PCD50953H/E69中文资料应用文章市场行情现货热卖使用介绍-中国IC网-芯三七

INTEGRATED CIRCUITS

DATA SHEET

PCD5095

DECT baseband controller

1997 Nov 19

Objective speciﬁcation

File under Integrated Circuits, IC17

Philips Semiconductors

Objective speciﬁcation

DECT baseband controller

PCD5095

CONTENTS

1

FEATURES

1.1

2

DSP software features

GENERAL DESCRIPTION

ORDERING INFORMATION

BLOCK DIAGRAM

3

4

5

PINNING INFORMATION

5.1

5.2

Pinning

Pin description

6

7

8

FUNCTIONAL DESCRIPTION

PACKAGE OUTLINE

SOLDERING

8.1

8.2

8.3

8.4

Introduction

Reflow soldering

Wave soldering

Repairing soldered joints

9

DEFINITIONS

10

11

LIFE SUPPORT APPLICATIONS

PURCHASE OF PHILIPS I²C COMPONENTS

1997 Nov 19

2

Philips Semiconductors

Objective speciﬁcation

DECT baseband controller

PCD5095

• Easy interfacing with radio circuits, operating at other

supply voltage (RF supply pin with level shifter for RF

signals)

1

FEATURES

• 80C51 ports P0, P1, P2 and P3 available for interfacing

to display, keyboard, I²C-bus, interrupt sources and/or

external memory. Integrated 64 kbyte ROM, 3 kbytes of

data memory and 1kbyte System Data RAM. External

program memory is addressable up to 128 kbytes

• Low-power oscillator with integrated frequency

adjustment

• QFP100 package

• +2.7 to 5 V port (P0 to P3) interface

• Power-on-reset

• TDMA frame (de)multiplexing, transmission or reception

can be programmed for any slot

• Programmable power-down modes

• Low supply voltage (2.7 to 3.6 V)

• CMOS technology.

• Ciphering, scrambling, CRC checking/generation and

protected B-fields

• Speech and data buffering space for six handsets

• Local call and B-field loop-back

1.1

DSP software features

• 3x ADPCM transcoding complying with G.726

• Two interrupt lines for BML and DSP to interrupt 80C51

• A-Law encoding and decoding complying with G.711

• On-chip, three channel time-multiplexed 8-bit

Analog-to-Digital Converter (ADC) for RSSI

measurement, one for battery voltage measurement

and one channel available for other purposes

• 4 Channel bidirectional ADPCM interface to the IOM -2

and radio interface

• Programmable channel switching and buffers

• Channel mute.

• On-chip 8-bit Digital-to-Analog Converter (DAC) for

electronic potentiometer function

For each DSP software version a separate manual is

available in which detailed information is provided on how

parameters must be set. For further information please

contact Philips Semiconductors.

• Phase error measurement and phase error correction by

hardware

• DACs and ADCs for dynamic earpiece and dynamic or

electret microphone

2

GENERAL DESCRIPTION

• On-chip reference voltage

The PCD5095 is designed for GAP-compliant business

systems, PABX and WLL. Two modes can be selected:

three channel ADPCM CODEC with conversion of

ADPCM samples to linear PCM format and vice versa, the

second mode copies four ADPCM samples into two IOM

data buffers and vice versa. In both modes the DSP

controls the bidirectional data flow from the radio interface

and the IOM -2 interface. The 80C51 controls the DECT

protocol and the IOM -2 interface. The performance of the

embedded 80C51 microcontroller is twice the performance

of the classic architecture. The PCD5095 has 64 kbytes of

PROM program memory and 3 kbytes of data memory

on-chip. In addition there is 1 kbyte of on-chip data

memory that is shared with the Burst Mode Logic (BML),

the DSP and the System Data RAM (SDR).

