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产品型号NUP4201DR2的概述

芯片NUP4201DR2的概述 NUP4201DR2是一款高灵敏度、低功耗的双极性晶体管级别的开关芯片,主要应用于信号增益、开关控制及各种电子电路的驱动等领域。该芯片拥有多项先进特性,结合了现代集成电路技术,广泛用于消费电子产品、通信设备及工业控制系统等。 芯片NUP4201DR2的详细参数 NUP4201DR2的主要参数如下: - 工作电压:通常在2.5V到30V范围内工作,使其在多种应用中表现出色。 - 最大电流:该芯片的输出电流可达500毫安,满足大多数负载驱动需求。 - 工作温度范围:-40°C至+125°C,适应各种复杂环境条件。 - 开关速度:在一定负载下,其开关响应时间可达到数十微秒,这对于需要高速响应的应用场合尤为重要。 - 封装类型:常见的封装形式为SOT-23,适合表面贴装技术(SMD),尤其是在空间受限的应用中。 芯片NUP4201DR2的厂家、包装和封装 NU...

产品型号NUP4201DR2的Datasheet PDF文件预览

NUP4201DR2  
Low Capacitance Surface  
Mount TVS for High−Speed  
Data Interfaces  
The NUP4201DR2 transient voltage suppressor is designed to  
protect equipment attached to high speed communication lines from  
ESD, EFT, and lightning.  
http://onsemi.com  
Features:  
SO−8 LOW CAPACITANCE  
VOLTAGE SUPPRESSOR  
500 WATTS PEAK POWER  
6 VOLTS  
SO−8 Package  
Peak Power − 500 Watts 8 x 20 mS  
ESD Rating:  
IEC 61000−4−2 (ESD) 15 kV (air) 8 kV (contact)  
IEC 61000−4−4 (EFT) 40 A (5/50 ns)  
IEC 61000−4−5 (lightning) 23 (8/20 ms)  
PIN CONFIGURATION  
AND SCHEMATIC  
UL Flammability Rating of 94V−0  
Typical Applications:  
High Speed Communication Line Protection  
USB Power and Data Line Protection  
Video Line Protection  
Base Stations  
HDSL, IDSL Secondary IC Side Protection  
Microcontroller Input Protection  
I/O 1  
REF 1  
REF 1  
I/O 2  
1
2
3
4
8
7
6
5
REF 2  
I/O 4  
I/O 3  
REF 2  
8
MAXIMUM RATINGS  
1
Rating  
Symbol  
Value  
Unit  
SO−8  
CASE 751  
PLASTIC  
Peak Power Dissipation  
P
pk  
500  
W
8 x 20 mS @ T = 25°C (Note 1)  
A
Junction and Storage  
Temperature Range  
T , T  
55 to  
+150  
°C  
°C  
J
stg  
MARKING DIAGRAM  
Lead Solder Temperature −  
T
L
260  
Maximum 10 Seconds Duration  
1. Non−repetitive current pulse 8 x 20 mS exponential decay waveform  
P4201  
LYW  
P4201 = Device Code  
L
Y
W
= Location Code  
= Year  
= Work Week  
ORDERING INFORMATION  
Device  
Package  
Shipping  
NUP4201DR2  
SO−8  
2500/Tape & Reel  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
Semiconductor Components Industries, LLC, 2004  
1
Publication Order Number:  
March, 2004 − Rev. 3  
NUP4201DR2/D  
 
NUP4201DR2  
ELECTRICAL CHARACTERISTICS  
Characteristic  
Symbol  
Min  
6.0  
N/A  
N/A  
N/A  
Typ  
Max  
Unit  
V
Reverse Breakdown Voltage @ I = 1.0 mA  
V
BR  
t
Reverse Leakage Current @ V  
= 5.0 Volts  
I
R
10  
mA  
V
RWM  
Maximum Clamping Voltage @ I = 1.0 A, 8 x 20 mS  
V
C
9.8  
12  
PP  
Maximum Clamping Voltage @ I = 10 A, 8 x 20 mS  
V
C
V
PP  
Between I/O Pins and Ground @ DC Bias = 0 V, 1.0 MHz  
Between I/O Pins and I/O @ DC Bias = 0 V, 1.0 MHz  
Capacitance  
Capacitance  
5.0  
2.5  
10  
pF  
pF  
5.0  
ELECTRICAL CHARACTERISTICS  
I
(T = 25°C unless otherwise noted)  
UNIDIRECTIONAL (Circuit tied to Pins 1 and 3 or 2 and 3)  
A
I
F
Symbol  
Parameter  
I
PP  
Maximum Reverse Peak Pulse Current  
V
C
Clamping Voltage @ I  
PP  
V
C
V
V
BR RWM  
V
I
V
