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产品型号PC123X5YUP0F的Datasheet PDF文件预览

PC123XNNSZ0F Series  
DIP 4pin Reinforced Insulation Type  
Photocoupler  
PC123XNNSZ0F  
Series  
Description  
Agency approvals/Compliance  
PC123XNNSZ0F Series contains an IRED optically  
1. Recognized by UL1577 (Double protection isolation),  
le No. E64380 (as model No. PC123)  
2. Approved by BSI, BS-EN60065, file No. 7087, BS-  
EN60950 le No. 7409, (as model No. PC123)  
3. Approved by SEMKO, EN60065, EN60950, (as mod-  
el No. PC123)  
coupled to a phototransistor.  
It is packaged in a 4-pin DIP, available in wide-lead  
spacing option and SMT gullwing lead-form option.  
Input-output isolation voltage(rms) is 5kV.  
CTR is 50% to 400% at input current of 5mA  
4. Approved by DEMKO, EN60065, EN60950, (as mod-  
el No. PC123)  
Features  
5. Approved by NEMKO, EN60065, EN60950, (as mod-  
el No. PC123)  
1. 4-pin DIP package  
2. Double transfer mold package (Ideal for Flow Solder-  
ing)  
6. Approved by FIMKO, EN60065, EN60950, (as model  
No. PC123)  
3. Current transfer ratio (CTR : MIN. 50% at I 5 mA,  
=
F
7. Recognized by CSA le No. CA95323, (as model No.  
VCE 5V)  
=
PC123)  
4. Several CTR ranks available  
8. Approved by VDE, DIN EN60747-5-2() (as an op-  
tion), le No. 40008087 (as model No. PC123)  
9. Package resin : UL ammability grade (94V - 0)  
5. Reinforced insulation type (Isolation distance : MIN.  
0.4mm)  
6. Long creepage distance type (wide lead-form type  
only : MIN. 8mm)  
() DIN EN60747-5-2 : successor standard of DIN VDE0884.  
7. High isolation voltage between input and output  
(Viso(rms) : 5kV)  
Applications  
8. Lead-free and RoHS directive compliant  
1. I/O isolation for MCUs (Micro Controller Units)  
2. Noise suppression in switching circuits  
3. Signal transmission between circuits of different po-  
tentials and impedances  
4. Over voltage detection  
Notice The content of data sheet is subject to change without prior notice.  
In the absence of conrmation by device specication sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP  
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specication sheets before using any SHARP device.  
Sheet No.: D2-A09501EN  
Date Sep. 1. 2006  
© SHARP Corporation  
1
PC123XNNSZ0F Series  
Internal Connection Diagram  
1
2
3
4
Anode  
1
4
Cathode  
Emitter  
Collector  
2
3
(Unit : mm)  
Outline Dimensions  
1. Through-Hole [ex. PC123XNNSZ0F]  
2. Through-Hole (VDE option)  
[ex. PC123XNYSZ0F]  
Rank mark  
Rank mark  
Factory identification mark  
Factory identification mark  
Anode mark  
Anode mark  
Date code  
Date code  
1
2
4
1
2
4
3
PC123  
PC123  
3
4
SHARP mark "S"  
6.5±0.3  
6.5±0.3  
VDE idenfication mark  
4.58±0.30  
7.62±0.30  
4.58±0.30  
7.62±0.30  
Epoxy resin  
0.26±0.10  
Epoxy resin  
0.26±0.10  
0.5±0.1  
0.5±0.1  
θ
θ
θ
θ
θ : 0 to 13˚  
θ : 0 to 13˚  
Product mass : approx. 0.23g  
Product mass : approx. 0.23g  
3. Wide Through-Hole Lead-Form  
4. Wide Through-Hole Lead-Form (VDE option)  
[ex. PC123XNNFZ0F]  
[ex. PC123XNYFZ0F]  
Factory identification mark  
Factory identification mark  
Rank mark  
Anode mark  
Rank mark  
Anode mark  
Date code  
Date code  
1
2
1
2
4
4
3
3
P C 1 2 3  
