风险等级：	5.83
制造商序列号：	NHQM
安装特点：	SURFACE MOUNT
端子数量：	2
最高工作温度：	125 °C
最低工作温度：	-40 °C
封装形状：	RECTANGULAR PACKAGE
电阻：	500 Ω
电阻器类型：	NTC THERMISTOR
表面贴装：	YES
端子形状：	WRAPAROUND
热敏指数：	3300 K
热敏电阻器应用：	TEMPERATURE COMPENSATION
Base Number Matches：	1

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