F
V
RWM  
Working Peak Reverse Voltage  
R
T
I
I
R
Maximum Reverse Leakage Current @ V  
RWM  
V
Breakdown Voltage @ I  
Test Current  
BR  
T
I
T
I
PP  
QV  
Maximum Temperature Coefficient of V  
Forward Current  
BR  
BR  
I
F
Uni−Directional TVS  
V
F
Forward Voltage @ I  
F
Z
Maximum Zener Impedance @ I  
Reverse Current  
ZT  
ZT  
I
ZK  
Z
ZK  
Maximum Zener Impedance @ I  
ZK  
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2
NUP4201DR2  
TYPICAL CHARACTERISTICS  
8
7
6
5
4
3
2
9
8
7
6
5
4
3
2
1
0
1
0
−100  
−50  
0
50  
100  
150  
200  
−100  
−50  
0
50  
100  
150  
200  
T, TEMPERATURE (°C)  
T, TEMPERATURE (°C)  
Figure 1. Reverse Breakdown versus  
Temperature  
Figure 2. Reverse Leakage versus  
Temperature  
35  
30  
25  
20  
15  
10  
5
100  
90  
80  
70  
60  
50  
40  
30  
20  
t
r
PEAK VALUE I  
@ 8 ms  
RSM  
PULSE WIDTH (t ) IS DEFINED  
AS THAT POINT WHERE THE  
PEAK CURRENT DECAY = 8 ms  
P
HALF VALUE I  
/2 @ 20 ms  
RSM  
t
P
10  
0
0
0
20  
40  
t, TIME (ms)  
60  
80  
0
10  
20  
30  
40  
50  
60  
70  
80  
90  
I , PEAK PULSE CURRENT (A)  
PP  
Figure 3. 8 × 20 ms Pulse Waveform  
Figure 4. Clamping Voltage versus Peak Pulse  
Current  
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3
NUP4201DR2  
APPLICATIONS INFORMATION  
The new NUP4201DR2 device is a low capacitance TVS  
Option 2  
Diode array designed to protect sensitive electronics such as  
communications systems, computers, and computer  
peripherals against damage due to ESD conditions or  
transient voltage conditions. Because of its low capacitance  
array configuration, it can be used in high speed I/O data  
lines.  
Four Data lines protection with Bias and power supply  
isolation resistor.  
I/O 1  
I/O 2  
V
CC  
1
2
3
4
The integrated design of the NUP4201DR2 device offers  
surge rated, low capacitance steering diodes and a TVS  
diode integrated in a single package (SO−8). If a transient  
condition occurs, the steering diodes will drive the transient  
condition to the positive polarity of the power supply or to  
ground. The TVS device protects the power line against  
over−voltage conditions to avoid damage in any  
downstream components.  
8
7
10 K  
6
5
I/O 3  
I/O 4  
The NUP4201DR2 device can be isolated from the power  
supply by connecting a series resistor between pins 2 & 3 and  
Vcc. A resistor of 10KW is recommended for isolation  
purposes. The internal TVS and steering diodes remain  
biased, which provides the advantage of lower capacitance.  
NUP4201DR2 Device’s Configurations Options  
The NUP4201DR2 is able to protect up to four data lines  
against transient over−voltage conditions by driving them to  
a fixed reference point for clamping purposes. The steering  
diodes will be forward biased whenever the voltage on the  
protected line exceeds the reference voltage (Vcc+Vf). The  
diodes will drive the transient current away from the  
sensitive circuit.  
