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产品型号OPA140ATDD2的概述

OPA140ATDD2芯片概述 OPA140ATDD2是一款高性能的运算放大器,属于Texas Instruments(德州仪器)公司产品线。这款芯片采用了先进的CMOS技术,集成了多种特性,使其在许多应用中都表现出色。OP放大器广泛应用于信号处理、数据采集、过滤器设计等各种电子设备中,因其具有高精度、高带宽和低噪声等优点,适合用于高要求的条件下。 OPA140ATDD2芯片具有端接电阻优化的设计,使其在各种负载条件下都能提供稳定的增益。此外,其较高的电源电压范围和宽广的输入共模电压范围使其十分灵活,能够在许多复杂电路中使用。许多设计工程师利用OPA140为了满足高精度和低失真的音频应用需求,展现出了该产品在音频放大和信号处理上的广泛适用性。 OPA140ATDD2详细参数 OPA140ATDD2的主要参数如下: - 增益带宽积(GBP): 20MHz - 输入失调电压: 50µV -...

产品型号OPA140ATDD2的Datasheet PDF文件预览

OPA140A-DIE  
www.ti.com  
SBOS610B MARCH 2012REVISED MARCH 2012  
HIGH-PRECISION, LOW-NOISE, RAIL-TO-RAIL OUTPUT,  
11-MHZ JFET OPERATIONAL AMPLIFIER  
Check for Samples: OPA140A-DIE  
1
FEATURES  
Very Low Offset Drift  
APPLICATIONS  
Very Low Offset  
Battery-Powered Instruments  
Low Input Bias Current  
Very Low 1/f Noise  
Industrial Controls  
Medical Instrumentation  
Photodiode Amplifiers  
Active Filters  
Low Noise  
Slew Rate  
Low Supply Current  
Data Acquisition Systems  
Automatic Test Systems  
Input Voltage Range Includes V– Supply  
Single-Supply Operation: 4.5 V to 36 V  
Dual-Supply Operation: ±2.25 V to ±18 V  
No Phase Reversal  
DESCRIPTION  
The OPA140A operational amplifier is a low-power JFET input amplifier that features good drift and low input  
bias current. The rail-to-rail output swing and input range that includes V– allow designers to take advantage of  
the low-noise characteristics of JFET amplifiers while also interfacing to modern, single-supply, precision analog-  
to-digital converters (ADCs) and digital-to-analog converters (DACs). The OPA140A runs on a single 4.5-V to  
36-V supply or dual ±2.25-V to ±18-V supplies.  
ORDERING INFORMATION(1)  
PACKAGE  
DESIGNATOR  
PRODUCT  
PACKAGE(2)  
ORDERABLE PART NUMBER  
PACKAGE QUANTITY  
OPA140ATDD1  
OPA140ATDD2  
252  
10  
OPA140A  
TD  
Bare Die In Waffle Pack  
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
web site at www.ti.com.  
(2) Processing is per the Texas Instruments commercial production baseline and is in compliance with the Texas Instruments Quality  
Control System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room  
temperature only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not  
warranted. Visual Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2012, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
OPA140A-DIE  
SBOS610B MARCH 2012REVISED MARCH 2012  
www.ti.com  
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with  
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.  
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more  
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.  
BARE DIE INFORMATION  
BACKSIDE  
POTENTIAL  
BOND PAD  
METALLIZATION COMPOSITION  
BOND PAD  
THICKNESS  
DIE THICKNESS  
BACKSIDE FINISH  
15 mils.  
Silicon with backgrind  
Floating  
TiW/AlCu (0.5%)  
1100 nm  
Table 1. Bond Pad Coordinates in Microns  
DISCRIPTION  
PAD NUMBER  
X MIN  
Y MIN  
X MAX  
Y MAX  
VIN  
N/C  
VIP  
N/C  
V-  
1
2
3
4
5
6
7
469.600  
-720.500  
544.600  
-645.500  
49.500  
-430.500  
124.500  
-355.500  
1034.050  
1264.500  
1264.500  
-124.550  
-107.500  
-737.500  
1109.050  
1339.500  
1339.500  
-49.550  
-32.500  
-662.500  
OUT  
V+  
2
Copyright © 2012, Texas Instruments Incorporated  
Product Folder Link(s): OPA140A-DIE  
PACKAGE OPTION ADDENDUM  
www.ti.com  
31-Mar-2012  
PACKAGING INFORMATION  
Status (1)  
Eco Plan (2)  
MSL Peak Temp (3)  
Samples  
Orderable Device  
Package Type Package  
Drawing  
Pins  
Package Qty  
Lead/  
Ball Finish  
(Requires Login)  
OPA140ATDD1  
OPA140ATDD2  
ACTIVE  
ACTIVE  
0
0
252  
10  
TBD  
TBD  
Call TI  
Call TI  
N / A for Pkg Type  
