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    产品型号QSMR-C199的Datasheet PDF文件预览

    S M T c h i p L E D s  
    HIGH PERFORMANCE CHIP LED  
    InGaN ChipLEDs  
    QSMR-C199 ( SPECIAL PART NUMBER )  
    Features  
    • High Brightness  
    • Small Size  
    • Industrial Standard Footprint  
    • Diffused Optics  
    • Top Emitting  
    • Compatible With IR Soldering  
    • Compatible For Use With Light Piping  
    • Available in 8mm Tape on 7” Diameter Reel  
    • Reel Sealed in Zip Locked Moisture Barrier Bags  
    Applications  
    • LCD Backlighting  
    • Push Button Backlighting  
    • Front Panel Indicator  
    • Symbol Indicator  
    • Microdisplays  
    • Small Message Panel Signage  
    Description  
    This small chip-type LEDs utilize high efficient and high brightness  
    InGaN material to deliver competitively priced high performance green.  
    This 470nm blue is unique hues which provide color differentiation to  
    a product.  
    This ChipLED comes in top emitting package with wide viewing angle  
    Where it is suitable for direct backlighting application or being  
    used with light pipes. In order to facilitate pick and place  
    operation, this ChipLED is shipped in tape and reel with 4000 units  
    per reel. The package is compatible with IR soldering and binned by  
    both color and intensity.  
    CAUTION: QSMR-C199 LEDs are Class 1 ESD sensitive per MIL-STD-1686. Please observe  
    appropriate precautions during handling and processing. Refer to Agilent Technologies  
    Application Note AN-1142 for additional details.  
    Agilent reserves the right to alter prices, specification, features, capabilities, functions, release dates, and remove availability of the product  
    (s) at anytime.  
    ChipLEDs  
    Package Dimensions  
    LED DIE  
    0.8  
    (0.031)  
    0.4 (0.016)  
    1.6  
    (0.063)  
    POLARITY  
    0.3  
    1.0  
    (0.039)  
    (0.012)  
    DIFFUSED  
    EPOXY  
    0.6  
    (0.023)  
    PC  
    BOARD  
    0.3  
    (0.012)  
    0.3 ± 0.15  
    0.3 ± 0.15  
    (0.012±0.006)  
    (0.012±0.006)  
    SOLDERING  
    TERMINAL  
    SOLDERING  
    TERMINAL  
    Notes:  
    1. All dimensions in millimeters (inches)  
    2. Tolerance is  
    0.1 mm ( 0.004 in.) unless otherwise specified.  
    Absolute Maximum Ratings at TA = 25°C  
    Parameter  
    DC Forward Current[1]  
    Power Dissipation  
    QSMR-C199  
    Units  
    mA  
    mW  
    V
    20  
    78  
    5
    Reverse Voltage (IR = 100µA)  
    LED Junction Temperature  
    Operating Temperature Range  
    Storage Temperature Range  
    95  
    °C  
    °C  
    °C  
    -30 to +85  
    -40 to +85  
    Soldering Temperature  
    See IR soldering profile (Figure 6)  
    Notes:  
    1. Derate linearly as shown in Figure 4.  
    Agilent reserves the right to alter prices, specification, features, capabilities, functions, release dates, and remove availability of the product  
    (s) at anytime.  
    2
    ChipLEDs  
    Electrical Characteristics at TA = 25°C  
    Forward Voltage  
    VF (Volts)  
    Reverse Breakdown  
    Capacitance C  
    (pF), VF = 0,  
    f = 1 MHz  
    Typ.  
    VR (Volts)  
    Part Number  
    QSMR-C199  
    @ IF = 5 mA[1]  
    @ IR = 100 µA  
    Min.  
    Max.  
    Min.  
    5
    2.55  
    3.15  
    110  
    Notes:  
    1. Vf Tolerance : +/- 0.1V  
    Optical Characteristics at TA = 25°C  
    Viewing  
    Angle  
    Peak  
    Wavelength  
    Color,  
    Dominant  
    Luminous  
    Efficacy  
    Luminous  
    Intensity  
    Iv (mcd)  
    @ 5 mA[1]  
    Part  
    Number  
    2 θ1/2  
    Degrees[3]  
    Typ.  
    Color  
    Wavelength  
    λpeak (nm)  
    ηv  
    [2]  
    Typ.  
    λd  
    (nm)  
    (lm/w) Typ.  
    QSMR-C199  
    Blue  
    Bin L, M  
    469  
    Bin D  
    140  
    88  
    Notes:  
    1. The luminous intensity IV is measured at the peak of the spatial radiation pattern which may not  
    be aligned with the mechanical axis of the lamp package.  
    2. The dominant wavelength λd is derived from the CIE Chromatically Diagram and represents the  
    perceived color of the device.  
    3. θ1/2 is the off-axis angle where the luminous intensity is ½ the peak intensity.  
    Intensity Bin [unit:mcd] (Tolerance: +/- 15 %)  
    Min.  
    11.2  
    18.0  
    Max.  
    18.0  
    28.5  
    L
    M
    Color Bin [unit:nm] (Tolerance: +/- 1 nm)  
    Min.  
    475  
    Max.  
