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产品型号SI5338A-B08801-GMR的Datasheet PDF文件预览

Si5338  
I2C-PROGRAMMABLE ANY-FREQUENCY, ANY-OUTPUT  
QUAD CLOCK GENERATOR  
Features  
Low power MultiSynth™ technology  
enables independent, any-frequency  
synthesis on four differential output  
drivers  
PCIe Gen 1/2/3/4 Common Clock and  
Gen 3 SRNS compliant  
Single supply core with excellent  
PSRR: 1.8, 2.5, 3.3 V  
Independent frequency increment/  
decrement feature enables  
glitchless frequency adjustments in  
1 ppm steps  
Highly-configurable output drivers with Independent phase adjustment on  
up to four differential outputs, eight  
single-ended clock outputs, or a  
combination of both  
Low phase jitter of 0.7 ps RMS typ  
High precision synthesis allows true  
zero ppm frequency accuracy on all  
outputs  
each of the output drivers with an  
accuracy of <20 ps steps  
Ordering Information:  
Highly configurable spread  
spectrum (SSC) on any output:  
Any frequency from 5 to 350 MHz  
Any spread from 0.5 to 5.0%  
Any modulation rate from 33 to  
63 kHz  
External feedback mode allows  
zero-delay mode  
Loss of lock and loss of signal  
alarms  
I2C/SMBus compatible interface  
Easy to use programming software  
Small size: 4 x 4 mm, 24-QFN  
Low power: 45 mA core supply typ  
Wide temperature range: –40 to  
+85 °C  
See page 42.  
Pin Assignments  
Flexible input reference:  
External crystal: 8 to 30 MHz  
CMOS input: 5 to 200 MHz  
SSTL/HSTL input: 5 to 350 MHz  
Differential input: 5 to 710 MHz  
Independently configurable outputs  
support any frequency or format:  
LVPECL/LVDS: 0.16 to 710 MHz  
HCSL: 0.16 to 250 MHz  
Top View  
24  
23  
22  
21  
20  
19  
1
2
3
4
IN1  
18  
17  
16  
15  
CLK1A  
IN2  
IN3  
IN4  
CLK1B  
VDDO1  
CMOS: 0.16 to 200 MHz  
SSTL/HSTL: 0.16 to 350 MHz  
Independent output voltage per driver:  
1.5, 1.8, 2.5, or 3.3 V  
GND  
Pad  
VDDO2  
CLK2A  
CLK2B  
5
6
14  
13  
IN5  
IN6  
Applications  
7
8
9
10  
12  
11  
Ethernet switch/router  
PCIe Gen1/2/3/4  
Broadcast video/audio timing  
Processor and FPGA clocking  
Any-frequency clock conversion  
MSAN/DSLAM/PON  
Fibre Channel, SAN  
Telecom line cards  
1 GbE and 10 GbE  
Description  
The Si5338 is a high-performance, low-jitter clock generator capable of  
synthesizing any frequency on each of the device's four output drivers. This timing  
IC is capable of replacing up to four different frequency crystal oscillators or  
operating as a frequency translator. Using its patented MultiSynth™ technology,  
the Si5338 allows generation of four independent clocks with 0 ppm precision.  
Each output clock is independently configurable to support various signal formats  
and supply voltages. The Si5338 provides low-jitter frequency synthesis in a  
space-saving 4 x 4 mm QFN package. The device is programmable via an I2C/  
SMBus-compatible serial interface and supports operation from a 1.8, 2.5, or  
3.3 V core supply. I2C device programming is made easy with the ClockBuilder™  
Desktop software available at www.silabs.com/ClockBuilder. Measuring PCIe  
clock jitter is quick and easy with the Silicon Labs PCIe Clock Jitter Tool.  
Download it for free at www.silabs.com/pcie-learningcenter.  
Rev. 1.6 12/15  
Copyright © 2015 by Silicon Laboratories  
Si5338  
 
Si5338  
Functional Block Diagram  
VDD  
Output  
Stage  
Synthesis  
Stage 1  
(PLL)  
Synthesis  
Stage 2  
Osc  
noclk  
VDDO0  
CLK0A  
CLK0B  
P1DIV_IN  
÷P1  
IN1  
IN2  
MultiSynth  
÷M0  
ref  
÷R0  
÷R1  
÷R2  
÷R3  
IN3  
VDDO1  
CLK1A  
Loop  
Filter  
VCO  
Phase  
MultiSynth  
÷M1  
Frequency  
Detector  
P2DIV_IN  
÷P2  
CLK1B  
fb  
IN4  
IN5  
IN6  
VDDO2  
CLK2A  
CLK2B  
noclk  
MultiSynth  
÷M2  
MultiSynth  
÷N  
Control & Memory  
VDDO3  
CLK3A  
OEB/PINC/FINC  
MultiSynth  
÷M3  
I2C_LSB/PDEC/FDEC  
NVM  
(OTP)  
CLK3B  
Control  
RAM  
SCL  
SDA  
INTR  
2
Rev. 1.6  
Si5338  
TABLE OF CONTENTS  
Section  
Page  
1. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
2. Typical Application Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17  
3. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18  
3.1. Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18  
3.2. Input Stage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19  
3.3. Synthesis Stages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19  
3.4. Output Stage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21  
3.5. Configuring the Si5338 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21  
3.6. Status Indicators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24  
3.7. Output Enable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24  
3.8. Power Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25  
3.9. Reset Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27  
3.10. Features of the Si5338 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27  
4. Applications of the Si5338 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29  
4.1. Free-Running Clock Generator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29  
4.2. Synchronous Frequency Translation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30  
4.3. Configurable Buffer and Level Translator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30  
5. I2C Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31  
6. Si5338 Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32  
7. Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33  
8. Device Pinout by Part Number . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37  
9. Package Outline: 24-Lead QFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39  
10. Recommended PCB Land Pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40  
11. Top Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41  
11.1. Si5338 Top Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41  
11.2. Top Marking Explanation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41  
12. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42  
13. Device Errata . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43  
Document Change List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44  
Rev. 1.6  
3
Si5338  
1. Electrical Specifications  
Table 1. Recommended Operating Conditions  
(VDD = 1.8 V –5% to +10%, 2.5 V ±10%, or 3.3 V ±10%, TA = –40 to 85 °C)  
Parameter  
Symbol  
Test Condition  
Min  
–40  
2.97  
2.25  
1.71  
1.4  
Typ  
25  
Max  
85  
Unit  
°C  
V
Ambient Temperature  
T
A
3.3  
2.5  
1.8  
3.63  
2.75  
1.98  
3.63  
V
V
Core Supply Voltage  
DD  
V
Output Buffer Supply  
Voltage  
V
V
DDOn  
Note: All minimum and maximum specifications are guaranteed and apply across the recommended operating conditions.  
Typical values apply at nominal supply voltages and an operating temperature of 25 °C unless otherwise noted.  
Table 2. Absolute Maximum Ratings1  
Parameter  
Symbol  
Test Condition  
Value  
–0.5 to 3.8  
–55 to 150  
2.5  
Unit  
V
DC Supply Voltage  
V
DD  
Storage Temperature Range  
ESD Tolerance  
T
°C  
kV  
STG  
HBM  
(100 pF, 1.5 k)  
ESD Tolerance  
CDM  
MM  
550  
175  
V
V
ESD Tolerance  
Latch-up Tolerance  
Junction Temperature  
Peak Soldering Reflow Temperature  
Notes:  
JESD78 Compliant  
T
150  
260  
°C  
°C  
J
2
1. Permanent device damage may occur if the absolute maximum ratings are exceeded. Functional operation should be  
restricted to the conditions as specified in the operational sections of this data sheet. Exposure to absolute maximum  
rating conditions for extended periods may affect device reliability.  
2. Refer to JEDEC J-STD-020 standard for more information.  
4
Rev. 1.6  
 
