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产品型号PCA82C250T/N4的概述

PCA82C250T/N4芯片的概述 PCA82C250T/N4是一款高性能的CAN（控制局域网络）收发器，广泛应用于工业自动化、汽车电子和其他领域requiring 数据交换的应用场合。它能够满足CAN协议的需求，保证稳定的传输性能和数据完整性。该芯片由NXP Semiconductors公司设计生产，具有良好的抗干扰能力和低功耗的特性，使得它适合于各种复杂的应用环境中。 PCA82C250T/N4具有增强的共模抑制能力和较宽的工作温度范围，其电气特性适应了不同的模拟和数字电路的要求，从而使其成为多种高可靠性系统的理想选择。它的设计遵循ISO 11898标准，支持CAN协议的各项特性，如报文优先级和间歇性数据传输。 PCA82C250T/N4的详细参数 PCA82C250T/N4的关键参数包括： 1. 供电电压：4.5V至5.5V，这使得它能与多种类型的微控制器和数字系统配合使用。 ...

产品型号PCA82C250T/N4的Datasheet PDF文件预览

INTEGRATED CIRCUITS

DATA SHEET

PCA82C250

CAN controller interface

Product speciﬁcation

2000 Jan 13

Supersedes data of 1997 Oct 21

File under Integrated Circuits, IC18

Philips Semiconductors

Product speciﬁcation

CAN controller interface

PCA82C250

FEATURES

APPLICATIONS

• Fully compatible with the “ISO 11898” standard

• High speed (up to 1 Mbaud)

• High-speed applications (up to 1 Mbaud) in cars.

GENERAL DESCRIPTION

• Bus lines protected against transients in an automotive

environment

The PCA82C250 is the interface between the CAN

protocol controller and the physical bus. The device

provides differential transmit capability to the bus and

differential receive capability to the CAN controller.

• Slope control to reduce Radio Frequency Interference

(RFI)

• Differential receiver with wide common-mode range for

high immunity against ElectroMagnetic Interference

(EMI)

• Thermally protected

• Short-circuit proof to battery and ground

• Low-current standby mode

• An unpowered node does not disturb the bus lines

• At least 110 nodes can be connected.

QUICK REFERENCE DATA

SYMBOL

V_CC

PARAMETER

CONDITIONS

MIN.

4.5

MAX.

5.5

UNIT

supply voltage

supply current

I_CC

standby mode

−

170

−

µA

Mbaud

1/t_bit

V_CAN

V_diff

t_PD

maximum transmission speed

CANH, CANL input/output voltage

differential bus voltage

non-return-to-zero

−8

1.5

−

+18

3.0

propagation delay

high-speed mode

T_amb

ambient temperature

−40

+125

°C

ORDERING INFORMATION

TYPE

PACKAGE

NUMBER

NAME

DESCRIPTION

CODE

SOT97-1

SOT96-1

−

PCA82C250

PCA82C250T

PCA82C250U

DIP8

SO8

−

plastic dual in-line package; 8 leads (300 mil)

plastic small outline package; 8 leads; body width 3.9 mm

bare die; 2790 × 1780 × 380 µm

2000 Jan 13

Philips Semiconductors

Product speciﬁcation

CAN controller interface

PCA82C250

BLOCK DIAGRAM

handbook, full pagewidth

PROTECTION

DRIVER

TXD

SLOPE/

STANDBY

CANH

CANL

RXD

RECEIVER

REFERENCE

VOLTAGE

ref

PCA82C250

MKA669

GND

Fig.1 Block diagram.

PINNING

SYMBOL

DESCRIPTION

transmit data input

TXD

GND

V_CC

handbook, halfpage

TXD

ground

supply voltage

GND

CANH

CANL

PCA82C250

RXD

V_ref

receive data output

reference voltage output

RXD

ref

CANL

LOW-level CAN voltage

input/output

MKA670

CANH

HIGH-level CAN voltage

input/output

Fig.2 Pin configuration.

slope resistor input

2000 Jan 13

Philips Semiconductors

Product speciﬁcation

CAN controller interface

PCA82C250

FUNCTIONAL DESCRIPTION

Pin 8 (Rs) allows three different modes of operation to be

selected: high-speed, slope control or standby.

