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产品型号OPA171AQDBVRQ1的概述

OPA171AQDBVRQ1 概述 OPA171AQDBVRQ1 是一款高性能运算放大器，属于德州仪器（Texas Instruments）公司推出的新型运算放大器系列。这款芯片的设计专注于提供优异的线性性能和低噪声特性，适用于各种精密信号处理应用。OPA171 的设计利用了高增益带宽产品，具有较低的失真和漂移特性，适合用于信号处理、传感器接口和许多工业应用中。该产品还具备较高的共模抑制和电源抑制比，确保在恶劣环境下仍能保持优异的性能。 OPA171AQDBVRQ1 的详细参数 OPA171 的主要电气参数为其应用领域提供了坚实的基础。以下是该运算放大器的重要技术参数： - 输入电压范围：-0.1V 到 36V - 共模输入范围：-0.1V 到 (V+ - 1.5V) - 增益带宽产品：10 MHz - 输入失调电压：最大为 0.5 mV - 输入偏置电流：最大为 10 nA - 电源...

产品型号OPA171AQDBVRQ1的Datasheet PDF文件预览

OPA171-Q1

www.ti.com

SBOS556 –JUNE 2011

36V, SINGLE-SUPPLY, GENERAL-PURPOSE

OPERATIONAL AMPLIFIER

Check for Samples: OPA171-Q1

FEATURES

DESCRIPTION

The OPA171-Q1 is a 36V, single-supply, low-noise

operational amplifier with the ability to operate on

supplies ranging from +2.7V (±1.35V) to +36V

(±18V). This device is available in micro-packages

and offer low offset, drift, and bandwidth with low

quiescent current. The single, dual, and quad

versions all have identical specifications for maximum

design flexibility.

•

Qualified for Automotive Applications

Supply Range: +2.7V to +36V, ±1.35V to ±18V

Low Noise: 14nV/√Hz

Low Offset Drift: ±0.3µV/°C (typ)

RFI Filtered Inputs

Input Range Includes the Negative Supply

Input Range Operates to Positive Supply

Rail-to-Rail Output

Unlike most op amps, which are specified at only one

supply voltage, the OPA171-Q1 is specified from

+2.7V to +36V. Input signals beyond the supply rails

do not cause phase reversal. The OPA171-Q1 is

stable with capacitive loads up to 300pF. The input

can operate 100mV below the negative rail and within

2V of the top rail during normal operation. Note that

these devices can operate with full rail-to-rail input

100mV beyond the top rail, but with reduced

performance within 2V of the top rail.

Gain Bandwidth: 3MHz

Low Quiescent Current: 475µA per Amplifier

High Common-Mode Rejection: 120dB (typ)

Low Input Bias Current: 8pA

Industry-Standard Package:

–

5-Pin Small Outline Transistor [SOT

(SOT-23) - DBV] Package

The OPA171-Q1 op amp is specified from –40°C to

+125°C.

APPLICATIONS

•

Tracking Amplifier in Power Modules

Merchant Power Supplies

Transducer Amplifiers

Bridge Amplifiers

Temperature Measurements

Strain Gauge Amplifiers

Precision Integrators

Package Footprint

Battery-Powered Instruments

Test Equipment

Product Family

DEVICE

PACKAGE

Package Height

OPA171-Q1

SOT (SOT-23) - DBV

DBV (SOT23-5)

Smallest Packaging for 36V Op Amp

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

OPA171-Q1

SBOS556 –JUNE 2011

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

DBV PACKAGE: OPA171-Q1

SOT23-5

(TOP VIEW)

V+

OUT

V-

-IN

+IN

ORDERING INFORMATION⁽¹⁾

ORDERABLE PART

T_A

PACKAGE

SOT (SOT-23) – DBV Reel of 3000

NUMBER

TOP-SIDE MARKING

OULQ

–40°C to 125°C

OPA171AQDBVRQ1

(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the

device product folder at www.ti.com.

ABSOLUTE MAXIMUM RATINGS⁽¹⁾

Over operating free-air temperature range, unless otherwise noted.

OPA171-Q1

UNIT

Supply voltage

±20

Voltage

Current

(V–) – 0.5 to (V+) + 0.5

Signal input terminals

±10

Continuous

–55 to +150

–65 to +150

+150

Output short circuit⁽²⁾

Operating temperature

Storage temperature

Junction temperature

°C

Human body model (HBM)

ESD ratings:

Charged device model (CDM)

500

(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not implied.

