PC924L芯片引脚定义引脚图及功能IC贸易商引脚图技术参数-中国IC网-芯三七

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产品型号PC924L的概述

概述 PC924L是一款高性能、低功耗的光耦合器，广泛用于各种电子设备的信号隔离和电路保护任务。其设计旨在实现高效的数据传输，同时保证电气隔离，以防止干扰和电压瞬变对系统的影响。光耦合器的核心组成部分通常包括发光二极管（LED）和光电晶体管，PC924L则在此基础上进行了优化，适应了多种工业和消费类应用的需求。详细参数 PC924L的结构与功能使其在各种电气环境中表现卓越。以下是PC924L的一些关键技术参数： - 输入电压范围：通常为1.2V至5V，确保在不同电压水平下工作良好。 - 输出电流：最大输出电流可达50mA，适应大多数应用场景。 - 传输延迟：上升时间和下降时间分别为10μs和6μs，特别适合高速数据传输。 - 隔离电压：提供高达5000Vrms的电气隔离，确保系统的安全性。 - 工作温度范围：通常为-40°C至85°C，适用于各种严酷的环境条件。 PC924L的工作特...

产品型号PC924L0NIP的Datasheet PDF文件预览

PC924L0NSZ Series

Gate Drive DIP 8 pin

OPIC Photocoupler

∗

PC924L0NSZ

Series

■ Description

PC924L0NSZ Series contains an IRED optically

coupled to an OPIC chip.

■ Agency approvals/Compliance

1. Recognized by UL1577 (Double protection isolation),

file No. E64380 (as model No. PC924L)

It is packaged in a 8 pin DIP, available in SMT gullw-

ing lead form option.

2. Approved by VDE (VDE0884) (as an option), file No.

87446 (as model No. PC924L)

Input-output isolation voltage(rms) is 5.0kV.

CMR is MIN. 15kV/µs.

3. Package resin : UL flammability grade (94V-0)

■ Applications

1. IGBT/MOSFET gate drive for inverter control

■ Features

1. 8 pin DIP package

2. Double transfer mold package

(Ideal for Flow Soldering)

3. Built-in direct drive circuit for IGBT drive

(I_O1P, I_O2P: 0.6A)

4. Wide operating supply voltage range

(V_CC: 15 to 30V)

5. High noise immunity due to high instantaneous com-

mon mode rejection voltage

(CM_H: MIN. −15kV/µs, CM_L: MIN. 15kV/µs)

6. High isolation voltage between input and output

(V_iso(rms): 5.0 kV)

∗

"OPIC"(Optical IC) is a trademark of the SHARP Corporation. An OPIC consists of a light-detecting element and a signal-processing

circuit integrated onto a single chip.

Notice The content of data sheet is subject to change without prior notice.

In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP

devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.

Sheet No.: D2-A06101EN

Date Nov. 28. 2003

PC924L0NSZ Series

■ Internal Connection Diagram

Anode

Cathode

O₁

O₂

GND

Interface

8 V_CC

Amp.

■ Truth table

Input O₂Terminal Output Tr.1

Tr.2

OFF

High level

Low level

OFF

(Unit : mm)

■ Outline Dimensions

1. Through-Hole [ex. PC924L0NSZ]

2. Through-Hole (VDE0884 option) [ex. PC924L0YIZ]

0.3

1.2

0.3

1.2

0.2

0.85

P C 9 2 4 L

VDE0884 Identification mark

0.5

9.66

Primary side

mark

Date code

Primary side

mark

Date code

0.3

7.62

Epoxy resin

0.1

0.25

0.26

0.1

2.54

0.5

θ:0 to 13˚

Sheet No.: D2-A06101EN

PC924L0NSZ Series

(Unit : mm)

3. SMT Gullwing Lead-Form [ex. PC924L0NIP]

4. SMT Gullwing Lead-Form (VDE0884 option)

[ex. PC924L0YIP]

0.3

1.2

0.2

0.85

P C 9 2 4 L

^{P C 9 2 4}4^L

Primary

side

mark

Primary

side

mark

0.5

VDE0884 Identification mark

Date code

9.66

Date code

0.3

7.62

Epoxy resin

+0.4

0.25

1.0

−0

2.54

−0

2.54

−0

10.0

−0.5

Product mass : approx. 0.55g

Sheet No.: D2-A06101EN

PC924L0NSZ Series

Date code (3 digit)

1st digit

2nd digit

3rd digit

Year of production

Month of production

Week of production

A.D.

