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产品型号S98WS064RA0HI0013的Datasheet PDF文件预览

S98WS064RA0HI001, -002, -003, -004  
Stacked Multi-Chip Product (MCP)  
64 Megabit (4 M x 16-Bit), 1.8 Volt-only Simultaneous Read/Write,  
Burst Mode Flash Memory with  
S98WS064RA0HI001, -002, -003, -004 Cover Sheet  
16 Megabit (1M x 16-Bit) CellularRAM  
Data Sheet (Advance Information)  
Notice to Readers: This document states the current technical specifications regarding the Spansion  
product(s) described herein. Each product described herein may be designated as Advance Information,  
Preliminary, or Full Production. See Notice On Data Sheet Designations for definitions.  
Publication Number S98WS064RA0HI001-004  
Revision 01  
Issue Date June 1, 2010  
D a t a S h e e t ( A d v a n c e I n f o r m a t i o n )  
Notice On Data Sheet Designations  
Spansion Inc. issues data sheets with Advance Information or Preliminary designations to advise readers of  
product information or intended specifications throughout the product life cycle, including development,  
qualification, initial production, and full production. In all cases, however, readers are encouraged to verify  
that they have the latest information before finalizing their design. The following descriptions of Spansion data  
sheet designations are presented here to highlight their presence and definitions.  
Advance Information  
The Advance Information designation indicates that Spansion Inc. is developing one or more specific  
products, but has not committed any design to production. Information presented in a document with this  
designation is likely to change, and in some cases, development on the product may discontinue. Spansion  
Inc. therefore places the following conditions upon Advance Information content:  
“This document contains information on one or more products under development at Spansion Inc.  
The information is intended to help you evaluate this product. Do not design in this product without  
contacting the factory. Spansion Inc. reserves the right to change or discontinue work on this proposed  
product without notice.”  
Preliminary  
The Preliminary designation indicates that the product development has progressed such that a commitment  
to production has taken place. This designation covers several aspects of the product life cycle, including  
product qualification, initial production, and the subsequent phases in the manufacturing process that occur  
before full production is achieved. Changes to the technical specifications presented in a Preliminary  
document should be expected while keeping these aspects of production under consideration. Spansion  
places the following conditions upon Preliminary content:  
“This document states the current technical specifications regarding the Spansion product(s)  
described herein. The Preliminary status of this document indicates that product qualification has been  
completed, and that initial production has begun. Due to the phases of the manufacturing process that  
require maintaining efficiency and quality, this document may be revised by subsequent versions or  
modifications due to changes in technical specifications.”  
Combination  
Some data sheets contain a combination of products with different designations (Advance Information,  
Preliminary, or Full Production). This type of document distinguishes these products and their designations  
wherever necessary, typically on the first page, the ordering information page, and pages with the DC  
Characteristics table and the AC Erase and Program table (in the table notes). The disclaimer on the first  
page refers the reader to the notice on this page.  
Full Production (No Designation on Document)  
When a product has been in production for a period of time such that no changes or only nominal changes  
are expected, the Preliminary designation is removed from the data sheet. Nominal changes may include  
those affecting the number of ordering part numbers available, such as the addition or deletion of a speed  
option, temperature range, package type, or VIO range. Changes may also include those needed to clarify a  
description or to correct a typographical error or incorrect specification. Spansion Inc. applies the following  
conditions to documents in this category:  
“This document states the current technical specifications regarding the Spansion product(s)  
described herein. Spansion Inc. deems the products to have been in sufficient production volume such  
that subsequent versions of this document are not expected to change. However, typographical or  
specification corrections, or modifications to the valid combinations offered may occur.”  
Questions regarding these document designations may be directed to your local sales office.  
2
S98WS064RA0HI001, -002, -003, -004  
S98WS064RA0HI001-004_01 June 1, 2010  
S98WS064RA0HI001, -002, -003, -004  
Stacked Multi-Chip Product (MCP)  
64 Megabit (4 M x 16-Bit), 1.8 Volt-only Simultaneous Read/Write,  
Burst Mode Flash Memory with  
16 Megabit (1M x 16-Bit) CellularRAM  
Data Sheet (Advance Information)  
Features  
„ Single 1.8 volt read, program and erase (1.7 to 1.95 volt)  
„ Speed  
– Flash and CellularRAM: 108 MHz  
„ Simultaneous Read/Write operation  
Note: CellularRAM burst mode operation has been disabled in  
certain product configurations.  