 
 
Si5338  
Table 3. DC Characteristics  
(VDD = 1.8 V –5% to +10%, 2.5 V ±10%, or 3.3 V ±10%, TA = –40 to 85 °C)  
Parameter  
Symbol  
Test Condition  
Min  
Typ  
Max  
Unit  
100 MHz on all outputs,  
25 MHz refclk  
I
45  
60  
mA  
Core Supply Current  
DD  
Core Supply Current  
(Buffer Mode)  
I
50 MHz refclk  
12  
mA  
DDB  
LVPECL, 710 MHz  
LVDS, 710 MHz  
30  
8
mA  
mA  
HCSL, 250 MHz  
2 pF load  
20  
mA  
CML, 350 MHz  
SSTL, 350 MHz  
CMOS, 50 MHz  
12  
mA  
mA  
19  
6
9
mA  
mA  
mA  
1
I
Output Buffer Supply Current  
DDOx  
15 pF load  
1,2  
CMOS, 200 MHz  
13  
10  
18  
14  
3.3 V VDD0  
1,2  
CMOS, 200 MHz  
2.5 V  
1,2  
CMOS, 200 MHz  
7
10  
19  
mA  
mA  
1.8 V  
HSTL, 350 MHz  
Notes:  
1. Single CMOS driver active.  
2. Measured into a 5” 50 trace with 2 pF load.  
Table 4. Thermal Characteristics  
Parameter  
Symbol  
Test Condition  
Value  
Unit  
Thermal Resistance  
Junction to Ambient  
Still Air  
37  
°C/W  
JA  
Thermal Resistance  
Junction to Case  
Still Air  
10  
°C/W  
JC  
Rev. 1.6  
5
 
 
 
Si5338  
Table 5. Performance Characteristics  
(VDD = 1.8 V –5% to +10%, 2.5 V ±10%, or 3.3 V ±10%, TA = –40 to 85 °C)  
Parameter  
PLL Acquisition Time  
PLL Tracking Range  
PLL Loop Bandwidth  
Symbol  
Test Condition  
Min  
Typ  
Max  
25  
Unit  
ms  
t
ACQ  
f
5000 20000  
ppm  
MHz  
ppb  
TRACK  
f
0
1.6  
0
BW  
MultiSynth Frequency  
Synthesis Resolution  
f
Output frequency < Fvco/8  
1
RES  
CLKIN Loss of Signal Detect  
Time  
t
2.6  
0.2  
5
1
µs  
µs  
LOS  
CLKIN Loss of Signal Release  
Time  
t
0.01  
LOSRLS  
PLL Loss of Lock Detect Time  
t
5
10  
2
ms  
ms  
LOL  
POR to Output Clock Valid  
(Pre-programmed Devices)  
t
RDY  
Input-to-Output Propagation  
Delay  
t
Buffer Mode  
(PLL Bypass)  
2.5  
4
ns  
PROP  
1
Rn divider = 1  
100  
15  
ps  
ms  
ns  
Output-Output Skew  
t
DSKEW  
2
POR to I C Ready  
Programmable Initial  
Phase Offset  
–45  
+45  
P
OFFSET  
Phase Increment/Decrement  
Accuracy  
P
–45  
5
20  
+45  
ps  
ns  
STEP  
Phase Increment/Decrement  
Range  
P
RANGE  
2
MultiSynth range for phase  
increment/decrement  
f
Fvco/8  
MHz  
ns  
PRANGE  
2,3  
Phase Increment/Decrement  
Update Time  
P
Pin control  
667  
UPDATE  
MultiSynth output >18 MHz  
Notes:  
1. Outputs at integer-related frequencies and using the same driver format. See "3.10.3. Programmable Initial Phase  
Offset" on page 27.  
2. The maximum step size is only limited by the register lengths; however, the MultiSynth output frequency must be kept  
between 5 MHz and Fvco/8.  
3. Update rate via I2C is also limited by the time it takes to perform a write operation.  
4. Default value is 0.5% down spread.  
5. Default value is ~31.5 kHz.  
6
Rev. 1.6  
 
 
 