(2) Short-circuit to ground, one amplifier per package.

THERMAL INFORMATION

OPA171-Q1

THERMAL METRIC⁽¹⁾

DBV (SOT-23)

5 PINS

277.3

UNITS

θ_JA

Junction-to-ambient thermal resistance

Junction-to-case(top) thermal resistance

Junction-to-board thermal resistance

θ_JC(top)

θ_JB

193.3

121.2

°C/W

ψ_JT

Junction-to-top characterization parameter

Junction-to-board characterization parameter

Junction-to-case(bottom) thermal resistance

51.8

ψ_JB

109.5

θ_JC(bottom)

n/a

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

OPA171-Q1

www.ti.com

SBOS556 –JUNE 2011

ELECTRICAL CHARACTERISTICS

Boldface limits apply over the specified temperature range, T_A= –40°C to +125°C.

At T_A= +25°C, V_S= +2.7V to +36V, V_CM= V_OUT= V_S/2, and R_LOAD= 10kΩ connected to V_S/2, unless otherwise noted.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

OFFSET VOLTAGE

Input offset voltage

Over temperature

Drift

V_OS

0.25

0.3

±1.8

±2

±2⁽¹⁾

dV_OS/dT

PSRR

µV/°C

µV/V

vs power supply

Channel separation, dc

INPUT BIAS CURRENT

Input bias current

Over temperature

Input offset current

Over temperature

NOISE

V_S= +4V to +36V

±3

I_B

±8

±4

±15

±3.5

I_OS

±3.5

Input voltage noise

f = 0.1Hz to 10Hz

f = 100Hz

µV_PP

nV/√Hz

Input voltage noise density

e_n

f = 1kHz

INPUT VOLTAGE

Common-mode voltage range⁽²⁾

V_CM

(V–) – 0.1V

(V+) – 2V

V_S= ±2V, (V–) – 0.1V < V_CM< (V+) – 2V

V_S= ±18V, (V–) – 0.1V < V_CM< (V+) – 2V

104

120

Common-mode rejection ratio

CMRR

104

INPUT IMPEDANCE

Differential

100 || 3

6 || 3

MΩ || pF

10¹²Ω ||

Common-mode

OPEN-LOOP GAIN

Open-loop voltage gain

FREQUENCY RESPONSE

Gain bandwidth product

Slew rate

A_OLV_S= +4V to +36V, (V–) + 0.35V < V_O< (V+) – 0.35V

110

130

GBP

3.0

MHz

V/µs

µs

G = +1

1.5

To 0.1%, V_S= ±18V, G = +1, 10V step

To 0.01% (12 bit), V_S= ±18V, G = +1, 10V step

Settling time

t_S

µs

Overload recovery time

Total harmonic distortion + noise

OUTPUT

_IN× Gain > V_S

µs

THD+N

G = +1, f = 1kHz, V_O= 3V_RMS

0.0002

Voltage output swing from rail

Short-circuit current

V_O

I_SC

R_L= 10kΩ, A_OL≥ 110dB

(V–) + 0.35

(V+) – 0.35

+25/–35

Capacitive load drive

Open-loop output resistance

POWER SUPPLY

C_LOAD

R_O

See Typical Characteristics

150

f = 1MHz, I_O= 0A

Specified voltage range

Quiescent current per amplifier

Over temperature

V_S

I_Q

+2.7

+36

595

650

I_O= 0A

475

µA

I_O= 0A

TEMPERATURE

Specified range

–40

–55

+125

+150

°C

Operating range

(1) Not production tested.

(2) The input range can be extended beyond (V+) – 2V up to V+. See the Typical Characteristics and Application Information sections for

additional information.