1990

1991

1992

1993

1994

1995

1996

1997

1998

1999

2000

2001

A.D

2002

2003

2004

2005

2006

2007

2008

2009

2010

2011

2012

Mark

Month

Mark

Week

Mark

January

February

March

1st

2nd

3rd

April

4th

May

5.6th

June

July

August

September

October

November

December

repeats in a 20 year cycle

Country of origin

Japan

Sheet No.: D2-A06101EN

PC924L0NSZ Series

■ Absolute Maximum Ratings

(T_a=25˚C)

Parameter

^*1Forward current

Reverse voltage

Symbol

I_F

Rating

Unit

V_R

Supply voltage

V_CC

I_O1

O₁output current

0.1

^*2O₁peak output current

I_O1P

I_O2

0.6

O₂output current

0.1

0.6

^*2O₂peak output current

O₁output voltage

I_O2P

V_O1

P_O

^*3Power dissipation

^*4Total power dissipation

^*5Isolation voltage

Operating temperature

Storage temperature

^*6Soldering temperature

500

˚C

P_tot

550

V_{iso (rms)}

T_opr

T_stg

5.0

−40 to +100

−55 to +125

270

T_sol

*1 The derating factors of a absolute maximum ratings due to ambient temperature

are shown in Fig.10

*2 Pulse width≤0.15µs, Duty ratio : 0.01

*3, 4 The derating factors of a absolute maximum ratings due to ambient temperature

are shown in Fig.11

*5 AC for 1minute, 40 to 60%RH, f=60Hz

*6 For 10s

■ Electro-optical Characteristics^*7

(Unless otherwise specified T_a=T_opr

)

Parameter

Symbol

V_F1

V_F2

I_R

Conditions

T_a=25˚C, I_F=20mA

T_a=25˚C, I_F=0.2mA

T_a=25˚C, V_R=4V

T_a=25˚C, V=0, f=1kHz

−

MIN.

−

TYP.

1.2

0.9

−

MAX.

1.4

−

Unit

Forward voltage

0.6

−

Reverse current

µA

Terminal capacitance

Supply voltage

C_t

−

250

V_CC

−

V_CC1=12V, V_CC2=−12V

I_O1=0.1A, I_F=10mA

V_O1L

−

0.2

0.4

O₁low level output voltage

O₂high level output voltage

O₂low level output voltage

O₁leak current

V_O2HV_CC=V_O1=24V, I_O2=−0.1A, I_F=10mA

0.5

−

V_O2L

I_O1L

I_O2L

I_CCH

I_CCL

V_CC=24V, I_O2=0.1A, I_F=0

V_CC=V_O1=35V, I_F=0

V_CC=V_O2=35V, I_F=10mA

V_CC=24V, I_F=10mA

V_CC=24V, I_F=0

−

0.8

500

3.0

7.0

10.0

−

µA

Ω

O₂leak current

−

^*9High level supply current

^*9Low level supply current

−

1.3

4.0

−

10¹¹

1.0

0.2

−

1.0

0.6

5×10¹⁰

−

T_a=25˚C, V_CC=24V

I_FLH

Low→High" input threshold current

V_CC=24V

Isolation resistance

R_ISO

t_PLH

t_PHL

t_r

T_a=25˚C, DC500V, 40 to 60%RH

"Low→High" propagation delay time

"High→Low" propagation delay time

Rise time

2.0

0.5

µs

T_a=25˚C, V_CC=24V, I_F=10mA

R_G=47Ω, C_G=3 000pF

−

µs

−

µs

Fall time

t_f

−

µs

T_a=25˚C, V_CM=1.5kV(p-p)

