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产品型号OPA317IDBVR的概述

OPA317IDBVR的概述 OPA317IDBVR是一款由德州仪器（Texas Instruments, TI）生产的高精度运算放大器，属于OPA系列。其设计适用于对信号进行放大、滤波、比较等多种应用。在现代电子系统中，运算放大器被广泛应用于音频处理、传感器信号调理以及数据采集等领域。OPA317使能用户在提供优良性能的同时，维持了全温范围内的低功耗特性，这使其在许多电池供电的设备中备受青睐。 OPA317IDBVR的详细参数 OPA317IDBVR运算放大器具有以下主要参数： 1. 输入电压范围：OPA317支持宽输入电压范围，允许接入超过电源电压的信号，极大地提高了系统的设计灵活性。 2. 增益带宽积：它具有高增益带宽积，适用于需要高增益的应用场合。 3. 低噪声特性：OPA317具有极低的噪声性能（约为15nV/√Hz），这对于音频应用和低级信号的处理尤其重要。 4. 低...

产品型号OPA317IDBVR的Datasheet PDF文件预览

OPA317

OPA2317

OPA4317

www.ti.com

SBOS682A –MAY 2013–REVISED JUNE 2013

Low-Offset, Rail-to-Rail I/O Operational Amplifier

Precision Catalog

Check for Samples: OPA317, OPA2317, OPA4317

FEATURES

DESCRIPTION

The OPA317 series of CMOS operational amplifiers

offer precision performance at a very competitive

price. These devices are members of the Zerø-Drift

•

Supply Voltage: 1.8 V to 5.5 V

microPackages:

–

Single: SOT23-5, SC-70, SOIC-8

Dual: MSOP-8, SOIC-8

family of amplifiers that use

proprietary

autocalibration technique to simultaneously provide

low offset voltage (90 μV max) and near-zero drift

over time and temperature at only 35 μA (max) of

quiescent current.

Quad: SOIC-14, TSSOP-14

•

Low Offset Voltage: 20 μV (typ)

CMRR: 108 dB (typ)

The OPA317 family features rail-to-rail input and

output in addition to near flat 1/f noise, making this

amplifier ideal for many applications, and much easier

to design into a system. These devices are optimized

for low-voltage operation as low as +1.8 V (±0.9 V)

and up to +5.5 V (±2.75 V).

Quiescent Current: 35 μA (max)

Gain Bandwidth: 300 kHz

Rail-to-Rail Input/Output

Internal EMI/RFI Filtering

The OPA317 (single version) is available in the

SC70-5, SOT23-5, and SOIC-8 packages. The

OPA2317 (dual version) is offered in MSOP-8 and

SOIC-8 packages. The OPA4317 is offered in the

standard SOIC-14 and TSSOP-14 packages, as well

as in the space-saving VQFN-14 package. All

versions are specified for operation from –40°C to

+125°C.

APPLICATIONS

•

Battery-Powered Instruments

Temperature Measurements

Transducer Applications

Electronic Scales

Medical Instrumentation

Handheld Test Equipment

Current Sense

PRODUCT FAMILY PACKAGE COMPARISON

PACKAGE-LEADS

NUMBER OF

DEVICE

OPA317

OPA2317

OPA4317

CHANNELS

SOIC

SOT23

SC70

MSOP

TSSOP

–

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

All trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

OPA317

OPA2317

OPA4317

SBOS682A –MAY 2013–REVISED JUNE 2013

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

PACKAGE AND ORDERING INFORMATION⁽¹⁾

(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the

device product folder at www.ti.com.

ABSOLUTE MAXIMUM RATINGS⁽¹⁾

Over operating free-air temperature range, unless otherwise noted.

VALUE

UNIT

Supply voltage, V_S= (V+) – (V–)

Signal input terminals, voltage⁽²⁾

Signal input terminals, current⁽²⁾

Output short-circuit⁽³⁾

(V–) –0.3 to (V+) + 0.3

±10

Continuous

–40 to +150

–65 to +150

+150

Operating temperature

°C

Storage temperature

Junction temperature

Human body model (HBM)

4000

Electrostatic

discharge (ESD)

ratings:

Charged device model (CDM)

Machine model (MM)

1000

400

(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not supported.

(2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.3 V beyond the supply rails should

be current limited to 10 mA or less.

(3) Short-circuit to ground, one amplifier per package.