OPA171-Q1

SBOS556 –JUNE 2011

www.ti.com

TYPICAL CHARACTERISTICS

TABLE OF GRAPHS

Table 1. Characteristic Performance Measurements

DESCRIPTION

FIGURE

Figure 1

Offset Voltage Production Distribution

Offset Voltage Drift Distribution

Figure 2

Offset Voltage vs Temperature

Figure 3

Offset Voltage vs Common-Mode Voltage

Offset Voltage vs Common-Mode Voltage (Upper Stage)

Offset Voltage vs Power Supply

Figure 4

Figure 5

Figure 6

I_Band I_OSvs Common-Mode Voltage

Input Bias Current vs Temperature

Output Voltage Swing vs Output Current (Maximum Supply)

CMRR and PSRR vs Frequency (Referred-to Input)

CMRR vs Temperature

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

Figure 13

Figure 14

Figure 15

Figure 16

Figure 17

Figure 18

Figure 19

Figure 20

Figure 21

Figure 22

Figure 23, Figure 24

Figure 25

Figure 26

Figure 27

Figure 28, Figure 29

Figure 30, Figure 31

Figure 32

Figure 33

Figure 34

Figure 35

Figure 36

PSRR vs Temperature

0.1Hz to 10Hz Noise

Input Voltage Noise Spectral Density vs Frequency

THD+N Ratio vs Frequency

THD+N vs Output Amplitude

Quiescent Current vs Temperature

Quiescent Current vs Supply Voltage

Open-Loop Gain and Phase vs Frequency

Closed-Loop Gain vs Frequency

Open-Loop Gain vs Temperature

Open-Loop Output Impedance vs Frequency

Small-Signal Overshoot vs Capacitive Load (100mV Output Step)

No Phase Reversal

Positive Overload Recovery

Negative Overload Recovery

Small-Signal Step Response (100mV)

Large-Signal Step Response

Large-Signal Settling Time (10V Positive Step)

Large-Signal Settling Time (10V Negative Step)

Short-Circuit Current vs Temperature

Maximum Output Voltage vs Frequency

Channel Separation vs Frequency

OPA171-Q1

www.ti.com

SBOS556 –JUNE 2011

TYPICAL CHARACTERISTICS

V_S= ±18V, V_CM= V_S/2, R_LOAD= 10kΩ connected to V_S/2, and C_L= 100pF, unless otherwise noted.

OFFSET VOLTAGE PRODUCTION DISTRIBUTION

OFFSET VOLTAGE DRIFT DISTRIBUTION

Distribution Taken From 3500 Amplifiers

Distribution Taken From 110 Amplifiers

Offset Voltage Drift (mV/°C)

Offset Voltage (mV)

Figure 1.

Figure 2.

OFFSET VOLTAGE vs TEMPERATURE

OFFSET VOLTAGE vs COMMON-MODE VOLTAGE

1000

600

400

10 Typical Units Shown

5 Typical Units Shown

800

600

200

400

200

-200

-400

-600

-800

-200

-400

-600

-800

-1000

V_CM= -18.1V

-15 -10

-20

-5

-75 -50 -25

100 125 150

V_CM(V)

Temperature (°C)

Figure 3.

Figure 4.

OFFSET VOLTAGE vs COMMON-MODE VOLTAGE

(Upper Stage)

OFFSET VOLTAGE vs POWER SUPPLY

10000

8000

350

250

10 Typical Units Shown

V_SUPPLY= ±1.35V to ±18V

10 Typical Units Shown

6000

150

4000

2000

-50

-2000

-4000

-6000

-8000

-10000

Normal

Operation

-150

-250

-350

V_CM= +18.1V

15.5

16.5

17.5

18.5

V_CM(V)

V_SUPPLY(V)

Figure 5.

Figure 6.

OPA171-Q1

SBOS556 –JUNE 2011

www.ti.com

TYPICAL CHARACTERISTICS (continued)

V_S= ±18V, V_CM= V_S/2, R_LOAD= 10kΩ connected to V_S/2, and C_L= 100pF, unless otherwise noted.

I_BAND I_OSvs COMMON-MODE VOLTAGE

INPUT BIAS CURRENT vs TEMPERATURE

10000

1000

100

-I_B

I_B+

I_B-

I_OS

+I_B

I_B

-I_OS

I_OS

V_CM= -18.1V

V_CM= 16V

-20

-18

-12

-6

-75 -50 -25

100 125 150

V_CM(V)

Temperature (°C)

Figure 7.

Figure 8.

OUTPUT VOLTAGE SWING vs OUTPUT CURRENT

(Maximum Supply)

CMRR AND PSRR vs FREQUENCY

(Referred-to Input)

140

120

100

14.5

-14.5

-15

-40°C

+25°C

+85°C

+125°C

-16

-17

-18

+PSRR

-PSRR

CMRR

100

10k

100k

10M

Output Current (mA)

Frequency (Hz)

Figure 9.