– Data can be continuously read from one bank while executing  
erase/program functions in other bank  
„ Page Mode Read Access  
– Zero latency between read and write operations  
– Flash: 8-word page with page access time of 20 ns  
– CellularRAM: 16-word page with page access time of 20 ns  
„ Package  
– 88-ball Thin Fine pitch BGA  
– 8.0 x 10.0 x 1.2 mm  
For detailed specifications, please refer to the individual data sheets:  
Document  
S29WS064R  
Publication Identification Number (PID)  
S29WS064R_00  
16 Mb Async/Page/Burst CellularRAM  
SWM016D133S3R  
Publication Number S98WS064RA0HI001-004  
Revision 01  
Issue Date June 1, 2010  
This document contains information on one or more products under development at Spansion Inc. The information is intended to help you evaluate this product. Do not design in  
this product without contacting the factory. Spansion Inc. reserves the right to change or discontinue work on this proposed product without notice.  
D a t a S h e e t ( A d v a n c e I n f o r m a t i o n )  
1. Ordering Information  
The order number is formed by a valid combinations of the following:  
S98WS  
064  
R
A0  
H
I
001  
0
Packing Type  
0
3
=
=
Tray  
13-inch Tape and Reel  
Additional Ordering Options  
See valid combinations table  
Temperature Range  
I
= Industrial (–40°C to +85°C)  
W = Wireless (–25°C to +85°C)  
Package Material  
H = Low-Halogen, Lead (Pb) Free Package  
DRAM Density  
A0 = 16 Megabit (1M x 16-Bit)  
Process Technology  
R = 65 nm MirrorBit® Technology  
Flash Density  
064 = 64 Megabit (4M x 16-Bit)  
Product Family  
S98WS = Stacked Multi-Chip Product, Simultaneous Read/Write, Burst Mode  
Flash Memory, 1.8-Volt Operation  
1.1  
Valid Combinations  
The following configurations are planned to be supported for this device. Consult the local sales office to  
confirm availability of specific valid combinations and to check on newly released combinations  
Table 1.1 Valid Combinations  
Product  
Family  
Flash  
Density  
Process  
Technology  
DRAM  
Density  
Packing  
Type  
Package Material / Temperature Range  
Model Number  
S98WS  
064  
R
A0  
HI, HW  
001, 002, 003, 004  
0, 3  
Note:  
BGA package marking omits leading S and packing type designator from ordering part number.  
2. Product Selector Guide  
Part#  
Flash Burst Frequency  
CellularRAM Frequency  
DYB  
S98WS064RA0HI001x S98WS064RA0HI002x S98WS064RA0HI003x S98WS064RA0HI004x  
108 MHz  
108 MHz  
Unlocked  
Locked  
108 MHz  
Asynchronous  
Unlocked  
Locked  
108 MHz  
108 MHz  
Unlocked  
Locked  
108 MHz  
Asynchronous  
Unlocked  
Factory Secured Silicon Region  
Customer Secured Silicon Region  
Boot option  
Locked  
Unlocked  
Top Boot  
Unlocked  
Top Boot  
Unlocked  
Bottom Boot  
Unlocked  
Bottom Boot  
4
S98WS064RA0HI001, -002, -003, -004  
S98WS064RA0HI001-004_01 June 1, 2010  
D a t a S h e e t ( A d v a n c e I n f o r m a t i o n )  
3. MCP Block Diagram  
3.1  
MCP Block Diagram for Model Numbers 001 and 003  
A0-A19  
A20-A21  
RDY  
DQ0-DQ15  
WS064R  
Flash  
Memory  
CLK  
AVD#  
F-CE#  
F-OE#  
F-RST#  
F-ACC  
VSS  
F-WE#  
F-VCC  
VCCQ  
16 Mb  
CellularRAM  
R-CE#  
R-OE#  
R-LB#  
R-UB#  
R-WE#  
R-CRE  
R-VCC  
June 1, 2010 S98WS064RA0HI001-004_01  
S98WS064RA0HI001, -002, -003, -004  
5
D a t a S h e e t ( A d v a n c e I n f o r m a t i o n )  
3.2  
MCP Block Diagram for Model Numbers 002 and 004  
A0-A19  
A20-A21  
F-RDY  
DQ0-DQ15  
WS064R  
Flash  
F-CLK  
F-AVD#  
F-CE#  
Memory  
F-OE#  
F-RST#  
F-ACC  
VSS  
F-WE#  
F-VCC  
VCCQ  
16 Mb  
CellularRAM  
(Note 1) V S S  
(Note 1) V S S  
R-CE#  
R-OE#  
R-LB#  
R-UB#  
R-WE#  
(Note 1) V S S  
R-VCC  
Notes:  