I_F=10mA, V_CC=24V, ∆V_O2H=2.0V

T_a=25˚C, V_CM=1.5kV(p-p)

Instantaneous common mode rejection

voltage (High level output)

CM_H

CM_L

−15

−

kV/µs

Instantaneous common mode rejection

voltage (Low level output)

I_F=0, V_CC=24V, ∆V_O2L=2.0V

*7 It shall connect a by-pass capacitor of 0.01µF or more between V_CC(pin

characteristics

) and GND (pin

)

near the device, when it measures the transfer characteristics and the output side

*8 I_FLHrepresents forward current when output goes from "Low" to "High"

*9 O₂output terminal is set to open

Sheet No.: D2-A06101EN

PC924L0NSZ Series

■ Model Line-up

Lead Form

Through-Hole

SMT Gullwing

Sleeve

Taping

Package

50pcs/sleeve

1 000pcs/reel

VDE0884

Model No.

−−−−−−

Approved

−−−−−−

Approved

−−−−−−

Approved

PC924L0NSZ PC924L0YSZ PC924L0NIZ PC924L0YIZ PC924L0NIP PC924L0YIP

Please contact a local SHARP sales representative to inquire about production status and Lead-Free options.

Sheet No.: D2-A06101EN

PC924L0NSZ Series

Fig.1 Test Circuit for O₁Low Level Output

Voltage

Fig.2 Test Circuit for O₂High Level Output

Voltage

V_CC1

I_O1

I_O2

V_CC

I_F

PC924L

V_O1L

V_CC2

V_O2H

Fig.3 Test Circuit for O₂Low Level Output

Voltage

Fig.4 Test Circuit for O₁Leak Current

I_O1L

V_CC

I_F

V_CC

PC924L

I_O2

V_O2L

Fig.5 Test Circuit for O₂Leak Current

Fig.6 Test Circuit for High Level / Low Level

Supply Current

I_CC

I_O2L

I_F

V_CC

PC924L

Sheet No.: D2-A06101EN

PC924L0NSZ Series

Fig.7 Test Circuit for "Low→High" Input Threshold Current

I_F

V_CC

PC924L

Variable

Fig.8 Test Circuit for Response Time

50%

V_INwave form

t =t =0.01µs

t_PHL

t_PLH

Pulse width 5µs

V_IN

V_CC

C_G

PC924L

R_G

V_OUT

Duty ratio 50%

90%

50%

V_OUTwave form

10%

t_r

t_f

Fig.9 Test Circuit for Instantaneous Common Mode Rejection Voltage

V_CM

(Peak)

V_CMwave form

GND

V_CC

PC924L

CM_H, V_O2wave form

SW at A, I_F=10mA

V_O2

V_O2H

∆V_O2H

∆V_O2L

−

CM_L, V_O2wave form

V_O2L

GND

SW at B, I_F=0

V_CM

Sheet No.: D2-A06101EN

PC924L0NSZ Series

Fig.11 Power Dissipation vs. Ambient

Fig.10 Forward Current vs. Ambient

Temperature

600

500

400

300

200

P_tot

P_O

100

−40 −25

100

125

−40 −25

100

125

Ambient temperature T_a(°C)

Fig.12 Forward Current vs. Forward Voltage

Fig.13 "Low→High" Relative Input Threshold

Current vs. Supply Voltage

120

100

T_a=25˚C

110

Value of V_CC=24V

assume 100

100

25°C

T_a=100°C

0°C

85°C

−40°C

50°C

0.1

0.5

0.75

1.25

1.5

1.75

Supply voltage V_CC(V)

Forward voltage V_F(V)

Fig.14 "Low→High" Relative Input Threshold

Fig.15 O₁Low Level Output Voltage vs.