    480  
    D
    Agilent reserves the right to alter prices, specification, features, capabilities, functions, release dates, and remove availability of the product  
    (s) at anytime.  
    3
    ChipLEDs  
    100  
    90  
    80  
    70  
    60  
    50  
    40  
    30  
    20  
    10  
    0
    400  
    500  
    Wavelength - nm  
    600  
    700  
    Figure 1: Relative Intensity vs. Wavelength.  
    100.0  
    1.2  
    1.0  
    0.8  
    0.6  
    0.4  
    0.2  
    0.0  
    10.0  
    1.0  
    0.1  
    2.0  
    2.5  
    3.0  
    3.5  
    4.0  
    0
    5
    10  
    15  
    20  
    25  
    VF-FORWARD VOLTAGE-V  
    IF-Forward Current-mA  
    Figure 2: Forward Current vs. Forward Voltage.  
    Figure 3: Luminous Intensity vs. Forward Current.  
    Agilent reserves the right to alter prices, specification, features, capabilities, functions, release dates, and remove availability of the product  
    (s) at anytime.  
    4
    ChipLEDs  
    25  
    20  
    15  
    10  
    5
    0
    0
    10  
    20  
    30  
    40  
    50  
    60  
    70  
    80  
    90  
    100  
    TA - Ambient Temperature - o  
    C
    Figure 4: Maximum Forward Current vs. Ambient Temperature.  
    100  
    90  
    80  
    70  
    60  
    50  
    40  
    30  
    20  
    10  
    0
    10 SEC. MAX.  
    230oC MAX.  
    140-160oC  
    4oC/SEC MAX.  
    -3oC/SEC MAX.  
    4oC/SEC MAX.  
    OVER 2 MIN.  
    -90 -80 -70 -60 -50 -40 -30 -20 -10  
    0
    10 20 30 40 50 60 70 80 90  
    Angle  
    TIME  
    Figure 5: Relative Intensity vs. Angle  
    Figure 6: Recommended Reflow Soldering Profile  
    0.8  
    (0.031)  
    0.8  
    0.7  
    0.8  
    (0.031)  
    (0.028)  
    (0.031)  
    Figure 7: Recommended Soldering Pattern  
    Note:  
    1. All dimensions in millimeters (inches).  
    Agilent reserves the right to alter prices, specification, features, capabilities, functions, release dates, and remove availability of the product  
    (s) at anytime.  
    5
    ChipLEDs  
    Figure 8: Reeling Orientation.  
    Figure 9: Reel Dimensions.  
    Note:  
    1. All dimensions in millimeters (inches).  
    Agilent reserves the right to alter prices, specification, features, capabilities, functions, release dates, and remove availability of the product  
    (s) at anytime.  
    6
    ChipLEDs  
    4.00 (0.157)  
    1.50 (0.059)  
    CATHODE  
    DIM. C  
    (SEE TABLE 1)  
    0.20 0.05  
    (0.008 0.002)  
    1.75 (0.069)  
    3.50 0.05  
    (0.138 0.002)  
    DIM. A (SEE  
    TABLE 1)  
    8.00 0.30 (0.315 0.012)  
    DIM. B  
    (SEE TABLE 1)  
    USER FEED  
    DIRECTION  
    COVER TAPE  
    CARRIER TAPE  
    2.00 0.05  
    (0.079 0.002)  
    4.00 (0.157)  
    TABLE 1  
    DIMENSIONS IN MILIMETERS (INCHES)  
    DIM. A  
    0.10 ( 0.004)  
    DIM. B  
    0.10 ( 0.004)  
    DIM. C  
    0.10( 0.004)  
    PART NUMBER  
    QSMR-C199 SERIES  
    1.80 (0.071)  
    0.95 (0.037)  
    0.75 (0.030)  
    Figure 14: Tape Dimensions.  
    Convective IR Reflow  
    END  
    START  
    Soldering  
    For more information on IR  
    reflow soldering, refer to  
    Application Note 1060,  
    Surface Mounting SMT LED  
    Indicator Components.  
    MINIMUM OF  
    THERE SHALL BE A MINIMUM OF  
    THERE SHALL BE A MINIMUM OF  
    160mm (6.3in.) OF EMPTY  
    COMPONENT POCKETS SEALED  
    WITH COVER TAPE.  
    MOUNTED WITH  
    COMPONENTS.  
    230mm  
    (9.05in.) MAY  
    CONSIST OF  
    CARRIER  
    160mm (6.3in.) OF EMPTY  
    COMPONENT POCKETS SEALED  
    WITH COVER TAPE.  
    AND/OR  
    COVER TAPE  
    Figure 15: Tape Leader and Trailer Dimensions.  
    Notes:  
    1. All dimensions in millimeters (inches).  
    2. Tolerance is  
    0.1 mm ( 0.004 in.) unless otherwise specified.  
    Storage Condition : 5 to 30 OC @ 60%RH max.  
    Baking is required under the condition :  
    a) the blue silica gel indicator becoming white / transparent color  
    b) the pack has been open for more than 1 week  
    Baking recommended condition : 60  
    5
    OC for 20 hrs.  
    Agilent reserves the right to alter prices, specification, features, capabilities, functions, release dates, and remove availability of the product  
    (s) at anytime.  
    7

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