Data lines are connected at pins 1,4,6 and 7. The negative  
reference is connected at pins 5 and 8. These pins must be  
connected directly to ground by using a ground plane to  
minimize the PCB’s ground inductance. It is very important  
to reduce as much as possible the PCB trace lengths to  
minimize parasitic inductances.  
Option 3  
Four Data lines protection using internal TVS diode as  
reference.  
I/O 1  
I/O 2  
1
2
3
4
8
7
NC  
NC  
Option 1  
6
5
Four Data lines protection and power supply protection  
using Vcc as reference.  
I/O 3  
I/O 4  
I/O 1  
I/O 2  
In the case of applications in which a positive supply  
reference is not available or full isolation is required, the  
internal TVS could be used as the reference, so for this  
purpose, the pins 2 and 3 are not connected. In this case, the  
steering diodes will conduct whenever the voltage on the  
protected line exceeds the working voltage of the TVS plus  
one diode drop (Vc=Vf + VTVS).  
1
2
3
4
8
7
V
CC  
6
5
I/O 3  
I/O 4  
For this configuration, connect pins 2 & 3 directly to the  
positive supply rail (Vcc), the data lines are referenced to the  
supply voltage. The internal TVS diode prevents  
over−voltage on the supply rail.  
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4
NUP4201DR2  
“Rail to Rail” Protection Topology  
The following figure shows a case when discrete diodes  
are configured for rail to rail protection on an I/O line:  
a good board layout to minimize the effects of the parasitic  
inductances.  
Nevertheless, some disadvantages are still present when  
discrete diodes are used to suppress ESD conditions in “rail  
to rail” configuration. If the ESD current is too high, it can  
potentially result in the damage of any components  
connected to that rail and it is also possible to experience  
damage in the discrete diodes if their power dissipation  
capability is exceeded.  
V
CC  
ESD  
Positive  
11  
D1  
VF + V  
CC  
The NUP4201DR2 On Semiconductor’s device provides  
a concept named “RailClamp” which is designed to  
eliminate the disadvantages of the usage of discrete diodes  
for ESD protection. The RailClamp concept is achieved  
with the integration of the TVS device in together with the  
steering diodes.  
−VF  
12  
D2  
ESD  
Negative  
Upon the above figure, it is possible to observe that if a  
positive ESD condition occurs, the D1 diode will be forward  
biased while the D2 diode will be biased when a negative  
ESD condition occurs. A valid first approximation of the  
resulting clamping voltage due to the protection diodes can  
be made as follows:  
D1  
D2  
D3  
D4  
D5  
D6  
D7  
D8  
For positive pulse conditions:  
Vc = Vcc + Vf  
For negative pulse conditions:  
Vc = −Vf  
It is important to mention that effects of parasitic  
inductances must be considered for fast rise time transient  
conditions because the clamping voltage on the protected  
circuit will be different than in the previous case. A valid  
approximation of the resulting clamping voltage can be  
made as show below:  
0
Rail to Rail Protection with integrated TBS to achieve the  
RailClamp concept  
During an ESD condition, the ESD current will be driven  
to ground through the TVS device, so the resulting clamping  
voltage on the protected IC will be:  
For positive pulse conditions:  
Vc = Vcc + Vf + (L diESD/dt)  
Vc = VF(RailClamp) + VTVS.  
The clamping voltage of the TVS device is shown as part  
of the specifications of the NUP4201DR2 datasheet. The  
clamping voltage will depend on the magnitude of the ESD  
current. The steering diodes are fast switching devices with  
unique forward voltage and low capacitance characteristics.  