The PCA82C250 is the interface between the CAN

protocol controller and the physical bus. It is primarily

intended for high-speed applications (up to 1 Mbaud) in

cars. The device provides differential transmit capability to

the bus and differential receive capability to the CAN

controller. It is fully compatible with the “ISO 11898”

standard.

For high-speed operation, the transmitter output

transistors are simply switched on and off as fast as

possible. In this mode, no measures are taken to limit the

rise and fall slope. Use of a shielded cable is

recommended to avoid RFI problems. The high-speed

mode is selected by connecting pin 8 to ground.

A current limiting circuit protects the transmitter output

stage against short-circuit to positive and negative battery

voltage. Although the power dissipation is increased

during this fault condition, this feature will prevent

destruction of the transmitter output stage.

For lower speeds or shorter bus length, an unshielded

twisted pair or a parallel pair of wires can be used for the

bus. To reduce RFI, the rise and fall slope should be

limited. The rise and fall slope can be programmed with a

resistor connected from pin 8 to ground. The slope is

proportional to the current output at pin 8.

If the junction temperature exceeds a value of

approximately 160 °C, the limiting current of both

transmitter outputs is decreased. Because the transmitter

is responsible for the major part of the power dissipation,

this will result in a reduced power dissipation and hence a

lower chip temperature. All other parts of the IC will remain

in operation. The thermal protection is particularly needed

when a bus line is short-circuited.

If a HIGH level is applied to pin 8, the circuit enters a low

current standby mode. In this mode, the transmitter is

switched off and the receiver is switched to a low current.

If dominant bits are detected (differential bus voltage

>0.9 V), RXD will be switched to a LOW level.

The microcontroller should react to this condition by

switching the transceiver back to normal operation (via

pin 8). Because the receiver is slow in standby mode, the

first message will be lost.

The CANH and CANL lines are also protected against

electrical transients which may occur in an automotive

environment.

Table 1 Truth table of the CAN transceiver

SUPPLY

TXD

CANH

HIGH

CANL

LOW

BUS STATE

dominant

recessive

RXD

4.5 to 5.5 V

1 (or ﬂoating)

X⁽¹⁾

ﬂoating

<2 V (not powered)

2 V < V_CC< 4.5 V

X⁽¹⁾

>0.75V_CC

X⁽¹⁾

ﬂoating if

V_Rs> 0.75V_CC

Note

1. X = don’t care.

Table 2 Pin Rs summary

CONDITION FORCED AT PIN Rs

_Rs> 0.75V_CC

MODE

RESULTING VOLTAGE OR CURRENT AT PIN Rs

standby

I_Rs< 10 µA

0.4V_CC< V_Rs< 0.6V_CC

I_Rs< −500 µA

−10 µA < I_Rs< −200 µA

slope control

high-speed

V_Rs< 0.3V_CC

2000 Jan 13

Philips Semiconductors

Product speciﬁcation

CAN controller interface

PCA82C250

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134); all voltages are referenced to pin 2;

positive input current.

SYMBOL

V_CC

PARAMETER

supply voltage

CONDITIONS

MIN.

−0.3

MAX.

+9.0

UNIT

V_n

DC voltage at pins 1, 4, 5 and 8

DC voltage at pins 6 and 7

−0.3

−8.0

V_CC+ 0.3

+18.0

V_{6, 7}

0 V < V_CC< 5.5 V;

no time limit

V_trt

transient voltage at pins 6 and 7

storage temperature

see Fig.8

−150

−55

+100

+150

+125

+150

+2000

+200

T_stg

T_amb

T_vj

°C

ambient temperature

−40

virtual junction temperature

electrostatic discharge voltage

note 1

note 2

note 3

−40

V_esd

−2000

−200

Notes

1. In accordance with “IEC 60747-1”. An alternative definition of virtual junction temperature is:

T_vj= T_amb+ P_d× R_th(vj-a), where R_th(j-a)is a fixed value to be used for the calculation of T_vj. The rating for T_vjlimits

the allowable combinations of power dissipation (P_d) and ambient temperature (T_amb).

2. Classification A: human body model; C = 100 pF; R = 1500 Ω; V = ±2000 V.

3. Classification B: machine model; C = 200 pF; R = 25 Ω; V = ±200 V.

THERMAL CHARACTERISTICS

SYMBOL

R_th(j-a)

PARAMETER

CONDITIONS

in free air

VALUE

UNIT

thermal resistance from junction to ambient

PCA82C250

100

160

K/W

PCA82C250T

QUALITY SPECIFICATION

According to “SNW-FQ-611 part E”.

