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  • SG6742MRSY图
  • 上海意淼电子科技有限公司

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  • 深圳市芯脉实业有限公司

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  • 数量6980 
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  • 数量3500 
  • 厂家Fairchild Semiconductor 
  • 封装8-SOIC 
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  • 深圳市羿芯诚电子有限公司

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  • 数量11530 
  • 厂家NXP Semiconductors 
  • 封装14-SOIC(3.9mm寬) 
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  • 数量5000 
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  • 数量5949 
  • 厂家Fairchild 
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  • 数量78800 
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  • 深圳市毅创腾电子科技有限公司

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  • 数量7500 
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  • 深圳市卓越微芯电子有限公司

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  • 数量5500 
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  • 数量1790 
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  • 数量15000 
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  • 数量20000 
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  • 数量85000 
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  • 深圳市特拉特科技有限公司

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  • 数量21000 
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  • 数量6500000 
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  • 数量5800 
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  • 深圳市捷立辉科技有限公司

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  • 数量1628 
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  • 数量1381 
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产品型号SG6742MRSY的概述

芯片SG6742MRSY的概述 SG6742MRSY是一款高性能的集成电路,常用于多种电子应用。这款芯片在现代电子设计中因其高效能和灵活性而受到广泛关注。SG6742MRSY特别适合于电源管理、信号处理等领域,其先进的设计使其能够满足多种不同的应用需求。随着科技的不断进步,类似SG6742MRSY的芯片开始在汽车、通讯、工业控制以及消费类电子产品中广泛应用。 芯片SG6742MRSY的详细参数 SG6742MRSY的主要技术参数显示了其在性能和应用范围方面的优势。其基本特性包括: - 工作电压范围:SG6742MRSY支持较宽的操作电压范围,通常在3V到15V之间,这使其具备良好的适应性。 - 工作温度范围:该芯片设计上的耐高温和耐低温性能,使其在-40℃至+85℃的环境下稳定工作。 - 封装类型:SG6742MRSY通常采用SOIC-8或DIP-8封装,这使得其在空间有限的应用中仍然...

产品型号SG6742MRSY的Datasheet PDF文件预览

June 2009  
SG6742ML/MR  
Highly Integrated Green-Mode PWM Controller  
Features  
Description  
The highly integrated SG6742ML/MR PWM controller  
provides several features to enhance the performance  
of flyback converters.  
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High-Voltage Startup  
Low Operating Current: 2.7mA  
Linearly Decreasing PWM Frequency to 22KHz  
Frequency Hopping to Reduce EMI Emission  
Fixed PWM Frequency: 65KHz  
To minimize standby power consumption, a proprietary  
green-mode function provides off-time modulation to  
linearly decrease the switching frequency at light-load  
conditions. To avoid acoustic-noise problems, the  
minimum PWM frequency is set above 22KHz. The  
green-mode function enables the power supply to meet  
international power conservation requirements. With the  
internal high-voltage startup circuitry, the power loss  
due to bleeding resistors is also eliminated. To further  
reduce power consumption, SG6742ML/MR is  
manufactured using the BiCMOS process, which allows  
an operating current of only 2.7mA.  
Peak-Current-Mode Control  
Cycle-by-Cycle Current Limiting  
Leading-Edge Blanking  
Synchronized Slope Compensation  
Internal Open-Loop Protection  
GATE Output Maximum Voltage Clamp: 18V  
VDD Under-Voltage Lockout (UVLO)  
VDD Over-Voltage Protection (OVP)  
Programmable Over-Temperature Protection (OTP)  
Internal Latch Circuit (OVP, OTP)  
Internal Sense Short-Circuit Protection  
Build-in 5ms Soft-Start Function  
SG6742ML/MR integrates a frequency-hopping function  
that helps reduce EMI emission of a power supply with  
minimum line filters. Its built-in synchronized slope  
compensation achieves stable peak-current-mode  
control. The proprietary, internal line compensation  
ensures constant output power limit over a wide AC  
input voltage range, from 90VAC to 264VAC  
.
SG6742ML/MR provides many protection functions. In  
addition to cycle-by-cycle current limiting, the internal  
open-loop protection circuit ensures safety should an  
open-loop or output short-circuit failure occur. PWM  
output is disabled until VDD drops below the UVLO lower  
limit, when the controller starts up again. As long as VDD  
exceeds ~26V, the internal OVP circuit is triggered.  