Figure 10.

CMRR vs TEMPERATURE

PSRR vs TEMPERATURE

-10

-20

-30

-1

-2

-3

V_S= 2.7V

V_S= 4V

V_S= 2.7V to 36V

V_S= 4V to 36V

V_S= 36V

-75 -50 -25

100 125 150

-75 -50 -25

100 125 150

Temperature (°C)

Figure 11.

Figure 12.

OPA171-Q1

www.ti.com

SBOS556 –JUNE 2011

TYPICAL CHARACTERISTICS (continued)

V_S= ±18V, V_CM= V_S/2, R_LOAD= 10kΩ connected to V_S/2, and C_L= 100pF, unless otherwise noted.

INPUT VOLTAGE NOISE SPECTRAL DENSITY vs

FREQUENCY

0.1Hz TO 10Hz NOISE

1000

100

Time (1s/div)

100

10k

100k

Frequency (Hz)

Figure 13.

Figure 14.

THD+N RATIO vs FREQUENCY

THD+N vs OUTPUT AMPLITUDE

0.1

-80

0.01

0.001

-80

V_OUT= 3V_RMS

BW = 80kHz

0.01

-100

-120

-140

-100

-120

-140

0.001

0.0001

0.00001

G = +1, R_L= 10kW

G = -1, R_L= 2kW

G = +1, R_L= 10kW

G = -1, R_L= 2kW

0.00001

0.01

0.1

10 20

100

10k 20k

Output Amplitude (V_RMS

)

Frequency (Hz)

Figure 15.

Figure 16.

QUIESCENT CURRENT vs TEMPERATURE

QUIESCENT CURRENT vs SUPPLY VOLTAGE

0.65

0.6

0.55

0.5

0.6

0.55

0.5

0.45

0.4

0.45

0.4

0.35

0.3

Specified Supply-Voltage Range

0.35

0.25

-75 -50 -25

100 125 150

Temperature (°C)

Supply Voltage (V)

Figure 17.

Figure 18.

OPA171-Q1

SBOS556 –JUNE 2011

www.ti.com

TYPICAL CHARACTERISTICS (continued)

V_S= ±18V, V_CM= V_S/2, R_LOAD= 10kΩ connected to V_S/2, and C_L= 100pF, unless otherwise noted.

OPEN-LOOP GAIN AND PHASE vs FREQUENCY

CLOSED-LOOP GAIN vs FREQUENCY

180

135

180

Gain

135

Phase

-5

-10

-15

-20

G = 10

G = 1

G = -1

-45

100

10k

100k

10M

10k

100k

10M

100M

Frequency (Hz)

Figure 19.

Figure 20.

OPEN-LOOP GAIN vs TEMPERATURE

OPEN-LOOP OUTPUT IMPEDANCE vs FREQUENCY

5 Typical Units Shown

V_S= 2.7V

V_S= 4V

100k

10k

2.5

V_S= 36V

1.5

100

0.5

-75 -50 -25

100 125 150

100

10k

100k

10M

Temperature (°C)

Frequency (Hz)

Figure 21.

Figure 22.

SMALL-SIGNAL OVERSHOOT vs CAPACITIVE LOAD

(100mV Output Step)

SMALL-SIGNAL OVERSHOOT vs CAPACITIVE LOAD

(100mV Output Step)

R_L= 10kW

R_OUT= 0W

R_OUT= 25W

R_OUT= 50W

G = +1

+18V

OPA171

-18V

R_F= 10kW

R_I= 10kW

G = -1

R_OUT= 0W

R_OUT= 25W

R_OUT= 50W

R_OUT

+18V

R_OUT

R_L

C_L

OPA171

C_L

-18V

100 200 300 400 500 600 700 800 900 1000

Capacitive Load (pF)

100 200 300 400 500 600 700 800 900 1000

Capacitive Load (pF)

Figure 23.

Figure 24.

OPA171-Q1

www.ti.com

SBOS556 –JUNE 2011

TYPICAL CHARACTERISTICS (continued)

V_S= ±18V, V_CM= V_S/2, R_LOAD= 10kΩ connected to V_S/2, and C_L= 100pF, unless otherwise noted.