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SBOS682A –MAY 2013–REVISED JUNE 2013

THERMAL INFORMATION: OPA317

OPA317

DBV (SOT23)

5 PINS

220.8

THERMAL METRIC⁽¹⁾

D (SOIC)

8 PINS

140.1

89.8

DCK (SC70)

5 PINS

298.4

65.4

UNITS

θ_JA

Junction-to-ambient thermal resistance

Junction-to-case (top) thermal resistance

Junction-to-board thermal resistance

θ_JCtop

θ_JB

97.5

80.6

61.7

97.1

°C/W

ψ_JT

Junction-to-top characterization parameter

Junction-to-board characterization parameter

Junction-to-case (bottom) thermal resistance

28.7

7.6

0.8

ψ_JB

80.1

61.1

95.5

θ_JCbot

N/A

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

THERMAL INFORMATION: OPA2317

OPA2317

THERMAL METRIC⁽¹⁾

D (SOIC)

8 PINS

124.0

73.7

DGK (MSOP)

8 PINS

180.3

48.1

UNITS

θ_JA

Junction-to-ambient thermal resistance

Junction-to-case (top) thermal resistance

Junction-to-board thermal resistance

θ_JCtop

θ_JB

64.4

100.9

2.4

°C/W

ψ_JT

Junction-to-top characterization parameter

Junction-to-board characterization parameter

Junction-to-case (bottom) thermal resistance

18.0

ψ_JB

63.9

99.3

θ_JCbot

N/A

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

THERMAL INFORMATION: OPA4317

OPA4317

THERMAL METRIC⁽¹⁾

D (SOIC)

14 PINS

83.8

PW (TSSOP)

14 PINS

120.8

34.3

UNITS

θ_JA

Junction-to-ambient thermal resistance

Junction-to-case (top) thermal resistance

Junction-to-board thermal resistance

θ_JCtop

θ_JB

70.7

59.5

62.8

°C/W

ψ_JT

Junction-to-top characterization parameter

Junction-to-board characterization parameter

Junction-to-case (bottom) thermal resistance

11.6

1.0

ψ_JB

37.7

56.5

θ_JCbot

N/A

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

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SBOS682A –MAY 2013–REVISED JUNE 2013

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ELECTRICAL CHARACTERISTICS: V_S= +1.8 V to +5.5 V

At T_A= +25°C, R_L= 10 kΩ connected to midsupply, V_CM= V_OUT= midsupply, unless otherwise noted.

OPA317, OPA2317, OPA4317

PARAMETER

OFFSET VOLTAGE

TEST CONDITIONS

MIN TYP

MAX

UNIT

V_S= +5 V

±90

μV

V_OS

Input offset voltage

T_A= –40°C to +125°C, V_S= +5 V

T_A= –40°C to +125°C

±100

dV_OS/dT

PSRR

vs temperature

0.05

μV/°C

μV/V

vs power supply

T_A= –40°C to +125°C, V_S= +1.8 V to +5.5 V

(1)