P C 1 2 3  
4
SHARP mark "S"  
6.5±0.3  
6.5±0.3  
7.62±0.30  
VDE idenfication mark  
7.62±0.30  
4.58±0.30  
4.58±0.30  
Epoxy resin  
10.16±0.50  
0.26±0.10  
Epoxy resin  
10.16±0.50  
0.26±0.10  
0.5±0.1  
0.5±0.1  
Product mass : approx. 0.23g  
Product mass : approx. 0.23g  
Sheet No.: D2-A09501EN  
2
PC123XNNSZ0F Series  
(Unit : mm)  
5. SMT Gullwing Lead-Form (VDE option)  
6. Wide SMT Gullwing Lead-Form  
[ex. PC123XNYIP0F]  
[ex. PC123XNNUP0F]  
Rank mark  
Anode mark  
Factory identification mark  
Rank mark  
Anode mark  
Factory identification mark  
Date code  
Date code  
1
2
4
4
1
2
3
3
P C 1 2 3  
P C 1 2 3  
4
SHARP mark "S"  
6.5±0.3  
6.5±0.3  
VDE  
idenfication mark  
7.62±0.30  
4.58±0.30  
7.62±0.30  
4.58±0.30  
Epoxy resin  
0.5±0.1  
0.75±0.25  
10.16±0.50  
12MAX  
0.75±0.25  
2.54±0.25  
+0.4  
0.0  
+0.4  
0.0  
Epoxy resin  
1.0  
1.0  
+0.0  
0.5  
10.0  
Product mass : approx. 0.22g  
Product mass : approx. 0.22g  
7. Wide SMT Gullwing Lead-Form (VDE option)  
[ex. PC123XNYUP0F]  
Rank mark  
Anode mark  
Factory identification mark  
Date code  
1
2
4
3
P C 1 2 3  
4
SHARP mark "S"  
6.5±0.3  
VDE  
idenfication mark  
7.62±0.30  
4.58±0.30  
Epoxy resin  
0.5±0.1  
0.75±0.25  
10.16±0.50  
12MAX  
0.75±0.25  
Product mass : approx. 0.22g  
Sheet No.: D2-A09501EN  
3
PC123XNNSZ0F Series  
Date code (2 digit)  
1st digit  
2nd digit  
Year of production  
Month of production  
A.D.  
1990  
1991  
1992  
1993  
1994  
1995  
1996  
1997  
1998  
1999  
2000  
2001  
Mark  
A
B
A.D.  
2002  
2003  
2004  
2005  
2006  
2007  
2008  
2009  
2010  
2011  
2012  
:
Mark  
P
Month  
Mark  
1
January  
February  
March  
R
2
C
S
3
D
E
T
April  
4
U
V
W
X
A
B
May  
5
F
June  
6
H
J
July  
7
August  
September  
October  
November  
December  
8
K
L
9
O
N
D
M
N
C
:
repeats in a 20 year cycle  
Factory identication mark and Plating material  
Factory identication Mark  
Country of origin  
Plating material  
no mark  
Japan  
SnCu (Cu : TYP. 2%)  
or  
or  
Indonesia  
China  
SnBi (Bi : TYP. 2%)  
SnCu (Cu : TYP. 2%)*  
SnCu (Cu : TYP. 2%)  
* Up to Date code "T4" (April 2005), SnBi (Bi : TYP. 2%).  
** This factory marking is for identication purpose only.  
Please contact the local SHARP sales representative to see the actural status of the production.  
Rank mark  
Refer to the Model Line-up table.  
Sheet No.: D2-A09501EN  
4
PC123XNNSZ0F Series  
Absolute Maximum Ratings  
(T 25̊C)  
=
a
Parameter  
Symbol  
Rating  
50  
1
Unit  
mA  
A
Forward current  
*1 Peak forward current  
IF  
IFM  
VR  
P
Input  
Reverse voltage  
6
V
Power dissipation  
70  
70  
6
mW  
V
Collector-emitter voltage  
Emitter-collector voltage  
Collector current  
VCEO  
VECO  
IC  
V
Output  
50  
150  
200  
5
mA  
mW  
mW  
kV  
̊C  
Collector power dissipation  
PC  
Total power dissipation  
*2 Isolation voltage  
Ptot  
V (rms)  
iso  
Operating temperature  
Storage temperature  
*2 Soldering temperature  
Topr  
Tstg  
Tsol  
30 to 100  
+
55 to 125  
̊C  
+
260  
̊C  
*1 Pulse width100ms, Duty ratio : 0.001  
*2 40 to 60%RH, AC for 1 minute, f = 60Hz  
*3 For 10s  
Electro-optical Characteristics  
(T 25̊C)  
=
a
Parameter  
Symbol  
VF  
Condition  
20mA  
MIN.  