• On-chip supply for electret microphone

• Very low ohmic buzzer output

• Serial interface to external ADPCM CODEC (PCD5032)

or 8 kHz u-law samples

• Speech switch for Digital Telephone Answering

Machine (DTAM) connected to SPI interface

• IOM -2 interface (Siemens registered trademark)

• Serial interface to synthesizer for frequency

programming

• Programmable polarity and timing of radio-control

signals

• GMSK pulse shaper

• On-chip comparator for use as data-slicer

3

ORDERING INFORMATION

TYPE

PACKAGE

NUMBER

NAME

DESCRIPTION

VERSION

PCD5095H

QFP100

plastic quad ﬂat package; 100 leads (lead length 1.95 mm);

SOT317-2

body 14 × 20 × 2.8 mm

1997 Nov 19

3

Philips Semiconductors

Objective speciﬁcation

DECT baseband controller

PCD5095

4

BLOCK DIAGRAM

GM1L8

h a n d b o o k , f u l l p a g e w i d t h

1997 Nov 19

4

Philips Semiconductors

Objective speciﬁcation

DECT baseband controller

PCD5095

5

PINNING INFORMATION

Pinning

5.1

handbook, full pagewidth

1

2

3

4

5

6

7

8

9

ANT_SW1

80 TST2

79 TST1

ANT_SW0

CLK100

78

77

V

SS4

T_ENABLE

T_PWR_RMP

T_DATA

DD5V_2

76 A16

75 P2.2

T_GMSK

P2.1

P2.0

74

73

VCO_BND_SW

SYNTH_LOCK

72 P3.7

71 P3.6

S_ENABLE 10

11

12

13

S_DATA

S_CLK

P3.5

P3.4

70

69

S_PWR

68 P3.3

67 P3.2

REF_CLK 14

V

15

16

17

P3.1

P3.0

V

66

65

64

63

62

61

60

SS1

DD_RF

PCD5095

V

DD3V_1

SS3

V

SLICE_CTR 18

R_PWR 19

SS2

BZP

BZM

V

20

R_DATAP

R_DATAM 21

R_ENABLE 22

RSSI_AN 23

VANLI 24

VBAT 25

DD3V_2

59 P1.7

P1.6

P1.5

58

57

56 P1.4

55 P1.3

CLK3 26

DCK 27

V

DD5V_1

54

53

52

DI 28

R_SLICED

FS1

DPLL_DATA

29

DO 30

51 GP_CLK7

MGL187

Fig.2 Pin configuration (QFP100).

5

1997 Nov 19

Philips Semiconductors

Objective speciﬁcation

DECT baseband controller

PCD5095

5.2

Pin description

Table 1 QFP100 package

STATE

AFTER

RESET

SYMBOL

ANT_SW1

I/O

PIN TYPE

PIN DESCRIPTION

1

O

I

H

ISP2DRF3 antenna switch 1 output

ISP2DRF3 antenna switch 0 output

ANT_SW0

CLK100

2

H

3

H

ISP2DPES 100 Hz signal related to DECT frame timing output

ISP2DRF3 enable transmitter output

T_ENABLE

T_PWR_RMP

T_DATA

4

H

5

L

ISP2DRF3 switch transmitter power output

6

off

ISF2DRF3

ANAIOD1

unmodulated transmitter data output

T_GMSK

VCO_BND_SW

SYNTH_LOCK

S_ENABLE

S_DATA

7

L

GMSK modulated transmitter data output

8

L

ISP2DRF3 VCO band switch output

9

−

DIPP0RF3 synthesizer lock input

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

O

−

L

ISP2DRF3 synthesizer enable output

L

ISP2DRF3 serial synthesizer data output

ISP2DRF3 clock for serial synthesizer interface output

ISP2DRF3 switch synthesizer power output

ISP4DRF3 13.824 MHz reference clock for synthesizer output

S_CLK

L

S_PWR

H

REF_CLK

V_SS1

running

−

supply

negative supply voltage 1

V_{DD_RF}

−

positive supply voltage for RF interface level shifters

positive supply voltage 1 (+3 V)