1. These signals are connected internally to VSS.  
2. This signal is not connected externally.  
6
S98WS064RA0HI001, -002, -003, -004  
S98WS064RA0HI001-004_01 June 1, 2010  
D a t a S h e e t ( A d v a n c e I n f o r m a t i o n )  
4. Connection Diagram  
4.1  
Connection Diagram for Model Numbers 001 and 003  
Legend  
A
B
A11  
A21  
RFU  
F-VCC  
VSS  
A19  
A18  
A4  
C
D
E
F
A16  
A14  
A8  
G
H
J
K
L
M
8
7
6
5
Outrigger/NC Balls  
NC  
NC  
A12  
A13  
A15  
A10  
A20  
AVD#  
RFU  
RFU  
A7  
RFU  
RDY  
DQ13  
DQ5  
RFU  
VCCQ R-CRE  
VSS  
VSS  
VSS  
VSS  
F-VCC  
VCCQ  
VSS  
VSS  
NC  
NC  
RFU  
CLK  
RFU  
VSS  
RFU  
R-LB#  
A5  
A9  
DQ7  
DQ15  
DQ6  
VCCQ  
RFU  
Reserved for  
Future Use  
R-CE#  
R-WE#  
F-ACC  
RFU  
A17  
DQ14  
DQ12  
DQ3  
Shared  
Flash Only  
F-WE#  
DQ4  
R-VCC  
RFU  
4
3
2
F-RST# DQ10  
DQ11  
DQ9  
CellularRAM Only  
R-UB#  
A6  
DQ2  
DQ8  
A0  
DQ1  
RFU  
NC  
NC  
DQ0  
F-OE#  
RFU  
RFU  
NC  
NC  
1
A3  
A2  
A1  
R-OE#  
F-CE#  
4.2  
Connection Diagram for Model Numbers 002 and 004  
Legend  
A
B
A11  
A21  
RFU  
F-VCC  
VSS  
A19  
A18  
A4  
C
D
E
F
G
H
J
K
L
M
8
7
6
5
Outrigger/NC Balls  
NC  
NC  
A12  
A13  
A15  
A10  
A20  
A16  
A14  
A8  
RFU  
RFU  
VCCQ  
DQ15  
DQ6  
RFU  
VSS  
VSS  
VSS  
VSS  
F-VCC  
VCCQ  
VSS  
VSS  
NC  
NC  
RFU  
F-CLK  
RFU  
VSS  
RFU  
R-LB#  
A5  
A9  
F-RDY  
DQ13  
DQ5  
DQ7  
VCCQ  
RFU  
Reserved for  
Future Use  
R-CE#  
DQ14  
DQ12  
DQ3  
Shared  
Flash Only  
R-WE# F-AVD# F-WE#  
DQ4  
R-VCC  
RFU  
4
3
2
F-ACC  
RFU  
A17  
RFU  
RFU  
A7  
F-RST# DQ10  
DQ11  
DQ9  
CellularRAM Only  
R-UB#  
A6  
DQ2  
DQ8  
A0  
DQ1  
RFU  
NC  
NC  
DQ0  
F-OE#  
RFU  
RFU  
NC  
NC  
1
A3  
A2  
A1  
R-OE#  
F-CE#  
June 1, 2010 S98WS064RA0HI001-004_01  
S98WS064RA0HI001, -002, -003, -004  
7
D a t a S h e e t ( A d v a n c e I n f o r m a t i o n )  
5. Input/Output Descriptions  
Signal  
A21-A20  
A19-A0  
DQ15-DQ0  
F-CE#  
Description  
Flash  
CellularRAM  
NOR Flash only Address inputs  
X
X
X
X
X
X
X
X
X
NOR Flash/CellularRAM Address inputs  
X
X
Flash Data input/output, shared between NOR and CellularRAM  
NOR Flash Chip-enable input #1. Asynchronous relative to CLK for Burst Mode  
NOR Output Enable input. Asynchronous relative to CLK for Burst mode  
NOR Write Enable input  
F-OE#  
F-WE#  
F-V  
NOR Flash device power supply (1.7V - 1.95V)  
Input/Output Buffer power supply  
CC  
V
X
X
CCQ  
V
Ground  
SS  
Flash ready output. Indicates the status of the Burst read. V = data valid. The Flash RDY  
OL  
pin is shared with the WAIT pin of the CellularRAM (Model numbers 001 and 003 only).  
