REF5050IDGKR全新原装原理图各脚功能电路原理芯片引脚定义-中国IC网-芯三七

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产品型号REF5050IDGKR的概述

芯片REF5050IDGKR的概述 REF5050IDGKR是一款高精度、低噪声的基准电压源，主要用于提供稳定的参考电压。该芯片通常应用于需要精确电压基准的仪器设备和电路设计中，能够满足多种应用需求。这款芯片的目标是提供优化的精确度和优越的长期温度稳定性，使其成为测量和控制系统中不可或缺的组件。高精度基准电压源在许多电子系统中扮演着至关重要的角色。无论是在信号采集、数据转换还是模拟电路中，稳定而精确的电压参考都确保了系统的可靠性和性能。使用REF5050IDGKR，设计工程师可以依据其优越的性能参数，简化设计过程并提高整体系统的可靠性。芯片REF5050IDGKR的详细参数 REF5050IDGKR的主要参数包括： - 输出电压： 5.000V - 输出电压精度： ±0.5% - 温度系数： 5 ppm/°C（范围0°C至70°C） - 输出电流：最大20 mA - 起始时间： ...

产品型号REF5050IDGKR的Datasheet PDF文件预览

REF5010, REF5020

REF5025, REF5030

REF5040, REF5045, REF5050

www.ti.com

SBOS410E –JUNE 2007–REVISED JUNE 2010

Low-Noise, Very Low Drift, Precision

VOLTAGE REFERENCE

Check for Samples: REF5010, REF5020, REF5025, REF5030, REF5040, REF5045, REF5050

FEATURES

DESCRIPTION

•

LOW TEMPERATURE DRIFT:

The REF50xx is a family of low-noise, low-drift, very

high precision voltage references. These references

are capable of both sinking and sourcing, and are

very robust with regard to line and load changes.

–

High-Grade: 3ppm/°C (max)

Standard-Grade: 8ppm/°C (max)

•

HIGH ACCURACY:

Excellent temperature drift (3ppm/°C) and high

accuracy (0.05%) are achieved using proprietary

design techniques. These features, combined with

very low noise, make the REF50xx family ideal for

use in high-precision data acquisition systems.

–

High-Grade: 0.05% (max)

Standard-Grade: 0.1% (max)

•

LOW NOISE: 3mV_PP/V

EXCELLENT LONG-TERM STABILITY:

Each reference voltage is available in both standard-

and high-grade versions. They are offered in MSOP-8

and SO-8 packages, and are specified from –40°C to

+125°C.

–

5ppm/1000hr (typ) after 1000 hours

•

HIGH OUTPUT CURRENT: ±10mA

TEMPERATURE RANGE: –40°C to +125°C

APPLICATIONS

REF50xx Family

•

16-BIT DATA ACQUISITION SYSTEMS

ATE EQUIPMENT

INDUSTRIAL PROCESS CONTROL

MEDICAL INSTRUMENTATION

OPTICAL CONTROL SYSTEMS

PRECISION INSTRUMENTATION

MODEL

REF5020

REF5025

REF5030

REF5040

REF5045

REF5050

REF5010

OUTPUT VOLTAGE

2.048V

2.5V

3.0V

4.096V

4.5V

5.0V

10.0V

+5V

Input

Signal

0V to 4V

R₁

50W

DNC⁽¹⁾

NC⁽²⁾

DNC⁽¹⁾

V_DD

OPA365

+IN

V_IN

TEMP

GND

ADS8326

REF50xx

C₁

1.2nF

V_OUT

-IN

REF

GND

TRIM/NR

REF5040

SO-8, MSOP-8

V_IN

V_OUT

+5V

C_BYPASS

NOTES:(1) DNC = Do not connect.

(2) NC = No internal connection.

C₂

1mF

22mF

GND

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

All trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

REF5010, REF5020

REF5025, REF5030

REF5040, REF5045, REF5050

SBOS410E –JUNE 2007–REVISED JUNE 2010

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

PACKAGE/ORDERING INFORMATION⁽¹⁾

PRODUCT

OUTPUT VOLTAGE

PACKAGE-LEAD

PACKAGE DESIGNATOR

PACKAGE MARKING

STANDARD GRADE (8ppm, 0.1%)

SO-8

MSOP-8

SO-8

DGK

REF5020

R50A

REF5020A

REF5025A

REF5030A

REF5040A

REF5045A

REF5050A

2.048V

2.5V

REF5025

R50B

MSOP-8

SO-8

DGK

REF5030

R50C

3.0V

MSOP-8

SO-8

DGK

REF5040

R50D

4.096V

4.5V

MSOP-8

SO-8

DGK

REF5045

R50E

MSOP-8

SO-8

DGK

REF5050

R50F

5.0V

MSOP-8

SO-8

DGK

REF5010

R50G

REF5010A

HIGH GRADE (3ppm, 0.05%)

REF5020I

10.0V

MSOP-8

DGK

SO-8

MSOP-8

SO-8

DGK

REF5020

R50A

2.048V

2.5V

REF5025

R50B

REF5025I

REF5030I

REF5040I

REF5045I

REF5050I

REF5010I

MSOP-8

SO-8

DGK

REF5030

R50C

3.0V

MSOP-8

SO-8

DGK

REF5040

R50D

4.096V

4.5V

MSOP-8

SO-8

DGK

REF5045

R50E

MSOP-8

SO-8

DGK

REF5050

R50F

5.0V

MSOP-8

SO-8

DGK

REF5010

R50G

10.0V

MSOP-8

DGK

(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the

device product folder at www.ti.com.

ABSOLUTE MAXIMUM RATINGS⁽¹⁾

PARAMETER

REF50xx

+18

UNIT

Input Voltage

Output Short-Circuit

°C

Operating Temperature Range

Storage Temperature Range

Junction Temperature (T_Jmax)

–55 to +125

–65 to +150

+150

Human Body Model (HBM)

Charged Device Model (CDM)

3000

ESD Rating

1000

(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not implied.

