QSE–028–01–F–D–DP–A–RT1
F-212
®
QSE–060–01–F–D–A
(0,80mm) .0315"
QSE SERIES
QSE–020–01–L–D–A–RT1
HIGH SPEED GROUND PLANE SOCKET
Integral metal plane
for power or ground
Board Mates:
QTE
SPECIFICATIONS
®
For complete specifications and
recommended PCB layouts see
www.samtec.com?QSE
Cable Mates:
EQCD, EQSD, EQDP, EQRF
(See Application Specific note)
Insulator Material:
Liquid Crystal
Polymer
TM
Terminal Material:
Phosphor Bronze
Plating:
EXTENDED LIFE PRODUCT
Au or Sn over 50µ" (1,27µm) Ni
Current Rating:
10 year Mixed Flowing Gas with 50µ" Gold
Call Samtec for maximum cycles mated with QTE
Contacts: 1.3A @ 95°C
Ground Plane: 10.1A @ 95°C
Operating Temp Range:
-55°C to +125°C
Rated @ 3dB Insertion Loss
with PCB effects* w/o PCB effects**
QTE/QSE
Type
Voltage Rating:
5mm Stack Height
225 VAC (5mm Stack Height)
Max Cycles:
Single-Ended Signaling
Differential Pair Signaling
Differential Pair Signaling
–D
–D
9 GHz / 18 Gbps
8 GHz / 16 Gbps
7.5 GHz / 15 Gbps
8.5 GHz / 17 Gbps
––––
Blade & Beam Design
100
Unmating Force (-RT1 option):
-RT1 option increases
unmating force up to 50%
RoHS Compliant:
Yes
–DP 8.5 GHz / 17 Gbps
ALSO
*Performance data includes effects of a non-optimized PCB.
**Test board losses de-embedded from performance data.
AVAILABLE
Board Spacing Standoffs.
See SO Series.
Performance data for other stack heights and complete test data
available at www.samtec.com?QSE or contact sig@samtec.com
Processing:
Lead–Free Solderable:
Yes
PINS PER ROW
NO. OF PAIRS
PLATING
OPTION
OTHER
OPTION
SMT Lead Coplanarity:
(0,10mm) .004" max (020-060)
(0,15mm) .006" max (080)
Board Stacking:
TYPE
QSE
A
01
For applications requiring
more than two connectors
per board or 4 banks or more,
contact ipg@samtec.com
–F
= Gold Flash on
Signal Pins and
Ground Plane, Matte
Tin on tails
–D
= Single-
Ended
–K
–020, –040, –060, –080
= (8,25mm) .325"
DIA Polyimide
Film Pick &
(40 total pins per bank = –D)
APPLICATION
SPECIFIC OPTION
–014, –028, –042, –056
Place Pad
–D–DP
= Differential
Pair
(14 pairs per bank = –D–DP)
• 14mm, 15mm, 22mm
and 30mm stack height
(Caution: Some automatic
placement/inspection
machines may have
component height
restrictions. Please
consult machinery
specifications.)
• 30µ" (0,76µm) Gold
(Specify -H plating for
Data Rate cable mating
applications.)
–L
= 10µ" (0,25µm) Gold
on Signal Pins
–TR
–D–DP = (No. of Positions per Row/14) x
(20,00) .7875 + (1,27) .050
(–01 only)
= Tape & Reel
Packaging
and Ground Plane,
Matte Tin on tails
(N/A on 56 &
80 positions)
–D = (No. of Positions per Row/20) x
(20,00) .7875 + (1,27) .050
–C*
(20,00) .7875
= Electro-Polished
Selective
02
–RT1
= Retention
Option
(N/A on 56 &
80 positions
or –L (latch)
option)
(7,49)
.295
50µ" (1,27µm) min
Au over 150µ"
(7,24)
.285
(3,81µm) Ni on Signal
Pins in contact area,
10µ" (0,25µm) min
Au over 50µ" (1,27µm)
Ni on Ground Plane
in contact area,
MatteTin over 50µ"
(1,27µm) min Ni on
all solder tails
01
(0,80)
.0315
(0,15)
.006
• Edge Mount
QTE
LEAD
MATED
HEIGHT
(3,25)
.128
• 100 positions per row
• Guide Posts and Friction
–L
STYLE WITH QSE*
= Latching
Option
(5,00) .197
–01
–02
–03
–04
Lock options
.
(8,00) .315
(N/A on 42,
56, 60 & 80
positions or
–RT1 option)
Call Samtec.
(3,05)
.120
(11,00) .433
(0,76)
.030
(16,00) .630
(19,00) .748
–05
(25,00) .984
–07
(3,81)
.150
(0,89)
.035
DIA
*Note: –C Plating passes
(0,64)
.025
10 year MFG testing
(3,76)
.148
DIA
*Processing
conditions will
affect mated height.
Note: Some lengths, styles
and options are non-standard,
non-returnable.
–L
–01
–RT1
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