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INTEGRATED CIRCUITS

DATA SHEET

PCA82C251

CAN transceiver for 24 V systems

Product speciﬁcation

2000 Jan 13

Supersedes data of 1997 Mar 14

File under Integrated Circuits, IC18

Philips Semiconductors

Productspeciﬁcation

CAN transceiver for 24 V systems

PCA82C251

FEATURES

GENERAL DESCRIPTION

• Fully compatible with the “ISO 11898-24 V” standard

• Slope control to reduce RFI

The PCA82C251 is the interface between the CAN

protocol controller and the physical bus. It is primarily

intended for applications (up to 1 Mbaud) in trucks and

buses. The device provides differential transmit capability

to the bus and differential receive capability to the CAN

controller.

• Thermally protected

• Short-circuit proof to battery and ground in 24 V

powered systems

• Low-current standby mode

• An unpowered node does not disturb the bus lines

• At least 110 nodes can be connected

• High speed (up to 1 Mbaud)

• High immunity against electromagnetic interference.

QUICK REFERENCE DATA

SYMBOL

V_CC

PARAMETER

supply voltage

CONDITIONS

MIN.

4.5

MAX.

5.5

UNIT

V

I_CC

supply current

standby mode

−

275

−

µA

1/t_bit

V_CAN

V_diff

maximum transmission speed

CANH, CANL input/output voltage

differential bus voltage

ambient temperature

non-return-to-zero

1

Mbaud

−36

1.5

−40

+36

3.0

+125

V

T_amb

°C

ORDERING INFORMATION

TYPE

PACKAGE

NUMBER

NAME

DESCRIPTION

CODE

SOT97-1

SOT96-1

−

PCA82C251

PCA82C251T

PCA82C251U

DIP8

SO8

−

plastic dual in-line package; 8 leads (300 mil)

plastic small outline package; 8 leads body width 3.9 mm

bare die; 2840 × 1780 × 380 µm

2000 Jan 13

2

Philips Semiconductors

Productspeciﬁcation

CAN transceiver for 24 V systems

PCA82C251

BLOCK DIAGRAM

V

handbook, full pagewidth

CC

3

1

PROTECTION

DRIVER

TXD

8

SLOPE/

Rs

STANDBY

7

6

4

CANH

CANL

RXD

RECEIVER

5

REFERENCE

VOLTAGE

V

ref

PCA82C251

2

MBG613

GND

Fig.1 Block diagram.

PINNING

SYMBOL

DESCRIPTION

transmit data input

TXD

GND

V_CC

1

2

3

4

5

6

handbook, halfpage

TXD

1

2

8

7

6

5

Rs

ground

supply voltage

GND

CANH

CANL

PCA82C251

RXD

V_ref

receive data output

reference voltage output

V

3

4

CC

V

RXD

ref

CANL

LOW-level CAN voltage

input/output

MBG612

CANH

Rs

7

8

HIGH-level CAN voltage

input/output

Fig.2 Pin configuration.

slope resistor input

2000 Jan 13

3

Philips Semiconductors

Productspeciﬁcation

CAN transceiver for 24 V systems

PCA82C251

FUNCTIONAL DESCRIPTION

Pin 8 (Rs) allows three different modes of operation to be

selected: high-speed, slope control or standby.

The PCA82C251 is the interface between the CAN

protocol controller and the physical bus. It is primarily

intended for applications up to 1 Mbaud in trucks and

buses. The device provides differential transmit capability

to the bus and differential receive capability to the CAN

controller. It is fully compatible with the “ISO 11898-24 V”

standard.

For high-speed operation, the transmitter output

transistors are simply switched on and off as fast as

possible. In this mode, no measures are taken to limit the

rise and fall slope. Use of a shielded cable is

recommended to avoid RFI problems. The high-speed

mode is selected by connecting pin 8 to ground.

A current limiting circuit protects the transmitter output

stage against short-circuit to positive and negative battery

voltage. Although the power dissipation is increased

during this fault condition, this feature will prevent

destruction of the transmitter output stage.

The slope control mode allows the use of an unshielded

twisted pair or a parallel pair of wires as bus lines.

To reduce RFI, the rise and fall slope should be limited.

The rise and fall slope can be programmed with a resistor

connected from pin 8 to ground. The slope is proportional

to the current output at pin 8.