RDY/F-RDY  
CLK/F-CLK  
X
X (1)  
NOR Flash Clock, shared with CLK of burst-mode CellularRAM (Model numbers 001 and  
003 only). The first rising edge of CLK in conjunction with AVD# low latches the address  
input and activates burst mode operation. After the initial word is output, subsequent rising  
edges of CLK increment the internal address counter. CLK should remain low during  
asynchronous access.  
X
X (1)  
NOR Flash Address Valid input. Shared with AVD# of burst-mode CellularRAM (Model  
numbers 001 and 003 only). Indicates to device that the valid address is present on the  
AVD#/F-AVD# address inputs. V = for asynchronous mode, indicates valid address; for burst mode,  
X
X (1)  
IL  
causes starting address to be latched on rising edge of CLK. V = device ignores address  
IH  
inputs.  
F-RST#  
F-ACC  
NOR Flash hardware reset input. V = device resets and returns to reading array data  
X
X
IL  
NOR Flash accelerated input. At V , accelerates programming; automatically places  
HH  
device in unlock bypass mode. At V , disables all program and erase functions. Should be  
IL  
at V for all other conditions.  
IH  
R-CE#  
R-OE#  
R-WE#  
R-CRE  
Chip-enable input for CellularRAM  
X
X
CellularRAM Output Enable input. Asynchronous relative to CLK for Burst mode  
CellularRAM Write Enable input  
X
Control Register Enable (CellularRAM). For CellularRAM only.  
CellularRAM Power Supply  
X (1)  
X
R-V  
CC  
R-UB#  
R-LB#  
DNU  
Upper Byte Control (CellularRAM)  
X
Lower Byte Control (CellularRAM)  
X
Do Not Use  
RFU  
Reserved for Future Use  
Note:  
1. CellularRAM functions of these balls not available on devices with model numbers 002 and 004.  
8
S98WS064RA0HI001, -002, -003, -004  
S98WS064RA0HI001-004_01 June 1, 2010  
D a t a S h e e t ( A d v a n c e I n f o r m a t i o n )  
6. Physical Dimensions  
TLB088—88-Ball Thin Fine Pitch Ball Grid Array (FBGA) 8 x 10 mm Package  
A
D
D1  
eD  
0.15  
(2X)  
C
8
7
6
5
4
3
2
1
SE  
7
E1  
E
B
eE  
L
J
H
G
F
E
D
C
B
A
M
K
PIN A1  
CORNER  
9
PIN A1  
CORNER  
7
INDEX MARK  
SD  
0.15  
(2X)  
C
TOP VIEW  
SIDE VIEW  
BOTTOM VIEW  
0.20  
0.08  
C
A2  
A
A1  
C
C
6
88X  
b
0.15  
0.08  
M
C
C
A B  
M
NOTES:  
1. DIMENSIONING AND TOLERANCING METHODS PER  
ASME Y14.5M-1994.  