 
Si5338  
Table 5. Performance Characteristics (Continued)  
(VDD = 1.8 V –5% to +10%, 2.5 V ±10%, or 3.3 V ±10%, TA = –40 to 85 °C)  
Parameter  
Symbol  
P
Test Condition  
Min  
Typ  
Max  
Unit  
2,3  
Phase Increment/Decrement  
Update Time  
Pin control  
10  
12  
Periods  
UPDATE  
MultiSynth output <18 MHz  
Number of periods of  
MultiSynth output frequency  
Frequency Increment/  
Decrement Step Size  
f
R divider not used  
1
5
10  
See  
Note  
ppm  
MHz  
STEP  
2
MultiSynth range for frequency  
increment/decrement  
f
R divider not used  
Fvco/8  
667  
RANGE  
UPDATE  
UPDATE  
2,3  
Frequency Increment/  
Decrement Update Time  
f
f
Pin control  
ns  
MultiSynth output >18 MHz  
2,3  
Frequency Increment/  
Pin control  
12  
Periods  
Decrement Update Time  
MultiSynth output <18 MHz  
Number of periods of  
MultiSynth output frequency  
4
Spread Spectrum PP  
Frequency Deviation  
SS  
SS  
MultiSynth Output < ~Fvco/8  
0.1  
30  
5.0  
%
DEV  
DEV  
5
Spread Spectrum Modulation  
Rate  
MultiSynth Output < ~Fvco/8  
63  
kHz  
Notes:  
1. Outputs at integer-related frequencies and using the same driver format. See "3.10.3. Programmable Initial Phase  
Offset" on page 27.  
2. The maximum step size is only limited by the register lengths; however, the MultiSynth output frequency must be kept  
between 5 MHz and Fvco/8.  
3. Update rate via I2C is also limited by the time it takes to perform a write operation.  
4. Default value is 0.5% down spread.  
5. Default value is ~31.5 kHz.  
Rev. 1.6  
7
Si5338  
Table 6. Input and Output Clock Characteristics  
(VDD = 1.8 V –5% to +10%, 2.5 V ±10%, or 3.3 V ±10%, TA = –40 to 85 °C)  
Parameter  
Symbol  
Test Condition  
Min  
Typ  
Max  
Unit  
1
Input Clock (AC Coupled Differential Input Clocks on Pins IN1/2, IN5/6)  
Frequency  
f
5
710  
2.4  
MHz  
IN  
Differential Voltage  
Swing  
V
710 MHz input  
0.4  
V
PP  
PP  
2
Rise/Fall Time  
t /t  
20%–80%  
< 1 ns tr/tf  
< 1 ns tr/tf  
40  
45  
1.0  
60  
55  
ns  
R F  
Duty Cycle  
Duty Cycle  
DC  
%
%
DC  
3
(PLL bypass)  
1
Input Impedance  
R
10  
k  
IN  
Input Capacitance  
C
3.5  
pF  
IN  
Input Clock (DC-Coupled Single-Ended Input Clock on Pins IN3/4)  
Frequency  
f
CMOS  
5
–0.1  
0.8  
2.0  
200  
MHz  
V
IN  
Input Voltage  
V
3.73  
I
Input Voltage Swing  
200 MHz  
10%–90%  
20%–80%  
< 4 ns tr/tf  
VDD+10%  
Vpp  
ns  
4
Rise/Fall Time  
t /t  
4
R F  
4
Rise/Fall Time  
t /t  
2.3  
60  
ns  
R F  
5
Duty Cycle  
DC  
40  
%
Input Capacitance  
C
pF  
IN  
Output Clocks (Differential)  
6
Frequency  
f
LVPECL, LVDS,  
CML  
0.16  
367  
550  
0.16  
350  
473.33  
710  
MHz  
MHz  
MHz  
MHz  
OUT  
HCSL  
250  
Notes:  
1. Use an external 100 resistor to provide load termination for a differential clock. See Figure 3.  
2. For best jitter performance, keep the midpoint differential input slew rate on pins 1,2,5,6 faster than 0.3 V/ns.  
3. Minimum input frequency in clock buffer mode (PLL bypass) is 5 MHz. Operation to 1 MHz is also supported in buffer  
mode, but loss-of-signal (LOS) status is not functional.  
4. For best jitter performance, keep the mid point input single ended slew rate on pins 3 or 4 faster than 1 V/ns.  
5. Not in PLL bypass mode.  
6. Only two unique frequencies above 350 MHz can be simultaneously output, Fvco/4 and Fvco/6. See "3.3. Synthesis  
Stages" on page 19.  
7. CML output format requires ac-coupling of the differential outputs to a differential 100 load at the receiver.  
8. Includes effect of internal series 22 resistor.  
8
Rev. 1.6  
 
 
 
 
 
 
 
 
 
Si5338  
Table 6. Input and Output Clock Characteristics (Continued)  
(VDD = 1.8 V –5% to +10%, 2.5 V ±10%, or 3.3 V ±10%, TA = –40 to 85 °C)  
Parameter  
Symbol  
Test Condition  
Min  
Typ  
Max  
Unit  
LVPECL Output  
Voltage  
V
common mode  
V
V
OC  
DDO  
1.45 V  
V
V
peak-to-peak sin-  
gle-ended swing  
0.55  
0.8  
0.96  
V
PP  
SEPP  
LVDS Output Voltage  
(2.5/3.3 V)  
V
common mode  
1.125  
0.25  
1.2  
1.275  
0.45  
V
OC  
Peak-to-Peak  
Single-Ended  
Swing  
0.35  
V
PP  
SEPP  
LVDS Output  
Voltage (1.8 V)  
V
Common Mode  
0.8  
0.875  
0.35  
0.95  
0.45  
V
OC  
V
V
V
Peak-to-Peak  
Single-Ended  
Swing  
0.25  
V
PP  
SEPP  
HCSL Output Voltage  
CML Output Voltage  
Rise/Fall Time  
V
Common Mode  
0.35  
0.375  
0.725  
0.400  
0.85  
V
OC  
Peak-to-Peak  
Single-Ended  
Swing  
0.575  
V
PP  
SEPP  
7
V
Common Mode  
See Note  
0.860  
V
OC  
Peak-to-Peak  
Single-Ended  
Swing  
0.67  
1.07  
V
PP  
SEPP  
t /t  
20%–80%  
450  
55  
ps  
R F  
5
Duty Cycle  
DC  
45  
%
Output Clocks (Single-Ended)  
Frequency  
f
CMOS  
SSTL, HSTL  
2 pF load  
0.16  
0.16  
200  
350  
0.85  
MHz  
MHz  
ns  
OUT  
CMOS 20%–80%  
Rise/Fall Time  
t /t  
0.45  
R F  
CMOS 20%–80%  
Rise/Fall Time  
t /t  
15 pF load  
2.0  
ns  
R F  
Notes:  
1. Use an external 100 resistor to provide load termination for a differential clock. See Figure 3.  
2. For best jitter performance, keep the midpoint differential input slew rate on pins 1,2,5,6 faster than 0.3 V/ns.  
3. Minimum input frequency in clock buffer mode (PLL bypass) is 5 MHz. Operation to 1 MHz is also supported in buffer  
mode, but loss-of-signal (LOS) status is not functional.  
4. For best jitter performance, keep the mid point input single ended slew rate on pins 3 or 4 faster than 1 V/ns.  
5. Not in PLL bypass mode.  
6. Only two unique frequencies above 350 MHz can be simultaneously output, Fvco/4 and Fvco/6. See "3.3. Synthesis  
Stages" on page 19.  
7. CML output format requires ac-coupling of the differential outputs to a differential 100 load at the receiver.  
8. Includes effect of internal series 22 resistor.  
Rev. 1.6  
9
Si5338  
Table 6. Input and Output Clock Characteristics (Continued)  
(VDD = 1.8 V –5% to +10%, 2.5 V ±10%, or 3.3 V ±10%, TA = –40 to 85 °C)  
Parameter  
Symbol  
Test Condition  
Min  
Typ  
Max  
Unit  
CMOS Output  
Resistance  
50  
SSTL Output  
Resistance  
50  
50  
HSTL Output  
Resistance  
CMOS Output Volt-  
age  
V
4 mA load  
4 mA load  
VDDO – 0.3  
V
V
V
V
OH  
8
V
0.3  
OL  
SSTL Output Voltage  
V
SSTL-3  
VDDOx = 2.97 to  
3.63 V  
0.45xVDDO+0.41  
OH  
V
0.45xVDDO  
–0.41  
OL  
V
SSTL-2  
VDDOx = 2.25 to  
2.75 V  
0.5xVDDO+0.41  
V
V
OH  
V
0.5xVDDO–  
0.41  
OL  
V
SSTL-18  
VDDOx = 1.71 to  
1.98 V  
0.5xVDDO+0.34  
V
V
OH  
V
0.5xVDDO–  
0.34  
OL  
HSTL Output Voltage  
V
VDDO = 1.4 to  
1.6 V  
0.5xVDDO+0.3  
V
V
OH  
V
0.5xVDDO –  
0.3  
OL  
5
Duty Cycle  
DC  
45  
55  
%
Notes:  
1. Use an external 100 resistor to provide load termination for a differential clock. See Figure 3.  
2. For best jitter performance, keep the midpoint differential input slew rate on pins 1,2,5,6 faster than 0.3 V/ns.  
3. Minimum input frequency in clock buffer mode (PLL bypass) is 5 MHz. Operation to 1 MHz is also supported in buffer  
mode, but loss-of-signal (LOS) status is not functional.  
4. For best jitter performance, keep the mid point input single ended slew rate on pins 3 or 4 faster than 1 V/ns.  
5. Not in PLL bypass mode.  
6. Only two unique frequencies above 350 MHz can be simultaneously output, Fvco/4 and Fvco/6. See "3.3. Synthesis  
Stages" on page 19.  
7. CML output format requires ac-coupling of the differential outputs to a differential 100 load at the receiver.  
8. Includes effect of internal series 22 resistor.  
10  
Rev. 1.6  
Si5338  
Table 7. Control Pins  
(VDD = 1.8 V –5% to +10%, 2.5 V ±10%, or 3.3 V ±10%, TA = –40 to 85 °C)  
Parameter  
Symbol  
Condition  
Min  
Typ  
Max  
Unit  
Input Control Pins (IN3, IN4)  
V
–0.1  
0.7 x V  
20  
0.3 x V  
3.73  
4
V
V
Input Voltage Low  
IL  
DD  
V
Input Voltage High  
Input Capacitance  
IH  
DD  
C
pF  
k  
IN  
R
Input Resistance  
IN  
Output Control Pins (INTR)  
V
I
= 3 mA  
0
0.4  
10  
V
Output Voltage Low  
OL  
SINK  
t /t  
C < 10 pf, pull up 1 k  
ns  
Rise/Fall Time 20–80%  
R F  
L
Table 8. Crystal Specifications for 8 to 11 MHz  
Parameter  
Symbol  
Min  
Typ  
Max  
Unit  
Crystal Frequency  
f
8
11  
MHz  
XTAL  
c (supported)*  
11  
12  
13  
pF  
L
Load Capacitance (on-chip differential)  
c (recommended)  
17  
18  
19  
6
pF  
pF  
L
Crystal Output Capacitance  
Equivalent Series Resistance  
Crystal Max Drive Level  
c
O
r
300  
ESR  
d
100  
µW  
L
*Note: See "AN360: Crystal Selection Guide for Si533x and Si5355/56 Devices" for how to adjust the registers to  
accommodate a 12 pF crystal CL.  
Table 9. Crystal Specifications for 11 to 19 MHz  
Parameter  
Symbol  
Min  
Typ  
Max  
Unit  
Crystal Frequency  
f
11  
19  
MHz  
XTAL  
c (supported)*  
11  
12  
13  
pF  
L
Load Capacitance (on-chip differential)  
c (recommended)  
17  
18  
19  
5
pF  
pF  
L
Crystal Output Capacitance  
Equivalent Series Resistance  
Crystal Max Drive Level  
c
O
r
200  
ESR  
d
100  
µW  
L
*Note: See "AN360: Crystal Selection Guide for Si533x and Si5355/56 Devices" for how to adjust the registers to  
accommodate a 12 pF crystal CL.  
Rev. 1.6  
11  
 