If the junction temperature exceeds a value of

approximately 160 °C, the limiting current of both

transmitter outputs is decreased. Because the transmitter

is responsible for the major part of the power dissipation,

this will result in a reduced power dissipation and hence a

lower chip temperature. All other parts of the IC will remain

operating. The thermal protection is particularly needed

when a bus line is short-circuited.

If a HIGH level is applied to pin 8, the circuit enters a low

current standby mode. In this mode, the transmitter is

switched off and the receiver is switched to a low current.

If dominant bits are detected (differential bus voltage

>0.9 V), RXD will be switched to a LOW level.

The microcontroller should react to this condition by

switching the transceiver back to normal operation

(via pin 8). Because the receiver is slower in standby

mode, the first message will be lost at higher bit rates.

The CANH and CANL lines are also protected against

electrical transients which may occur in an automotive

environment.

Table 1 Truth table of the CAN transceiver

V_CC

TXD

CANH

CANL

BUS STATE

RXD

4.5 to 5.5 V

0

HIGH

LOW

dominant

recessive

ﬂoating

0

1 (or ﬂoating)

X⁽¹⁾

ﬂoating

1⁽²⁾

4.5 < V_CC< 5.5 V

ﬂoating if

V_Rs> 0.75V_CC

0 < V_CC< 4.5 V

ﬂoating

X⁽¹⁾

Notes

1. X = don’t care.

2. If another bus node is transmitting a dominant bit, then RXD is logic 0.

Table 2 Pin Rs summary

CONDITION FORCED AT PIN Rs

MODE

RESULTING VOLTAGE OR CURRENT AT PIN Rs

V_Rs> 0.75V_CC

10 µA < −I_Rs< 200 µA

V_Rs< 0.3V_CC

standby

−I_Rs< 10 µA

0.4V_CC< V_Rs< 0.6V_CC

−I_Rs< 500 µA

slope control

high-speed

2000 Jan 13

4

Philips Semiconductors

Productspeciﬁcation

CAN transceiver for 24 V systems

PCA82C251

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134); all voltages are referenced to pin 2;

positive input current.

SYMBOL

V_CC

PARAMETER

supply voltage

CONDITIONS

MIN.

−0.3

MAX.

+7.0

V_CC+ 0.3 V

UNIT

V

V_n

V₆

DC voltage at pins 1, 4, 5 and 8

DC voltage at pin 6 (CANL)

0 V < V_CC< 5.5 V; TXD HIGH −36

or ﬂoating

+36

V

0 V < V_CC< 5.5 V; no time

limit; note 1

−36

0 V < V_CC< 5.5 V; no time

limit; note 2

V₇

DC voltage at pin 7 (CANH)

0 V < V_CC< 5.5 V; no time limit −36

+36

V

V_tr

transient voltage on pins 6 and 7 see Fig.8

storage temperature

−200

−55

+200

+150

+125

+150

+2500

+250

T_stg

T_amb

T_vj

°C

V

ambient temperature

−40

virtual junction temperature

note 3

note 4

note 5

−40

V_esd

electrostatic discharge voltage

−2500

−250

V

Notes

1. TXD is LOW. Short-circuit protection provided for slew rates up to 5 V/µs for voltages above +30 V.

2. Short-circuit applied when TXD is HIGH, followed by TXD switched to LOW.

3. In accordance with “IEC 60747-1”. An alternative definition of virtual junction temperature is:

T_vj= T_amb+ P_d× R_th(vj-a), where R_th(vj-a)is a fixed value to be used for the calculation of T_vj. The rating for T_vjlimits

the allowable combinations of power dissipation (P_d) and ambient temperature (T_amb).

4. Classification A: human body model; C = 100 pF; R = 1500 Ω; V = ±2500 V.

5. Classification B: machine model; C = 200 pF; R = 0 Ω; V = ±250 V.

THERMAL CHARACTERISTICS

SYMBOL

R_th(j-a)

PARAMETER

thermal resistance from junction to ambient

PCA82C251

CONDITIONS

in free air

VALUE

UNIT

100

160

K/W

PCA82C251T

QUALITY SPECIFICATION

According to “SNW-FQ-611 part E”.