Current vs. Ambient Temperature

160

O₁Output Current

T_a=25°C

V_CC1=12V

V_CC=24V

140

V_CC2=−12V

I_F=10mA

120

I_FLH=100% at T_a=25˚C

100

−40 −20

100

0.0

0.1

0.2

0.3

0.4

0.5

0.6

Ambient temperature T_a(°C)

O₁output current I_O1(A)

Sheet No.: D2-A06101EN

PC924L0NSZ Series

Fig.17 O₂Output Voltage Drop vs.

Fig.16 O₁Low Level Output Voltage vs.

Ambient Temperature

O₂Output Current

0.30

T_a=25°C

V_CC1=12V

V_CC=V_O1=24V

I_F=10mA

V_CC2=−12V

I_F=10mA

0.25

−1

−2

−3

I_O2=0.1A

0.20

0.15

0.10

−4

−5

0.05

0.00

−40 −20

100

0.0

0.1

0.2

0.3

0.4

0.5

0.6

Ambient temperature T_a(˚C)

O₂output current I_O2(A)

Fig.18 O₂High Level Output Voltage vs.

Supply Voltage

Fig.19 O₂High Level Output Voltage vs.

Ambient Temperature

T_a=25°C

I_F=10mA

V_CC=24V

I_F=10mA

I_O2Nearly=0A

I_O2=−0.1A

−40 −20

100

Supply voltage V_CC(V)

Ambient temperature T_a(°C)

Fig.20 O₂Low Level Output Voltage vs.

O₂Output Current

Fig.21 O₂Low Level Output Voltage vs.

Ambient Temperature

0.8

T_a=25°C

V_CC=V_O1=24V

I_F=0

V_CC=24V

I_F=0

I_O2=0.1A

0.7

0.6

0.5

0.4

0.3

0.2

0.0

0.1

0.2

0.3

0.4

0.5

0.6

−40 −20

100

O₂output current I_O2(A)

Ambient temperature T_a(°C)

Sheet No.: D2-A06101EN

PC924L0NSZ Series

Fig.23 Low Level Supply Current vs.

Fig.22 High Level Supply Current vs.

Supply Voltage

T_a=25˚C

I_F=10mA

T_a=25˚C

I_F=0

2.5

1.5

0.5

Supply voltage V_CC(V)

Fig.24 High Level Supply Current vs. Ambient Fig.25 Low Level Supply Current vs.

Temperature

Ambient Temperature

V_CC=24V

I_F=10mA

V_CC=24V

I_F=0

2.5

1.5

0.5

−40 −20

100

−40 −20

100

Ambient temperature T_a(˚C)

Fig.26 Propagation Delay Time vs. Forward

Fig.27 Propagation Delay Time vs. Ambient

Temperature

Current

2.5

V_CC=V_O1=24V

t_PHL

t_PLH

R_G=47Ω

C_G=3 000pF

I_F=10mA

C_G=3 000pF

2.0

1.5

T_a=85˚C

25˚C

−40˚C

1.0

t_PHL

0.5

t_PLH

25˚C

−40˚C

85˚C

−40 −20

100

Forward current I_F(mA)

Ambient temperature T_a(˚C)

Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.

Sheet No.: D2-A06101EN

PC924L0NSZ Series

■ Design Considerations

● Recommended operating conditions

MAX.

Unit

Symbol

I_F

Parameter

Forward current

Supply voltage

MIN.

TYP.

−

V_CC

T_opr

Operating temperature

−40

˚C

● Notes about static electricity

Transistor of detector side in bipolar configuration may be damaged by static electricity due to its minute de-

sign.

When handling these devices, general countermeasure against static electricity should be taken to avoid

breakdown of devices or degradation of characteristics.

● Design guide

In order to stabilize power supply line, we should certainly recommend to connect a by-pass capacitor of

0.01µF or more between V_CCand GND near the device.