Constant Power Limit (Full AC Input Range)  
Internal OTP Sensor with Hysteresis  
Applications  
SG6742ML/MR is available in an 8-pin SOP package.  
General-purpose switch-mode power supplies and  
flyback power converters, including:  
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Power Adapters  
Open-Frame SMPS  
Ordering Information  
Operating  
Part  
OLP  
Function  
Packing  
Method  
Eco  
Status  
Temperature  
Number  
Package  
Range  
SG6742MLSY  
SG6742MRSY  
-40 to +105°C  
-40 to +105°C  
Latch  
8-Lead Small Outline Package (SOP)  
8-Lead Small Outline Package (SOP)  
Green  
Green  
Tape & Reel  
Tape & Reel  
Restart  
For Fairchild’s definition of Eco Status, please visit: http://www.fairchildsemi.com/company/green/rohs_green.html.  
© 2008 Fairchild Semiconductor Corporation  
SG6742ML/MR • Rev. 1.0.4  
www.fairchildsemi.com  
Application Diagram  
Figure 1. Typical Application  
Internal Block Diagram  
SG6742ML  
SG6742MR  
Figure 2. Functional Block Diagram  
© 2008 Fairchild Semiconductor Corporation  
SG6742ML/MR • Rev. 1.0.4  
www.fairchildsemi.com  
2
Marking Information  
F- Fairchild Logo  
Z- Plant Code  
X- 1 Digit Year Code  
Y- 1 Digit week Code  
TT: 2 Digits Die Run Code  
T: Package Type (D=DIP, S=SOP)  
P: Y: Green Package  
M: Manufacture Flow Code  
ZXYTT  
6742ML  
TPM  
ZXYTT  
6742MR  
TPM  
Figure 3. Top Mark  
Pin Configuration  
SOP-8  
GND  
FB  
1
2
3
4
8
7
6
5
GATE  
VDD  
SENSE  
RT  
NC  
HV  
Figure 4. Pin Configuration (Top View)  
Pin Definitions  
Pin #  
Name Description  
1
GND  
Ground.  
The signal from the external compensation circuit is fed into this pin. The PWM duty cycle is  
determined in response to the signal on this pin and the current-sense signal on the SENSE pin.  
2
FB  
3
4
NC  
HV  
No connection.  
For startup, this pin is pulled high to the line input or bulk capacitor via resistors.  
For over-temperature protection, an external NTC thermistor is connected from this pin to the  
GND pin. The impedance of the NTC decreases at high temperatures. Once the voltage of the  
RT pin drops below a fixed limit, PWM output is latched.  
5
6
RT  
Current sense. The sensed voltage is used for peak-current-mode control and cycle-by-cycle  
current limiting.  
SENSE  
Power supply. The internal protection circuit disables PWM output as long as VDD exceeds the  
OVP trigger point.  
7
8
VDD  
GATE  
The totem-pole output driver. Soft driving waveform is implemented for improved EMI.  
© 2008 Fairchild Semiconductor Corporation  
SG6742ML/MR • Rev. 1.0.4  
www.fairchildsemi.com  
3
Absolute Maximum Ratings  
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be  
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.  
In addition, extended exposure to stresses above the recommended operating conditions may affect device  
reliability. The absolute maximum ratings are stress ratings only.  
Symbol  
VVDD  
VFB  
Parameter  
Min.  
Max.  
30  
Unit  
V
DC Supply Voltage(1, 2)  
FB Pin Input Voltage  
-0.3  
-0.3  
-0.3  
7.0  
V
VSENSE  
VRT  
SENSE Pin Input Voltage  
RT Pin Input Voltage  
7.0  
V
7.0  
V
VHV  
HV Pin Input Voltage  
500  
400  
141  
+125  
+150  
+260  
V
Power Dissipation (TA50°C)  
PD  
mW  
Thermal Resistance (Junction-to-Air)  
Operating Junction Temperature  
ΘJA  
TJ  
°C/W  
°C  
-40  
-55  
TSTG  
TL  
Storage Temperature Range  
°C  
Lead Temperature (Wave Soldering or IR, 10 Seconds)  
°C  
Electrostatic Discharge Capability,  
All Pins Except HV Pin  
4
kV  
V
Human Body Model, JESD22-A114  
ESD  
Electrostatic Discharge Capability,  
All Pins Except HV Pin  
200  
Machine Model, JESD22-A115  
Notes:  
1. All voltage values, except differential voltages, are given with respect to the network ground terminal.  
2. Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device.  