NO PHASE REVERSAL

POSITIVE OVERLOAD RECOVERY

+18V

OPA171

-18V

V_OUT

Output

37V_PP

Sine Wave

(±18.5V)

V_IN

20kW

+18V

2kW

V_OUT

OPA171

Output

V_IN

-18V

G = -10

Time (5ms/div)

Time (100ms/div)

Figure 25.

Figure 26.

SMALL-SIGNAL STEP RESPONSE

(100mV)

NEGATIVE OVERLOAD RECOVERY

R_L= 10kW

G = +1

+18V

OPA171

-18V

C_L= 100pF

R_L

C_L

V_IN

20kW

+18V

2kW

V_OUT

OPA171

V_IN

V_OUT

-18V

G = -10

Time (5ms/div)

Time (1ms/div)

Figure 27.

Figure 28.

SMALL-SIGNAL STEP RESPONSE

(100mV)

LARGE-SIGNAL STEP RESPONSE

G = +1

R_L= 10kW

C_L= 100pF

R_I= 2kW R_F= 2kW

+18V

OPA171

C_L

-18V

G = -1

Time (20ms/div)

Time (5ms/div)

Figure 29.

Figure 30.

OPA171-Q1

SBOS556 –JUNE 2011

www.ti.com

TYPICAL CHARACTERISTICS (continued)

V_S= ±18V, V_CM= V_S/2, R_LOAD= 10kΩ connected to V_S/2, and C_L= 100pF, unless otherwise noted.

LARGE-SIGNAL SETTLING TIME

(10V Positive Step)

LARGE-SIGNAL STEP RESPONSE

G = -1

R_L= 10kW

C_L= 100pF

12-Bit Settling

-2

-4

-6

-8

-10

(±1/2LSB = ±0.024%)

Time (4ms/div)

Time (ms)

Figure 31.

Figure 32.

LARGE-SIGNAL SETTLING TIME

(10V Negative Step)

SHORT-CIRCUIT CURRENT vs TEMPERATURE

G = -1

I_SC, Sink

12-Bit Settling

-2

-4

-6

-8

-10

I_SC, Source

(±1/2LSB = ±0.024%)

-75 -50 -25

100 125 150

Time (ms)

Temperature (°C)

Figure 33.

Figure 34.

MAXIMUM OUTPUT VOLTAGE vs FREQUENCY

CHANNEL SEPARATION vs FREQUENCY

12.5

-60

-70

V_S= ±15V

-80

Maximum output voltage without

slew-rate induced distortion.

7.5

-90

V_S= ±5V

-100

-110

-120

2.5

V_S= ±1.35V

10k

100k

10M

100

10k

100k

Frequency (Hz)

Figure 35.

Figure 36.

OPA171-Q1

www.ti.com

SBOS556 –JUNE 2011

APPLICATION INFORMATION

The OPA171-Q1 operational amplifier provides high

overall performance, making it ideal for many

general-purpose applications. The excellent offset

drift of only 2µV/°C provides excellent stability over

the entire temperature range. In addition, the device

offers very good overall performance with high

CMRR, PSRR, and A_OL. As with all amplifiers,

applications with noisy or high-impedance power

supplies require decoupling capacitors close to the

device pins. In most cases, 0.1µF capacitors are

adequate.

This device can operate with full rail-to-rail input

100mV beyond the top rail, but with reduced

performance within 2V of the top rail. The typical

performance in this range is summarized in Table 2.

PHASE-REVERSAL PROTECTION

The OPA171-Q1 has an internal phase-reversal

protection. Many op amps exhibit a phase reversal

when the input is driven beyond its linear

common-mode range. This condition is most often

encountered in noninverting circuits when the input is

driven beyond the specified common-mode voltage

range, causing the output to reverse into the opposite

rail. The input of the OPAx171 prevents phase

reversal with excessive common-mode voltage.

Instead, the output limits into the appropriate rail. This

performance is shown in Figure 37.

OPERATING CHARACTERISTICS

The OPA171-Q1 is specified for operation from 2.7V

to 36V (±1.35V to ±18V). Many of the specifications

apply from –40°C to +125°C. Parameters that can

exhibit significant variance with regard to operating

voltage or temperature are presented in the Typical

Characteristics.

+18V

OPA171

Output

GENERAL LAYOUT GUIDELINES

-18V

37V_PP

For best operational performance of the device, good

printed circuit board (PCB) layout practices are

recommended. Low-loss, 0.1µF bypass capacitors

should be connected between each supply pin and

ground, placed as close to the device as possible. A

single bypass capacitor from V+ to ground is

applicable to single-supply applications.