TYP. MAX.  
Unit  
V
Forward voltage  
I
1.2  
1.4  
10  
250  
100  
=
F
Input Reverse current  
Terminal capacitance  
IR  
VR 4V  
A
μ
=
Ct  
V 0, f 1kHz  
30  
pF  
nA  
V
=
=
Collector dark current  
Output Collector-emitter breakdown voltage  
Emitter-collector breakdown voltage  
Collector current  
ICEO  
BVCEO  
BVECO  
IC  
VCE 50V, I 0  
= =  
F
IC 0.1mA, I  
0
70  
6
=
=
F
I
10 A, I  
0
=
F
nA  
mA  
V
=
μ
E
I
5mA, V 5V  
2.5  
20  
0.2  
=
=
CE  
F
Collector-emitter saturation voltage VCE(sat)  
I
20mA, I 1mA  
0.1  
=
=
C
F
Transfer Isolation resistance  
Floating capacitance  
RISO  
Cf  
fC  
DC500V, 40 to 60%RH  
V 0, f 1MHz  
5×1010 1×1011  
Ω
charac  
0.6  
80  
4
1
pF  
kHz  
=
=
teristics Cut-off frequency  
VCE 5V, I 2mA, R 100 , 3dB  
Ω −  
=
=
C
=
L
Rise time  
Fall time  
tr  
18  
18  
s
s
μ
Response time  
VCE 2V, I 2mA, R 100  
Ω
=
=
=
L
C
tf  
3
μ
Sheet No.: D2-A09501EN  
5
PC123XNNSZ0F Series  
Model Line-up  
Lead Form  
Through-Hole  
Wide Through-Hole  
IC[mA]  
Sleeve  
(I 5mA,  
Package  
DIN  
=
F
Rank mark  
100pcs/sleeve  
VCE 5V,  
=
T 25˚C)  
=
a
Approved  
Approved  
EN60747-5-2  
With or without  
2.5 to 20  
2.5 to 7.5  
5 to 12.5  
10 to 20  
5 to 10  
PC123XNNSZ0F PC123XNYSZ0F PC123XNNFZ0F PC123XNYFZ0F  
PC123X1NSZ0F PC123X1YSZ0F PC123X1NFZ0F PC123X1YFZ0F  
PC123X2NSZ0F PC123X2YSZ0F PC123X2NFZ0F PC123X2YFZ0F  
PC123X5NSZ0F PC123X5YSZ0F PC123X5NFZ0F PC123X5YFZ0F  
PC123X8NSZ0F PC123X8YSZ0F PC123X8NFZ0F PC123X8YFZ0F  
L
M
N
E
Model No.  
Lead Form  
Package  
SMT Gullwing  
Wide SMT Gullwing  
IC[mA]  
Taping  
(I 5mA,  
=
F
Rank mark  
2 000pcs/reel  
VCE 5V,  
=
DIN  
T 25˚C)  
=
Approved  
Approved  
a
EN60747-5-2  
With or without  
2.5 to 20  
2.5 to 7.5  
5 to 12.5  
10 to 20  
5 to 10  
PC123XNYIP0F PC123XNNUP0F PC123XNYUP0F  
PC123X1YIP0F PC123X1NUP0F PC123X1YUP0F  
PC123X2YIP0F PC123X2NUP0F PC123X2YUP0F  
PC123X5YIP0F PC123X5NUP0F PC123X5YUP0F  
PC123X8YIP0F PC123X8NUP0F PC123X8YUP0F  
L
M
N
E
Model No.  
Please contact a local SHARP sales representative to inquire about production status.  
Sheet No.: D2-A09501EN  
6
PC123XNNSZ0F Series  
Fig.1 Forward Current vs. Ambient  
Temperature  
Fig.2 Diode Power Dissipation vs.  
Ambient Temperature  
50  
40  
30  
20  
100  
80  
70  
60  
40  
10  
0
20  
0
30  
0
25  
50 55 75  
100  
125  
30  
0
25  
50 55 75  
100  
125  
Ambient temperature Ta (˚C)  
Ambient temperature Ta (˚C)  
Fig.3 Collector Power Dissipation vs.  