© 2008 Fairchild Semiconductor Corporation  
SG6742ML/MR • Rev. 1.0.4  
www.fairchildsemi.com  
4
Electrical Characteristics  
VDD=15V and TA=25°C unless otherwise noted.  
Symbol  
Parameter  
Conditions  
Min.  
Typ.  
Max.  
Units  
VDD Section  
VOP  
Continuously Operating Voltage  
22  
16.5  
10.5  
30  
V
V
VDD-ON Start Threshold Voltage  
14.5  
8.5  
15.5  
9.5  
VDD-OFF Minimum Operating Voltage  
V
IDD-ST  
IDD-OP  
Startup Current  
VDD-ON – 0.16V  
µA  
mA  
µA  
V
Operating Supply Current  
VDD=15V, GATE Open  
VTH-OLP+0.1V  
2.7  
60  
3.7  
90  
IDD-OLP Internal Sink Current  
VTH-OLP IDD-OLP Off Voltage  
30  
6.5  
25  
7.5  
26  
8.0  
27  
VDD-OVP VDD Over-Voltage Protection  
V
VDD Over-Voltage Protection  
tD-VDDOVP  
75  
125  
200  
µs  
Debounce Time  
HV Section  
V
V
AC=90V (VDC=120V),  
DD=10µF  
IHV  
Supply Current from HV Pin  
Leakage Current After Startup  
mA  
µA  
1.5  
2.3  
1
3.1  
20  
HV=500V, VDD=VDD-  
OFF+1V  
IHV-LC  
Oscillator Section  
62  
±3.7  
3.9  
18  
65  
±4.2  
4.4  
22  
68  
±4.7  
4.9  
25  
Center Frequency  
Hopping Range  
fOSC  
Frequency in Normal Mode  
KHz  
tHOP  
Hopping Period  
ms  
fOSC-G  
Green-Mode Frequency  
KHz  
Frequency Variation vs. VDD  
Deviation  
fDV  
fDT  
VDD=11V to 22V  
5
5
%
%
Frequency Variation vs.  
Temperature Deviation  
TA=-40 to 105°C  
Continued on the following page…  
PWM Frequency  
fOSC  
fOSC-G  
V
FB-ZDC VFB-G  
VFB-N  
VFB  
Figure 5. VFB vs. PWM Frequency  
© 2008 Fairchild Semiconductor Corporation  
SG6742ML/MR • Rev. 1.0.4  
www.fairchildsemi.com  
5
Electrical Characteristics (Continued)  
VDD=15V and TA=25°C unless otherwise noted.  
Symbol  
Parameter  
Conditions  
Min.  
Typ. Max. Units  
Feedback Input Section  
AV  
Input Voltage to Current-Sense Attenuation  
Input Impedance  
1/4.5  
4
1/4.0  
1/3.5 V/V  
ZFB  
7
k  
V
VFB-OPEN Output High Voltage  
FB Pin Open  
5.2  
4.8  
VFB-OLP FB Open-Loop Trigger Level  
4.6  
50  
5.0  
62  
V
tD-OLP  
VFB-N  
VFB-G  
Delay Time of FB Pin Open-Loop Protection  
56  
ms  
V
Green-Mode Entry FB Voltage  
Green-Mode Ending FB Voltage  
2.8  
3.0  
3.2  
V
FB-N-0.6  
V
VFB-ZDC Zero Duty-Cycle Input Voltage  
V
1.6  
Current-Sense Section  
ZSENSE Input Impedance  
12  
0.90  
0.34  
100  
150  
0.15  
150  
5
KΩ  
V
VSTHFL Current Limit Flatten Threshold Voltage  
VSTHVA Current Limit Valley Threshold Voltage  
0.87  
0.30  
0.93  
0.38  
200  
200  
0.20  
200  
VSTHFL–VSTHVA  
V
tPD  
tLEB  
Delay to Output  
ns  
ns  
V
Leading-Edge Blanking Time  
100  
0.10  
100  
VS-SCP  
Threshold Voltage for SENSE Short-Circuit Protection  
tD-SSCP Delay Time for SENSE Short-Circuit Protection  
tSS Period During Soft-Startup Time  
µs  
ms  
VSENSE<0.15V  
Startup Time  
GATE Section  
DCYMAX Maximum Duty Cycle  
VGATE-L Gate Low Voltage  
60  
65  
70  
%
V
1.5  
VDD=15V, IO=50mA  
VDD=12V, IO=50mA  
VDD=15V, CL=1nF  
VDD=15V, CL=1nF  
VGATE-H Gate High Voltage  
8
V
tr  
tf  
ns  
ns  
Gate Rising Time  
Gate Falling Time  
150  
30  
250  
50  
350  
90  
IGATE-  
SOURCE  
mA  
V
Gate Source Current  
VDD=15V, GATE=6V  
VDD=22V  
250  
VGATE-  
CLAMP  
Gate Output Clamping Voltage  
18  
RT Section  
IRT  
Output Current from RT Pin  
92  
100  
108  