Sine Wave

(±18.5V)

Output

Time (100ms/div)

COMMON-MODE VOLTAGE RANGE

The input common-mode voltage range of the

OPAx171 series extends 100mV below the negative

rail and within 2V of the top rail for normal operation.

Figure 37. No Phase Reversal

Table 2. Typical Performance Range

PARAMETER

Input Common-Mode Voltage

Offset voltage

MIN

(V+) – 2

TYP

MAX

UNIT

(V+) + 0.1

vs Temperature

Common-mode rejection

Open-loop gain

0.7

µV/°C

GBW

MHz

V/µs

nV/√Hz

Slew rate

Noise at f = 1kHz

OPA171-Q1

SBOS556 –JUNE 2011

www.ti.com

CAPACITIVE LOAD AND STABILITY

or even the output pin. Each of these different pin

functions have electrical stress limits determined by

the voltage breakdown characteristics of the

particular semiconductor fabrication process and

specific circuits connected to the pin. Additionally,

internal electrostatic discharge (ESD) protection is

built into these circuits to protect them from

accidental ESD events both before and during

product assembly.

The dynamic characteristics of the OPA171-Q1 have

been optimized for commonly encountered operating

conditions. The combination of low closed-loop gain

and high capacitive loads decreases the phase

margin of the amplifier and can lead to gain peaking

or oscillations. As a result, heavier capacitive loads

must be isolated from the output. The simplest way to

achieve this isolation is to add a small resistor (for

example, R_OUTequal to 50Ω) in series with the

output. Figure 38 and Figure 39 illustrate graphs of

small-signal overshoot versus capacitive load for

several values of R_OUT. Also, refer to Applications

Bulletin AB-028 (SBOA015), available for download

from the TI website for details of analysis techniques

and application circuits.

These ESD protection diodes also provide in-circuit,

input overdrive protection, as long as the current is

limited to 10mA as stated in the Absolute Maximum

Ratings. Figure 40 shows how a series input resistor

may be added to the driven input to limit the input

current. The added resistor contributes thermal noise

at the amplifier input and its value should be kept to a

minimum in noise-sensitive applications.

R_L= 10kW

V+

I_OVERLOAD

10mA max

V_OUT

OPA171

V_IN

5kW

G = +1

+18V

R_OUT= 0W

R_OUT

OPA171

Figure 40. Input Current Protection

R_OUT= 25W

R_L

C_L

-18V

R_OUT= 50W

An ESD event produces

short duration,

high-voltage pulse that is transformed into a short

duration, high-current pulse as it discharges through

a semiconductor device. The ESD protection circuits

are designed to provide a current path around the

operational amplifier core to prevent it from being

damaged. The energy absorbed by the protection

circuitry is then dissipated as heat.

100 200 300 400 500 600 700 800 900 1000

Capacitive Load (pF)

Figure 38. Small-Signal Overshoot versus

Capacitive Load (100mV Output Step)

R_OUT= 0W

When the operational amplifier connects into a circuit,

the ESD protection components are intended to

remain inactive and not become involved in the

application circuit operation. However, circumstances

may arise where an applied voltage exceeds the

operating voltage range of a given pin. Should this

condition occur, there is a risk that some of the

internal ESD protection circuits may be biased on,

and conduct current. Any such current flow occurs

through ESD cells and rarely involves the absorption

device.

R_OUT= 25W

R_OUT= 50W

R_F= 10kW

R_I= 10kW

G = -1

+18V

R_OUT

OPA171

C_L

-18V

100 200 300 400 500 600 700 800 900 1000

Capacitive Load (pF)

If there is an uncertainty about the ability of the

supply to absorb this current, external zener diodes

may be added to the supply pins. The zener voltage

must be selected such that the diode does not turn

on during normal operation.

Figure 39. Small-Signal Overshoot versus

Capacitive Load (100mV Output Step)

ELECTRICAL OVERSTRESS

However, its zener voltage should be low enough so

that the zener diode conducts if the supply pin begins

to rise above the safe operating supply voltage level.