2000 Jan 13

5

Philips Semiconductors

Productspeciﬁcation

CAN transceiver for 24 V systems

PCA82C251

CHARACTERISTICS

V_CC= 4.5 to 5.5 V; T_amb= −40 to + 125 °C; R_L= 60 Ω; I₈> −10 µA; unless otherwise speciﬁed; all voltages referenced

to ground (pin 2); positive input current; all parameters are guaranteed over the ambient temperature range by design,

but only 100% tested at +25 °C.

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

Supply

I₃

supply current

dominant; V₁= 1 V;

−

78

mA

V

_CC< 5.1 V

dominant; V₁= 1 V;

_CC< 5.25 V

dominant; V₁= 1 V;

_CC< 5.5 V

80

mA

µA

V

85

V

recessive; V₁= 4 V;

R₈= 47 kΩ

10

standby; note 1

275

DC bus transmitter

V_IH

V_IL

I_IH

HIGH-level input voltage

output recessive

output dominant

V₁= 4 V

0.7V_CC

−0.3

−200

−100

2.0

−

V_CC+ 0.3 V

LOW-level input voltage

HIGH-level input current

LOW-level input current

recessive bus voltage

0.3V_CC

+30

−600

3.0

V

µA

V

I_IL

V₁= 1 V

V_{6, 7}

I_LO

V₁= 4 V; no load

−2 V< (V₆, V₇) < 7 V

−5 V< (V₆, V₇) < 36 V

off-state output leakage

current

−2

+2

mA

V

−10

+10

4.5

V₇

CANH output voltage

V₁= 1 V; V_CC= 4.75 to 5.5 V 3.0

V₁= 1 V; V_CC= 4.5 to 4.75 V 2.75

4.5

V

V₆

CANL output voltage

V₁= 1 V

0.5

1.5

−500

−

2.0

V

∆V_6,7

difference between output V₁= 1 V

voltage at pins 6 and 7

3.0

V

V₁= 1 V; R_L= 45 Ω

−

V

V₁= 4 V; no load

short-circuit CANH current V₇= −5 V

+50

−200

−

mV

mA

I_sc7

V₇= −36 V

−

−100

I_sc6

short-circuit CANL current V₆= 36 V

−

200

DC bus receiver [V₁= 4 V; pins 6 and 7 externally driven; −2 V < (V₆, V₇) < 7 V; unless otherwise speciﬁed]

V_diff(r)

differential input voltage

(recessive)

note 2

−1.0

−

+0.5

+0.4

5.0

V

−7 V < (V_6,V₇) < 12 V; note 2 −1.0

V_diff(d)

differential input voltage

(dominant)

0.9

−7 V < (V_6,V₇) < 12 V; not

1.0

5.0

standby mode

standby mode;

0.97

0.91

−

5.0

V

V_CC= 4.5 to 5.10 V

V_diff(hys)

differential input hysteresis see Fig.5

−

150

−

mV

2000 Jan 13

6

Philips Semiconductors

Productspeciﬁcation

CAN transceiver for 24 V systems

PCA82C251

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

V_CC

UNIT

V_OH

HIGH-level output voltage I₄= −100 µA

0.8V_CC

−

V

(pin 4)

V_OL

LOW-level output voltage

(pin 4)

I₄= 1 mA

0

5

−

0.2V_CC

1.5

V

I₄= 10 mA

R_i

CANH, CANL input

resistance

25

kΩ

R_diff

differential input resistance

20

−

100

kΩ

Reference output

V_refreference output voltage

V₈= 1 V; I₅< 50 µA

V₈= 4 V; I₅< 5 µA

0.45V_CC

0.4V_CC

−

0.55V_CC

0.6V_CC

V

Timing (R_L= 60 Ω; C_L= 100 pF; unless otherwise speciﬁed. See Figs 3 and 4)

t_bit

minimum bit time

R₈= 0 Ω

−

1

µs

ns

t_onTXD

t_offTXD

t_onRXD

delay TXD to bus active

−

50

80

120

delay TXD to bus inactive R₈= 0 Ω

40

55

delay TXD to receiver

active

R₈= 0 Ω

t_offRXD

delay TXD to receiver

inactive

R₈= 0 Ω; T_amb< +85 °C;