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REF5010, REF5020

REF5025, REF5030

REF5040, REF5045, REF5050

www.ti.com

SBOS410E –JUNE 2007–REVISED JUNE 2010

ELECTRICAL CHARACTERISTICS: PER DEVICE

Boldface limits apply over the specified temperature range, T_A= –40°C to +125°C.

At T_A= +25°C, I_LOAD= 0, C_L= 1mF, and V_IN= (V_OUT+ 0.2V) to 18V, unless otherwise noted.

PER DEVICE

TYP

PARAMETER

CONDITIONS

MIN

MAX

UNIT

REF5020 (V_OUT= 2.048V)⁽¹⁾

OUTPUT VOLTAGE

Output Voltage

V_OUT

2.7V < V_IN< 18V

2.048

Initial Accuracy:

High-Grade

–0.05

–0.1

0.05

0.1

Standard-Grade

NOISE

Output Voltage Noise

f = 0.1Hz to 10Hz

mV_PP

REF5025 (V_OUT= 2.5V)

OUTPUT VOLTAGE

Output Voltage

2.5

Initial Accuracy:

High-Grade

–0.05

–0.1

0.05

0.1

Standard-Grade

NOISE

Output Voltage Noise

f = 0.1Hz to 10Hz

7.5

3.0

mV_PP

REF5030 (V_OUT= 3.0V)

OUTPUT VOLTAGE

Output Voltage

Initial Accuracy:

High-Grade

–0.05

–0.1

0.05

0.1

Standard-Grade

NOISE

Output Voltage Noise

f = 0.1Hz to 10Hz

mV_PP

REF5040 (V_OUT= 4.096V)

OUTPUT VOLTAGE

Output Voltage

4.096

Initial Accuracy:

High-Grade

–0.05

–0.1

0.05

0.1

Standard-Grade

NOISE

Output Voltage Noise

f = 0.1Hz to 10Hz

mV_PP

REF5045 (V_OUT= 4.5V)

OUTPUT VOLTAGE

Output Voltage

4.5

Initial Accuracy:

High-Grade

–0.05

–0.1

0.05

0.1

Standard-Grade

NOISE

Output Voltage Noise

f = 0.1Hz to 10Hz

13.5

5.0

mV_PP

REF5050 (V_OUT= 5.0V)

OUTPUT VOLTAGE

Output Voltage

Initial Accuracy:

High-Grade

–0.05

–0.1

0.05

0.1

Standard-Grade

NOISE

Output Voltage Noise

f = 0.1Hz to 10Hz

mV_PP

REF5010 (V_OUT= 10.0V)

OUTPUT VOLTAGE

Output Voltage

10.0

Initial Accuracy:

High-Grade

–0.05

–0.1

0.05

0.1

Standard-Grade

NOISE

Output Voltage Noise

f = 0.1Hz to 10Hz

mV_PP

(1) For V_OUT≤ 2.5V, the minimum supply voltage is 2.7V.

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Product Folder Link(s): REF5010 REF5020 REF5025 REF5030 REF5040 REF5045 REF5050

REF5010, REF5020

REF5025, REF5030

REF5040, REF5045, REF5050

SBOS410E –JUNE 2007–REVISED JUNE 2010

www.ti.com

ELECTRICAL CHARACTERISTICS: ALL DEVICES

Boldface limits apply over the specified temperature range, T_A= –40°C to +125°C.

At T_A= +25°C, I_LOAD= 0, C_L= 1mF, and V_IN= (V_OUT+ 0.2V) to 18V, unless otherwise noted.

REF50xx

TYP

PARAMETER

OUTPUT VOLTAGE TEMPERATURE DRIFT

Output Voltage Temperature Drift

High-Grade

CONDITIONS

MIN

MAX

UNIT

dV_OUT/dT

2.5

ppm/°C

Standard-Grade

LINE REGULATION

Line Regulation

dV_OUT/dV_IN

REF5020⁽¹⁾Only

V_IN= 2.7V to 18V

V_IN= V_OUT+ 0.2V

0.1

0.2

ppm/V

All Other Devices

Over Temperature

LOAD REGULATION

Load Regulation

dV_OUT/d_ILOAD

–10mA < I_LOAD< +10mA

V_IN= 3V

REF5020 Only

ppm/mA

All Other Devices

V_IN= V_OUT+ 0.75V

Over Temperature

SHORT-CIRCUIT CURRENT

Short-Circuit Current

I_SC

V_OUT= 0

(2)

THERMAL HYSTERESIS

High-Grade

Standard-Grade

High-Grade

MSOP-8

SO-8

Cycle 1

Cycle 2

ppm

Standard-Grade

High-Grade

SO-8

MSOP-8

SO-8

Standard-Grade

High-Grade

Standard-Grade

LONG-TERM STABILITY

MSOP-8

SO-8

0 to 1000 hours

1000 to 2000 hours

0 to 1000 hours

ppm/1000 hr

MSOP-8

SO-8

1000 to 2000 hours

TEMP PIN

Voltage Output

Temperature Sensitivity

TURN-ON SETTLING TIME

Turn-On Settling Time

POWER SUPPLY

Supply Voltage

Quiescent Current

Over Temperature

TEMPERATURE RANGE

Specified Range

Operating Range

Thermal Resistance

MSOP-8

At T_A= +25°C

575

2.64

mV/°C

To 0.1% with C_L= 1mF

200

0.8

(1)

V_S

See Note

V_OUT+ 0.2⁽¹⁾

1.2

–40

–55

+125

°C

q_JA

150

°C/W

SO-8

(1) For V_OUT≤ 2.5V, the minimal supply voltage is 2.7V.