V_{DD3V_1}

−

SLICE_CTR

R_PWR

O

I

L

ISP2DRF3 switch slicer time constant output

ISP2DRF3 switch receiver power output

H

−

R_DATAP

R_DATAM

R_ENABLE

RSSI_AN

VANLI

ANAIOD2

positive input for receiver data

negative input for receiver data

I

−

O

I

H

−

ISP2DRF3 enable receiver output

ANAIOD1

analog input for RSSI measurement

I

−

analog input to ADC

VBAT

I

−

analog input for battery voltage measurement

CLK3

O

I/O

L

ISP2DPES 3.456 MHz clock output for external ADPCM codec

DCK

input

ISF2DPES ADPCM output or IOM -2 data clock input/output

ISF2UPES (ISF2UPES in PCD5090/xxx, PCA5097/xxx)

DI

28

29

I

−

DIPP0PES ADPCM or IOM -2 data input

FS1

I/O

input

ISF2DPES 8 kHz framing input/output

ISF2UPES (ISF2UPES in PCD5090/xxx, PCA5097/xxx)

DO

30

31

32

33

34

35

O

I

off

ISI8DPES

ANAIOD1

supply

ADPCM or IOM -2 data output

crystal oscillator output

XTAL2

XTAL1

VANLO

V_SSO

running

−

1.0 V

−

crystal oscillator input

O

−

analog output from DAC

negative supply voltage for the oscillator

positive supply voltage for the oscillator

V_DDO

−

supply

1997 Nov 19

6

Philips Semiconductors

Objective speciﬁcation

DECT baseband controller

PCD5095

STATE

SYMBOL

LIFM

I/O

AFTER

RESET

PIN TYPE

PIN DESCRIPTION

36

37

38

39

40

41

42

43

44

45

46

47

48

49

50

51

52

53

54

55

56

57

58

59

60

61

62

63

64

65

66

67

68

69

70

71

72

73

74

I

0.7 V

ANAIOD1

supply

negative input from line interface

positive input from line interface

LIFP

I

0.7 V

V_SSA

−

negative supply voltage for analog circuits

negative input from microphone

positive input from microphone

positive microphone supply voltage (+2 V)

reference voltage (+2 V)

MICM

MICP

VMIC

V_ref

I

0.7 V

ANAIOR1

ANAIOD1

ANAIOR1

supply

I

0.7 V

O

off

O

2.0 V

VBGP

V_DDA

O

1.25 V

−

bandgap output voltage (+1.25 V)

positive supply voltage for analog circuits

negative output to earpiece

−

EARM

EARP

EN_WATCHDOG

P1.0

O

1.4 V

−

ANAIOD1

O

positive output to earpiece

I

DIUP0PES Watchdog Timer enable input

ISQ2CPES bidirectional 80C51 port pin

ISP2DPES general purpose 6.912 MHz output

ISP2DPES data after clock recovery network

ISP2DPES R_DATA comparator output

I/O

O

H

P1.1

H

P1.2

H

GP_CLK7

DPLL_DATA

R_SLICED

V_{DD5V_1}

P1.3

L

O

L

O

L

−

supply

positive supply voltage 1 for the +5 V interface

I/O

−

H

ISQ2CPES bidirectional 80C51 port pin

P1.4

H

P1.5

H

P1.6

off

−

ISI8DPES

supply

bidirectional 80C51 port pin

positive supply voltage 2 (+3 V)