Long-term stability⁽¹⁾

See

Channel separation, dc

μV/V

INPUT BIAS CURRENT

±275

±155

±300

±400

±140

I_B

Input bias current

OPA4317

T_A= –40°C to +125°C

I_OS

Input offset current

OPA4317

NOISE

e_n

Input voltage noise density

Input voltage noise

f = 1 kHz

0.3

nV/√Hz

μV_PP

f = 0.01 Hz to 1 Hz

f = 0.1 Hz to 10 Hz

f = 10 Hz

1.1

μV_PP

i_n

Input current noise

100

fA/√Hz

INPUT VOLTAGE RANGE

V_CM

Common-mode voltage range

(V–) – 0.1

(V+) + 0.1

T_A= –40°C to +125°C

(V–) – 0.1 V < V_CM< (V+) + 0.1 V

108

CMRR

Common-mode rejection ratio

OPA4317, T_A= –40°C to +125°C

(V–) – 0.1 V < V_CM< (V+) + 0.1 V, V_S= 5.5 V

INPUT CAPACITANCE

Differential

Common-mode

OPEN-LOOP GAIN

T_A= –40°C to +125°C, (V–) + 100 mV < V_O

(V+) – 100 mV, R_L= 10 kΩ

A_OL

Open-loop voltage gain

100

110

FREQUENCY RESPONSE

GBW

Gain-bandwidth product

C_L= 100 pF

G = +1

300

kHz

Slew rate

0.15

V/μs

OUTPUT

Voltage output swing from rail

Short-circuit current

T_A= –40°C to +125°C

f = 350 kHz, I_O= 0

±5

100

I_SC

C_L

Capacitive load drive

See Typical Characteristics

Open-loop output impedance

kΩ

POWER SUPPLY

V_S

Specified voltage range

Quiescent current per amplifier T_A= –40°C to +125°C, I_O= 0

Turn-on time V_S= +5 V

TEMPERATURE

Specified range

1.8

5.5

I_Q

μA

μs

100

–40

–65

+125

+150

°C

Operating range

Storage range

(1) 300-hour life test at +150°C demonstrated randomly distributed variation of approximately 1 μV.

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SBOS682A –MAY 2013–REVISED JUNE 2013

PIN CONFIGURATIONS

OPA317

SOT23-5

(TOP VIEW)

OPA317

SC70-5

(TOP VIEW)

OUT

V-

V+

+IN

V-

V+

+IN

-IN

OUT

OPA317

SOIC-8

(TOP VIEW)

OPA2317

SOIC-8, MSOP-8

(TOP VIEW)

NC⁽¹⁾

V+

NC⁽¹⁾

OUT A

V+

-IN

+IN

V-

-IN A

+IN A

V-

OUT B

OUT

NC⁽¹⁾

-IN B

+IN B

OPA4317

SOIC-14

(TOP VIEW)

OPA4317

TSSOP-14

(TOP VIEW)

OUT A

OUT D

OUT A

-IN A

+IN A

V+

14 OUT D

13 -IN D

12 +IN D

11 V-

-IN A

+IN A

V+

13 -IN D

12 +IN D

11 V-

+IN B

-IN B

OUT B

+IN C

-IN C

OUT C

+IN C

-IN C

OUT C

+IN B

-IN B

OUT B

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SBOS682A –MAY 2013–REVISED JUNE 2013

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TYPICAL CHARACTERISTICS

At T_A= +25°C, C_L= 0 pF, R_L= 10 kΩ connected to midsupply, V_CM= V_OUT= midsupply, unless otherwise noted.

120

100

250

200

150

100

Phase

Gain

-50

-100

-20

100

10k

100k

Frequency (Hz)

Offset Voltage (mV)

Figure 1. OFFSET VOLTAGE PRODUCTION DISTRIBUTION

Figure 2. OPEN-LOOP GAIN vs FREQUENCY

140

120

100

120

100

+PSRR

-PSRR

100

10k

100k

100

10k

100k

Frequency (Hz)

Figure 3. COMMON-MODE REJECTION RATIO vs

FREQUENCY

Figure 4. POWER-SUPPLY REJECTION RATIO vs

FREQUENCY

210

205

200

195

190

V_S= ±2.75V

V_S= ±0.9V

-I_B

-40°C

+25°C

+125°C

+25°C

-40°C

-190

-195

-200

-205

-210

-1

-2

-3

+125°C

+25°C

+I_B

-40°C

Output Current (mA)

Common-Mode Voltage (V)

Figure 5. OUTPUT VOLTAGE SWING vs OUTPUT CURRENT

Figure 6. INPUT BIAS CURRENT vs COMMON-MODE

VOLTAGE

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SBOS682A –MAY 2013–REVISED JUNE 2013

TYPICAL CHARACTERISTICS (continued)

At T_A= +25°C, C_L= 0 pF, R_L= 10 kΩ connected to midsupply, V_CM= V_OUT= midsupply, unless otherwise noted.

250

200

150

100

-I_B

V_S= 5.5V

V_S= 1.8V

-I_B

V_S= 5.5V

V_S= 1.8V

-50

-100

-150

-200

-250

+I_B

-50

-25

100

125

-50

-25

100

125

Temperature (°C)

Figure 7. INPUT BIAS CURRENT vs TEMPERATURE

Figure 8. QUIESCENT CURRENT vs TEMPERATURE

G = 1

G = +1

R_L= 10kW

Time (50ms/div)

Time (5ms/div)

Figure 9. LARGE-SIGNAL STEP RESPONSE

Figure 10. SMALL-SIGNAL STEP RESPONSE

Input

Output

10 kW

+2.5 V

1 kW

Output

Device

-2.5 V

Time (50 ms/div)

Figure 11. POSITIVE OVER-VOLTAGE RECOVERY

Figure 12. NEGATIVE OVER-VOLTAGE RECOVERY

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TYPICAL CHARACTERISTICS (continued)

At T_A= +25°C, C_L= 0 pF, R_L= 10 kΩ connected to midsupply, V_CM= V_OUT= midsupply, unless otherwise noted.