V_CC= 4.5 to 5.1 V

−

80

150

ns

R₈= 0 Ω; V_CC= 4.5 to 5.1 V

R₈= 0 Ω; T_amb< +85 °C

R₈= 0 Ω

−

80

90

170

190

400

550

ns

R₈= 47 kΩ

290

440

t_onRXD

delay TXD to receiver

active

R₈= 47 kΩ

SR

CANH, CANL slew rate

R₈= 47 kΩ

−

7

−

V/µs

µs

t_WAKE

wake-up time from standby see Fig.6

(via pin 8)

−

20

t_dRXDL

bus dominant to RXD LOW V₈= 4 V; see Fig.7

−

3

µs

Standby/slope control (pin 8)

V_stb

input voltage for standby

mode

0.75V_CC

−

V

I_slope

slope control mode current

slope control mode voltage

−10

−

−200

µA

V_slope

0.4V_CC

0.6V_CC

V

Notes

1. I₁= I₄= I₅= 0 mA; 0 V < V₆< V_CC; 0 V < V₇< V_CC; V₈= V_CC; T_amb< 90 °C.

2. This is valid for the receiver in all modes: high-speed, slope control and standby.

2000 Jan 13

7

Philips Semiconductors

Productspeciﬁcation

CAN transceiver for 24 V systems

PCA82C251

TEST AND APPLICATION INFORMATION

100 nF

handbook, full pagewidth

+

5 V

V

CC

3

TXD

CANH

1

7

6

V

ref

5

4

PCA82C251

60 Ω

100 pF

CANL

RXD

2

8

GND

Rs

30 pF

MBG614

Fig.3 Test circuit for dynamic characteristics.

V

handbook, full pagewidth

CC

V

TXD

0 V

0.9 V

V

diff

0.5 V

0.7V

CC

V

RXD

0.3V

CC

t

offTXD

onTXD

t

offRXD

MBG615

onRXD

Fig.4 Timing diagram for dynamic characteristics.

8

2000 Jan 13

Philips Semiconductors

Productspeciﬁcation

CAN transceiver for 24 V systems

PCA82C251

MBG616

handbook, full pagewidth

V

RXD

HIGH

LOW

hysteresis

0.5

0.9

V

(V)

diff

Fig.5 Hysteresis.

V

CC

handbook, full pagewidth

V

Rs

0 V

V

RXD

MBG617

t

WAKE

V_TXD= 1 V.

Fig.6 Timing diagram for wake up from standby.

1.5 V

0 V

handbook, full pagewidth

V

diff

V

RXD

MBG618

t

dRXDL

V_Rs= 4 V; V_TXD= 4 V.

Fig.7 Timing diagram for bus dominant to RXD low.

9

2000 Jan 13

Philips Semiconductors

Productspeciﬁcation

CAN transceiver for 24 V systems

PCA82C251

100 nF

handbook, full pagewidth

+

5 V

V

CC

3

500 pF

TXD

CANH

1

5

4

7

6

V

ref

SCHAFFNER

GENERATOR

PCA82C251

60 Ω

CANL

RXD

2

8

MBG619

GND

Rs

47 kΩ

The waveforms of the applied transients shall be in accordance with “ISO 7637 part 1”, test pulses 1, 2, 3a and 3b.

Fig.8 Test circuit for automotive transients.

handbook, full pagewidth

P8xC592

CAN-CONTROLLER

CTX0 CRX0 CRX1 PX,Y

R

ext

+

5 V

V

TXD

RXD

ref

Rs

V

CC

PCA82C251

CAN-TRANSCEIVER

100 nF

GND

CANH

CANL

CAN BUS

LINE

120 Ω

MBG620

(1) The output control register of the P8xC592 should be programmed to 1AH (push-pull operation, dominant = LOW).

(2) If no slope control is desired: R_ext= 0.

Fig.9 Application of the PCA82C251 CAN Transceiver.

2000 Jan 13

10

Philips Semiconductors

Productspeciﬁcation

CAN transceiver for 24 V systems

PCA82C251

BONDING PAD LOCATIONS

COORDINATES⁽¹⁾

SYMBOL

PAD

x

y

TXD

GND

V_CC

1

2

3

4

5

6

7

8

196

1080

1567

2644

1490

748

137

RXD

V_ref

137

1644

1610

CANL

CANH

Rs

200

Note

1. All coordinates (µm) represent the position of the centre of each pad with respect to the bottom left-hand corner of

the die (x/y = 0).

handbook, full pagewidth

5

7

6

8

1.78

mm

PCA82C251U

1

2

3

4

0

x

0

y

MGL944

2.84 mm

Fig.10 Bonding pad locations.