negative buzzer output

P1.7

V_{DD3V_2}

BZM

O

L

ANAIOD2

supply

BZP

O

L

positive buzzer output

V_SS2

−

negative supply voltage 2

negative supply voltage 3

V_SS3

−

supply

P3.0

I/O

H

ISQ2CPES bidirectional 80C51 port pin

P3.1

H

P3.2

H

P3.3

H

P3.4

H

P3.5

H

P3.6

H

P3.7

H

P2.0

H

P2.1

H

1997 Nov 19

7

Philips Semiconductors

Objective speciﬁcation

DECT baseband controller

PCD5095

STATE

SYMBOL

P2.2

I/O

AFTER

RESET

PIN TYPE

PIN DESCRIPTION

75

76

77

78

79

80

81

82

83

84

85

86

87

88

89

90

91

I/O

O

H

L

ISQ2CPES bidirectional 80C51 port pin

ISP4DPES address bit 16 for 128 kbytes external program memory

A16

V_{DD5V_2}

V_SS4

TST1

TST2

P2.3

P2.4

P2.5

P2.6

P2.7

PSE

−

supply

positive supply voltage 2 for the +5 V interface

negative supply voltage 4

−

I

−

DIDP0PES test input 1

I

−

DIDP0PES test input 2

I/O

O

H

−

ISQ2CPES bidirectional 80C51 port pin

ISQ2CPES program store enable (80C51); active LOW

ISQ4CPES address latch enable (80C51)

ISF2DPES external access enable (80C51); active LOW

ALE

O

EA

I

V_SS5

V_{DD5V_3}

P0.7

−

supply

negative supply voltage 5

−

positive supply voltage 3 for the +5 V interface

I/O

off

H

ISP2DPES bidirectional 80C51 port pin

ISQ2CPES (ISQ2CPES in PCD5090/xxx, PCA5097/xxx)

P0.6

P0.5

P0.4

P0.3

P0.2

P0.1

P0.0

92

93

94

95

96

97

98

I/O

off

H

ISP2DPES bidirectional 80C51 port pin

ISQ2CPES (ISQ2CPES in PCD5090/xxx, PCA5097/xxx)

off

H

ISP2DPES bidirectional 80C51 port pin

ISQ2CPES (ISQ2CPES in PCD5090/xxx, PCA5097/xxx)

off

H

ISP2DPES bidirectional 80C51 port pin

ISQ2CPES (ISQ2CPES in PCD5090/xxx, PCA5097/xxx)

off

H

ISP2DPES bidirectional 80C51 port pin

ISQ2CPES (ISQ2CPES in PCD5090/xxx, PCA5097/xxx)

off

H

ISP2DPES bidirectional 80C51 port pin

ISQ2CPES (ISQ2CPES in PCD5090/xxx, PCA5097/xxx)

off

H

ISP2DPES bidirectional 80C51 port pin

ISQ2CPES (ISQ2CPES in PCD5090/xxx, PCA5097/xxx)

off

H

ISP2DPES bidirectional 80C51 port pin

ISQ2CPES (ISQ2CPES in PCD5090/xxx, PCA5097/xxx)

M_RESET

99

I

−

DIDP0PES master reset input (Schmitt trigger)

ISF2DPES reset output

RESET_OUT

100

O

H

1997 Nov 19

8

Philips Semiconductors

Objective speciﬁcation

DECT baseband controller

PCD5095

conversion of three ADPCM channels based on linear

PCM format, the second mode copies four ADPCM

samples, without data processing, into two IOM -2 data

buffers and vice versa. In both modes the DSP controls

the bidirectional data flow from the radio interface and the

IOM -2 interface. The 80C51 controls the DECT protocol

and the IOM -2 interface.

6

FUNCTIONAL DESCRIPTION

The PCD509x is a family of single-chip controllers,

designed for use in Digital Enhanced Cordless

Telecommunications systems (DECT). The family is

designed for minimum component-count and minimum

power consumption. All controllers include an embedded

80C51 microcontroller with on-chip memory and I²C-bus

interface. The Philips DECT RF interface is implemented.

The Burst Mode Logic (BML) performs the time-critical

MAC layer functions for applications in DECT handsets

and base stations. The ADPCM transcoding is in

compliance with the CCITT recommendation G.721 and

includes receive and transmit filters.