(2) The thermal hysteresis procedure is explained in more detail in the Application Information section.

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REF5010, REF5020

REF5025, REF5030

REF5040, REF5045, REF5050

www.ti.com

SBOS410E –JUNE 2007–REVISED JUNE 2010

TYPICAL CHARACTERISTICS

At T_A= +25°C, I_LOAD= 0, and V_S= V_OUT+ 0.2V, unless otherwise noted. For V_OUT≤ 2.5V, the minimum supply voltage is 2.7V.

TEMPERATURE DRIFT

(0°C to +85°C)

TEMPERATURE DRIFT

(–40°C to +125°C)

Drift (ppm/°C)

Figure 1.

Figure 2.

OUTPUT VOLTAGE

INITIAL ACCURACY

OUTPUT VOLTAGE ACCURACY

vs TEMPERATURE

0.05

0.04

0.03

0.02

0.01

-0.01

-0.02

-0.03

-0.04

-0.05

-50

-25

100

125

Temperature (°C)

Output Initial Accuracy (%)

Figure 3.

Figure 4.

POWER-SUPPLY REJECTION RATIO

vs FREQUENCY

DROPOUT VOLTAGE

vs LOAD CURRENT

160

140

120

100

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

+125°C

+25°C

-40°C

100

10k

100k

-15

-10

-5

Frequency (Hz)

Load Current (mA)

Figure 5.

Figure 6.

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Product Folder Link(s): REF5010 REF5020 REF5025 REF5030 REF5040 REF5045 REF5050

REF5010, REF5020

REF5025, REF5030

REF5040, REF5045, REF5050

SBOS410E –JUNE 2007–REVISED JUNE 2010

www.ti.com

TYPICAL CHARACTERISTICS (continued)

At T_A= +25°C, I_LOAD= 0, and V_S= V_OUT+ 0.2V, unless otherwise noted. For V_OUT≤ 2.5V, the minimum supply voltage is 2.7V.

REF5025 OUTPUT VOLTAGE

vs LOAD CURRENT

TEMP PIN OUTPUT VOLTAGE

vs TEMPERATURE

2.50125

2.50100

2.50075

2.50050

2.50025

2.50000

2.49975

2.49950

2.49925

2.49900

2.49875

0.9

0.8

0.7

0.6

0.5

0.4

0.3

+25°C

-40°C

+125°C

-10

-5

-50

-25

100

125

Load Current (mA)

Temperature (°C)

Figure 7.

Figure 8.

QUIESCENT CURRENT

vs TEMPERATURE

QUIESCENT CURRENT

vs INPUT VOLTAGE

1000

950

900

850

800

750

700

650

600

1050

1000

950

900

850

800

750

700

650

600

+125?C

+25?C

-40?C

10 11 12 13 14 15 16 17 18

-50

-25

100

125

Temperature (°C)

V_IN(V)

Figure 9.

Figure 10.

LINE REGULATION

vs TEMPERATURE

SHORT-CIRCUIT CURRENT

vs TEMPERATURE

0.5

0.4

Sourcing

0.3

0.2

0.1

Sinking

-0.1

-0.2

-0.3

-0.4

-0.5

-50

-25

100

125

-50

-25

100

125

Temperature (°C)

Figure 11.

Figure 12.

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REF5010, REF5020

REF5025, REF5030

REF5040, REF5045, REF5050

www.ti.com

SBOS410E –JUNE 2007–REVISED JUNE 2010

TYPICAL CHARACTERISTICS (continued)

At T_A= +25°C, I_LOAD= 0, and V_S= V_OUT+ 0.2V, unless otherwise noted. For V_OUT≤ 2.5V, the minimum supply voltage is 2.7V.

STARTUP

NOISE

(REF5025, C_L= 1mF)

V_IN

2V/div

1V/div

V_OUT

1s/div

40ms/div

Figure 13.

Figure 14.

STARTUP

LOAD TRANSIENT

(REF5025, C_L= 10mF)

(C_L= 1mF, I_OUT= 1mA)

+1mA

V_IN

I_LOAD

5V/div

-1mA

1mA/div

5mV/div

V_OUT

1V/div

400ms/div

20ms/div

Figure 15.

Figure 16.

LOAD TRANSIENT

(C_L= 1mF, I_OUT= 10mA)

(C_L= 10mF, I_OUT= 1mA)

I_LOAD

+10mA

+1mA

+10mA

10mA/div

I_LOAD

-1mA

1mA/div

5mV/div

-10mA

V_OUT

2mV/div

20ms/div

100ms/div

Figure 17.

Figure 18.

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Product Folder Link(s): REF5010 REF5020 REF5025 REF5030 REF5040 REF5045 REF5050

REF5010, REF5020

REF5025, REF5030

REF5040, REF5045, REF5050

SBOS410E –JUNE 2007–REVISED JUNE 2010

www.ti.com

TYPICAL CHARACTERISTICS (continued)

At T_A= +25°C, I_LOAD= 0, and V_S= V_OUT+ 0.2V, unless otherwise noted. For V_OUT≤ 2.5V, the minimum supply voltage is 2.7V.

LOAD TRANSIENT

LINE TRANSIENT

(C_L= 10mF, I_OUT= 10mA)

(C_L= 1mF)

I_LOAD

+10mA

-10mA

10mA/div

2mV/div

V_IN

500mV/div

5mV/div

V_OUT

100ms/div

20ms/div

Figure 19.

Figure 20.

LINE TRANSIENT

REF50xx

(C_L= 10mF)

LONG-TERM STABILITY (FIRST 1000 HOURS)

140

120

100

96 Units

MSOP-8 Package

V_IN

500mV/div

V_OUT

5mV/div

-20

-40

100ms/div

100 200 300 400 500 600 700 800 900 1000

Hours

Figure 21.

REF50xx

Figure 22.