600

500

400

300

200

100

4V Step

0.001%

0.01%

100

1000

Gain (dB)

Load Capacitance (pF)

Figure 13. SETTLING TIME vs CLOSED-LOOP GAIN

Figure 14. SMALL-SIGNAL OVERSHOOT vs LOAD

CAPACITANCE

1000

100

1000

Continues with no 1/f (flicker) noise.

Current Noise

100

Voltage Noise

100

10k

1s/div

Frequency (Hz)

Figure 15. 0.1Hz TO 10Hz NOISE

Figure 16. CURRENT AND VOLTAGE NOISE SPECTRAL

DENSITY vs FREQUENCY

Normal Operating Range

(see the Input Differential

Voltage section in the

Applications Information)

-10

-20

-30

-40

-50

Over-Driven Condition

200 400 600 800

-1V -800 -600 -400 -200

Input Differential Voltage (mV)

Figure 17. INPUT BIAS CURRENT vs INPUT DIFFERENTIAL VOLTAGE

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SBOS682A –MAY 2013–REVISED JUNE 2013

APPLICATIONS INFORMATION

The OPA317, OPA2317, and OPA4317 are unity-gain stable, precision operational amplifiers free from

unexpected output and phase reversal. Proprietary Zerø-Drift circuitry gives the benefit of low input offset voltage

over time and temperature, as well as lowering the 1/f noise component. As a result of the high PSRR, these

devices work well in applications that run directly from battery power without regulation. The OPA317 family is

optimized for low-voltage, single-supply operation. These miniature, high-precision, low quiescent current

amplifiers offer high-impedance inputs that have a common-mode range 100 mV beyond the supplies, and a rail-

to-rail output that swings within 100 mV of the supplies under normal test conditions. The OPA317 series are

precision amplifiers for cost-sensitive applications.

OPERATING VOLTAGE

The OPA317 series op amps can be used with single or dual supplies from an operating range of V_S= +1.8 V

(±0.9 V) up to +5.5 V (±2.75 V).

CAUTION

Supply voltages greater than +7 V can permanently damage the device.

See the Absolute Maximum Ratings table. Key parameters that vary over the supply voltage or temperature

range are shown in the Typical Characteristics section of this data sheet.

INPUT VOLTAGE

The OPA317, OPA2317, and OPA4317 input common-mode voltage range extends 0.1 V beyond the supply

rails. The OPA317 is designed to cover the full range without the troublesome transition region found in some

other rail-to-rail amplifiers.

Typically, input bias current is about 200 pA; however, input voltages exceeding the power supplies can cause

excessive current to flow into or out of the input pins. Momentary voltages greater than the power supply can be

tolerated if the input current is limited to 10 mA. This limitation is easily accomplished with an input resistor, as

shown in Figure 18.

Current-limiting resistor

required if input voltage

exceeds supply rails by

³ 0.3 V.

+5 V

I_OVERLOAD

10 mA max

Device

V_OUT

V_IN

5 kW

Figure 18. Input Current Protection

INPUT DIFFERENTIAL VOLTAGE

The typical input bias current of the OPA317 during normal operation is approximately 200 pA. In overdriven

conditions, the bias current can increase significantly (see Figure 17).The most common cause of an overdriven

condition occurs when the op amp is outside of the linear range of operation. When the output of the op amp is

driven to one of the supply rails, the feedback loop requirements cannot be satisfied and a differential input

voltage develops across the input pins. This differential input voltage results in activation of parasitic diodes

inside the front-end input chopping switches that combine with 10-kΩ electromagnetic interference (EMI) filter

resistors to create the equivalent circuit shown in Figure 19. Note that the input bias current remains within

specification within the linear region.

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10 kW

Clamp

+In

CORE

-In

Figure 19. Equivalent Input Circuit

INTERNAL OFFSET CORRECTION

The OPA317, OPA2317, and OPA4317 op amps use an auto-calibration technique with a time-continuous, 125-

kHz op amp in the signal path. This amplifier is zero-corrected every 8 μs using a proprietary technique. Upon

power-up, the amplifier requires approximately 100 μs to achieve specified V_OSaccuracy. This design has no

aliasing or flicker noise.