Si5338  
Table 10. Crystal Specifications for 19 to 26 MHz  
Parameter  
Symbol  
Min  
Typ  
Max  
Unit  
Crystal Frequency  
f
19  
26  
MHz  
XTAL  
c (supported)*  
11  
17  
12  
18  
13  
pF  
L
Load Capacitance (on-chip differential)  
c (recommended)  
19  
5
pF  
pF  
L
Crystal Output Capacitance  
Equivalent Series Resistance  
Crystal Max Drive Level  
c
O
r
100  
ESR  
d
100  
µW  
L
*Note: See "AN360: Crystal Selection Guide for Si533x and Si5355/56 Devices" for how to adjust the registers to  
accommodate a 12 pF crystal CL.  
Table 11. Crystal Specifications for 26 to 30 MHz  
Parameter  
Symbol  
Min  
Typ  
Max  
Unit  
Crystal Frequency  
f
26  
30  
MHz  
XTAL  
c (supported)*  
11  
17  
12  
18  
13  
pF  
L
Load Capacitance (on-chip differential)  
c (recommended)  
19  
5
pF  
pF  
L
Crystal Output Capacitance  
Equivalent Series Resistance  
Crystal Max Drive Level  
c
O
r
75  
ESR  
d
100  
µW  
L
*Note: See "AN360: Crystal Selection Guide for Si533x and Si5355/56 Devices" for how to adjust the registers to  
accommodate a 12 pF crystal CL.  
12  
Rev. 1.6  
 
Si5338  
Table 12. Jitter Specifications1,2,3  
(VDD = 1.8 V –5% to +10%, 2.5 V ±10%, or 3.3 V ±10%, TA = –40 to 85 °C)  
Parameter  
Symbol  
Test Condition  
Min  
Typ  
Max  
Unit  
GbE Random Jitter  
(12 kHz–20 MHz)  
CLKIN = 25 MHz  
All CLKn at 125 MHz  
J
0.7  
1
ps RMS  
GbE  
4
5
5
GbE Random Jitter  
(1.875–20 MHz)  
CLKIN = 25 MHz  
All CLKn at 125 MHz  
R
0.38  
0.7  
0.79  
ps RMS  
ps RMS  
JGbE  
CLKIN = 19.44 MHz  
All CLKn at  
OC-12 Random Jitter  
(12 kHz–5 MHz)  
J
1
OC12  
5
155.52 MHz  
PCI Express 1.1 Common  
Clocked  
6
Total Jitter  
20.1  
0.15  
0.58  
0.15  
33.6  
1.47  
0.75  
0.45  
ps pk-pk  
ps RMS  
ps RMS  
ps RMS  
6
RMS Jitter , 10 kHz to  
1.5 MHz  
PCI Express 2.1 Common  
Clocked  
6
RMS Jitter , 1.5 MHz to  
50 MHz  
PCI Express 3.0 Common  
Clocked  
6
RMS Jitter  
PLL BW of 2–4 or  
2–5 MHz,  
CDR = 10 MHz  
PCIe Gen 3 Separate  
Reference No Spread,  
SRNS  
0.11  
0.32  
ps RMS  
PLL BW of 2–4 or  
2–5 MHz,  
CDR = 10 MHz  
PCIe Gen 4,  
Common Clock  
0.15  
10  
0.45  
30  
ps RMS  
ps pk-pk  
7
J
Period Jitter  
N = 10,000 cycles  
PER  
Notes:  
1. All jitter measurements apply for LVDS/HCSL/LVPECL/CML output format with a low noise differential input clock and  
are made with an Agilent 90804 oscilloscope. All RJ measurements use RJ/DJ separation.  
2. For best jitter performance, keep the single ended clock input slew rates at Pins 3 and 4 more than 1.0 V/ns and the  
differential clock input slew rates more than 0.3 V/ns.  
3. All jitter data in this table is based upon all output formats being differential. When single-ended outputs are used, there  
is the potential that the output jitter may increase due to the nature of single-ended outputs. If your configuration  
implements any single-ended output and any output is required to have jitter less than 3 ps rms, contact Silicon Labs  
for support to validate your configuration and ensure the best jitter performance. In many configurations, CMOS  
outputs have little to no effect upon jitter.  
4. DJ for PCI and GbE is < 5 ps pp  
5. Output MultiSynth in Integer mode.  
6. All output clocks 100 MHz HCSL format. Jitter is from the PCIE jitter filter combination that produces the highest jitter.  
See AN562 for details. Jitter is measured with the Intel Clock Jitter Tool, Ver. 1.6.4.  
7. Input frequency to the Phase Detector between 25 and 40 MHz and any output frequency > 5 MHz.  
8. Measured in accordance with JEDEC standard 65.  
9. Rj is multiplied by 14; estimate the pp jitter from Rj over 212 rising edges.  
10. Gen 4 specifications based on the PCI-Express Base Specification 4.0 rev. 0.5.  
11. Download the Silicon Labs PCIe Clock Jitter Tool at www.silabs.com/pcie-learningcenter.  
Rev. 1.6  
13  
 