REF50xx

LONG-TERM STABILITY (SECOND 1000 HOURS)

LONG-TERM STABILITY (2000 HOURS)

140

120

100

96 Units

MSOP-8 Package

96 Units

MSOP-8 Package

-10

-20

-40

1000 1100 1200 1300 1400 1500 1600 1700 1800 1900 2000

Hours

200 400 600 800 1000 1200 1400 1600 1800 2000

Hours

Figure 23.

Figure 24.

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Product Folder Link(s): REF5010 REF5020 REF5025 REF5030 REF5040 REF5045 REF5050

REF5010, REF5020

REF5025, REF5030

REF5040, REF5045, REF5050

www.ti.com

SBOS410E –JUNE 2007–REVISED JUNE 2010

TYPICAL CHARACTERISTICS (continued)

At T_A= +25°C, I_LOAD= 0, and V_S= V_OUT+ 0.2V, unless otherwise noted. For V_OUT≤ 2.5V, the minimum supply voltage is 2.7V.

REF50xx

LONG-TERM STABILITY (FIRST 1000 HOURS)

LONG-TERM STABILITY (SECOND 1000 HOURS)

250

200

150

100

96 Units

SO-8 Package

96 Units

SO-8 Package

-20

-40

-50

100 200 300 400 500 600 700 800 900 1000

Hours

1000 1100 1200 1300 1400 1500 1600 1700 1800 1900 2000

Hours

Figure 25.

Figure 26.

REF50xx

LONG-TERM STABILITY (2000 HOURS)

250

200

150

100

96 Units

SO-8 Package

-50

200 400 600 800 1000 1200 1400 1600 1800 2000

Hours

Figure 27.

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REF5010, REF5020

REF5025, REF5030

REF5040, REF5045, REF5050

SBOS410E –JUNE 2007–REVISED JUNE 2010

www.ti.com

APPLICATION INFORMATION

The REF50xx is family of low-noise, precision

bandgap voltage references that are specifically

designed for excellent initial voltage accuracy and

drift. Figure 28 shows a simplified block diagram of

the REF50xx.

requirement of 2.7V, these references can be

operated with a supply of 200mV above the output

voltage in an unloaded condition. For loaded

conditions, a typical dropout voltage versus load plot

is shown in Figure 6 of the Typical Characteristics.

V_IN

OUTPUT ADJUSTMENT USING THE TRIM/NR

REF50xx

The

REF50xx

provides

very

accurate,

factory-trimmed voltage output. However, V_OUTcan

be adjusted using the trim and noise reduction pin

(TRIM/NR, pin 5). Figure 30 shows a typical circuit

that allows an output adjustment of ±15mV

(10mA

at +25°C)

V_OUT

TEMP

+V_SUPPLY

10kW

REF50xx

TRIM/NR

1.2V

1kW

DNC

V_IN

DNC

60kW

V_OUT

TEMP

GND TRIM/NR

GND

10kW

1kW

470kW

Figure 28. REF50xx Simplified Block Diagram

BASIC CONNECTIONS

Figure 30. V_OUTAdjustment Using the TRIM/NR

Figure 29 shows the typical connections for the

REF50xx.

supply bypass capacitor ranging

between 1mF to 10mF is recommended. A 1mF to

50mF output capacitor (C_L) must be connected from

V_OUTto GND. The ESR value of C_Lmust be less than

or equal to 1.5Ω to ensure output stability. To

minimize noise, the recommended ESR of C_Lis

between 1Ω and 1.5Ω.

The REF50xx allows access to the bandgap through

the TRIM/NR pin. Placing a capacitor from the

TRIM/NR pin to GND (see Figure 31) in combination

with the internal R₃and R₄resistors creates a

low-pass filter. A capacitance of 1mF creates a

low-pass filter with the corner frequency between

10Hz and 20Hz. Such a filter decreases the overall

noise measured on the V_OUTpin by half. Higher

capacitance results in a lower filter cutoff frequency,

further reducing output noise. Note that use of this

capacitor increases startup time.

+V_SUPPLY

REF50xx

DNC

V_IN

DNC

C_BYPASS

V_OUT

TEMP

+V_SUPPLY

1mF to 10mF

C_L

1mF to 50mF

GND TRIM/NR

REF50xx

DNC

V_IN

DNC

V_OUT

TEMP

Figure 29. Basic Connections

GND TRIM/NR

SUPPLY VOLTAGE

1mF

The REF50xx family of voltage references features

extremely low dropout voltage. With the exception of

Figure 31. Noise Reduction Using the TRIM/NR

the REF5020, which has

minimum supply

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REF5025, REF5030

REF5040, REF5045, REF5050

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SBOS410E –JUNE 2007–REVISED JUNE 2010

TEMPERATURE DRIFT

To avoid errors caused by low-impedance loading,

buffer the TEMP pin output with

suitable

The REF50xx is designed for minimal drift error,

which is defined as the change in output voltage over

temperature. The drift is calculated using the box

method, as described by the following equation:

low-temperature drift op amp, such as the OPA333,

OPA335, or OPA376, as shown in Figure 32.

V_OUTMAX* V_OUTMIN

_{Drift +}ǒ

10 (ppm)

V_OUT Temp Range

(1)

REF50xx

DNC

V_IN

DNC

The REF50xx features a maximum drift coefficient of

3ppm/°C for the high-grade version, and 8ppm/°C for

the standard-grade.

V_TEMP

OPA⁽¹⁾

2.6mV/°C

V_OUT

TEMP

GND TRIM/NR

space

NOTE: (1) Low drift op amp, such as the OPA333, OPA335, or OPA376.