2000 Jan 13

Philips Semiconductors

Product speciﬁcation

CAN controller interface

PCA82C250

CHARACTERISTICS

V_CC= 4.5 to 5.5 V; T_amb= −40 to +125 °C; R_L= 60 Ω; I₈> −10 µA; unless otherwise speciﬁed; all voltages referenced

to ground (pin 2); positive input current; all parameters are guaranteed over the ambient temperature range by design,

but only 100% tested at +25 °C.

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

Supply

I₃

supply current

dominant; V₁= 1 V

−

recessive; V₁= 4 V;

R₈= 47 kΩ

µA

recessive; V₁= 4 V;

V₈= 1 V

−

standby; T_amb< 90 °C;

100

170

note 1

DC bus transmitter

V_IH

V_IL

I_IH

HIGH-level input voltage

LOW-level input voltage

HIGH-level input current

LOW-level input current

recessive bus voltage

output recessive

output dominant

V₁= 4 V

0.7V_CC

−0.3

−200

−100

2.0

−

V_CC+ 0.3 V

0.3V_CC

+30

−600

3.0

µA

I_IL

V₁= 1 V

V_6,7

I_LO

V₁= 4 V; no load

off-state output leakage current −2 V < (V_6,V₇) < 7 V

−5 V < (V_6,V₇) < 18 V

−2

−5

+12

4.5

V₇

CANH output voltage

CANL output voltage

V₁= 1 V

2.75

0.5

V₆

V₁= 1 V

2.25

3.0

∆V_{6, 7}

difference between output

voltage at pins 6 and 7

V₁= 1 V

1.5

V₁= 1 V; R_L= 45 Ω;

1.5

−

V_CC≥ 4.9 V

V₁= 4 V; no load

V₇= −5 V; V_CC≤ 5 V

V₇= −5 V; V_CC= 5.5 V

V₆= 18 V

−500

−

+50

I_sc7

short-circuit CANH current

short-circuit CANL current

−

−105

−120

160

I_sc6

DC bus receiver: V₁= 4 V; pins 6 and 7 externally driven; −2 V < (V_6,V₇) < 7 V; unless otherwise speciﬁed

V_diff(r)

differential input voltage

(recessive)

−1.0

−

+0.5

+0.4

−7 V < (V_6,V₇) < 12 V;

not standby mode

V_diff(d)

differential input voltage

(dominant)

0.9

1.0

−

5.0

−7 V < (V_6,V₇) < 12 V;

not standby mode

V_diff(hys)

V_OH

differential input hysteresis

see Fig.5

−

150

−

HIGH-level output voltage

(pin 4)

I₄= −100 µA

0.8V_CC

−

V_CC

V_OL

LOW-level output voltage (pin 4) I₄= 1 mA

I₄= 10 mA

−

0.2V_CC

1.5

R_i

CANH, CANL input resistance

kΩ

2000 Jan 13

Philips Semiconductors

Product speciﬁcation

CAN controller interface

PCA82C250

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

100

UNIT

kΩ

R_diff

C_i

differential input resistance

CANH, CANL input capacitance

differential input capacitance

−

C_diff

−

Reference output

V_ref

reference output voltage

V₈= 1 V;

−50 µA < I₅< 50 µA

0.45V_CC

0.4V_CC

−

0.55V_CC

0.6V_CC

V₈= 4 V;

−5 µA < I₅< 5 µA

Timing (see Figs 4, 6 and 7)

t_bit

minimum bit time

V₈= 1 V

−

µs

t_onTXD

t_offTXD

t_onRXD

t_offRXD

delay TXD to bus active

delay TXD to bus inactive

delay TXD to receiver active

delay TXD to receiver inactive

−

120

150

V₈= 1 V; V_CC< 5.1 V;

T_amb< +85 °C

V₈= 1 V; V_CC< 5.1 V;

T_amb< +125 °C

−

170

190

V₈= 1 V; V_CC< 5.5 V;

T_amb< +85 °C

V₈= 1 V; V_CC< 5.5 V;

T_amb< +125 °C

t_onRXD

delay TXD to receiver active

delay TXD to receiver inactive

R₈= 47 kΩ

R₈= 24 kΩ

R₈= 47 kΩ

R₈= 24 kΩ

R₈= 47 kΩ

−

390

260

210

520

320

450

320

−

t_offRXD

differential output voltage slew

rate

V/µs

t_WAKE

wake-up time from standby

(via pin 8)

