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产品型号NL27WZ07DFT2G的概述

NL27WZ07DFT2G的概述 NL27WZ07DFT2G是由ON Semiconductor公司生产的一款高性能TTL（晶体管-晶体管逻辑）电路，属于74系列，主要用于实现反相器功能。反相器广泛应用于逻辑电路中，通过将输入信号反转，实现信号的逻辑转换。NL27WZ07DFT2G具有低功耗、高速和高抗干扰能力，适合在各种电子应用中使用。在现代电子设计中，随着对功耗和速度要求的不断提高，NL27WZ07DFT2G的设计在一定程度上满足了这些需求。该芯片以其独特的特性和功能，成为了许多电子应用中的理想选择。 NL27WZ07DFT2G的详细参数 NL27WZ07DFT2G在技术规格和功能参数上具有以下特点： - 电源电压 (VCC): 2V至6V（典型值为5V） - 输入电压范围 (VI): 0V至VCC - 输出电压范围 (VO): 0V至VCC - 输入电流 (II): 最大20µ...

产品型号NL27WZ07DFT2G的Datasheet PDF文件预览

NL27WZ07

Dual Buffer with Open Drain

Outputs

The NL27WZ07 is a high performance dual buffer with open drain

outputs operating from a 1.65 to 5.5 V supply.

The internal circuit is composed of multiple stages, including an open

drain output which provides the capability to set output switching level.

This allows the NL27WZ07 to be used to interface 5 V circuits to circuits

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of any voltage between V and 7.0 V using an external resistor and

MARKING

power supply.

DIAGRAMS

Features

SC−88

DF SUFFIX

CASE 419B

• Extremely High Speed: t 2.3 ns (typical) at V = 5.0 V

M7^d

• Designed for 1.65 V to 5.5 V V Operation, CMOS compatible

• Over Voltage Tolerant Inputs

• LVTTL Compatible − Interface Capability with 5.0 V TTL Logic

Pin 1

with V = 3.0 V

d = Date Code

• LVCMOS Compatible

• 24 mA Output Sink Capability

• Near Zero Static Supply Current Substantially Reduces System

TSOP−6

DT SUFFIX

CASE 318G

M7^d

Power Requirements

• Chip Complexity: FET = 72; Equivalent Gate = 18

• Pb−Free Packages are Available

Pin 1

d = Date Code

PIN ASSIGNMENT

IN A1

GND

IN A2

OUT Y1

IN A1

GND

IN A2

OUT Y2

OUT Y1

OUT Y2

FUNCTION TABLE

A Input

Y Output

Figure 1. Pinout (Top View)

IN A1

IN A2

OUT Y1

OUT Y2

ORDERING INFORMATION

See detailed ordering and shipping information in the package

dimensions section on page 4 of this data sheet.

Figure 2. Logic Symbol

Semiconductor Components Industries, LLC, 2004

Publication Order Number:

April, 2004 − Rev. 7

NL27WZ07/D

NL27WZ07

MAXIMUM RATINGS

Symbol

Characteristics

Value

Unit

DC Supply Voltage

*0.5 to )7.0

DC Input Voltage

*0.5 ≤ V ≤ )7.0

DC Output Voltage

Output in Z or LOW State (Note 1)

V < GND

*0.5 ≤ V ≤ 7.0

DC Input Diode Current

*50

°C

DC Output Diode Current

DC Output Sink Current

< GND

*50

$50

DC Supply Current per Supply Pin

DC Ground Current per Ground Pin

Storage Temperature Range

Power Dissipation in Still Air

Thermal Resistance

$100

GND

$100

*65 to )150

STG

SC−88, TSOP−6

200

°C/W

°C

333

260

Lead Temperature, 1 mm from case for 10 s

Junction Temperature under Bias

)150

°C

Latch−Up Performance

Moisture Sensitivity

Flammability Rating

ESD Classification

Above V and Below GND at 85°C (Note 5)

$500

Latch−Up

MSL

Level 1

Oxygen Index: 28 to 34

UL 94 V−0 @ 0.125 in

Human Body Model (Note 3)

Machine Model (Note 4)

Charged Device Model (Note 5)

> 2000

> 200

N/A

ESD

Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit

values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,

damage may occur and reliability may be affected.