In case that some sudden big noise caused by voltage variation is provided between primary and secondary

terminals of photocoupler some current caused by it is floating capacitance may be generated and result in

false operation since current may go through IRED or current may change.

If the photocoupler may be used under the circumstances where noise will be generated we recommend to

use the bypass capacitors at the both ends of IRED.

The detector which is used in this device, has parasitic diode between each pins and GND.

There are cases that miss operation or destruction possibly may be occurred if electric potential of any pin

becomes below GND level even for instant.

Therefore it shall be recommended to design the circuit that electric potential of any pin does not become

below GND level.

This product is not designed against irradiation and incorporates non-coherent IRED.

This photocoupler is dedicated to the use for IGBT or MOSFET Gate Drive.

Please do not use this for the other application.

As mentioned below, when the input is on, if DC load (resistor etc.) is connected between O₂output pin 6

and GND pin 7 and if the electric potential V_O2goes approx. 2V below than electric potential V_CCpin 8 con-

tinuously, supply current I_CCmay flow more than usually and go beyond power dissipation.

2V or more

V_CC

I_F

PC924L

Sheet No.: D2-A06101EN

PC924L0NSZ Series

● Degradation

In general, the emission of the IRED used in photocouplers will degrade over time.

In the case of long term operation, please take the general IRED degradation (50% degradation over 5years)

into the design consideration.

Please decide the input current which become 2times of MAX. I_FLH

● Recommended Foot Print (reference)

8.2

2.2

(Unit : mm)

✩

For additional design assistance, please review our corresponding Optoelectronic Application Notes.

Sheet No.: D2-A06101EN

PC924L0NSZ Series

■ Manufacturing Guidelines

● Soldering Method

Reflow Soldering:

Reflow soldering should follow the temperature profile shown below.

Soldering should not exceed the curve of temperature profile and time.

Please don't solder more than twice.

(˚C)

300

Terminal : 260˚C peak

( package surface : 250˚C peak)

200

Reflow

220˚C or more, 60s or less

Preheat

100

150 to 180˚C, 120s or less

(min)

Flow Soldering :

Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below

listed guidelines.

Flow soldering should be completed below 270˚C and within 10s.

Preheating is within the bounds of 100 to 150˚C and 30 to 80s.

Please don't solder more than twice.

Hand soldering

Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.

Please don't solder more than twice.

Other notices

Please test the soldering method in actual condition and make sure the soldering works fine, since the impact

on the junction between the device and PCB varies depending on the tooling and soldering conditions.

Sheet No.: D2-A06101EN

PC924L0NSZ Series

● Cleaning instructions

Solvent cleaning:

Solvent temperature should be 45˚C or below Immersion time should be 3minutes or less

Ultrasonic cleaning:

The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,

size of PCB and mounting method of the device.

Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of

mass production.

Recommended solvent materials:

Ethyl alcohol, Methyl alcohol and Isopropyl alcohol

In case the other type of solvent materials are intended to be used, please make sure they work fine in ac-

tual using conditions since some materials may erode the packaging resin.

● Presence of ODC

This product shall not contain the following materials.

And they are not used in the production process for this device.

Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)

Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.

Sheet No.: D2-A06101EN

PC924L0NSZ Series

■ Package specification

● Sleeve package

Package materials

Sleeve : HIPS (with anti-static material)

Stopper : Styrene-Elastomer

Package method

MAX. 50 pcs. of products shall be packaged in a sleeve.

Both ends shall be closed by tabbed and tabless stoppers.

The product shall be arranged in the sleeve with its primary side mark on the tabless stopper side.

MAX. 20 sleeves in one case.