2000 Jan 13

11

Philips Semiconductors

Productspeciﬁcation

CAN transceiver for 24 V systems

PCA82C251

PACKAGE OUTLINES

DIP8: plastic dual in-line package; 8 leads (300 mil)

SOT97-1

D

M

E

A

2

A

1

L

c

w M

Z

b

1

e

(e )

1

M

H

b

2

8

5

pin 1 index

E

1

4

0

5

10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

(1)

Z

A

2

(1)

1

w

UNIT

mm

b

c

D

E

e

L

M

H

1

2

1

E

max.

min.

max.

1.73

1.14

0.53

0.38

1.07

0.89

0.36

0.23

9.8

9.2

6.48

6.20

3.60

3.05

8.25

7.80

10.0

8.3

4.2

0.51

3.2

2.54

0.10

7.62

0.30

0.254

0.01

1.15

0.068 0.021 0.042 0.014

0.045 0.015 0.035 0.009

0.39

0.36

0.26

0.24

0.14

0.12

0.32

0.31

0.39

0.33

inches

0.17

0.020

0.13

0.045

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

PROJECTION

ISSUE DATE

VERSION

IEC

JEDEC

EIAJ

95-02-04

99-12-27

SOT97-1

050G01

MO-001

SC-504-8

2000 Jan 13

12

Philips Semiconductors

Productspeciﬁcation

CAN transceiver for 24 V systems

PCA82C251

SO8: plastic small outline package; 8 leads; body width 3.9 mm

SOT96-1

D

E

A

X

v

c

y

H

M

A

E

Z

5

8

Q

A

2

A

(A )

3

A

1

pin 1 index

θ

L

p

L

1

4

e

w

M

detail X

b

p

0

2.5

5 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

(1)

(2)

UNIT

A

b

c

D

E

e

H

L

p

Q

v

w

y

Z

θ

1

2

3

p

E

max.

0.25

0.10

1.45

1.25

0.49

0.36

0.25

0.19

5.0

4.8

4.0

3.8

6.2

5.8

1.0

0.4

0.7

0.6

0.7

0.3

mm

1.27

0.050

1.05

0.041

1.75

0.25

0.01

0.25

0.01

0.25

0.1

8^o

0^o

0.010 0.057

0.004 0.049

0.019 0.0100 0.20

0.014 0.0075 0.19

0.16

0.15

0.244

0.228

0.039 0.028

0.016 0.024

0.028

0.012

inches 0.069

0.01 0.004

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

PROJECTION

ISSUE DATE

VERSION

IEC

JEDEC

EIAJ

97-05-22

99-12-27

SOT96-1

076E03

MS-012

2000 Jan 13

13

Philips Semiconductors

Productspeciﬁcation

CAN transceiver for 24 V systems

PCA82C251

SOLDERING

Introduction

Typical reflow peak temperatures range from

215 to 250 °C. The top-surface temperature of the

packages should preferable be kept below 230 °C.

This text gives a very brief insight to a complex technology.

A more in-depth account of soldering ICs can be found in

our “Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).

WAVE SOLDERING

Conventional single wave soldering is not recommended

for surface mount devices (SMDs) or printed-circuit boards

with a high component density, as solder bridging and

non-wetting can present major problems.

There is no soldering method that is ideal for all IC

packages. Wave soldering is often preferred when

through-hole and surface mount components are mixed on

one printed-circuit board. However, wave soldering is not

always suitable for surface mount ICs, or for printed-circuit

boards with high population densities. In these situations

reflow soldering is often used.

To overcome these problems the double-wave soldering

method was specifically developed.

If wave soldering is used the following conditions must be

observed for optimal results:

• Use a double-wave soldering method comprising a

turbulent wave with high upward pressure followed by a

smooth laminar wave.

Through-hole mount packages

SOLDERING BY DIPPING OR BY SOLDER WAVE

• For packages with leads on two sides and a pitch (e):

The maximum permissible temperature of the solder is

260 °C; solder at this temperature must not be in contact

with the joints for more than 5 seconds. The total contact

time of successive solder waves must not exceed

5 seconds.

– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the

transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the

printed-circuit board.

The device may be mounted up to the seating plane, but

the temperature of the plastic body must not exceed the

specified maximum storage temperature (T_stg(max)). If the

printed-circuit board has been pre-heated, forced cooling

may be necessary immediately after soldering to keep the

temperature within the permissible limit.

The footprint must incorporate solder thieves at the

downstream end.

• For packages with leads on four sides, the footprint must

be placed at a 45° angle to the transport direction of the

printed-circuit board. The footprint must incorporate

solder thieves downstream and at the side corners.

MANUAL SOLDERING

Apply the soldering iron (24 V or less) to the lead(s) of the

package, either below the seating plane or not more than

2 mm above it. If the temperature of the soldering iron bit

is less than 300 °C it may remain in contact for up to

10 seconds. If the bit temperature is between

During placement and before soldering, the package must

be fixed with a droplet of adhesive. The adhesive can be

applied by screen printing, pin transfer or syringe

dispensing. The package can be soldered after the

adhesive is cured.

300 and 400 °C, contact may be up to 5 seconds.

Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal

of corrosive residues in most applications.

Surface mount packages

REFLOW SOLDERING

MANUAL SOLDERING

Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied

to the printed-circuit board by screen printing, stencilling or

pressure-syringe dispensing before package placement.

Fix the component by first soldering two

diagonally-opposite end leads. Use a low voltage (24 V or

less) soldering iron applied to the flat part of the lead.

Contact time must be limited to 10 seconds at up to

300 °C.

Several methods exist for reflowing; for example,

infrared/convection heating in a conveyor type oven.

Throughput times (preheating, soldering and cooling) vary

between 100 and 200 seconds depending on heating

method.

When using a dedicated tool, all other leads can be

soldered in one operation within 2 to 5 seconds between

270 and 320 °C.

2000 Jan 13

14

Philips Semiconductors

Productspeciﬁcation

CAN transceiver for 24 V systems

PCA82C251

Suitability of IC packages for wave, reﬂow and dipping soldering methods

SOLDERING METHOD

WAVE

REFLOW⁽¹⁾DIPPING

suitable⁽²⁾

MOUNTING

PACKAGE

Through-hole mount DBS, DIP, HDIP, SDIP, SIL

−

suitable

Surface mount

BGA, LFBGA, SQFP, TFBGA

not suitable

not suitable⁽³⁾

suitable

−

HBCC, HLQFP, HSQFP, HSOP, HTQFP,

HTSSOP, SMS

PLCC⁽⁴⁾, SO, SOJ

LQFP, QFP, TQFP

SSOP, TSSOP, VSO

suitable

−

not recommended⁽⁴⁾⁽⁵⁾suitable

not recommended⁽⁶⁾

suitable

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

temperature (with respect to time) and body size of the package, there is a risk that internal or external package

cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the

Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.

2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.

3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink

(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.

The package footprint must incorporate solder thieves downstream and at the side corners.

5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm;

it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is

definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

2000 Jan 13

15

Philips Semiconductors

Productspeciﬁcation

CAN transceiver for 24 V systems

PCA82C251

DEFINITIONS

Data sheet status

Objective speciﬁcation

Preliminary speciﬁcation

Product speciﬁcation

This data sheet contains target or goal speciﬁcations for product development.

This data sheet contains preliminary data; supplementary data may be published later.

This data sheet contains ﬁnal product speciﬁcations.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or

more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation

of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation

is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the speciﬁcation.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these

products can reasonably be expected to result in personal injury. Philips customers using or selling these products for

use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such

improper use or sale.

BARE DIE DISCLAIMER

All die are tested and are guaranteed to comply with all data sheet limits up to the point of wafer sawing for a period of

ninety (90) days from the date of Philips’ delivery. If there are data sheet limits not guaranteed, these will be separately

indicated in the data sheet. There are no post packing tests performed on individual die or wafer. Philips Semiconductors

has no control of third party procedures in the sawing, handling, packing or assembly of the die. Accordingly, Philips

Semiconductors assumes no liability for device functionality or performance of the die or systems after third party sawing,

handling, packing or assembly of the die. It is the responsibility of the customer to test and qualify their application in

which the die is used.