1. I absolute maximum rating must be observed.

2. Tested to EIA/JESD22−A114−A, rated to EIA/JESD22−A114−B.

3. Tested to EIA/JESD22−A115−A, rated to EIA/JESD22−A115−A.

4. Tested to JESD22−C101−A

5. Tested to EIA/JESD78

RECOMMENDED OPERATING CONDITIONS

Symbol

Parameter

Min

Max

Unit

Supply Voltage

Operating

Data Retention Only

1.65

1.5

5.5

Input Voltage

5.5

Output Voltage

(Z or LOW State)

Operating Free−Air Temperature

Input Transition Rise or Fall Rate

*40

)85

°C

Dt/DV

= 2.5 V $0.2 V

=3.0 V $0.3 V

=5.0 V $0.5 V

ns/V

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NL27WZ07

DC ELECTRICAL CHARACTERISTICS

= 25°C

*40°C ≤T ≤ 85°C

(V)

Min

Typ

Max

Min

Max

Symbol

Parameter

Condition

Unit

High−Level Input Voltage

1.65 to 1.95 0.75 V

0.75 V

2.3 to 5.5

0.75 V

Low−Level Input Voltage

1.65 to 1.95

2.3 to 5.5

0.3 V

Z−State Output Leakage

Current

= V

2.3 to 5.5

$5.0

$10.0

LKG

= V or GND

OUT

Low−Level Output Voltage

= 100 mA

1.65 to 5.5

1.65

2.3

0.0

0.1

0.24

0.3

0.1

0.24

0.3

= V

= 4 mA

= 8 mA

0.08

0.20

0.22

0.28

0.38

0.42

= 12 mA

= 16 mA

= 24 mA

= 32 mA

2.7

0.4

3.0

0.4

3.0

0.55

$0.1

0.55

$1.0

4.5

Input Leakage Current

or V

= V or

0 to 5.5

OUT

GND

Power Off−Output

Leakage Current

= 5.5 V

OFF

OUT

Quiescent Supply Current

= V or GND

5.5

AC ELECTRICAL CHARACTERISTICS t = t = 2.5 ns; C = 50 pF; R = 500 W

= 25°C

*40°C ≤T ≤ 85°C

Min

1.8

1.2

0.8

0.5

1.8

1.2

0.8

0.5

Typ

5.3

3.7

2.9

2.3

5.3

2.8

2.1

1.4

Max

11.5

5.8

Min

1.8

1.2

0.8

0.5

1.8

1.2

0.8

0.5

Max

12.0

6.4

Symbol

Parameter

Condition

(V)

Unit

Propagation Delay

(Figure 3 and 4)

R = 5000 W, C = 15 pF

1.8 $ 0.15

2.5 $ 0.2

3.3 $ 0.3

5.0 $ 0.5

1.8 $ 0.15

2.5 $ 0.2

3.3 $ 0.3

5.0 $ 0.5

PZL

L =

R = 500 W, C = 50 pF

1 L

L =

4.4

4.8

3.5

3.9

Propagation Delay

(Figure 3 and 4)

R = 5000 W, C = 15 pF

11.5

5.8

12.0

6.4

PLZ

L =

R = 500 W, C = 50 pF

1 L

L =

4.4

4.8

3.5

3.9

CAPACITIVE CHARACTERISTICS

Symbol

Parameter

Input Capacitance

Output Capacitance

Power Dissipation Capacitance (Note 6)

Condition

Typical

2.5

Unit

= 5.5 V, V = 0 V or V

4.0

OUT

10 MHz, V = 5.5 V, V = 0 V or V

4.0

6. C is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.

Average operating current can be obtained by the equation: I

power consumption; P = C ꢀ V

₎= C ꢀ V ꢀ f ) I . C is used to determine the no−load dynamic

CC(OPR

PD CC in CC PD

ꢀ f ) I ꢀ V

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NL27WZ07

50%

GND

PLZ

PZL

HIGH

IMPEDANCE

50% V

)0.3 V

Figure 3. Switching Waveforms

PULSE

GENERATOR

DUT

R = Z

of pulse generator (typically 50 W)

OUT

Figure 4. Test Circuit

ORDERING INFORMATION

Device Nomenclature

No. of

Logic

Circuit

Indicator

Temp

Range

Identifier

Tape &

Reel

Suffix

Gates

per

Package

Package Type

(Name/SOT#/

Common Name)

Device

Function

Package

Suffix

†

Technology

Device

Shipping

NL27WZ07DFT2

SC−88 / SOT−363

/ SC−70

178 mm (7”)

3000 Unit

NL27WZ07DFT2G

SC−88 / SOT−363

/ SC−70

178 mm (7”)

3000 Unit

(Pb−Free)

NL27WZ07DTT1

TSOP−6 / SOT−23

/ SC−59

178 mm (7”)

3000 Unit

NL27WZ07DTT1G

TSOP−6 / SOT−23

/ SC−59

178 mm (7”)

3000 Unit

(Pb−Free)

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

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NL27WZ07

PACKAGE DIMENSIONS

SC−88 (SOT−363)

DF SUFFIX

CASE 419B−02

ISSUE T

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. 419B−01 OBSOLETE, NEW STANDARD 419B−02.