µA  
V
0.7V VRT  
1.05V, After 12ms  
Latch Off  
VRTTH1  
1.015  
1.050 1.085  
Over-Temperature Protection Threshold Voltage  
V
RT 0.7V, After  
100µs Latch Off  
RTTH2 VRT  
VRTTH2  
tD-OTP1  
0.65  
0.70  
0.75  
V
V
8
12  
16  
ms  
µs  
VRTTH1  
Over-Temperature Latch-off Debounce  
tD-OTP2  
Over-Temperature Protection Section (OTP)  
VRT< VRTTH2  
40  
100  
160  
TOTP  
TRestart  
Notes:  
Protection Junction Temperature(3)  
Restart Junction Temperature(4)  
+135  
°C  
°C  
TOTP-25  
3. When activated, the output is disabled and the latch is turned off.  
4. The threshold temperature for enabling the output again and resetting the latch after OTP has been activated.  
© 2008 Fairchild Semiconductor Corporation  
SG6742ML/MR • Rev. 1.0.4  
www.fairchildsemi.com  
6
Typical Performance Characteristics  
5
4
3
2
1
0
25  
20  
15  
10  
5
0
-40  
-30  
-15  
0
25  
50  
75  
85  
100  
125  
-40  
-30  
-15  
0
25  
50  
75  
85  
100  
125  
Temperature (  
)
)
Temperature (  
Figure 7. Operation Supply Current (IDD-OP  
)
Figure 6. Startup Current (IDD-ST) vs. Temperature  
vs. Temperature  
18  
12  
11  
10  
9
17  
16  
15  
14  
13  
8
7
-40  
-30  
-15  
0
25  
50  
75  
85  
100  
125  
-40  
-30  
-15  
0
25  
50  
75  
85  
100  
125  
Temperature ()  
Temperature ()  
Figure 8. Start Threshold Voltage (VDD-ON  
)
Figure 9. Minimum Operating Voltage (VDD-OFF  
vs. Temperature  
)
vs. Temperature  
5
4
3
2
1
0
10  
8
6
4
2
0
-40  
-30  
-15  
0
25  
50  
75  
85  
100  
125  
-40  
-30  
-15  
0
25  
50  
75  
85  
100  
125  
Temperature ()  
Temperature ()  
Figure 10. Supply Current Drawn from HV Pin (IHV  
)
Figure 11. HV Pin Leakage Current After Startup  
(IHV-LC) vs. Temperature  
vs. Temperature  
70  
68  
66  
64  
62  
60  
70  
68  
66  
64  
62  
60  
-40  
-30  
-15  
0
25  
50  
75  
85  
100  
125  
-40  
-30  
-15  
0
25  
50  
75  
85  
100  
125  
Temperature ()  
Temperature ()  
Figure 12. Frequency in Normal Mode (fOSC  
)
Figure 13. Maximum Duty Cycle (DCYMAX  
)
vs. Temperature  
vs. Temperature  
© 2008 Fairchild Semiconductor Corporation  
SG6742ML/MR • Rev. 1.0.4  
www.fairchildsemi.com  
7
Typical Performance Characteristics  
7
62  
60  
58  
56  
54  
52  
50  
6
5
4
3
-40  
-30  
-15  
0
25  
50  
75  
85  
100  
125  
-40  
-30  
-15  
0
25  
50  
75  
85  
100  
125  
Temperature (  
)
Temperature ()  
Figure 14. FB Open-Loop Trigger Level (VFB-OLP  
)
Figure 15. Delay Time of FB Pin Open-Loop Protection  
(tD-OLP) vs. Temperature  
vs. Temperature  
0.15  
0.145  
0.14  
100  
99  
98  
0.135  
0.13  
97  
96  
-40  
-30  
-15  
0
25  
50  
75  
85  
100  
125  
-40  
-30  
-15  
0
25  
50  
75  
85  
100  
125  
Temperature (  
)
Temperature (  
)
Figure 16. Threshold Voltage for SENSE Short-Circuit  
Protection (VS-SCP) vs. Temperature  
Figure 17. Output Current from RT Pin (IRT  
vs. Temperature  
)
1.2  
1.1  
1
0.9  
0.8  
0.7  
0.6  
0.5  
0.9  
0.8  
-40  
-30  
-15  
0
25  
50  
75  
85  
100  
125  
-40  
-30  
-15  
0
25  
50  
75  
85  
100  
125  
Temperature (  
)
Temperature (  
)
Figure 18. Over-Temperature Protection Threshold  
Figure 19. Over-Temperature Protection Threshold  
Voltage (VRTTH1) vs. Temperature  
Voltage (VRTTH2) vs. Temperature  