Designers often ask questions about the capability of

an operational amplifier to withstand electrical

overstress. These questions tend to focus on the

device inputs, but may involve the supply voltage pins

PACKAGE OPTION ADDENDUM

www.ti.com

26-Mar-2012

PACKAGING INFORMATION

Status ⁽¹⁾

Eco Plan ⁽²⁾

MSL Peak Temp ⁽³⁾

Samples

Orderable Device

Package Type Package

Drawing

Pins

Package Qty

Lead/

Ball Finish

(Requires Login)

OPA171AQDBVRQ1

ACTIVE

SOT-23

DBV

3000

Green (RoHS

& no Sb/Br)

CU NIPDAU Level-2-260C-1 YEAR

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

⁽²⁾Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

⁽³⁾MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF OPA171-Q1 :

Catalog: OPA171

•

NOTE: Qualified Version Definitions:

Catalog - TI's standard catalog product

•

Addendum-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

23-Mar-2012

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package Package Pins

Type Drawing

SPQ

Reel

Pin1

Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant

(mm) W1 (mm)

OPA171AQDBVRQ1

SOT-23

DBV

3000

180.0

8.4

3.23

3.17

1.37

4.0

8.0

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

23-Mar-2012

*All dimensions are nominal

Device

Package Type Package Drawing Pins

SOT-23 DBV

SPQ

Length (mm) Width (mm) Height (mm)

202.0 201.0 28.0

OPA171AQDBVRQ1

3000

Pack Materials-Page 2

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,

and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should

obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are

sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard

warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where

mandated by government requirements, testing of all parameters of each product is not necessarily performed.

TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and

applications using TI components. To minimize the risks associated with customer products and applications, customers should provide

adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,

or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information

published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a

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Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied

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www.ti.com/audio

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DLP® Products

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OPA171AQDBVRQ1产品参数

型号:	OPA171AQDBVRQ1
Brand Name：	Texas Instruments
是否无铅：	不含铅
是否Rohs认证：	符合
生命周期：	Active
IHS 制造商：	TEXAS INSTRUMENTS INC
零件包装代码：	SOIC
包装说明：	SOP-5
针数：	5
Reach Compliance Code：	compliant
ECCN代码：	EAR99
HTS代码：	8542.33.00.01
Factory Lead Time：	6 weeks
风险等级：	1.76
Samacsys Confidence：	3
Samacsys Status：	Released
Samacsys PartID：	711404
Samacsys Pin Count：	5
Samacsys Part Category：	Integrated Circuit
Samacsys Package Category：	SOT23 (5-Pin)
Samacsys Footprint Name：	SOT-23+
Samacsys Released Date：	2019-08-02 10:01:50
Is Samacsys：	N
放大器类型：	OPERATIONAL AMPLIFIER
架构：	VOLTAGE-FEEDBACK
最大平均偏置电流 (IIB)：	0.000015 µA
25C 时的最大偏置电流 (IIB)：	0.000015 µA
最小共模抑制比：	104 dB
标称共模抑制比：	120 dB
频率补偿：	YES
最大输入失调电流 (IIO)：	0.0035 µA
最大输入失调电压：	1800 µV
JESD-30 代码：	R-PDSO-G5
JESD-609代码：	e4
长度：	2.9 mm
低-偏置：	YES
低-失调：	NO
微功率：	YES
湿度敏感等级：	2
功能数量：	1
端子数量：	5
最高工作温度：	125 °C
最低工作温度：	-40 °C
封装主体材料：	PLASTIC/EPOXY
封装代码：	LSSOP
封装等效代码：	TSOP5/6,.11,37
封装形状：	RECTANGULAR
封装形式：	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
包装方法：	TR
峰值回流温度（摄氏度）：	260
功率：	NO
电源：	+-1.35/+-18/2.7/36 V
可编程功率：	NO
认证状态：	Not Qualified
筛选级别：	AEC-Q100
座面最大高度：	1.45 mm
标称压摆率：	1.5 V/us
子类别：	Operational Amplifier
最大压摆率：	0.595 mA
供电电压上限：	40 V
表面贴装：	YES
技术：	BIPOLAR
温度等级：	AUTOMOTIVE
端子面层：	Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式：	GULL WING
端子节距：	0.95 mm
端子位置：	DUAL
处于峰值回流温度下的最长时间：	NOT SPECIFIED
标称均一增益带宽：	3000 kHz
最小电压增益：	316000
宽带：	NO
宽度：	1.6 mm
Base Number Matches：	1

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