Sleeve outline dimensions

12.0

6.7

(Unit : mm)

Sheet No.: D2-A06101EN

PC924L0NSZ Series

● Tape and Reel package

Package materials

Carrier tape : A-PET (with anti-static material)

Cover tape : PET (three layer system)

Reel : PS

Carrier tape structure and Dimensions

Dimensions List

(Unit : mm)

0.3

0.1

+0.1

16.0

7.5

1.75

12.0

2.0

4.0

φ1.5

−0

0.05

0.1

10.4

0.4

4.2

10.2

Reel structure and Dimensions

Dimensions List

(Unit : mm)

1.5

1.0

0.5

330

17.5

100

1.0

0.5

2.0

Direction of product insertion

Pull-out direction

[Packing : 1 000pcs/reel]

Sheet No.: D2-A06101EN

PC924L0NSZ Series

■ Important Notices

· The circuit application examples in this publication are

provided to explain representative applications of

SHARP devices and are not intended to guarantee any

circuit design or license any intellectual property rights.

SHARP takes no responsibility for any problems rela-

ted to any intellectual property right of a third party re-

sulting from the use of SHARP's devices.

with equipment that requires higher reliability such as:

--- Transportation control and safety equipment (i.e.,

aircraft, trains, automobiles, etc.)

--- Traffic signals

--- Gas leakage sensor breakers

--- Alarm equipment

--- Various safety devices, etc.

(iii) SHARP devices shall not be used for or in connec-

tion with equipment that requires an extremely high lev-

el of reliability and safety such as:

--- Space applications

--- Telecommunication equipment [trunk lines]

--- Nuclear power control equipment

--- Medical and other life support equipment (e.g.,

scuba).

· Contact SHARP in order to obtain the latest device

specification sheets before using any SHARP device.

SHARP reserves the right to make changes in the spec-

ifications, characteristics, data, materials, structure,

and other contents described herein at any time without

notice in order to improve design or reliability. Manufac-

turing locations are also subject to change without no-

tice.

· If the SHARP devices listed in this publication fall with-

in the scope of strategic products described in the For-

eign Exchange and Foreign Trade Law of Japan, it is

necessary to obtain approval to export such SHARP de-

vices.

· Observe the following points when using any devices

in this publication. SHARP takes no responsibility for

damage caused by improper use of the devices which

does not meet the conditions and absolute maximum

ratings to be used specified in the relevant specification

sheet nor meet the following conditions:

(i) The devices in this publication are designed for use

in general electronic equipment designs such as:

--- Personal computers

· This publication is the proprietary product of SHARP

duced or transmitted in any form or by any means, elec-

tronic or mechanical, for any purpose, in whole or in

part, without the express written permission of SHARP.

Express written permission is also required before any

use of this publication may be made by a third party.

--- Office automation equipment

--- Telecommunication equipment [terminal]

--- Test and measurement equipment

--- Industrial control

--- Audio visual equipment

--- Consumer electronics

· Contact and consult with a SHARP representative if

there are any questions about the contents of this pub-

lication.

(ii) Measures such as fail-safe function and redundant

design should be taken to ensure reliability and safety

when SHARP devices are used for or in connection

Sheet No.: D2-A06101EN

PC924L相关文章

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柒号芯城电子商务（深圳）有限公司服务专线: 18922803401 在线联系:

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北京元坤伟业科技有限公司服务专线: 010-62104931621064316210489162104791 在线联系:

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首天国际（深圳）科技有限公司服务专线: 0755-82807802/82807803 在线联系:

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PC924L0NIP产品参数

型号:	PC924L0NIP
是否Rohs认证：	不符合
生命周期：	Obsolete
IHS 制造商：	SHARP CORP
包装说明：	PLASTIC, SMT, DIP-8
Reach Compliance Code：	unknown
风险等级：	5.8
其他特性：	UL RECOGNIZED
配置：	COMPLEX
最大正向电流：	0.025 A
最大绝缘电压：	5000 V
JESD-609代码：	e0
元件数量：	1
最大通态电流：	0.1 A
最高工作温度：	100 °C
最低工作温度：	-40 °C
光电设备类型：	LOGIC IC OUTPUT OPTOCOUPLER
最小供电电压：	15 V
端子面层：	Tin/Lead (Sn/Pb)
Base Number Matches：	1

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