The data flow between radio, DSP and IOM -2 is

described in the “PCD5095 DSP user manual”. Basically

the System Data RAM (SDR), the shared memory with

inbound and outbound speech buffers, is the interface to

the DSP and to the radio. Depending on the selected

mode the DSP processes the data stored in the SDR. The

speech buffers are 40 bytes long and each buffer can

hold 80 ADPCM-coded speech samples.

The PCD5095 is designed for business systems, PABX

and WLL. Two modes can be selected: bidirectional

handbook, full pagewidth

DECT CORDLESS PABX

IOM-2

INTERFACE

HANDSET

RF

RF PCD5095

PABX

(PCD5091)

MGL189

HANDSET

RF

(PCD5091)

Fig.3 PCD5095 for PABX.

1997 Nov 19

9

Philips Semiconductors

Objective speciﬁcation

DECT baseband controller

PCD5095

7

PACKAGE OUTLINE

QFP100: plastic quad flat package; 100 leads (lead length 1.95 mm); body 14 x 20 x 2.8 mm

SOT317-2

y

X

A

80

51

81

50

Z

E

e

A

2

H

A

E

(A )

3

A

1

θ

w M

p

pin 1 index

L

p

b

L

31

100

detail X

1

30

w M

Z

v

M

D

A

b

p

e

D

B

H

v

M

B

D

0

5

scale

10 mm

DIMENSIONS (mm are the original dimensions)

A

(1)

UNIT

A

b

c

D

E

e

H

D

H

L

v

w

y

Z

E

θ

1

2

3

p

E

p

D

max.

7^o

0^o

0.25 2.90

0.05 2.65

0.40 0.25 20.1 14.1

0.25 0.14 19.9 13.9

24.2 18.2

23.6 17.6

1.0

0.6

0.8

0.4

1.0

0.6

mm

3.20

0.25

0.65

1.95

0.2 0.15 0.1

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

PROJECTION

ISSUE DATE

VERSION

IEC

JEDEC

EIAJ

95-02-04

97-08-01

SOT317-2

1997 Nov 19

10

Philips Semiconductors

Objective speciﬁcation

DECT baseband controller

PCD5095

8

SOLDERING

Introduction

8.3

Wave soldering

Wave soldering is not recommended for QFP packages.

This is because of the likelihood of solder bridging due to

closely-spaced leads and the possibility of incomplete

solder penetration in multi-lead devices.

8.1

There is no soldering method that is ideal for all IC

packages. Wave soldering is often preferred when

through-hole and surface mounted components are mixed

on one printed-circuit board. However, wave soldering is

not always suitable for surface mounted ICs, or for

printed-circuits with high population densities. In these

situations reflow soldering is often used.

CAUTION

Wave soldering is NOT applicable for all QFP

packages with a pitch (e) equal or less than 0.5 mm.

This text gives a very brief insight to a complex technology.

A more in-depth account of soldering ICs can be found in

our “IC Package Databook” (order code 9398 652 90011).

If wave soldering cannot be avoided, for QFP

packages with a pitch (e) larger than 0.5 mm, the

following conditions must be observed:

8.2

Reﬂow soldering

• A double-wave (a turbulent wave with high upward

pressure followed by a smooth laminar wave)

soldering technique should be used.

Reflow soldering techniques are suitable for all QFP

packages.

• The footprint must be at an angle of 45° to the board

direction and must incorporate solder thieves

downstream and at the side corners.

The choice of heating method may be influenced by larger

plastic QFP packages (44 leads, or more). If infrared or

vapour phase heating is used and the large packages are

not absolutely dry (less than 0.1% moisture content by

weight), vaporization of the small amount of moisture in

them can cause cracking of the plastic body. For more

information, refer to the Drypack chapter in our “Quality

Reference Handbook” (order code 9397 750 00192).