Fig.4 Total Power Dissipation vs. Ambient  
Ambient Temperature  
Temperature  
250  
250  
200  
150  
100  
200  
150  
100  
50  
0
50  
0
30  
0
25  
50  
75  
100  
125  
30  
0
25  
50  
75  
100  
125  
Ambient temperature Ta (˚C)  
Ambient temperature Ta (˚C)  
Fig.5 Peak Forward Current vs. Duty Ratio  
Fig.6 Forward Current vs. Forward Voltage  
10 000  
Ta=75˚C  
Pulse width100μs  
Ta=25˚C  
50˚C  
25˚C  
100  
0˚C  
1 000  
25˚C  
10  
100  
10  
1
103  
102  
Duty ratio  
101  
1
0
0.5  
1
1.5  
2
2.5  
3
3.5  
Forward voltage VF (V)  
Sheet No.: D2-A09501EN  
7
PC123XNNSZ0F Series  
Fig.7 Current Transfer Ratio vs.  
Fig.8 Collector Current vs.  
Forward Current  
Collector-emitter Voltage  
300  
Ta=25˚C  
V
CE=5V  
60  
54  
Ta=25˚C  
250  
200  
150  
100  
PC (MAX.)  
48  
42  
36  
30  
24  
18  
12  
50  
0
6
0
0
1
2
3
4
5
6
7
8
9
10  
0.1  
1
10  
100  
Forward current IF (mA)  
Collector-emitter voltage VCE (V)  
Fig.9 Relative Current Transfer Ratio vs.  
Ambient Temperature  
Fig.10 Collector - emitter Saturation Voltage  
vs. Ambient Temperature  
150  
0.16  
IF=5mA  
IF=20mA  
VCE=5V  
IC=1mA  
0.14  
0.12  
0.1  
100  
0.08  
0.06  
0.04  
50  
0
0.02  
0
30  
0
25  
50  
75  
100  
30  
0
20  
40  
60  
80  
100  
Ambient temperature Ta (˚C)  
Ambient temperature Ta (˚C)  
Fig.11 Collector Dark Current vs.  
Fig.12 Response Time vs.  
Load Resistance  
1 000  
Ambient Temperature  
105  
VCE=50V  
V
CE=2V  
IC=2mA  
Ta=25˚C  
106  
107  
108  
109  
100  
tr  
tf  
10  
td  
ts  
1
1010  
1011  
0.1  
0.01  
0.1  
1
10  
100  
30  
0
20  
40  
60  
80  
100  
Load resistance (kΩ)  
Ambient temperature Ta (˚C)  
Sheet No.: D2-A09501EN  
8
PC123XNNSZ0F Series  
Fig.13 Test Circuit for Response Time  
Fig.14 Frequency Response  
5
0
V
CE=5V  
IC=2mA  
Ta=25˚C  
Input  
VCC  
Output  
Output  
VCE  
RL  
Input RD  
10%  
90%  
tf  
5  
td  
ts  
tr  
10  
Please refer to the conditions in Fig.12.  
RL=10kΩ  
100Ω  
1kΩ  
15  
20  
0.1  
1
10  
100  
1 000  
Frequency (kHz)  
Fig.15 Collector-emitter Saturation Voltage vs.  
Forward Current  
Ta=25˚C  
5
IC=0.5mA  
1mA  
3mA  
4.5  
5mA  
7mA  
4
3.5  
3
2.5  
2
1.5  
1
0.5  
0
0
2
4
6
8
10 12 14 16 18 20  
Forward current IF (mA)  
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.  
Sheet No.: D2-A09501EN  
9
PC123XNNSZ0F Series  
Design Considerations  
Design guide  
While operating at IF<1mA, CTR variation may increase.  
Please make design considering this fact.  
This product is not designed against irradiation and incorporates non-coherent IRED.  
Degradation  
In general, the emission of the IRED used in photocouplers will degrade over time.  
In the case of long term operation, please take the general IRED degradation (50% degradation over 5  
years) into the design consideration.  
Recommended foot print (reference)  
SMT Gullwing lead-form  
Wide SMT Gullwing lead-form  
8.2  
10.2  
2.2  
2.2  
(Unit : mm)  
For additional design assistance, please review our corresponding Optoelectronic Application Notes.  