−

µs

t_dRXDL

bus dominant to RXD LOW

V₈= 4 V; standby mode

Standby/slope control (pin 8)

V₈

input voltage for high-speed

−

0.3V_CC

−500

−

I₈

input current for high-speed

input voltage for standby mode

slope control mode current

slope control mode voltage

V₈= 0 V

−

µA

V_stb

I_slope

V_slope

0.75V_CC

−10

−200

0.6V_CC

µA

0.4V_CC

Note

1. I₁= I₄= I₅= 0 mA; 0 V < V₆< V_CC; 0 V < V₇< V_CC; V₈= V_CC

2000 Jan 13

Philips Semiconductors

Product speciﬁcation

CAN controller interface

PCA82C250

+5 V

handbook, halfpage

100 pF

CANH

TXD

PCA82C250

62 Ω

100 pF

ref

CANL

RXD

GND

30 pF

ext

MKA671

Fig.3 Test circuit for dynamic characteristics.

handbook, full pagewidth

TXD

0 V

0.9 V

diff

0.5 V

0.7V

RXD

0.3V

offTXD

onTXD

MKA672

onRXD

offRXD

Fig.4 Timing diagram for dynamic characteristics.

2000 Jan 13

Philips Semiconductors

Product speciﬁcation

CAN controller interface

PCA82C250

handbook, full pagewidth

RXD

HIGH

LOW

hysteresis

0.5 V

0.9 V

MKA673

diff

Fig.5 Hysteresis.

handbook, full pagewidth

0 V

RXD

MKA674

WAKE

V₁= 1 V.

Fig.6 Timing diagram for wake-up from standby.

2000 Jan 13

Philips Semiconductors

Product speciﬁcation

CAN controller interface

PCA82C250

1.5 V

0 V

handbook, full pagewidth

diff

RXD

MKA675

dRXDL

V₁= 4 V; V₈= 4 V.

Fig.7 Timing diagram for bus dominant to RXD LOW.

+5 V

handbook, full pagewidth

1 nF

TXD

CANH

PCA82C250

SCHAFFNER

GENERATOR

62 Ω

1 nF

RXD

CANL

ref

MKA676

GND

ext

The waveforms of the applied transients shall be in accordance with “ISO 7637 part 1”, test pulses 1, 2, 3a and 3b.

Fig.8 Test circuit for automotive transients.

2000 Jan 13

Philips Semiconductors

Product speciﬁcation

CAN controller interface

PCA82C250

APPLICATION INFORMATION

handbook, halfpage

P8xC592/P8xCE598

CAN-CONTROLLER

CTX0 CRX0 CRX1 PX,Y

ext

+5 V

TXD

RXD

ref

PCA82C250T

CAN-TRANSCEIVER

100 nF

GND

CANH

CANL

CAN BUS

LINE

124 Ω

MKA677

Fig.9 Application of the CAN transceiver.

2000 Jan 13

Philips Semiconductors

Product speciﬁcation

CAN controller interface

PCA82C250

handbook, full pagewidth

SJA1000

CAN-CONTROLLER

TX0 TX1

RX0 RX1

3.6 kΩ

6.8 kΩ

390 Ω

+5 V

100 nF

390 Ω

6N137

0 V

6N137

390 Ω

+5 V

100 nF

390 Ω

+5 V

TXD

RXD

ref

PCA82C250

CAN-TRANSCEIVER

100 nF

ext

GND

CANH CANL

124 Ω

CAN BUS LINE

MKA678

Fig.10 Application with galvanic isolation.

2000 Jan 13

Philips Semiconductors

Product speciﬁcation

CAN controller interface

PCA82C250

INTERNAL PIN CONFIGURATION

handbook, full pagewidth

TXD

RXD

CANH

CANL

PCA82C250

ref

MKA679

GND

Fig.11 Internal pin configuration.