During placement and before soldering, the package must

be fixed with a droplet of adhesive. The adhesive can be

applied by screen printing, pin transfer or syringe

dispensing. The package can be soldered after the

adhesive is cured.

Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied

to the printed-circuit board by screen printing, stencilling or

pressure-syringe dispensing before package placement.

Maximum permissible solder temperature is 260 °C, and

maximum duration of package immersion in solder is

10 seconds, if cooled to less than 150 °C within

6 seconds. Typical dwell time is 4 seconds at 250 °C.

Several methods exist for reflowing; for example,

infrared/convection heating in a conveyor type oven.

Throughput times (preheating, soldering and cooling) vary

between 50 and 300 seconds depending on heating

method. Typical reflow peak temperatures range from

215 to 250 °C.

A mildly-activated flux will eliminate the need for removal

of corrosive residues in most applications.

8.4

Repairing soldered joints

Fix the component by first soldering two diagonally-

opposite end leads. Use only a low voltage soldering iron

(less than 24 V) applied to the flat part of the lead. Contact

time must be limited to 10 seconds at up to 300 °C. When

using a dedicated tool, all other leads can be soldered in

one operation within 2 to 5 seconds between

270 and 320 °C.

1997 Nov 19

11

Philips Semiconductors

Objective speciﬁcation

DECT baseband controller

PCD5095

9

DEFINITIONS

Data sheet status

Objective speciﬁcation

Preliminary speciﬁcation

Product speciﬁcation

Short-form speciﬁcation

This data sheet contains target or goal speciﬁcations for product development.

This data sheet contains preliminary data; supplementary data may be published later.

This data sheet contains ﬁnal product speciﬁcations.

The data in this speciﬁcation is extracted from a full data sheet with the same type

number and title. For detailed information see the relevant data sheet or data handbook.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or

more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation

of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation

is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the speciﬁcation.

10 LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these

products can reasonably be expected to result in personal injury. Philips customers using or selling these products for

use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such

improper use or sale.

11 PURCHASE OF PHILIPS I²C COMPONENTS

Purchase of Philips I²C components conveys a license under the Philips’ I²C patent to use the

components in the I²C system provided the system conforms to the I²C specification defined by

Philips. This specification can be ordered using the code 9398 393 40011.

1997 Nov 19

12

Philips Semiconductors

Objective speciﬁcation

DECT baseband controller

PCD5095

NOTES

1997 Nov 19

13

Philips Semiconductors

Objective speciﬁcation

DECT baseband controller

PCD5095

NOTES

1997 Nov 19

14

Philips Semiconductors

Objective speciﬁcation

DECT baseband controller

PCD5095

NOTES

1997 Nov 19

15

Philips Semiconductors – a worldwide company

Argentina: see South America

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. +31 40 27 82785, Fax. +31 40 27 88399

Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,

Tel. +61 2 9805 4455, Fax. +61 2 9805 4466

New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. +64 9 849 4160, Fax. +64 9 849 7811

Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,

Tel. +43 1 60 101, Fax. +43 1 60 101 1210

Norway: Box 1, Manglerud 0612, OSLO,

Tel. +47 22 74 8000, Fax. +47 22 74 8341

Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,

220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773

Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,

Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474

Belgium: see The Netherlands

Brazil: see South America

Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,

Tel. +48 22 612 2831, Fax. +48 22 612 2327

Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,

51 James Bourchier Blvd., 1407 SOFIA,

Tel. +359 2 689 211, Fax. +359 2 689 102

Portugal: see Spain

Romania: see Italy

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,

Tel. +1 800 234 7381

Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. +7 095 247 9145, Fax. +7 095 247 9144

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,

72 Tat Chee Avenue, Kowloon Tong, HONG KONG,

Tel. +852 2319 7888, Fax. +852 2319 7700

Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,

Tel. +65 350 2538, Fax. +65 251 6500

Colombia: see South America

Czech Republic: see Austria

Slovakia: see Austria

Slovenia: see Italy

Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,

Tel. +45 32 88 2636, Fax. +45 31 57 1949

South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,

Tel. +27 11 470 5911, Fax. +27 11 470 5494

Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. +358 9 615800, Fax. +358 9 61580/xxx