27  
26.5  
26  
25.5  
25  
-40  
-30  
-15  
0
25  
50  
75  
85  
100  
125  
Temperature (  
)
Figure 20. VDD Over-Voltage Protection (VDD-OVP) vs. Temperature  
© 2008 Fairchild Semiconductor Corporation  
SG6742ML/MR • Rev. 1.0.4  
www.fairchildsemi.com  
8
Functional Description  
Startup Current  
Gate Output / Soft Driving  
For startup, the HV pin is connected to the line input or  
bulk capacitor through an external diode and resistor,  
The BiCMOS output stage is a fast totem-pole gate  
driver. Cross conduction has been avoided to minimize  
heat dissipation, increase efficiency, and enhance  
reliability. The output driver is clamped by an internal  
18V Zener diode to protect power MOSFET transistors  
against undesirable gate over voltage. A soft driving  
waveform is implemented to minimize EMI.  
RHV, (1N4007 / 100Krecommended). Typical startup  
current drawn from the HV pin is 2.3mA and charges  
the hold-up capacitor through the diode and resistor.  
When the VDD capacitor level reaches VDD-ON, the  
startup current switches off. At this moment, the VDD  
capacitor only supplies the SG6742ML/MR to keep the  
V
DD before the auxiliary winding of the main transformer  
Soft-Start  
provides the operating current.  
For many applications, it is necessary to minimize the  
inrush current at startup. The built-in 5ms soft-start  
circuit significantly reduces the startup current spike  
and output voltage overshoot.  
Operating Current  
Operating current is around 2.7mA. The low operating  
current enables better efficiency and reduces the  
requirement of VDD hold-up capacitance.  
Built-in Slope Compensation  
The sensed voltage across the current-sense resistor is  
used for peak-current-mode control and pulse-by-pulse  
current limiting. Built-in slope compensation improves  
stability and prevents sub-harmonic oscillation.  
SG6742ML/MR inserts a synchronized, positive-going,  
ramp at every switching cycle.  
Green-Mode Operation  
The proprietary green-mode function provides off-time  
modulation to reduce the switching frequency in light-  
load and no-load conditions. The on time is limited for  
better abnormal or brownout protection. VFB, which is  
derived from the voltage feedback loop, is taken as the  
reference. Once VFB is lower than the threshold voltage,  
switching frequency is continuously decreased to the  
minimum green-mode frequency of around 22KHz.  
Constant Output Power Limit  
When the SENSE voltage across sense resistor RS  
reaches the threshold voltage, around 0.9V, the output  
GATE drive is turned off after a small delay, tPD. This  
delay introduces an additional current proportional to tPD  
• VIN / LP. Since the delay is nearly constant regardless  
of the input voltage VIN, higher input voltage results in a  
larger additional current and the output power limit is  
higher than under low input line voltage. To compensate  
this variation for a wide AC input range, a sawtooth  
power-limiter is designed to solve the unequal power-  
limit problem. The power limiter is designed as a  
positive ramp signal fed to the inverting input of the  
OCP comparator. This results in a lower current limit at  
high-line inputs than at low-line inputs.  