2000 Jan 13

Philips Semiconductors

Product speciﬁcation

CAN controller interface

PCA82C250

BONDING PAD LOCATIONS

SYMBOL

COORDINATES⁽¹⁾

PAD

TXD

GND

V_CC

196

1280

1767

2588

2594

1689

948

135

RXD

V_ref

135

1640

CANL

CANH

196

Note

1. All coordinates (µm) represent the position of the centre of each pad with respect to the bottom left-hand corner of

the die (x/y = 0).

handbook, full pagewidth

1.78

PCA82C250U

MGL945

2.79 mm

Fig.12 Bonding pad locations.

2000 Jan 13

Philips Semiconductors

Product speciﬁcation

CAN controller interface

PCA82C250

PACKAGE OUTLINES

DIP8: plastic dual in-line package; 8 leads (300 mil)

SOT97-1

w M

(e )

pin 1 index

10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

(1)

UNIT

max.

min.

max.

1.73

1.14

0.53

0.38

1.07

0.89

0.36

0.23

9.8

9.2

6.48

6.20

3.60

3.05

8.25

7.80

10.0

8.3

4.2

0.51

3.2

2.54

0.10

7.62

0.30

0.254

0.01

1.15

0.068 0.021 0.042 0.014

0.045 0.015 0.035 0.009

0.39

0.36

0.26

0.24

0.14

0.12

0.32

0.31

0.39

0.33

inches

0.17

0.020

0.13

0.045

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

PROJECTION

ISSUE DATE

VERSION

IEC

JEDEC

EIAJ

95-02-04

99-12-27

SOT97-1

050G01

MO-001

SC-504-8

2000 Jan 13

Philips Semiconductors

Product speciﬁcation

CAN controller interface

PCA82C250

SO8: plastic small outline package; 8 leads; body width 3.9 mm

SOT96-1

(A )

pin 1 index

detail X

2.5

5 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

(1)

(2)

UNIT

max.

0.25

0.10

1.45

1.25

0.49

0.36

0.25

0.19

5.0

4.8

4.0

3.8

6.2

5.8

1.0

0.4

0.7

0.6

0.7

0.3

1.27

0.050

1.05

0.041

1.75

0.25

0.01

0.25

0.01

0.25

0.1

8^o

0^o

0.010 0.057

0.004 0.049

0.019 0.0100 0.20

0.014 0.0075 0.19

0.16

0.15

0.244

0.228

0.039 0.028

0.016 0.024

0.028

0.012

inches 0.069

0.01 0.004

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

PROJECTION

ISSUE DATE

VERSION

IEC

JEDEC

EIAJ

97-05-22

99-12-27

SOT96-1

076E03

MS-012

2000 Jan 13

Philips Semiconductors

Product speciﬁcation

CAN controller interface

PCA82C250

SOLDERING

Introduction

Typical reflow peak temperatures range from

215 to 250 °C. The top-surface temperature of the

packages should preferable be kept below 230 °C.

This text gives a very brief insight to a complex technology.

A more in-depth account of soldering ICs can be found in

our “Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).

WAVE SOLDERING

Conventional single wave soldering is not recommended

for surface mount devices (SMDs) or printed-circuit boards

with a high component density, as solder bridging and

non-wetting can present major problems.

There is no soldering method that is ideal for all IC

packages. Wave soldering is often preferred when

through-hole and surface mount components are mixed on

one printed-circuit board. However, wave soldering is not

always suitable for surface mount ICs, or for printed-circuit

boards with high population densities. In these situations

reflow soldering is often used.

To overcome these problems the double-wave soldering

method was specifically developed.

If wave soldering is used the following conditions must be

observed for optimal results:

• Use a double-wave soldering method comprising a

turbulent wave with high upward pressure followed by a

smooth laminar wave.

Through-hole mount packages

SOLDERING BY DIPPING OR BY SOLDER WAVE

• For packages with leads on two sides and a pitch (e):

The maximum permissible temperature of the solder is

260 °C; solder at this temperature must not be in contact

with the joints for more than 5 seconds. The total contact

time of successive solder waves must not exceed

5 seconds.

– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the

transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the

printed-circuit board.

The device may be mounted up to the seating plane, but

the temperature of the plastic body must not exceed the

specified maximum storage temperature (T_stg(max)). If the

printed-circuit board has been pre-heated, forced cooling

may be necessary immediately after soldering to keep the

temperature within the permissible limit.

The footprint must incorporate solder thieves at the

downstream end.

• For packages with leads on four sides, the footprint must

be placed at a 45° angle to the transport direction of the

printed-circuit board. The footprint must incorporate

solder thieves downstream and at the side corners.