South America: Rua do Rocio 220, 5th floor, Suite 51,

04552-903 São Paulo, SÃO PAULO - SP, Brazil,

Tel. +55 11 821 2333, Fax. +55 11 829 1849

France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex,

Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427

Spain: Balmes 22, 08007 BARCELONA,

Tel. +34 3 301 6312, Fax. +34 3 301 4107

Germany: Hammerbrookstraße 69, D-20097 HAMBURG,

Tel. +49 40 23 53 60, Fax. +49 40 23 536 300

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,

Tel. +46 8 632 2000, Fax. +46 8 632 2745

Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,

Tel. +30 1 4894 339/239, Fax. +30 1 4814 240

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,

Tel. +41 1 488 2686, Fax. +41 1 481 7730

Hungary: see Austria

India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd.

Worli, MUMBAI 400 018, Tel. +91 22 4938 541, Fax. +91 22 4938 722

Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66,

Chung Hsiao West Road, Sec. 1, P.O. Box 22978,

TAIPEI 100, Tel. +886 2 382 4443, Fax. +886 2 382 4444

Indonesia: see Singapore

Ireland: Newstead, Clonskeagh, DUBLIN 14,

Tel. +353 1 7640 000, Fax. +353 1 7640 200

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,

209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,

Tel. +66 2 745 4090, Fax. +66 2 398 0793

Israel: RAPAC Electronics, 7 Kehilat Saloniki St, TEL AVIV 61180,

Tel. +972 3 645 0444, Fax. +972 3 649 1007

Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,

Tel. +90 212 279 2770, Fax. +90 212 282 6707

Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,

20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,

252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461

Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,

Tel. +81 3 3740 5130, Fax. +81 3 3740 5077

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,

MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421

Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,

Tel. +82 2 709 1412, Fax. +82 2 709 1415

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,

Tel. +1 800 234 7381

Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,

Tel. +60 3 750 5214, Fax. +60 3 757 4880

Uruguay: see South America

Vietnam: see Singapore

Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,

Tel. +9-5 800 234 7381

Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. +381 11 625 344, Fax.+381 11 635 777

Middle East: see Italy

For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,

Internet: http://www.semiconductors.philips.com

Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825

SCA52

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed

without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license

under patent- or other industrial or intellectual property rights.

Printed in The Netherlands

437027/1200/01/pp16

Date of release: 1997 Nov 19

Document order number: 9397 750 02387

型号:	PCD5095H
生命周期：	Obsolete
IHS 制造商：	NXP SEMICONDUCTORS
包装说明：	QFP, QFP100,.7X.9
Reach Compliance Code：	compliant
HTS代码：	8542.39.00.01
风险等级：	5.84
Is Samacsys：	N
JESD-30 代码：	R-PQFP-G100
长度：	20 mm
功能数量：	1
端子数量：	100
封装主体材料：	PLASTIC/EPOXY
封装代码：	QFP
封装等效代码：	QFP100,.7X.9
封装形状：	RECTANGULAR
封装形式：	FLATPACK
电源：	3/3.3,5 V
认证状态：	Not Qualified
座面最大高度：	3.2 mm
子类别：	Other Telecom ICs
标称供电电压：	3 V
表面贴装：	YES
技术：	CMOS
电信集成电路类型：	CORDLESS TELEPHONE BASEBAND CIRCUIT
端子形式：	GULL WING
端子节距：	0.65 mm
端子位置：	QUAD
宽度：	14 mm
Base Number Matches：	1

电子百科

产品导航

产品型号PCD5095H的Datasheet PDF文件预览

PCD50953H/E69相关产品..

PCD50953H/E69相关文章

IC37:专业IC行业平台