2000 Jan 13

16

Philips Semiconductors

Productspeciﬁcation

CAN transceiver for 24 V systems

PCA82C251

NOTES

2000 Jan 13

17

Philips Semiconductors

Productspeciﬁcation

CAN transceiver for 24 V systems

PCA82C251

NOTES

2000 Jan 13

18

Philips Semiconductors

Productspeciﬁcation

CAN transceiver for 24 V systems

PCA82C251

NOTES

2000 Jan 13

19

Philips Semiconductors – a worldwide company

Argentina: see South America

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. +31 40 27 82785, Fax. +31 40 27 88399

Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140,

Tel. +61 2 9704 8141, Fax. +61 2 9704 8139

New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. +64 9 849 4160, Fax. +64 9 849 7811

Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,

Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210

Norway: Box 1, Manglerud 0612, OSLO,

Tel. +47 22 74 8000, Fax. +47 22 74 8341

Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,

220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773

Pakistan: see Singapore

Belgium: see The Netherlands

Brazil: see South America

Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,

Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474

Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,

51 James Bourchier Blvd., 1407 SOFIA,

Tel. +359 2 68 9211, Fax. +359 2 68 9102

Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW,

Tel. +48 22 5710 000, Fax. +48 22 5710 001

Portugal: see Spain

Romania: see Italy

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,

Tel. +1 800 234 7381, Fax. +1 800 943 0087

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,

72 Tat Chee Avenue, Kowloon Tong, HONG KONG,

Tel. +852 2319 7888, Fax. +852 2319 7700

Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. +7 095 755 6918, Fax. +7 095 755 6919

Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,

Colombia: see South America

Czech Republic: see Austria

Tel. +65 350 2538, Fax. +65 251 6500

Slovakia: see Austria

Slovenia: see Italy

Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,

Tel. +45 33 29 3333, Fax. +45 33 29 3905

South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,

Tel. +27 11 471 5401, Fax. +27 11 471 5398

Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. +358 9 615 800, Fax. +358 9 6158 0920

France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,

Tel. +33 1 4099 6161, Fax. +33 1 4099 6427

South America: Al. Vicente Pinzon, 173, 6th floor,

04547-130 SÃO PAULO, SP, Brazil,

Tel. +55 11 821 2333, Fax. +55 11 821 2382

Germany: Hammerbrookstraße 69, D-20097 HAMBURG,

Tel. +49 40 2353 60, Fax. +49 40 2353 6300

Spain: Balmes 22, 08007 BARCELONA,

Tel. +34 93 301 6312, Fax. +34 93 301 4107

Hungary: see Austria

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,

Tel. +46 8 5985 2000, Fax. +46 8 5985 2745

India: Philips INDIA Ltd, Band Box Building, 2nd floor,

254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,

Tel. +91 22 493 8541, Fax. +91 22 493 0966

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,

Tel. +41 1 488 2741 Fax. +41 1 488 3263

Indonesia: PT Philips Development Corporation, Semiconductors Division,

Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,

Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080

Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,

TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874

Ireland: Newstead, Clonskeagh, DUBLIN 14,

Tel. +353 1 7640 000, Fax. +353 1 7640 200

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,

209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,

Tel. +66 2 745 4090, Fax. +66 2 398 0793

Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,

TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007

Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,

ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813

Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI),

Tel. +39 039 203 6838, Fax +39 039 203 6800

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,

252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461

Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,

TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,

MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421

Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,

Tel. +82 2 709 1412, Fax. +82 2 709 1415

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,

Tel. +1 800 234 7381, Fax. +1 800 943 0087

Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,

Tel. +60 3 750 5214, Fax. +60 3 757 4880

Uruguay: see South America

Vietnam: see Singapore

Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,

Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087

Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Middle East: see Italy

Tel. +381 11 3341 299, Fax.+381 11 3342 553

For all other countries apply to: Philips Semiconductors,

Internet: http://www.semiconductors.philips.com

International Marketing & Sales Communications, Building BE-p, P.O. Box 218,

5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825

69

SCA

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed

without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license

under patent- or other industrial or intellectual property rights.

Printed in The Netherlands

285002/03/pp20

Date of release: 2000 Jan 13

Document order number: 9397 750 06611

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