For negative pulse conditions:  
Vc = −Vf – (L diESD/dt)  
As shown in the formulas, the clamping voltage (Vc) not  
only depends on the Vf of the steering diodes but also in the  
L diESD/dt factor, so this is why it is very important to have  
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5
NUP4201DR2  
TYPICAL APPLICATIONS  
UPSTREAM  
USB PORT  
V
BUS  
V
BUS  
V
BUS  
D+  
D−  
V
BUS  
R
R
T
D+  
DOWNSTREAM  
USB PORT  
T
D−  
V
V
BUS  
BUS  
NUP4201DR2  
USB  
Controller  
GND  
GND  
C
C
T
T
V
BUS  
V
BUS  
NUP2201DT1  
R
R
T
DOWNSTREAM  
USB PORT  
D+  
T
D−  
GND  
C
C
T
T
ESD Protection for USB Port  
R1  
RTIP  
R3  
R2  
RRING  
T1  
V
CC  
T1/E1  
TRANCEIVER  
NUP4201DR2  
R4  
R5  
TTIP  
TRING  
T2  
TI/E1 Interface Protection  
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6
NUP4201DR2  
PACKAGE DIMENSIONS  
SO−8  
CASE 751−07  
ISSUE AB  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
−X−  
A
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSION A AND B DO NOT INCLUDE MOLD  
PROTRUSION.  
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER  
SIDE.  
8
5
4
5. DIMENSION D DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN  
EXCESS OF THE D DIMENSION AT MAXIMUM  
MATERIAL CONDITION.  
S
M
M
B
0.25 (0.010)  
Y
1
K
−Y−  
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW  
STANDAARD IS 751−07  
G
MILLIMETERS  
DIM MIN MAX  
INCHES  
MIN  
MAX  
0.197  
0.157  
0.069  
0.020  
A
B
C
D
G
H
J
4.80  
3.80  
1.35  
0.33  
5.00 0.189  
4.00 0.150  
1.75 0.053  
0.51 0.013  
C
N X 45  
_
SEATING  
PLANE  
−Z−  
1.27 BSC  
0.050 BSC  
0.10 (0.004)  
0.10  
0.19  
0.40  
0
0.25 0.004  
0.25 0.007  
1.27 0.016  
0.010  
0.010  
0.050  
8
M
J
H
D
K
M
N
S
8
0
_
_
_
_
0.25  
5.80  
0.50 0.010  
6.20 0.228  
0.020  
0.244  
M
S
S
X
0.25 (0.010)  
Z
Y
SOLDERING FOOTPRINT*  
1.52  
0.060  
7.0  
0.275  
4.0  
0.155  
0.6  
0.024  
1.270  
0.050  
mm  
inches  
ǒ
Ǔ
SCALE 6:1  
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
http://onsemi.com  
7
NUP4201DR2  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights  
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should  
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
N. American Technical Support: 800−282−9855 Toll Free  
USA/Canada  
ON Semiconductor Website: http://onsemi.com  
Order Literature: http://www.onsemi.com/litorder  
Literature Distribution Center for ON Semiconductor  
P.O. Box 5163, Denver, Colorado 80217 USA  
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada  
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada  
Email: orderlit@onsemi.com  
Japan: ON Semiconductor, Japan Customer Focus Center  
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051  
Phone: 81−3−5773−3850  
For additional information, please contact your  
local Sales Representative.  
NUP4201DR2/D  
配单直通车
NUP4201DR2产品参数
型号:NUP4201DR2
是否无铅:不含铅
是否Rohs认证:不符合
生命周期:Active
IHS 制造商:ROCHESTER ELECTRONICS LLC
包装说明:R-PDSO-G8
针数:8
制造商包装代码:CASE 751-07
Reach Compliance Code:unknown
风险等级:5.83
Is Samacsys:N
其他特性:LOW CAPACITANCE
最小击穿电压:6 V
配置:SINGLE
二极管元件材料:SILICON
二极管类型:TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 代码:R-PDSO-G8
JESD-609代码:e0
湿度敏感等级:NOT SPECIFIED
最大非重复峰值反向功率耗散:500 W
元件数量:1
端子数量:8
封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR
封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):240
极性:UNIDIRECTIONAL
认证状态:COMMERCIAL
表面贴装:YES
技术:AVALANCHE
端子面层:TIN LEAD
端子形式:GULL WING
端子位置:DUAL
处于峰值回流温度下的最长时间:30
Base Number Matches:1
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