 
 
 
 
 
 
 
 
Si5338  
Table 12. Jitter Specifications1,2,3 (Continued)  
(VDD = 1.8 V –5% to +10%, 2.5 V ±10%, or 3.3 V ±10%, TA = –40 to 85 °C)  
Parameter  
Symbol  
Test Condition  
Min  
Typ  
Max  
Unit  
N = 10,000 cycles  
Output MultiSynth  
operated in integer or  
8
J
9
29  
ps pk  
Cycle-Cycle Jitter  
CC  
7
fractional mode  
Output and feedback  
MultiSynth in integer or  
fractional mode  
Random Jitter  
(12 kHz–20 MHz)  
R
0.7  
3
1.5  
15  
ps RMS  
ps pk-pk  
J
7
Output MultiSynth  
operated in fractional  
7
mode  
D
Deterministic Jitter  
J
Output MultiSynth  
operated in integer  
2
10  
ps pk-pk  
7
mode  
Output MultiSynth  
13  
12  
36  
20  
ps pk-pk  
ps pk-pk  
operated in fractional  
7
mode  
T = D +14xR  
J
(See Note )  
Total Jitter  
(12 kHz–20 MHz)  
J
J
9
Output MultiSynth  
operated in integer  
7
mode  
Notes:  
1. All jitter measurements apply for LVDS/HCSL/LVPECL/CML output format with a low noise differential input clock and  
are made with an Agilent 90804 oscilloscope. All RJ measurements use RJ/DJ separation.  
2. For best jitter performance, keep the single ended clock input slew rates at Pins 3 and 4 more than 1.0 V/ns and the  
differential clock input slew rates more than 0.3 V/ns.  
3. All jitter data in this table is based upon all output formats being differential. When single-ended outputs are used, there  
is the potential that the output jitter may increase due to the nature of single-ended outputs. If your configuration  
implements any single-ended output and any output is required to have jitter less than 3 ps rms, contact Silicon Labs  
for support to validate your configuration and ensure the best jitter performance. In many configurations, CMOS  
outputs have little to no effect upon jitter.  
4. DJ for PCI and GbE is < 5 ps pp  
5. Output MultiSynth in Integer mode.  
6. All output clocks 100 MHz HCSL format. Jitter is from the PCIE jitter filter combination that produces the highest jitter.  
See AN562 for details. Jitter is measured with the Intel Clock Jitter Tool, Ver. 1.6.4.  
7. Input frequency to the Phase Detector between 25 and 40 MHz and any output frequency > 5 MHz.  
8. Measured in accordance with JEDEC standard 65.  
9. Rj is multiplied by 14; estimate the pp jitter from Rj over 212 rising edges.  
10. Gen 4 specifications based on the PCI-Express Base Specification 4.0 rev. 0.5.  
11. Download the Silicon Labs PCIe Clock Jitter Tool at www.silabs.com/pcie-learningcenter.  
14  
Rev. 1.6  
Si5338  
Table 13. Jitter Specifications, Clock Buffer Mode (PLL Bypass)*  
(VDD = 1.8 V –5% to +10%, 2.5 V ±10%, or 3.3 V ±10%, TA = –40 to 85 °C)  
Parameter  
Symbol  
Test Condition  
Min  
Typ  
Max  
Unit  
0.7 V pk-pk differential input  
clock at 622.08 MHz with  
70 ps rise/fall time  
Additive Phase Jitter  
(12 kHz–20 MHz)  
0.165  
ps RMS  
t
RPHASE  
0.7 V pk-pk differential input  
clock at 622.08 MHz with  
70 ps rise/fall time  
Additive Phase Jitter  
(50 kHz–80 MHz)  
0.225  
ps RMS  
t
RPHASEWB  
*Note: All outputs are in Clock Buffer mode (PLL Bypass).  
Table 14. Typical Phase Noise Performance  
Offset Frequency  
25 MHz XTAL  
to 156.25 MHz  
27 MHz Ref In  
to 148.3517 MHz  
19.44 MHz Ref In  
to 155.52 MHz  
Units  
100 Hz  
1 kHz  
–90  
–87  
–110  
–116  
–123  
–128  
–128  
–145  
dBc/Hz  
dBc/Hz  
dBc/Hz  
dBc/Hz  
dBc/Hz  
dBc/Hz  
–120  
–126  
–132  
–132  
–145  
–117  
–123  
–130  
–132  
–145  
10 kHz  
100 kHz  
1 MHz  
10 MHz  
Rev. 1.6  
15  
 