THERMAL HYSTERESIS

Thermal hysteresis for the REF50xx is defined as the

change in output voltage after operating the device at

+25°C, cycling the device through the specified

temperature range, and returning to +25°C. It can be

expressed as Equation 2:

Figure 32. Buffering the TEMP Pin Output

POWER DISSIPATION

The REF50xx family is specified to deliver current

loads of ±10mA over the specified input voltage

range. The temperature of the device increases

according to the equation:

· 10⁶(ppm)

|V_PRE- V_POST

V_HYST

(

V_NOM

(2)

T_J= T_A+ P_D× q_JA

(3)

Where:

V_HYST= thermal hysteresis (in units of ppm).

V_NOM= the specified output voltage.

T_J= Junction temperature (°C)

T_A= Ambient temperature (°C)

P_D= Power dissipated (W)

V_PRE

= output voltage measured at +25°C

pretemperature cycling.

q_JA

(°C/W)

= Junction-to-ambient thermal resistance

V_POST= output voltage measured after the device

has been cycled from +25°C through the

specified temperature range of –40°C to +125°C

and returned to +25°C.

The REF50xx junction temperature must not exceed

the absolute maximum rating of +150°C.

TEMPERATURE MONITORING

NOISE PERFORMANCE

The temperature output terminal (TEMP, pin 3)

provides a temperature-dependent voltage output

with approximately 60kΩ source impedance. As seen

in Figure 8, the output voltage follows the nominal

relationship:

Typical 0.1Hz to 10Hz voltage noise for each member

of the REF50xx family is specified in the Electrical

Characteristics: Per Device table. The noise voltage

increases with output voltage and operating

temperature. Additional filtering can be used to

improve output noise levels, although care should be

taken to ensure the output impedance does not

degrade performance.

V_{TEMP PIN}= 509mV + 2.64 × T(°C)

This pin indicates general chip temperature, accurate

to approximately ±15°C. Although it is not generally

suitable for accurate temperature measurements, it

can be used to indicate temperature changes or for

temperature compensation of analog circuitry. A

temperature change of 30°C corresponds to an

approximate 79mV change in voltage at the TEMP

pin.

For additional information about how to minimize

noise and maximize performance in mixed-signal

applications such as data converters, refer to the

series of Analog Applications Journal articles entitled,

How a Voltage Reference Affects ADC Performance.

This three-part series is available for download from

the TI website under three literature numbers:

SLYT331, SLYT339, and SLYT355 for Part I, Part II,

and Part III, respectively.

The TEMP pin has high output impedance (see

Figure 28). Loading this pin with a low-impedance

circuit induces a measurement error; however, it does

not have any effect on V_OUTaccuracy.

Submit Documentation Feedback

Product Folder Link(s): REF5010 REF5020 REF5025 REF5030 REF5040 REF5045 REF5050

REF5010, REF5020

REF5025, REF5030

REF5040, REF5045, REF5050

SBOS410E –JUNE 2007–REVISED JUNE 2010

www.ti.com

APPLICATION CIRCUITS

DATA ACQUISITION

NEGATIVE REFERENCE VOLTAGE

Data acquisition systems often require stable voltage

references to maintain accuracy. The REF50xx family

features low noise, very low drift, and high initial

accuracy for high-performance data converters.

Figure 34 shows the REF5040 in a basic data

acquisition system.

For applications requiring a negative and positive

reference voltage, the REF50xx and OPA735 can be

used to provide a dual-supply reference from a 5V

supply. Figure 33 shows the REF5025 used to

provide a 2.5V supply reference voltage. The low drift

performance of the REF50xx complements the low

offset voltage and zero drift of the OPA735 to provide

an accurate solution for split-supply applications.

Care must be taken to match the temperature

coefficients of R₁and R₂.

+5V

Input

Signal

0V to 4V

R₁

50W

V_DD

OPA365

+IN

ADS8326

C₁

1.2nF

+5V

-IN

REF

GND

REF5025

DNC

V_IN

DNC

REF5040

V_IN

V_OUT

+5V

C_BYPASS

V_OUT

+2.5V

TEMP

C₂

1mF

22mF

1mF

GND TRIM/NR

GND

R₁

10kW

R₂

10kW

Figure 34. Basic Data Acquisition System

+5V

-2.5V

OPA735

-5V

NOTE: Bypass capacitors not shown.

Figure 33. The REF5025 and OPA735 Create

Positive and Negative Reference Voltages

Submit Documentation Feedback

Product Folder Link(s): REF5010 REF5020 REF5025 REF5030 REF5040 REF5045 REF5050

REF5010, REF5020

REF5025, REF5030

REF5040, REF5045, REF5050

www.ti.com

SBOS410E –JUNE 2007–REVISED JUNE 2010

REVISION HISTORY

Changes from Revision D (April, 2009) to Revision E

Page

•

Updated Features list; added Excellent Long-Term Stability bullet ...................................................................................... 1

Added Thermal Hysteresis parameters and specifications .................................................................................................. 4

Added Long-Term Stability parameters and specifications .................................................................................................. 4

Added Figure 22 through Figure 24 ...................................................................................................................................... 8

Added Figure 25 through Figure 27 ...................................................................................................................................... 9

Added Thermal Hysteresis section ..................................................................................................................................... 11

Revised Noise Performance section; added paragraph with links to applications articles ................................................. 11

Changes from Revision C (December, 2008) to Revision D

Page

•

Removed all notes regarding MSOP-8 package status. MSOP-8 package released at time of document revision ............ 1

Changed Storage Temperature Range absolute minimum value from –55°C to –65°C ...................................................... 2

Added test condition to Line Regulation, All other devices specification .............................................................................. 4

Added Load Regulation test condition and Over Temperature specifications ...................................................................... 4

Added typical characteristic graph, Quiescent Current vs Input Voltage (Figure 10) ........................................................... 6