Sheet No.: D2-A09501EN  
10  
PC123XNNSZ0F Series  
Manufacturing Guidelines  
Soldering Method  
Reow Soldering :  
Reow soldering should follow the temperature prole shown below.  
Soldering should not exceed the curve of temperature prole and time.  
Please don't solder more than twice.  
(˚C)  
300  
Terminal : 260˚C peak  
(package surface : 250˚C peak)  
200  
Reflow  
220˚C or more, 60s or less  
Preheat  
100  
150 to 180˚C, 120s or less  
0
0
1
2
3
4
(min)  
Flow Soldering :  
Due to SHARP's double transfer mold construction submersion in ow solder bath is allowed under the be-  
low listed guidelines.  
Flow soldering should be completed below 270̊C and within 10s.  
Preheating is within the bounds of 100 to 150̊C and 30 to 80s.  
Please don't solder more than twice.  
Hand soldering  
Hand soldering should be completed within 3s when the point of solder iron is below 400̊C.  
Please don't solder more than twice  
Other notice  
Please test the soldering method in actual condition and make sure the soldering works ne, since the im-  
pact on the junction between the device and PCB varies depending on the tooling and soldering conditions.  
Sheet No.: D2-A09501EN  
11  
PC123XNNSZ0F Series  
Cleaning instructions  
Solvent cleaning :  
Solvent temperature should be 45˚C or below. Immersion time should be 3 minutes or less.  
Ultrasonic cleaning :  
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,  
size of PCB and mounting method of the device.  
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of  
mass production.  
Recommended solvent materials :  
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol.  
In case the other type of solvent materials are intended to be used, please make sure they work ne in ac-  
tual using conditions since some materials may erode the packaging resin.  
Presence of ODC  
This product shall not contain the following materials.  
And they are not used in the production process for this product.  
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)  
Specic brominated ame retardants such as the PBB and PBDE are not used in this product at all.  
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).  
•Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated  
diphenyl ethers (PBDE).  
Sheet No.: D2-A09501EN  
12  
PC123XNNSZ0F Series  
Package specication  
Sleeve package  
1. Through-Hole  
Package materials  
Sleeve : HIPS (with anti-static material)  
Stopper : Styrene-Elastomer  
Package method  
MAX. 100pcs of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless  
stoppers.  
The product shall be arranged in the sleeve with its anode mark on the tabless stopper side.  
MAX. 20 sleeves in one case.  
Sleeve outline dimensions  
12  
6.7  
(Unit : mm)  
2. Wide Through-Hole  
Package materials  
Sleeve : HIPS (with anti-static material)  
Stopper : Styrene-Elastomer  
Package method  
MAX. 100pcs of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless  
stoppers.  
The product shall be arranged in the sleeve with its anode mark on the tabless stopper side.  
MAX. 20 sleeves in one case.  
Sleeve outline dimensions  
15  
6.35  
(Unit : mm)  
Sheet No.: D2-A09501EN  
13  
PC123XNNSZ0F Series  
Tape and Reel package  
1. SMT Gullwing  
Package materials  
Carrier tape : PS  
Cover tape : PET (three layer system)  
Reel : PS  
Carrier tape structure and Dimensions  
F
D
J
G
E
I
K
Dimensions List  
(Unit : mm)  
A
B
C
D
E
F
G
+0.1  
16.0±0.3  
7.5±0.1  
1.75±0.10  
8.0±0.1  
2.0±0.1  
4.0±0.1  
φ1.5  
0.0  
H
I
J
K
10.4±0.1 0.40±0.05  
4.2±0.1  
5.1±0.1  
Reel structure and Dimensions  
e
d
g
Dimensions List  
(Unit : mm)  
a
b
c
d
φ330  
17.5±1.5  
φ100±1 φ13.0±0.5  
f
e
f
g
b
φ23±1  
2.0±0.5  
2.0±0.5  
a
Direction of product insertion  
Pull-out direction  
[Packing : 2 000pcs/reel]  
Sheet No.: D2-A09501EN  
14  
PC123XNNSZ0F Series  
2. Wide SMT Gullwing  
Package materials  
Carrier tape : PS  
Cover tape : PET (three layer system)  
Reel : PS  
Carrier tape structure and Dimensions  
F
D
J
G
C
I
E
K
Dimensions List  
(Unit : mm)  
A
B
C
D
E
F
G
+0.1  
24.0±0.3  
11.5±0.1 1.75±0.10  
8.0±0.1  
2.0±0.1  
4.0±0.1  
φ1.5  
0.0  
H
I
J
K
12.4±0.1 0.40±0.05  
4.1±0.1  
5.1±0.1  
Reel structure and Dimensions  
e
d
g
Dimensions List  
(Unit : mm)  
a
b
c
d
φ330  
25.5±1.5  
φ100±1 φ13.0±0.5  
f
e
f
g
b
φ23±1  
2.0±0.5  
2.0±0.5  
a
Direction of product insertion  
Pull-out direction  
[Packing : 2 000pcs/reel]  
Sheet No.: D2-A09501EN  
15  
PC123XNNSZ0F Series  
Important Notices  
· The circuit application examples in this publication  
are provided to explain representative applications of  
SHARP devices and are not intended to guarantee any  
circuit design or license any intellectual property rights.  