Current Sensing / PWM Current Limiting  
Peak-current-mode control is utilized to regulate output  
voltage and provide pulse-by-pulse current limiting. The  
switch current is detected by a sense resistor into the  
SENSE pin. The PWM duty cycle is determined by this  
current-sense signal and VFB, the feedback voltage.  
When the voltage on SENSE pin reaches around  
VCOMP=(VFB–0.6)/4, the switch cycle is terminated  
immediately. VCOMP is internally clamped to a variable  
voltage around 0.85V for output power limit.  
Leading-Edge Blanking (LEB)  
VDD Over-Voltage Protection (OVP)  
Each time the power MOSFET is switched on, a turn-on  
spike occurs on the sense-resistor. To avoid premature  
termination of the switching pulse, a leading-edge  
blanking time is built in. During this blanking period, the  
current-limit comparator is disabled and cannot switch  
off the gate driver.  
VDD over-voltage protection is built in to prevent  
damage due to abnormal conditions. If the VDD voltage  
is over the over-voltage protection voltage (VDD-OVP) and  
lasts for tD-VDDOVP, the PWM pulses are disabled until  
the VDD voltage drops below the UVLO, then starts  
again. Over-voltage conditions are usually caused by  
open feedback loops.  
Under-Voltage Lockout (UVLO)  
The turn-on and turn-off thresholds are fixed internally  
at 15.5V and 9.5V. During startup, the hold-up capacitor  
must be charged to 15.5V through the startup resistor to  
enable the IC. The hold-up capacitor continues to  
supply VDD before the energy can be delivered from  
auxiliary winding of the main transformer. VDD must not  
drop below 9.5V during startup. This UVLO hysteresis  
window ensures that hold-up capacitor is adequate to  
supply VDD during startup.  
Thermal Protection  
An NTC thermistor, RNTC, in series with resistor RA, can  
be connected from the RT pin to ground. A constant  
current IRT is output from the RT pin. The voltage on the  
RT pin can be expressed as VRT=IRT • (RNTC + RA),  
where IRT is 100µA. At high ambient temperatures, RNTC  
is smaller, such that VRT decreases. When VRT is less  
than 1.05V (VRTTH1), the PWM turns off after 12ms  
(tD-OTP1). If VRT is less than 0.7V (VRTTH2), PWM turns off  
after 100µs (tD-OTP2).  
© 2008 Fairchild Semiconductor Corporation  
SG6742ML/MR • Rev. 1.0.4  
www.fairchildsemi.com  
9
Functional Description (Continued)  
Limited Power Control  
Noise Immunity  
The FB voltage increases every time the output of the  
power supply is shorted or overloaded. If the FB voltage  
remains higher than a built-in threshold for longer than  
Noise on the current sense or control signal may cause  
significant pulse-width jitter, particularly in continuous-  
conduction mode. Slope compensation helps alleviate  
this problem. Good placement and layout practices  
should be followed. Avoiding long PCB traces and  
component leads, locating compensation and filter  
components near the SG6742ML/MR, and increasing  
the power MOS gate resistance improve performance.  
t
D-OLP, PWM output is turned off. As PWM output is  
turned off, VDD begins decreasing.  
When VDD goes below the turn-off threshold (~9.5V) the  
controller is totally shut down. VDD is charged up to the  
turn-on threshold voltage of 15.5V through the startup  
resistor until PWM output is restarted. This protection  
feature continues as long as the overloading condition  
persists. This prevents the power supply from  
overheating due to overloading conditions. When VRT is  
less than 1.05V (VRTTH1), the PWM is turned off after  
12ms (tD-OTP1). If VRT is less than 0.7V (VRTTH2), PWM is  
turned off after 100µs (tD-OTP2).  