PACKAGE  
JEDEC  
TLB 088  
N/A  
2. ALL DIMENSIONS ARE IN MILLIMETERS.  
D x E  
10.00 mm x 8.00 mm  
PACKAGE  
3. BALL POSITION DESIGNATION PER JEP95, SECTION 4.3,  
SPP-010.  
SYMBOL  
MIN  
---  
NOM  
---  
MAX  
1.20  
---  
NOTE  
4.  
e REPRESENTS THE SOLDER BALL GRID PITCH.  
A
A1  
PROFILE  
5. SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"  
DIRECTION.  
0.20  
0.79  
---  
BALL HEIGHT  
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE  
"E" DIRECTION.  
A2  
---  
0.96  
BODY THICKNESS  
BODY SIZE  
D
10.00 BSC.  
8.00 BSC.  
8.80 BSC.  
5.60 BSC.  
12  
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS  
FOR MATRIX SIZE MD X ME.  
E
BODY SIZE  
D1  
E1  
MATRIX FOOTPRINT  
MATRIX FOOTPRINT  
6
7
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL  
DIAMETER IN A PLANE PARALLEL TO DATUM C.  
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A  
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER  
BALL IN THE OUTER ROW.  
MD  
ME  
n
MATRIX SIZE D DIRECTION  
MATRIX SIZE E DIRECTION  
BALL COUNT  
8
88  
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE  
OUTER ROW SD OR SE = 0.000.  
Øb  
eE  
0.33  
0.38  
0.43  
BALL DIAMETER  
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE  
OUTER ROW, SD OR SE = e/2  
0.80 BSC.  
0.80 BSC  
0.40 BSC.  
BALL PITCH  
eD  
SD SE  
BALL PITCH  
8. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED  
BALLS.  
SOLDER BALL PLACEMENT  
DEPOPULATED SOLDER BALLS  
?
A3,A4,A5,A6,M3,M4,M5,M6  
9
A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK  
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.  
10. OUTLINE AND DIMENSIONS PER CUSTOMER REQUIREMENT.  
3552\ 16-038.22 \ 3.16.6  
June 1, 2010 S98WS064RA0HI001-004_01  
S98WS064RA0HI001, -002, -003, -004  
9
D a t a S h e e t ( A d v a n c e I n f o r m a t i o n )  
7. Revision History  
Section  
Description  
Revision 01 (June 1, 2010)  
Initial release  
10  
S98WS064RA0HI001, -002, -003, -004  
S98WS064RA0HI001-004_01 June 1, 2010  
D a t a S h e e t ( A d v a n c e I n f o r m a t i o n )  
Colophon  
The products described in this document are designed, developed and manufactured as contemplated for general use, including without  
limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as  
contemplated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the  
public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility,  
aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for  
any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion will not be liable to  
you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor  
devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design  
measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal  
operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under  
the Foreign Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country,  
the prior authorization by the respective government entity will be required for export of those products.  
Trademarks and Notice  
The contents of this document are subject to change without notice. This document may contain information on a Spansion product under  
development by Spansion. Spansion reserves the right to change or discontinue work on any product without notice. The information in this  
document is provided as is without warranty or guarantee of any kind as to its accuracy, completeness, operability, fitness for particular purpose,  
merchantability, non-infringement of third-party rights, or any other warranty, express, implied, or statutory. Spansion assumes no liability for any  
damages of any kind arising out of the use of the information in this document.  
Copyright © 2010 Spansion Inc. All rights reserved. Spansion®, the Spansion logo, MirrorBit®, MirrorBit® Eclipse, ORNAND, EcoRAM™ and  
combinations thereof, are trademarks and registered trademarks of Spansion LLC in the United States and other countries. Other names used  
are for informational purposes only and may be trademarks of their respective owners.  
June 1, 2010 S98WS064RA0HI001-004_01  
S98WS064RA0HI001, -002, -003, -004  
11  
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S98WS064RA0HI0010产品参数
型号:S98WS064RA0HI0010
生命周期:Obsolete
IHS 制造商:SPANSION INC
包装说明:,
Reach Compliance Code:unknown
风险等级:5.84
Base Number Matches:1
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