SHARP takes no responsibility for any problems related  
to any intellectual property right of a third party resulting  
from the use of SHARP's devices.  
with equipment that requires higher reliability such as:  
--- Transportation control and safety equipment (i.e.,  
aircraft, trains, automobiles, etc.)  
--- Trafc signals  
--- Gas leakage sensor breakers  
--- Alarm equipment  
--- Various safety devices, etc.  
(iii) SHARP devices shall not be used for or in  
connection with equipment that requires an extremely  
high level of reliability and safety such as:  
--- Space applications  
· Contact SHARP in order to obtain the latest device  
specification sheets before using any SHARP device.  
SHARP reserves the right to make changes in the  
specications, characteristics, data, materials, structure,  
and other contents described herein at any time  
without notice in order to improve design or reliability.  
Manufacturing locations are also subject to change  
without notice.  
--- Telecommunication equipment [trunk lines]  
--- Nuclear power control equipment  
--- Medical and other life support equipment (e.g.,  
scuba).  
· If the SHARP devices listed in this publication fall  
within the scope of strategic products described in the  
Foreign Exchange and Foreign Trade Law of Japan, it  
is necessary to obtain approval to export such SHARP  
devices.  
· Observe the following points when using any devices  
in this publication. SHARP takes no responsibility for  
damage caused by improper use of the devices which  
does not meet the conditions and absolute maximum  
ratings to be used specied in the relevant specication  
sheet nor meet the following conditions:  
· This publication is the proprietary product of SHARP  
and is copyrighted, with all rights reserved. Under  
the copyright laws, no part of this publication may be  
reproduced or transmitted in any form or by any means,  
electronic or mechanical, for any purpose, in whole or in  
part, without the express written permission of SHARP.  
Express written permission is also required before any  
use of this publication may be made by a third party.  
(i) The devices in this publication are designed for use  
in general electronic equipment designs such as:  
--- Personal computers  
--- Ofce automation equipment  
--- Telecommunication equipment [terminal]  
--- Test and measurement equipment  
--- Industrial control  
--- Audio visual equipment  
--- Consumer electronics  
· Contact and consult with a SHARP representative  
if there are any questions about the contents of this  
publication.  
(ii) Measures such as fail-safe function and redundant  
design should be taken to ensure reliability and safety  
when SHARP devices are used for or in connection  
Sheet No.: D2-A09501EN  
[E253]  
16  
配单直通车
PC123X5YUP0F产品参数
型号:PC123X5YUP0F
是否Rohs认证: 符合
生命周期:Obsolete
IHS 制造商:SHARP CORP
包装说明:ROHS COMPLIANT, PLASTIC, SMT, DIP-4
Reach Compliance Code:compliant
风险等级:5.82
Is Samacsys:N
其他特性:UL RECOGNIZED, VDE APPROVED
Coll-Emtr Bkdn Voltage-Min:70 V
配置:SINGLE
标称电流传输比:400%
最大暗电源:100 nA
最大正向电流:0.05 A
最大绝缘电压:5000 V
JESD-609代码:e6
元件数量:1
最高工作温度:100 °C
最低工作温度:-30 °C
光电设备类型:TRANSISTOR OUTPUT OPTOCOUPLER
端子面层:Tin/Bismuth (Sn/Bi)
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