Si5338  
Table 15. I2C Specifications (SCL,SDA)1  
Parameter  
Symbol  
Test Condition  
Standard Mode  
Fast Mode  
Min Max  
–0.5 0.3 x V  
DDI2C  
Unit  
Min  
Max  
2
LOW Level  
Input Voltage  
V
–0.5  
0.3 x V  
V
V
V
ILI2C  
DDI2  
C
2
HIGH Level  
Input Voltage  
V
0.7 x V  
3.63  
N/A  
0.7 x V  
3.63  
IHI2C  
DDI2  
DDI2C  
C
Hysteresis of  
Schmitt Trigger  
Inputs  
V
N/A  
0.1  
HYS  
2
2
LOW Level Out- V  
put Voltage  
(open drain or  
open collector)  
at 3 mA Sink  
Current  
V
= 2.5/3.3 V  
0
0.4  
0
0
0.4  
V
V
OLI2C  
DDI2C  
2
V
= 1.8 V  
N/A  
N/A  
0.2 x V  
DDI2C  
DDI2C  
Input Current  
I
–10  
10  
4
–10  
10  
4
µA  
pF  
I2C  
Capacitance for  
each I/O Pin  
C
V
= –0.1 to V  
IN DDI2C  
I2C  
2
I C Bus Time-  
Timeout Enabled  
Standard Mode  
25  
35  
25  
35  
ms  
out  
Data Rate  
100  
400  
kbps  
Hold Time  
(Repeated)  
START  
t
4.0  
0.6  
s  
HD:STA  
Condition  
Set-Up Time for  
a Repeated  
START Condi-  
tion  
t
4.7  
0.6  
s  
SU:STA  
Data Hold  
Time  
t
100  
250  
100  
150  
ns  
ns  
HD:DAT  
3,4  
Data Set-Up  
Time  
t
SU:DAT  
Notes:  
1. Refer to NXP’s UM10204 I2C-bus specification and user manual, Revision 03, for further details:  
www.nxp.com/acrobat_download/usermanuals/UM10204_3.pdf.  
2. I2C pullup voltages (VDDI2C) of 1.71 to 3.63 V are supported. Must write register 27[7] = 1 if the I2C bus voltage is less  
than 2.5 V to maintain compatibility with the I2C bus standard.  
3. Hold time is defined as the time that data should hold its logical value after clock has transitioned to a logic low.  
4. Guaranteed by characterization.  
16  
Rev. 1.6  
 
 
 
Si5338  
2. Typical Application Circuits  
+3.3 V  
SD/HD/3G-SDI  
Video/Audio  
0.1 uF Power Supply  
Decoupling Capacitors  
(1 per VDD or VDDOx pin)  
Format Converter  
7
24 20 16 15 11  
SD/HD/3G  
SDI OUT  
SD/HD/3G  
SDI IN  
SDI  
Deserializer  
Video  
Processor  
SDI  
Serializer  
1
2
Optional XTAL for  
Free-run Applications  
27 MHz  
XTAL  
IN1  
IN2  
3
100 MHz  
100  
22  
27 MHz  
74.25 MHz  
74.25/1.001 MHz  
148.5 MHz  
148.5/1.001 MHz  
IN3  
IN5  
Single-ended or  
CLK0A  
CLK0B  
21 x  
Differential Inputs  
for Synchronous  
Applications  
5
74.25 MHz, 74.25/1.001 MHz  
148.5 MHz, 148.5/1.001 MHz  
Si5338C  
100  
18  
17  
6
CLK1A  
CLK1B  
IN6  
Audio Out  
+3.3 V  
14 x  
13 x  
Audio  
Processor  
CLK2A  
CLK2B  
N3  
1k  
1k  
1k  
8
19  
12  
24.576 MHz / 6.144 MHz  
10  
INTR  
SDA  
SCL  
CLK3A  
CLK3B  
I2C Bus  
9
x
4
I2C Address = 111 0000 or 111 0001  
I2C_LSB  
PAD  
PAD  
23  
23  
Storage Area  
Network  
+3.3 V  
disk  
disk  
disk  
disk  
0.1 uF Power Supply  
Decoupling Capacitors  
(1 per VDD or VDDOx pin)  
SAS2  
4/8 Port  
Controller  
Ethernet  
Fiber  
Channel  
7
24 20 16 15 11  
PCIe  
Switch  
SAS2  
4/8 Port  
Controller  
1
25 MHz  
XTAL  
IN1  
IN2  
2
3
22  
21  
IN3  
IN5  
IN6  
37.5/75/120/150 MHz  
CLK0A  
5
CLK0B  
x
Si5338C  
6
18  
100 MHz  
CLK1A  
CLK1B  
17 x  
14  
Network  
Processor  
+3.3V  
66 MHz  
CLK2A  
CLK2B  
13 x  
1k  
1k  
1k  
8
19  
12  
10  
106.25 MHz  
INTR  
SDA  
SCL  
CLK3A  
CLK3B  
I2C Bus  
9
x
4
I2C Address = 111 0000 or 111 0001  
I2C_LSB  
PAD  
PAD  
23  
23  
Rev. 1.6  
17  
Si5338  
3. Functional Description  
VDD  
Output  
Stage  
Synthesis  
Stage 1  
(PLL)  
Input  
Stage  
Synthesis  
Stage 2  
Osc  
VDDO0  
CLK0A  
CLK0B  
MultiSynth  
÷M0  
÷R0  
÷R1  
÷R2  
÷R3  
CLKIN  
IN1  
IN2  
ref  
fb  
÷P1  
VDDO1  
CLK1A  
IN3  
Loop  
Filter  
VCO  
Phase  
MultiSynth  
÷M1  
Frequency  
Detector  
FDBK  
÷P2  
CLK1B  
IN4  
IN5  
IN6  
VDDO2  
CLK2A  
CLK2B  
MultiSynth  
÷M2  
MultiSynth  
÷N  
Control & Memory  
VDDO3  
CLK3A  
OEB/PINC/FINC  
MultiSynth  
÷M3  
I2C_LSB/PDEC/FDEC  
NVM  
(OTP)  
CLK3B  
Control  
RAM  
SCL  
SDA  
INTR  
Figure 1. Si5338 Block Diagram  
3.1. Overview  
The Si5338 is a high-performance, low-jitter clock A zero-delay mode is also available to help minimize  
generator capable of synthesizing four independent input-to-output delay. Spread spectrum is available on  
user-programmable clock frequencies up to 350 MHz each of the clock outputs for EMI-sensitive applications,  
and select frequencies up to 710 MHz. The device such as PCI Express.  
supports free-run operation using an external crystal, or  
it can lock to an external clock for generating  
synchronous clocks. The output drivers support four  
Configuration and control of the Si5338 is mainly  
handled through the I C/SMBus interface. Some  
features, such as output enable and frequency or phase  
2
differential clocks or eight single-ended clocks or a  
adjustments, can optionally be pin controlled. The  
combination of both. The output drivers are configurable  
device has a maskable interrupt pin that can be  
to support common signal formats, such as LVPECL,  
monitored for loss of lock or loss of input signal  
LVDS, HCSL, CMOS, HSTL, and SSTL. Separate  
conditions.  
output supply pins allow supply voltages of 3.3, 2.5, 1.8,  
The device also provides the option of storing a user-  
and 1.5 V to support the multi-format output driver. The  
definable clock configuration in its non-volatile memory  
core voltage supply accepts 3.3, 2.5, or 1.8 V and is  
(NVM), which becomes the default clock configuration  
independent from the output supplies.  
at power-up.  
Using its two-stage synthesis architecture and patented  
3.1.1. ClockBuilder™ Desktop Software  
high-resolution MultiSynth technology, the Si5338 can  
To simplify device configuration, Silicon Labs provides  
generate four independent frequencies from a single  
ClockBuilder Desktop software, which can operate  
input frequency. In addition to clock generation, the  
stand alone or in conjunction with the Si5338 EVB.  
inputs can bypass the synthesis stage enabling the  
When the software is connected to an Si5338 EVB it will  
Si5338 to be used as a high-performance clock buffer or  
control both the supply voltages to the Si5338 as well as  
a combination of a buffer and generator.  
the entire clock path within the Si5338. Clockbuilder  
Desktop can also measure the current delivered by the  
EVB regulators to each supply voltage of the Si5338. A  
For applications that need fine frequency adjustments,  
such as clock margining, each of the synthesized  
frequencies can be incremented or decremented in  
user-defined steps as low as 1 ppm per step.  
Si5338 configuration can be written to a text file to be  
2
used by any system to configure the Si5338 via I C.  
Output-to-output phase delays are also adjustable in  
user-defined steps with an error of <20 ps to  
compensate for PCB trace delays or for fine tuning of  
setup and hold margins.  
ClockBuilder Desktop can be downloaded from  
www.silabs.com/ClockBuilder and runs on Windows XP,  
Windows Vista, and Windows 7.  
18  
Rev. 1.6  
 