N / A for Pkg Type  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 1  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,  
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should  
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are  
sold subject to TIs terms and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TIs standard  
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where  
mandated by government requirements, testing of all parameters of each product is not necessarily performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and  
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide  
adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,  
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information  
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a  
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual  
property of the third party, or a license from TI under the patents or other intellectual property of TI.  
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied  
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive  
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional  
restrictions.  
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all  
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not  
responsible or liable for any such statements.  
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably  
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing  
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products  
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be  
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in  
such safety-critical applications.  
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are  
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military  
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at  
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.  
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are  
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated  
products in automotive applications, TI will not be responsible for any failure to meet such requirements.  
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:  
Products  
Audio  
Applications  
www.ti.com/audio  
amplifier.ti.com  
dataconverter.ti.com  
www.dlp.com  
Automotive and Transportation www.ti.com/automotive  
Communications and Telecom www.ti.com/communications  
Amplifiers  
Data Converters  
DLP® Products  
DSP  
Computers and Peripherals  
Consumer Electronics  
Energy and Lighting  
Industrial  
www.ti.com/computers  
www.ti.com/consumer-apps  
www.ti.com/energy  
dsp.ti.com  
Clocks and Timers  
Interface  
www.ti.com/clocks  
interface.ti.com  
logic.ti.com  
www.ti.com/industrial  
www.ti.com/medical  
www.ti.com/security  
Medical  
Logic  
Security  
Power Mgmt  
Microcontrollers  
RFID  
power.ti.com  
Space, Avionics and Defense www.ti.com/space-avionics-defense  
microcontroller.ti.com  
www.ti-rfid.com  
Video and Imaging  
www.ti.com/video  
OMAP Mobile Processors www.ti.com/omap  
Wireless Connectivity www.ti.com/wirelessconnectivity  
TI E2E Community Home Page  
e2e.ti.com  
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2012, Texas Instruments Incorporated  
配单直通车
OPA140ATDD2产品参数
型号:OPA140ATDD2
Brand Name:Texas Instruments
生命周期:Active
IHS 制造商:TEXAS INSTRUMENTS INC
包装说明:DIE,
Reach Compliance Code:not_compliant
Factory Lead Time:6 weeks
风险等级:5.78
放大器类型:OPERATIONAL AMPLIFIER
最大平均偏置电流 (IIB):0.00001 µA
最小共模抑制比:126 dB
标称共模抑制比:140 dB
最大输入失调电压:120 µV
JESD-30 代码:R-XUUC-N8
长度:1.448 mm
功能数量:1
端子数量:8
封装主体材料:UNSPECIFIED
封装代码:DIE
封装形状:RECTANGULAR
封装形式:UNCASED CHIP
标称压摆率:20 V/us
子类别:Operational Amplifier
最大压摆率:2 mA
表面贴装:YES
端子形式:NO LEAD
端子位置:UPPER
标称均一增益带宽:11000 kHz
宽度:0.846 mm
Base Number Matches:1
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