EMI SUSCEPTIBILITY AND INPUT FILTERING

Operational amplifiers vary in their susceptibility to EMI. If conducted EMI enters the operational amplifier, the dc

offset observed at the amplifier output may shift from its nominal value while the EMI is present. This shift is a

result of signal rectification associated with the internal semiconductor junctions. While all operational amplifier

pin functions can be affected by EMI, the input pins are likely to be the most susceptible. The OPA317

operational amplifier family incorporates an internal input low-pass filter that reduces the amplifier response to

EMI. Both common-mode and differential mode filtering are provided by the input filter. The filter is designed for a

cutoff frequency of approximately 8 MHz (–3 dB), with a roll-off of 20 dB per decade.

ACHIEVING OUTPUT SWING TO THE OP AMP NEGATIVE RAIL

Some applications require output voltage swings from 0 V to a positive full-scale voltage (such as +2.5 V) with

excellent accuracy. With most single-supply op amps, problems arise when the output signal approaches 0 V,

near the lower output swing limit of a single-supply op amp. A good single-supply op amp may swing close to

single-supply ground, but will not reach ground. The output of the OPA317, OPA2317, and OPA4317 can be

made to swing to ground, or slightly below, on a single-supply power source. To do so requires the use of

another resistor and an additional, more negative power supply than the op amp negative supply. A pull-down

resistor can be connected between the output and the additional negative supply to pull the output down below

the value that the output would otherwise achieve, as shown in Figure 20.

V+ = +5 V

Device

V_OUT

V_IN

R_P= 20 kW

Op Amp V- = GND

-5 V

Additional

Negative

Supply

Figure 20. For V_OUTRange to Ground

The OPA317, OPA2317, and OPA4317 have an output stage that allows the output voltage to be pulled to its

negative supply rail, or slightly below, using the technique previously described. This technique only works with

some types of output stages. The OPA317, OPA2317, and OPA4317 have been characterized to perform with

this technique; the recommended resistor value is approximately 20 kΩ. Note that this configuration increases

the current consumption by several hundreds of microamps. Accuracy is excellent down to 0 V and as low as –2

mV. Limiting and nonlinearity occurs below –2 mV, but excellent accuracy returns as the output drives back up

above –2 mV. Lowering the resistance of the pull-down resistor allows the op amp to swing even further below

the negative rail. Use resistances as low as 10 kΩ to achieve excellent accuracy down to –10 mV.

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APPLICATION CIRCUITS

Figure 21 shows the basic configuration for a bridge amplifier. A low-side current shunt monitor is shown in

Figure 22.

V_EX

R₁

+5 V

Device

V_OUT

R₁

V_REF

Figure 21. Single Op Amp Bridge Amplifier

3 V

REF3130

+5 V

Load

R₁

4.99 kW

R₂

49.9 kW

R₆

71.5 kW

R_N

56 W

R_SHUNT

1 W

I_LOAD

Device

I²C

R₃

4.99 kW

R₄

48.7 kW

R_N

56 W

ADS1100

R₇

1.18 kW

(PGA Gain = 4)

FS = 3.0 V

Stray Ground-Loop Resistance

NOTE: 1% resistors provide adequate common-mode rejection at small ground-loop errors.

Figure 22. Low-Side Current Monitor

R_Nare operational resistors used to isolate the ADS1100 from the noise of the digital I²C bus. The ADS1100 is a

16-bit converter; therefore, a precise reference is essential for maximum accuracy. If absolute accuracy is not

required and the 5-V power supply is sufficiently stable, the REF3130 may be omitted.

Figure 23 shows the OPA317 in a typical thermistor circuit.

100 kW

1 MW

60 kW

3 V

NTC

Thermistor

1 MW

Device

Figure 23. Thermistor Measurement

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GENERAL LAYOUT GUIDELINES

Attention to good layout practice is always recommended. Keep traces short and, when possible, use a printed

circuit board (PCB) ground plane with surface-mount components placed as close to the device pins as possible.

Place a 0.1-μF capacitor closely across the supply pins. Apply these guidelines throughout the analog circuit to

improve performance and provide benefits, such as reducing the electromagnetic interference (EMI)

susceptibility.