Submit Documentation Feedback

Product Folder Link(s): REF5010 REF5020 REF5025 REF5030 REF5040 REF5045 REF5050

PACKAGE OPTION ADDENDUM

www.ti.com

11-Apr-2013

PACKAGING INFORMATION

Orderable Device

Status Package Type Package Pins Package

Eco Plan Lead/Ball Finish

MSL Peak Temp

Op Temp (°C)

Top-Side Markings

Samples

Drawing

Qty

(1)

(2)

(3)

(4)

REF5010AID

ACTIVE

SOIC

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

-40 to 125

REF

5010

REF5010AIDGKR

REF5010AIDGKT

REF5010AIDR

ACTIVE

VSSOP

SOIC

DGK

2500

250

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

-40 to 125

R50G

Green (RoHS

& no Sb/Br)

R50G

2500

Green (RoHS

& no Sb/Br)

REF

5010

REF5010ID

REF5010IDGKR

REF5010IDGKT

REF5010IDR

ACTIVE

SOIC

VSSOP

SOIC

DGK

2500

250

2500

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

-40 to 125

REF

5010

Green (RoHS

& no Sb/Br)

R50G

Green (RoHS

& no Sb/Br)

R50G

Green (RoHS

& no Sb/Br)

REF

5010

REF5020AID

SOIC

Green (RoHS

& no Sb/Br)

REF

5020

REF5020AIDG4

ACTIVE

SOIC

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

-40 to 125

REF

5020

REF5020AIDGKR

REF5020AIDGKT

REF5020AIDR

ACTIVE

VSSOP

SOIC

DGK

2500

250

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

-40 to 125

R50A

Green (RoHS

& no Sb/Br)

R50A

2500

Green (RoHS

& no Sb/Br)

REF

5020

REF5020AIDRG4

ACTIVE

SOIC

2500

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

-40 to 125

REF

5020

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

11-Apr-2013

Orderable Device

Status Package Type Package Pins Package

Eco Plan Lead/Ball Finish

MSL Peak Temp

Op Temp (°C)

-40 to 125

Top-Side Markings

Samples

Drawing

Qty

(1)

(2)

(3)

(4)

REF5020ID

REF5020IDG4

REF5020IDGKR

REF5020IDGKT

REF5020IDR

ACTIVE

SOIC

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

REF

5020

ACTIVE

DGK

Green (RoHS

& no Sb/Br)

REF

5020

VSSOP

SOIC

2500

250

Green (RoHS

& no Sb/Br)

R50A

Green (RoHS

& no Sb/Br)

R50A

2500

Green (RoHS

& no Sb/Br)

REF

5020

REF5020IDRG4

REF5025AID

SOIC

Green (RoHS

& no Sb/Br)

REF

5020

SOIC

Green (RoHS

& no Sb/Br)

REF

5025

REF5025AIDG4

ACTIVE

SOIC

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

-40 to 125

REF

5025

REF5025AIDGKR

REF5025AIDGKT

REF5025AIDR

ACTIVE

VSSOP

SOIC

DGK

2500

250

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

-40 to 125

R50B

Green (RoHS

& no Sb/Br)

R50B

2500

Green (RoHS

& no Sb/Br)

REF

5025

REF5025AIDRG4

ACTIVE

SOIC

2500

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

-40 to 125

REF

5025

REF5025ID

REF5025IDG4

REF5025IDGKR

REF5025IDGKT

ACTIVE

SOIC

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

-40 to 125

REF

5025

Green (RoHS

& no Sb/Br)

REF

5025

VSSOP

DGK

2500

250

Green (RoHS

& no Sb/Br)

R50B

Green (RoHS

& no Sb/Br)

R50B

Addendum-Page 2

PACKAGE OPTION ADDENDUM

www.ti.com

11-Apr-2013

Orderable Device

Status Package Type Package Pins Package

Eco Plan Lead/Ball Finish

MSL Peak Temp

Op Temp (°C)

-40 to 125

Top-Side Markings

Samples

Drawing

Qty

(1)

(2)

(3)

(4)

REF5025IDR

REF5025IDRG4

REF5030AID

ACTIVE

SOIC

2500

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

REF

5025

ACTIVE

2500

Green (RoHS

& no Sb/Br)

-40 to 125

REF

5025

Green (RoHS

& no Sb/Br)

-40 to 125

REF

5030

REF5030AIDG4

ACTIVE

SOIC

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

-40 to 125

REF

5030

REF5030AIDGKR

REF5030AIDGKT

REF5030AIDR

ACTIVE

VSSOP

SOIC

DGK

2500

250

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

-40 to 125

R50C

Green (RoHS

& no Sb/Br)

R50C

2500

Green (RoHS

& no Sb/Br)

REF

5030

REF5030AIDRG4

ACTIVE

SOIC

2500

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

-40 to 125

REF

5030

REF5030ID

REF5030IDG4

REF5030IDGKR

REF5030IDGKT

REF5030IDR

ACTIVE

SOIC

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

-40 to 125

REF

5030

Green (RoHS

& no Sb/Br)

REF

5030

VSSOP

SOIC

DGK

2500

250

2500

Green (RoHS

& no Sb/Br)

R50C

Green (RoHS

& no Sb/Br)

R50C

Green (RoHS

& no Sb/Br)

REF

5030

REF5030IDRG4

REF5040AID

SOIC

Green (RoHS

& no Sb/Br)

REF

5030

SOIC

Green (RoHS

& no Sb/Br)

REF

5040

REF5040AIDG4

ACTIVE

SOIC

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

-40 to 125

REF

5040

Addendum-Page 3

PACKAGE OPTION ADDENDUM

www.ti.com

11-Apr-2013

Orderable Device

Status Package Type Package Pins Package

Eco Plan Lead/Ball Finish

MSL Peak Temp

Op Temp (°C)

Top-Side Markings

Samples

Drawing

DGK

Qty

2500

250

(1)

(2)

(3)

(4)