© 2008 Fairchild Semiconductor Corporation  
SG6742ML/MR • Rev. 1.0.4  
www.fairchildsemi.com  
10  
Applications Information  
F1  
R2  
Q1  
C6  
2
BD1  
CN1  
L1  
T1  
1
3
VZ1  
1
2
3
C1  
T2  
4
1
4
5
8
C2  
CN1  
VO+  
C8  
R1  
L2  
VO+  
C5  
+
1
2
C4  
6
2
L3  
C3  
+
+
D4  
D1  
C7  
3
7
D2  
VO-  
R3  
Q2  
R4  
1
D3  
1
2
+
SG6742
U1  
C9  
1
2
3
4
8
7
6
5
GND GATE  
FB  
NC SENSE  
HV RT  
VDD  
C12  
R5  
R6  
C10  
R7  
THER1  
R8  
U2  
VO+  
R9  
R
R10  
R11  
C11  
U3  
Figure 21. 60W Flyback 12V/5A Application Circuit  
BOM  
Designator  
Part Type  
Designator  
Part Type  
BD1  
C1  
C2  
C3  
C4  
C5  
C6  
C7  
C8  
C9  
C10  
C11  
C12  
D1  
D2  
D3  
D4  
F1  
L3  
Inductor (900µH)  
STP20-100CT  
MOS 7A/600V  
R 100KΩ 1/2W  
R 47Ω 1/4W  
R 100KΩ 1/2W  
R 4.7Ω 1/8W  
R 100Ω 1/8W  
R 4.7KΩ 1/8W  
R 0.3Ω 2W  
BD 4A/600V  
Q1  
Q2  
R1  
R2  
R3  
R4  
R5  
XC 0.68µF/300V  
XC 0.1µF/300V  
YC 2200pF/Y1  
EC 120µF/400V  
CC 0.01µF/500V  
CC 1000pF/100V  
EC 1000µF/25V  
EC 470µF/25V  
EC 22µF/50V  
R6, R9  
R7  
R8  
CC 47pF/50V  
R 680Ω 1/8W  
R 150KΩ 1/8W  
R 39KΩ 1/8W  
Thermistor TTC104  
10mH  
R10  
R11  
THER1  
T1  
CC 2200pF/50V  
CC 0.01µF/50V  
Zener Diode 15V 1/2W (option)  
BYV95C  
FR103  
T2  
600µH(PQ2620)  
IC SG6742  
1N4007  
U1  
FUSE 4A/250V  
Inductor (900µH)  
Inductor (2µH)  
U2  
IC PC817  
L1  
U3  
IC TL431  
L2  
VZ1  
VZ 9G  
© 2008 Fairchild Semiconductor Corporation  
SG6742ML/MR • Rev. 1.0.4  
www.fairchildsemi.com  
11  
Physical Dimensions  
5.00  
4.80  
A
0.65  
3.81  
8
5
B
1.75  
6.20  
5.80  
4.00  
3.80  
5.60  
1
4
PIN ONE  
INDICATOR  
1.27  
1.27  
(0.33)  
M
0.25  
C B A  
LAND PATTERN RECOMMENDATION  
SEE DETAIL A  
0.25  
0.10  
0.25  
0.19  
C
1.75 MAX  
0.10  
C
0.51  
0.33  
OPTION A - BEVEL EDGE  
0.50  
0.25  
x 45°  
R0.10  
R0.10  
GAGE PLANE  
OPTION B - NO BEVEL EDGE  
0.36  
NOTES: UNLESS OTHERWISE SPECIFIED  
8°  
0°  
0.90  
A) THIS PACKAGE CONFORMS TO JEDEC  
MS-012, VARIATION AA, ISSUE C,  
B) ALL DIMENSIONS ARE IN MILLIMETERS.  
C) DIMENSIONS DO NOT INCLUDE MOLD  
FLASH OR BURRS.  
SEATING PLANE  
(1.04)  
0.406  
D) LANDPATTERN STANDARD: SOIC127P600X175-8M.  
E) DRAWING FILENAME: M08AREV13  
DETAIL A  
SCALE: 2:1  
Figure 22. 8-Pin Small Outline Package (SOP)  
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner  
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify  
or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,  
specifically the warranty therein, which covers Fairchild products.  
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:  
http://www.fairchildsemi.com/packaging/.  
© 2008 Fairchild Semiconductor Corporation  
SG6742ML/MR • Rev. 1.0.4  
www.fairchildsemi.com  
12  
© 2008 Fairchild Semiconductor Corporation  
SG6742ML/MR • Rev. 1.0.4  
www.fairchildsemi.com  
13  

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