Si5338  
IN3 and IN4 accept single-ended signals from 5 MHz to  
200 MHz. The single-ended inputs are internally ac-  
coupled; so, they can accept a wide variety of signals  
without requiring a specific dc level. The input signal  
only needs to meet a minimum voltage swing and must  
not exceed a maximum VIH or a minimum VIL. Refer to  
Table 6 for signal voltage limits. A typical single-ended  
connection is shown in Figure 3. For additional  
termination options, refer to “AN408: Termination  
Options for Any-Frequency, Any-Output Clock  
Generators and Clock Buffers—Si5338, Si5334,  
Si5330”.  
3.2. Input Stage  
The input stage supports four inputs. Two are used as  
the clock inputs to the synthesis stage, and the other  
two are used as feedback inputs for zero delay or  
external feedback mode. In cases where external  
feedback is not required, all four inputs are available to  
the synthesis stage. The reference selector selects one  
of the inputs as the reference to the synthesis stage.  
The input configuration is selectable through the I C  
interface. The input MUXes are set automatically in  
ClockBuilder Desktop (see “3.1.1. ClockBuilder™  
Desktop Software”). For information on setting the input  
MUXs manually, see the Si5338 Reference Manual:  
Configuring the Si5338 without ClockBuilder Desktop.  
For free-run operation, the internal oscillator can  
operate from a low-frequency fundamental mode crystal  
(XTAL) with a resonant frequency between 8 and  
30 MHz. A crystal can easily be connected to pins IN1  
and IN2 without external components as shown in  
Figure 4. See Tables 8–11 for crystal specifications that  
are guaranteed to work with the Si5338.  
Osc  
noclk  
P1DIV_IN  
÷P1  
IN1  
IN2  
IN3  
IN1  
To synthesis stage  
or output selectors  
XTAL  
P2DIV_IN  
÷P2  
Osc  
IN4  
IN5  
IN6  
IN2  
noclk  
Figure 4. Connecting an XTAL to the Si5338  
Figure 2. Input Stage  
Refer to “AN360: Crystal Selection Guide for Si533x/5x  
Devices” for information on the crystal selection.  
IN1/IN2 and IN5/IN6 are differential inputs capable of  
accepting clock rates from 5 to 710 MHz. The  
differential inputs are capable of interfacing to multiple  
signals, such as LVPECL, LVDS, HSCT, HCSL, and  
CML. Differential signals must be ac-coupled as shown  
in Figure 3. A termination resistor of 100 placed close  
to the input pins is also required. Refer to Table 6 for  
signal voltage limits.  
3.2.1. Loss-of-Signal (LOS) Alarm Detectors  
There are two LOS detectors: LOS_CLKIN and  
LOS_FDBK. These detectors are tied to the outputs of  
the P1 and P2 frequency dividers, which are always  
enabled. See "3.6. Status Indicators" on page 24 for  
details on the alarm indicators. These alarms are used  
during programming to ensure that a valid input clock is  
detected. The input MUXs are set automatically in  
ClockBuilder Desktop (see the Si5338 Reference  
Manual to set manually).  
0.1 uF  
50  
IN1 / IN5  
IN2 / IN6  
100  
3.3. Synthesis Stages  
50  
Next-generation timing applications require a wide  
range of frequencies that are often non-integer related.  
Traditional clock architectures address this by using  
multiple single PLL ICs, often at the expense of BOM  
complexity and power. The Si5338 uses patented  
MultiSynth technology to dramatically simplify timing  
architectures by integrating the frequency synthesis  
capability of four Phase-Locked Loops (PLLs) in a  
single device, greatly reducing size and power  
requirements versus traditional solutions.  
0.1 uF  
Rs  
50  
IN3 / IN4  
Figure 3. Interfacing Differential and Single-  
Ended Signals to the Si5338  
Rev. 1.6  
19  
 
 
 
 
Si5338  
Synthesis of the output clocks is performed in two The second stage of synthesis consists of the output  
stages, as shown in Figure 5. The first stage consists of MultiSynth dividers (MS ). Based on a fractional N  
x
a high-frequency analog phase-locked loop (PLL) that divider, the MultiSynth divider shown in Figure 6  
multiplies the input stage to a frequency within the switches seamlessly between the two closest integer  
range of 2.2 to 2.84 GHz. Multiplication of the input divider values to produce the exact output clock  
frequency is accomplished using a proprietary and frequency with 0 ppm error.  
highly precise MultiSynth feedback divider (N), which  
allows the PLL to generate any frequency within its  
MultiSynth block calculates the relative phase difference  
VCO range with much less jitter than typical fractional N  
To eliminate phase error generated by this process, the  
between the clock produced by the fractional-N divider  
and the desired output clock and dynamically adjusts  
PLL.  
the phase to match the ideal clock waveform. This novel  
approach makes it possible to generate any output  
clock frequency without sacrificing jitter performance.  
Synthesis  
Stage 2  
Synthesis  
Stage 1  
(APLL)  
MultiSynth  
This architecture allows the output of each MultiSynth to  
÷MS0  
produce any frequency from 5 to F /8 MHz. To  
2.2-2.84 GHz  
VCO  
vco  
ref  
fb  
support higher frequency operation, the MultiSynth  
divider can be bypassed. In bypass mode, integer divide  
ratios of 4 and 6 are supported. This allows for output  
Loop  
Filter  
Phase  
Frequency  
Detector  
MultiSynth  
÷MS1  
frequencies of F /4 and F /6 MHz, which translates  
vco  
vco  
to 367–473.33 MHz and 550–710 MHz respectively.  
Because each MultiSynth uses the same VCO output,  
there are output frequency limitations when output  
MultiSynth  
÷MS2  
MultiSynth  
÷N  
frequencies greater than F /8 are desired.  
vco  
MultiSynth  
÷MS3  
For example, if 375 MHz is needed at the output of  
MultiSynth0, the VCO frequency would need to be  
2.25 GHz. Now, all the other MultiSynths can produce  
any frequency from 5 MHz up to a maximum frequency  
of 2250/8 = 281.25 MHz. MultiSynth1,2,3 could also  
Figure 5. Synthesis Stages  
produce F /4 = 562.5 MHz or F /6 = 375 MHz. Only  
vco  
vco  
two unique frequencies above F /8 can be output:  
vco  
F
/6 and F /4.  
vco  
vco  
MultiSynth  
Fractional-N  
Phase  
Adjust  
Divider  
fVCO  
fOUT  
Phase Error  
Calculator  
Divider Select  
(DIV1, DIV2)  
Figure 6. Silicon Labs’ MultiSynth Technology  
20  
Rev. 1.6  
 