INCHES

DIM MIN MAX

MILLIMETERS

MIN

1.80

1.15

0.80

0.10

MAX

2.20

1.35

1.10

0.30

0.071 0.087

0.045 0.053

0.031 0.043

0.004 0.012

0.026 BSC

−−− 0.004

0.004 0.010

0.004 0.012

0.008 REF

−B−

0.65 BSC

−−−

0.10

0.25

0.30

0.20 REF

0.079 0.087

2.00

2.20

D 6 PL

0.2 (0.008)

SOLDERING FOOTPRINT*

0.50

0.0197

0.65

0.025

0.65

0.025

0.40

0.0157

1.9

0.0748

inches

SCALE 20:1

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

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NL27WZ07

PACKAGE DIMENSIONS

TSOP−6

DT SUFFIX

CASE 318G−02

ISSUE K

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. MAXIMUM LEAD THICKNESS INCLUDES

LEAD FINISH THICKNESS. MINIMUM LEAD

THICKNESS IS THE MINIMUM THICKNESS

OF BASE MATERIAL.

4. DIMENSIONS A AND B DO NOT INCLUDE

MOLD FLASH, PROTRUSIONS, OR GATE

BURRS.

MILLIMETERS

DIM MIN MAX

INCHES

MIN MAX

2.90

1.30

0.90

0.25

0.85

3.10 0.1142 0.1220

1.70 0.0512 0.0669

1.10 0.0354 0.0433

0.50 0.0098 0.0197

1.05 0.0335 0.0413

0.013 0.100 0.0005 0.0040

0.05 (0.002)

0.10

0.20

1.25

0.26 0.0040 0.0102

0.60 0.0079 0.0236

1.55 0.0493 0.0610

2.50

3.00 0.0985 0.1181

SOLDERING FOOTPRINT*

2.4

0.094

0.95

0.037

1.9

0.075

0.95

0.037

0.7

0.028

1.0

0.039

inches

SCALE 10:1

Figure 5. TSOP−6

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

ON Semiconductor and

are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice

to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability

arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.

“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights

nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications

intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should

Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,

and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death

associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal

Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

PUBLICATION ORDERING INFORMATION

LITERATURE FULFILLMENT:

N. American Technical Support: 800−282−9855 Toll Free

USA/Canada

ON Semiconductor Website: http://onsemi.com

Order Literature: http://www.onsemi.com/litorder

Literature Distribution Center for ON Semiconductor

P.O. Box 5163, Denver, Colorado 80217 USA

Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada

Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada

Email: orderlit@onsemi.com

Japan: ON Semiconductor, Japan Customer Focus Center

2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051

Phone: 81−3−5773−3850

For additional information, please contact your

local Sales Representative.

NL27WZ07/D

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NL27WZ07DFT2G产品参数

型号:	NL27WZ07DFT2G
Brand Name：	ON Semiconductor
是否无铅：	不含铅
是否Rohs认证：	符合
生命周期：	Active
IHS 制造商：	ON SEMICONDUCTOR
零件包装代码：	SOT-363
包装说明：	TSSOP, TSSOP6,.08
针数：	6
制造商包装代码：	419B-02
Reach Compliance Code：	compliant
ECCN代码：	EAR99
HTS代码：	8542.39.00.01
Factory Lead Time：	1 week
风险等级：	0.68
系列：	LVC/LCX/Z
JESD-30 代码：	R-PDSO-G6
JESD-609代码：	e3
长度：	2 mm
负载电容（CL）：	50 pF
逻辑集成电路类型：	BUFFER
最大I（ol）：	0.024 A
湿度敏感等级：	1
功能数量：	2
输入次数：	1
端子数量：	6
最高工作温度：	125 °C
最低工作温度：	-55 °C
输出特性：	OPEN-DRAIN
封装主体材料：	PLASTIC/EPOXY
封装代码：	TSSOP
封装等效代码：	TSSOP6,.08
封装形状：	RECTANGULAR
封装形式：	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
包装方法：	TR
峰值回流温度（摄氏度）：	260
电源：	3.3 V
最大电源电流（ICC）：	0.1 mA
Prop。Delay @ Nom-Sup：	4.8 ns
传播延迟（tpd）：	12 ns
认证状态：	Not Qualified
施密特触发器：	NO
座面最大高度：	1.1 mm
子类别：	Gates
最大供电电压 (Vsup)：	5.5 V
最小供电电压 (Vsup)：	1.65 V
标称供电电压 (Vsup)：	3.3 V
表面贴装：	YES
技术：	CMOS
温度等级：	MILITARY
端子面层：	Tin (Sn)
端子形式：	GULL WING
端子节距：	0.65 mm
端子位置：	DUAL
处于峰值回流温度下的最长时间：	40
宽度：	1.25 mm
Base Number Matches：	1

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