Optimize circuit layout and mechanical conditions for lowest offset voltage and precision performance. Avoid

temperature gradients that create thermoelectric (Seebeck) effects in the thermocouple junctions formed from

connecting dissimilar conductors. These thermally-generated potentials can be made to cancel by assuring they

are equal on both input terminals. Other layout and design considerations include:

•

Use low thermoelectric-coefficient conditions (avoid dissimilar metals).

Thermally isolate components from power supplies or other heat sources.

Shield op amp and input circuitry from air currents, such as cooling fans.

Following these guidelines reduces the likelihood of junctions being at different temperatures, which can cause

thermoelectric voltages of 0.1 μV/°C or higher, depending on the materials used.

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SBOS682A –MAY 2013–REVISED JUNE 2013

REVISION HISTORY

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Original (May 2013) to Revision A

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Deleted PSRR Features bullet .............................................................................................................................................. 1

Changed Quiescent Current Features bullet ........................................................................................................................ 1

Changed second sentence in Description section ................................................................................................................ 1

Changed PSSR maximum value .......................................................................................................................................... 4

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Product Folder Links: OPA317 OPA2317 OPA4317

PACKAGE OPTION ADDENDUM

www.ti.com

18-Jul-2013

PACKAGING INFORMATION

Orderable Device

OPA2317ID

Status Package Type Package Pins Package

Eco Plan Lead/Ball Finish

MSL Peak Temp

Op Temp (°C)

-40 to 125

Device Marking

Samples

Drawing

Qty

(1)

(2)

(3)

(4/5)

ACTIVE

SOIC

VSSOP

SOIC

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

O2317A

OPA2317IDGKR

OPA2317IDGKT

OPA2317IDR

OPA317ID

ACTIVE

DGK

2500

250

Green (RoHS CU NIPDAUAG Level-1-260C-UNLIM

& no Sb/Br)

OVBQ

O2317A

O317A

OVCQ

SJP

Green (RoHS CU NIPDAUAG Level-1-260C-UNLIM

& no Sb/Br)

2500

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

Level-2-260C-1 YEAR

SOIC

Green (RoHS

& no Sb/Br)

OPA317IDBVR

OPA317IDBVT

OPA317IDCKR

OPA317IDCKT

OPA317IDR

SOT-23

SC70

DBV

DCK

3000

250

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

3000

250

Green (RoHS

& no Sb/Br)

SC70

Green (RoHS

& no Sb/Br)

SJP

SOIC

2500

Green (RoHS

& no Sb/Br)

O317A

O4317A

OPA4317ID

SOIC

Green (RoHS

& no Sb/Br)

OPA4317IDR

OPA4317IPW

OPA4317IPWR

SOIC

2500

Green (RoHS

& no Sb/Br)

TSSOP

Green (RoHS

& no Sb/Br)

2000

Green (RoHS

& no Sb/Br)

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

18-Jul-2013

⁽²⁾Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

⁽³⁾MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

⁽⁴⁾There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

⁽⁵⁾Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2

PACKAGE MATERIALS INFORMATION

www.ti.com

18-Jul-2013

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package Package Pins

Type Drawing

SPQ

Reel

Pin1

Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant

(mm) W1 (mm)

OPA2317IDR

OPA317IDBVT

OPA317IDCKT

OPA317IDR

SOIC

SOT-23

SC70

DBV

DCK

2500

250

330.0

178.0

330.0

12.4

9.0

6.4

3.23

2.4

6.4

6.5

6.9

5.2

3.17

2.5

5.2

9.0

5.6

2.1

1.37

1.2

2.1

1.6

8.0

4.0

8.0

12.0

8.0

250

9.0

8.0

SOIC

2500

2000

12.4

16.4

12.4

12.0

16.0

12.0

OPA4317IDR

OPA4317IPWR

SOIC

TSSOP

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

18-Jul-2013

*All dimensions are nominal

Device

Package Type Package Drawing Pins

SPQ

Length (mm) Width (mm) Height (mm)

OPA2317IDR

OPA317IDBVT

OPA317IDCKT

OPA317IDR

SOIC

SOT-23

SC70

DBV

DCK

2500

250

367.0

180.0

367.0

180.0

367.0

35.0

18.0

35.0

38.0

35.0

250

SOIC

2500

2000

OPA4317IDR

OPA4317IPWR

SOIC

TSSOP

Pack Materials-Page 2

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other

changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest

issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and

complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale

supplied at the time of order acknowledgment.

TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms

and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary

to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily

performed.

TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and

applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide

adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or

other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information

published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or

endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the

third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration

and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered

documentation. Information of third parties may be subject to additional restrictions.

Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service

voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.

TI is not responsible or liable for any such statements.

Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements

concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support

that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which

anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause

harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use

of any TI components in safety-critical applications.

In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to

help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and

requirements. Nonetheless, such components are subject to these terms.

No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties

have executed a special agreement specifically governing such use.

Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in

military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components

which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and

regulatory requirements in connection with such use.

TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of

non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.

Products

Applications

Audio

www.ti.com/audio

amplifier.ti.com

dataconverter.ti.com

www.dlp.com

Automotive and Transportation www.ti.com/automotive

Communications and Telecom www.ti.com/communications

Amplifiers

Data Converters

DLP® Products

DSP

Computers and Peripherals

Consumer Electronics

Energy and Lighting

Industrial

www.ti.com/computers

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www.ti.com/energy

dsp.ti.com

Clocks and Timers

Interface

www.ti.com/clocks

interface.ti.com

logic.ti.com

www.ti.com/industrial

www.ti.com/medical

Medical

Logic

Security

www.ti.com/security

Power Mgmt

Microcontrollers

RFID

power.ti.com

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www.ti.com/space-avionics-defense

www.ti.com/video

microcontroller.ti.com

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www.ti.com/omap

OMAP Applications Processors

Wireless Connectivity

TI E2E Community

e2e.ti.com

www.ti.com/wirelessconnectivity

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

OPA317IDBVR相关文章

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OPA320AIDBVR产品参数

型号:	OPA320AIDBVR
Brand Name：	Texas Instruments
是否无铅：	不含铅
是否Rohs认证：	符合
生命周期：	Active
IHS 制造商：	TEXAS INSTRUMENTS INC
零件包装代码：	SOT-23
包装说明：	SOT-23, 5 PIN
针数：	5
Reach Compliance Code：	compliant
ECCN代码：	EAR99
HTS代码：	8542.33.00.01
Factory Lead Time：	6 weeks
风险等级：	1.14
Samacsys Confidence：	3
Samacsys Status：	Released
Samacsys PartID：	340728
Samacsys Pin Count：	5
Samacsys Part Category：	Integrated Circuit
Samacsys Package Category：	SOT23 (5-Pin)
Samacsys Footprint Name：	OPA320AIDBVR
Samacsys Released Date：	2017-09-02 17:58:05
Is Samacsys：	N
放大器类型：	OPERATIONAL AMPLIFIER
架构：	VOLTAGE-FEEDBACK
最大平均偏置电流 (IIB)：	9e-7 µA
25C 时的最大偏置电流 (IIB)：	9e-7 µA
最小共模抑制比：	100 dB
标称共模抑制比：	114 dB
频率补偿：	YES
最大输入失调电流 (IIO)：	9e-7 µA
最大输入失调电压：	150 µV
JESD-30 代码：	R-PDSO-G5
JESD-609代码：	e4
长度：	2.9 mm
低-偏置：	YES
低-失调：	YES
微功率：	NO
湿度敏感等级：	2
功能数量：	1
端子数量：	5
最高工作温度：	125 °C
最低工作温度：	-40 °C
封装主体材料：	PLASTIC/EPOXY
封装代码：	LSSOP
封装等效代码：	TSOP5/6,.11,37
封装形状：	RECTANGULAR
封装形式：	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
包装方法：	TR
峰值回流温度（摄氏度）：	260
功率：	NO
电源：	+-0.9/+-2.75/1.8/5.5 V
可编程功率：	NO
认证状态：	Not Qualified
座面最大高度：	1.45 mm
标称压摆率：	10 V/us
子类别：	Operational Amplifier
最大压摆率：	1.75 mA
供电电压上限：	6 V
标称供电电压 (Vsup)：	5 V
表面贴装：	YES
技术：	CMOS
温度等级：	AUTOMOTIVE
端子面层：	Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式：	GULL WING
端子节距：	0.95 mm
端子位置：	DUAL
处于峰值回流温度下的最长时间：	NOT SPECIFIED
标称均一增益带宽：	20000 kHz
最小电压增益：	63100
宽带：	NO
宽度：	1.6 mm
Base Number Matches：	1

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