REF5040AIDGKR

REF5040AIDGKT

REF5040AIDR

ACTIVE

VSSOP

SOIC

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

-40 to 125

R50D

Green (RoHS

& no Sb/Br)

R50D

2500

Green (RoHS

& no Sb/Br)

REF

5040

REF5040AIDRG4

ACTIVE

SOIC

2500

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

-40 to 125

REF

5040

REF5040ID

REF5040IDG4

REF5040IDGKR

REF5040IDGKT

REF5040IDR

ACTIVE

SOIC

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

-40 to 125

REF

5040

Green (RoHS

& no Sb/Br)

REF

5040

VSSOP

SOIC

DGK

2500

250

2500

Green (RoHS

& no Sb/Br)

R50D

Green (RoHS

& no Sb/Br)

R50D

Green (RoHS

& no Sb/Br)

REF

5040

REF5040IDRG4

REF5045AID

SOIC

Green (RoHS

& no Sb/Br)

REF

5040

SOIC

Green (RoHS

& no Sb/Br)

REF

5045

REF5045AIDG4

ACTIVE

SOIC

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

-40 to 125

REF

5045

REF5045AIDGKR

REF5045AIDGKT

REF5045AIDR

ACTIVE

VSSOP

SOIC

DGK

2500

250

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

-40 to 125

R50E

Green (RoHS

& no Sb/Br)

R50E

2500

Green (RoHS

& no Sb/Br)

REF

5045

Addendum-Page 4

PACKAGE OPTION ADDENDUM

www.ti.com

11-Apr-2013

Orderable Device

Status Package Type Package Pins Package

Eco Plan Lead/Ball Finish

MSL Peak Temp

Op Temp (°C)

Top-Side Markings

Samples

Drawing

Qty

(1)

(2)

(3)

(4)

REF5045AIDRG4

ACTIVE

SOIC

2500

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

-40 to 125

REF

5045

REF5045ID

REF5045IDG4

REF5045IDGKR

REF5045IDGKT

REF5045IDR

ACTIVE

SOIC

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

-40 to 125

REF

5045

Green (RoHS

& no Sb/Br)

REF

5045

VSSOP

SOIC

DGK

2500

250

2500

Green (RoHS

& no Sb/Br)

R50E

Green (RoHS

& no Sb/Br)

R50E

Green (RoHS

& no Sb/Br)

REF

5045

REF5045IDRG4

REF5050AID

SOIC

Green (RoHS

& no Sb/Br)

REF

5045

SOIC

Green (RoHS

& no Sb/Br)

REF

5050

REF5050AIDG4

ACTIVE

SOIC

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

-40 to 125

REF

5050

REF5050AIDGKR

REF5050AIDGKT

REF5050AIDR

ACTIVE

VSSOP

SOIC

DGK

2500

250

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

-40 to 125

R50F

Green (RoHS

& no Sb/Br)

R50F

2500

Green (RoHS

& no Sb/Br)

REF

5050

REF5050AIDRG4

ACTIVE

SOIC

2500

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

-40 to 125

REF

5050

REF5050ID

REF5050IDG4

REF5050IDGKR

ACTIVE

SOIC

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

-40 to 125

REF

5050

Green (RoHS

& no Sb/Br)

REF

5050

VSSOP

DGK

2500

Green (RoHS

& no Sb/Br)

R50F

Addendum-Page 5

PACKAGE OPTION ADDENDUM

www.ti.com

11-Apr-2013

Orderable Device

Status Package Type Package Pins Package

Eco Plan Lead/Ball Finish

MSL Peak Temp

Op Temp (°C)

-40 to 125

Top-Side Markings

Samples

Drawing

Qty

(1)

(2)

(3)

(4)

REF5050IDGKT

REF5050IDR

ACTIVE

VSSOP

SOIC

DGK

250

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

R50F

ACTIVE

2500

Green (RoHS

& no Sb/Br)

-40 to 125

REF

5050

REF5050IDRG4

SOIC

Green (RoHS

& no Sb/Br)

-40 to 125

REF

5050

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

⁽²⁾Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

⁽³⁾MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)

Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a

continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF REF5020, REF5025, REF5040, REF5050 :

Addendum-Page 6

PACKAGE OPTION ADDENDUM

www.ti.com

11-Apr-2013

Enhanced Product: REF5020-EP, REF5025-EP, REF5040-EP, REF5050-EP

•

NOTE: Qualified Version Definitions:

Enhanced Product - Supports Defense, Aerospace and Medical Applications

•

Addendum-Page 7

PACKAGE MATERIALS INFORMATION

www.ti.com

5-Jun-2013

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package Package Pins

Type Drawing

SPQ

Reel

Pin1

Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant

(mm) W1 (mm)

REF5010AIDGKR

REF5010AIDGKT

REF5010AIDR

REF5010IDGKR

REF5010IDGKT

REF5010IDR

VSSOP

SOIC

DGK

2500

250

330.0

180.0

330.0

180.0

330.0

180.0

330.0

180.0

330.0

180.0

330.0

180.0

330.0

12.4

5.3

6.4

5.3

6.4

5.3

6.4

5.3

6.4

5.3

6.4

5.3

6.4

3.4

5.2

3.4

5.2

3.4

5.2

3.4

5.2

3.4

5.2

3.4

5.2

1.4

2.1

1.4

2.1

1.4

2.1

1.4

2.1

1.4

2.1

1.4

2.1

8.0

12.0

2500

250

VSSOP

SOIC

DGK

2500

250

REF5020AIDGKR

REF5020AIDGKT

REF5020AIDR

REF5020IDGKR

REF5020IDGKT

REF5020IDR

VSSOP

SOIC

DGK

2500

250

VSSOP

SOIC

DGK

2500

250

REF5025AIDGKR

REF5025AIDGKT

REF5025AIDR

REF5025IDGKR

REF5025IDGKT

REF5025IDR

VSSOP

SOIC

DGK

2500

250

VSSOP

SOIC

DGK

2500

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

5-Jun-2013

Device

Package Package Pins

Type Drawing

SPQ

Reel

Pin1

Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant

(mm) W1 (mm)