MANUAL SOLDERING

Apply the soldering iron (24 V or less) to the lead(s) of the

package, either below the seating plane or not more than

2 mm above it. If the temperature of the soldering iron bit

is less than 300 °C it may remain in contact for up to

10 seconds. If the bit temperature is between

During placement and before soldering, the package must

be fixed with a droplet of adhesive. The adhesive can be

applied by screen printing, pin transfer or syringe

dispensing. The package can be soldered after the

adhesive is cured.

300 and 400 °C, contact may be up to 5 seconds.

Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal

of corrosive residues in most applications.

Surface mount packages

REFLOW SOLDERING

MANUAL SOLDERING

Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied

to the printed-circuit board by screen printing, stencilling or

pressure-syringe dispensing before package placement.

Fix the component by first soldering two

diagonally-opposite end leads. Use a low voltage (24 V or

less) soldering iron applied to the flat part of the lead.

Contact time must be limited to 10 seconds at up to

300 °C.

Several methods exist for reflowing; for example,

infrared/convection heating in a conveyor type oven.

Throughput times (preheating, soldering and cooling) vary

between 100 and 200 seconds depending on heating

method.

When using a dedicated tool, all other leads can be

soldered in one operation within 2 to 5 seconds between

270 and 320 °C.

2000 Jan 13

Philips Semiconductors

Product speciﬁcation

CAN controller interface

PCA82C250

Suitability of IC packages for wave, reﬂow and dipping soldering methods

SOLDERING METHOD

WAVE

REFLOW⁽¹⁾DIPPING

suitable⁽²⁾

MOUNTING

PACKAGE

Through-hole mount DBS, DIP, HDIP, SDIP, SIL

−

suitable

Surface mount

BGA, LFBGA, SQFP, TFBGA

not suitable

not suitable⁽³⁾

suitable

−

HBCC, HLQFP, HSQFP, HSOP, HTQFP,

HTSSOP, SMS

PLCC⁽⁴⁾, SO, SOJ

LQFP, QFP, TQFP

SSOP, TSSOP, VSO

suitable

−

not recommended⁽⁴⁾⁽⁵⁾suitable

not recommended⁽⁶⁾

suitable

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

temperature (with respect to time) and body size of the package, there is a risk that internal or external package

cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the

Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.

2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.

3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink

(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.

The package footprint must incorporate solder thieves downstream and at the side corners.

5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm;

it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is

definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

2000 Jan 13

Philips Semiconductors

Product speciﬁcation

CAN controller interface

PCA82C250

DEFINITIONS

Data sheet status

Objective speciﬁcation

Preliminary speciﬁcation

Product speciﬁcation

This data sheet contains target or goal speciﬁcations for product development.

This data sheet contains preliminary data; supplementary data may be published later.

This data sheet contains ﬁnal product speciﬁcations.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or

more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation

of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation

is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the speciﬁcation.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these

products can reasonably be expected to result in personal injury. Philips customers using or selling these products for

use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such

improper use or sale.

BARE DIE DISCLAIMER

All die are tested and are guaranteed to comply with all data sheet limits up to the point of wafer sawing for a period of

ninety (90) days from the date of Philips’ delivery. If there are data sheet limits not guaranteed, these will be separately

indicated in the data sheet. There are no post packing tests performed on individual die or wafer. Philips Semiconductors

has no control of third party procedures in the sawing, handling, packing or assembly of the die. Accordingly, Philips

Semiconductors assumes no liability for device functionality or performance of the die or systems after third party sawing,

handling, packing or assembly of the die. It is the responsibility of the customer to test and qualify their application in

which the die is used.

2000 Jan 13

Philips Semiconductors – a worldwide company

Argentina: see South America

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. +31 40 27 82785, Fax. +31 40 27 88399

Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140,

Tel. +61 2 9704 8141, Fax. +61 2 9704 8139

New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. +64 9 849 4160, Fax. +64 9 849 7811

Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,

Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210

Norway: Box 1, Manglerud 0612, OSLO,

Tel. +47 22 74 8000, Fax. +47 22 74 8341

Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,

220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773

Pakistan: see Singapore

Belgium: see The Netherlands

Brazil: see South America

Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,

Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474

Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,

51 James Bourchier Blvd., 1407 SOFIA,

Tel. +359 2 68 9211, Fax. +359 2 68 9102

Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW,

Tel. +48 22 5710 000, Fax. +48 22 5710 001

Portugal: see Spain

Romania: see Italy

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,

Tel. +1 800 234 7381, Fax. +1 800 943 0087

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,

72 Tat Chee Avenue, Kowloon Tong, HONG KONG,

Tel. +852 2319 7888, Fax. +852 2319 7700

Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. +7 095 755 6918, Fax. +7 095 755 6919

Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,

Colombia: see South America

Czech Republic: see Austria

Tel. +65 350 2538, Fax. +65 251 6500

Slovakia: see Austria

Slovenia: see Italy

Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,

Tel. +45 33 29 3333, Fax. +45 33 29 3905

South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,

Tel. +27 11 471 5401, Fax. +27 11 471 5398

Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. +358 9 615 800, Fax. +358 9 6158 0920

France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,

Tel. +33 1 4099 6161, Fax. +33 1 4099 6427

South America: Al. Vicente Pinzon, 173, 6th floor,

04547-130 SÃO PAULO, SP, Brazil,

Tel. +55 11 821 2333, Fax. +55 11 821 2382

Germany: Hammerbrookstraße 69, D-20097 HAMBURG,

Tel. +49 40 2353 60, Fax. +49 40 2353 6300

Spain: Balmes 22, 08007 BARCELONA,

Tel. +34 93 301 6312, Fax. +34 93 301 4107

Hungary: see Austria

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,

Tel. +46 8 5985 2000, Fax. +46 8 5985 2745

India: Philips INDIA Ltd, Band Box Building, 2nd floor,

254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,

Tel. +91 22 493 8541, Fax. +91 22 493 0966

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,

Tel. +41 1 488 2741 Fax. +41 1 488 3263

Indonesia: PT Philips Development Corporation, Semiconductors Division,

Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,

Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080

Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,

TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874

Ireland: Newstead, Clonskeagh, DUBLIN 14,

Tel. +353 1 7640 000, Fax. +353 1 7640 200

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,

209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,

Tel. +66 2 745 4090, Fax. +66 2 398 0793

Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,

TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007

Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,

ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813

Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI),

Tel. +39 039 203 6838, Fax +39 039 203 6800

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,

252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461

Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,

TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,

MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421

Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,

Tel. +82 2 709 1412, Fax. +82 2 709 1415

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,

Tel. +1 800 234 7381, Fax. +1 800 943 0087

Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,

Tel. +60 3 750 5214, Fax. +60 3 757 4880

Uruguay: see South America

Vietnam: see Singapore

Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,

Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087

Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Middle East: see Italy

Tel. +381 11 3341 299, Fax.+381 11 3342 553

For all other countries apply to: Philips Semiconductors,

Internet: http://www.semiconductors.philips.com

International Marketing & Sales Communications, Building BE-p, P.O. Box 218,

5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825

SCA

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed

without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license

under patent- or other industrial or intellectual property rights.

Printed in The Netherlands

285002/05/pp20

Date of release: 2000 Jan 13

Document order number: 9397 750 06609

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PCA82C250T/N4产品参数

型号:	PCA82C250T/N4
是否无铅：	不含铅
是否Rohs认证：	符合
生命周期：	Obsolete
零件包装代码：	SOIC
包装说明：	SOP, SOP8,.25
针数：	8
Reach Compliance Code：	unknown
HTS代码：	8542.39.00.01
风险等级：	5.23
JESD-30 代码：	R-PDSO-G8
JESD-609代码：	e4
长度：	4.9 mm
功能数量：	1
端子数量：	8
收发器数量：	1
最高工作温度：	125 °C
最低工作温度：	-40 °C
封装主体材料：	PLASTIC/EPOXY
封装代码：	SOP
封装等效代码：	SOP8,.25
封装形状：	RECTANGULAR
封装形式：	SMALL OUTLINE
峰值回流温度（摄氏度）：	260
电源：	5 V
认证状态：	Not Qualified
座面最大高度：	1.75 mm
子类别：	Network Interfaces
标称供电电压：	5 V
表面贴装：	YES
技术：	BICMOS
电信集成电路类型：	INTERFACE CIRCUIT
温度等级：	AUTOMOTIVE
端子面层：	Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式：	GULL WING
端子节距：	1.27 mm
端子位置：	DUAL
处于峰值回流温度下的最长时间：	40
宽度：	3.9 mm
Base Number Matches：	1

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