REF5030AIDGKR

REF5030AIDGKT

REF5030AIDR

REF5030IDGKR

REF5030IDGKT

REF5030IDR

VSSOP

SOIC

DGK

2500

250

330.0

180.0

330.0

180.0

330.0

180.0

330.0

180.0

330.0

180.0

330.0

180.0

330.0

180.0

330.0

180.0

330.0

12.4

5.3

6.4

5.3

6.4

5.3

6.4

5.3

6.4

5.3

6.4

5.3

6.4

5.3

6.4

5.3

6.4

3.4

5.2

3.4

5.2

3.4

5.2

3.4

5.2

3.4

5.2

3.4

5.2

3.4

5.2

3.4

5.2

1.4

2.1

1.4

2.1

1.4

2.1

1.4

2.1

1.4

2.1

1.4

2.1

1.4

2.1

1.4

2.1

8.0

12.0

2500

250

VSSOP

SOIC

DGK

2500

250

REF5040AIDGKR

REF5040AIDGKT

REF5040AIDR

REF5040IDGKR

REF5040IDGKT

REF5040IDR

VSSOP

SOIC

DGK

2500

250

VSSOP

SOIC

DGK

2500

250

REF5045AIDGKR

REF5045AIDGKT

REF5045AIDR

REF5045IDGKR

REF5045IDGKT

REF5045IDR

VSSOP

SOIC

DGK

2500

250

VSSOP

SOIC

DGK

2500

250

REF5050AIDGKR

REF5050AIDGKT

REF5050AIDR

REF5050IDGKR

REF5050IDGKT

REF5050IDR

VSSOP

SOIC

DGK

2500

250

VSSOP

SOIC

DGK

2500

Pack Materials-Page 2

PACKAGE MATERIALS INFORMATION

www.ti.com

5-Jun-2013

*All dimensions are nominal

Device

Package Type Package Drawing Pins

SPQ

Length (mm) Width (mm) Height (mm)

REF5010AIDGKR

REF5010AIDGKT

REF5010AIDR

VSSOP

SOIC

DGK

2500

250

367.0

210.0

367.0

210.0

367.0

210.0

367.0

210.0

367.0

210.0

367.0

210.0

367.0

210.0

367.0

185.0

367.0

185.0

367.0

185.0

367.0

185.0

367.0

185.0

367.0

185.0

367.0

185.0

35.0

2500

250

REF5010IDGKR

REF5010IDGKT

REF5010IDR

VSSOP

SOIC

DGK

2500

250

REF5020AIDGKR

REF5020AIDGKT

REF5020AIDR

VSSOP

SOIC

DGK

2500

250

REF5020IDGKR

REF5020IDGKT

REF5020IDR

VSSOP

SOIC

DGK

2500

250

REF5025AIDGKR

REF5025AIDGKT

REF5025AIDR

VSSOP

SOIC

DGK

2500

250

REF5025IDGKR

REF5025IDGKT

REF5025IDR

VSSOP

SOIC

DGK

2500

250

REF5030AIDGKR

REF5030AIDGKT

VSSOP

DGK

Pack Materials-Page 3

PACKAGE MATERIALS INFORMATION

www.ti.com

5-Jun-2013

Device

Package Type Package Drawing Pins

SPQ

Length (mm) Width (mm) Height (mm)

REF5030AIDR

REF5030IDGKR

REF5030IDGKT

REF5030IDR

SOIC

VSSOP

SOIC

2500

250

367.0

210.0

367.0

210.0

367.0

210.0

367.0

210.0

367.0

210.0

367.0

210.0

367.0

210.0

367.0

185.0

367.0

185.0

367.0

185.0

367.0

185.0

367.0

185.0

367.0

185.0

367.0

185.0

367.0

35.0

DGK

2500

250

REF5040AIDGKR

REF5040AIDGKT

REF5040AIDR

REF5040IDGKR

REF5040IDGKT

REF5040IDR

VSSOP

SOIC

DGK

2500

250

VSSOP

SOIC

DGK

2500

250

REF5045AIDGKR

REF5045AIDGKT

REF5045AIDR

REF5045IDGKR

REF5045IDGKT

REF5045IDR

VSSOP

SOIC

DGK

2500

250

VSSOP

SOIC

DGK

2500

250

REF5050AIDGKR

REF5050AIDGKT

REF5050AIDR

REF5050IDGKR

REF5050IDGKT

REF5050IDR

VSSOP

SOIC

DGK

2500

250

VSSOP

SOIC

DGK

2500

Pack Materials-Page 4

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other

changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest

issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and

complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale

supplied at the time of order acknowledgment.

TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms

and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary

to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily

performed.

TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and

applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide

adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or

other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information

published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or

endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the

third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration

and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered

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Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service

voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.

TI is not responsible or liable for any such statements.

Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements

concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support

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of any TI components in safety-critical applications.

In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to

help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and

requirements. Nonetheless, such components are subject to these terms.

No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties

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Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in

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which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and

regulatory requirements in connection with such use.

TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of

non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.

Products

Applications

Audio

www.ti.com/audio

amplifier.ti.com

dataconverter.ti.com

www.dlp.com

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Communications and Telecom www.ti.com/communications

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DLP® Products

DSP

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www.ti.com/computers

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www.ti.com/clocks

interface.ti.com

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www.ti.com/industrial

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Logic

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www.ti.com/security

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RFID

power.ti.com

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www.ti.com/space-avionics-defense

www.ti.com/video

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www.ti.com/omap

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TI E2E Community

e2e.ti.com

www.ti.com/wirelessconnectivity

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