 
Si5338  
Each of the outputs can also be enabled or disabled  
through the I C port. A single pin to enable/disable all  
outputs is available in the Si5338K/L/M.  
3.4. Output Stage  
2
The output stage consists of output selectors, output  
dividers, and programmable output drivers as shown in  
Figure 7.  
3.5. Configuring the Si5338  
The Si5338 is a highly-flexible clock generator that is  
2
entirely configurable through its I C interface. The  
Output  
Stage  
device’s default configuration is stored in non-volatile  
memory (NVM) as shown in Figure 8. The NVM is a  
one-time programmable memory (OTP), which can  
store a custom user configuration at power-up. This is a  
useful feature for applications that need a clock present  
at power-up (e.g., for providing a clock to a processor).  
VDDO0  
CLK0A  
÷R0  
CLK0B  
VDDO1  
CLK1A  
÷R1  
CLK1B  
Power-Up/POR  
VDDO2  
CLK2A  
÷R2  
NVM  
CLK2B  
(OTP)  
RAM  
VDDO3  
Default  
CLK3A  
÷R3  
Config  
CLK3B  
I2C  
Figure 7. Output Stage  
Figure 8. Si5338 Memory Configuration  
The output selectors select the clock source for the  
output drivers. By default, each output driver is  
connected to its own MultiSynth block (e.g. MS0 to  
CLK0, MS1 to CLK1, etc), but other combinations are  
possible by reconfiguring the device. The PLL can be  
bypassed by connecting the input stage signals (osc,  
ref, refdiv, fb, or fbdiv) directly to the output divider.  
Bypassing an input directly to an output will not allow  
phase alignment of that output to other outputs. Each of  
the output drivers can also connect to the first  
MultiSynth block (MS0) enabling a fan-out function. This  
allows the Si5338 to act as a clock generator, a fanout  
buffer, or a combination of both in the same package.  
The output dividers (R0, R1, R2, R3) allow another  
stage of clock division.These dividers are configurable  
as divide by 1 (default), 2, 4, 8, 16, or 32. When an Rn  
does not equal 1, the phase alignment function for that  
output will not work.  
During a power cycle or a power-on reset (POR), the  
contents of the NVM are copied into random access  
memory (RAM), which sets the device configuration that  
will be used during operation. Any changes to the  
device configuration after power-up are made by  
reading and writing to registers in the RAM space  
2
through the I C interface. ClockBuilder Desktop (see  
"3.1.1. ClockBuilder™ Desktop Software" on page 18)  
can be used to easily configure register map files that  
can be written into RAM (see “3.5.2. Creating a New  
Configuration for RAM” for details). Alternatively, the  
register map file can be created manually with the help  
of the equations in the Si5338 Reference Manual.  
Two versions of the Si5338 are available. First,  
standard, non-customized Si5338 devices are available  
in which the RAM can be configured in-circuit via I C  
2
(example part number Si5338C-A-GM). Alternatively,  
standard Si5338 devices can be field-programmed  
using the Si5338/56-PROG-EVB field programmer.  
Second, custom factory-programmed Si5338 devices  
are available that include a user-specified startup  
frequency configuration (example part number  
Si5338C-Axxxxx-GM). See "12. Ordering Information"  
on page 42 for details.  
The output drivers are configurable to support common  
signal formats, such as LVPECL, LVDS, HCSL, CMOS,  
HSTL, and SSTL. Separate output supply pins (VDDO )  
n
are provided for each output buffer.  
The voltage on these supply pins can be 3.3, 2.5, 1.8, or  
1.5 V as needed for the possible output formats.  
Additionally, the outputs can be configured to stop high,  
low, or tri-state when the PLL has lost lock. If the Si5338  
is used in a zero delay mode, the output that is fed back  
must be set for always on, which will override any  
output disable signal.  
Rev. 1.6  
21  
 
 
 
Si5338  
3.5.1. Ordering a Custom NVM Configuration  
The Si5338 is orderable with a factory-programmed custom NVM configuration. This is the simplest way of using  
the Si5338 since it generates the desired output frequencies at power-up or after a power-on reset (POR). This  
2
default configuration can be reconfigured in RAM through the I C interface after power-up (see “3.5.2. Creating a  
New Configuration for RAM”).  
2
2
Custom 7-bit I C addresses may also be requested. Note that for the A/B/C devices, the I C LS bit address is the  
2
logical “or” of the I C address LS bit in Register 27 and the state of the I2C_LSB pin. If I2C_LSB pin functionality is  
2
2
required, custom I C addresses may only be even numbers. For all other variants of the device, custom I C  
addresses may be even or odd numbers. See the Si5338 Reference Manual: Configuring the Si5338 without  
ClockBuilder Desktop for more details.  
The first step in ordering a custom device is generating an NVM file which defines the input and output clock  
frequencies and signal formats. This is easily done using the ClockBuilder Desktop software (see "3.1.1.  
ClockBuilder™ Desktop Software" on page 18). This GUI based software generates an NVM file, which is used by  
the factory to manufacture custom parts. Each custom part is marked with a unique part number identifying the  
specific configuration (e.g., Si5338C-A00100-GM). Consult your local sales representative for more details on  
ordering a custom Si5338.  
3.5.2. Creating a New Configuration for RAM  
2
Any Si5338 device can be configured by writing to registers in RAM through the I C interface. A non-factory  
programmed device must be configured in this manner.  
The first step is to determine all the register values for the required configuration. This can be accomplished by one  
of two methods.  
1. Create a device configuration (register map) using ClockBuilder Desktop (v3.0 or later; see "3.1.1.  
ClockBuilder™ Desktop Software" on page 18).  
a. Configure the frequency plan.  
b. Configure the output driver format and supply voltage.  
c. Configure frequency and/or phase inc/dec (if desired).  
d. Configure spread spectrum (if desired).  
e. Configure for zero-delay mode (if desired, see "3.10.6. Zero-Delay Mode" on page 28).  
f. If needed go to the Advanced tab and make additional configurations.  
g. Save the configuration using the Options > Save Register Map File or Options > Save C code Header.  
2. Create a device configuration, register by register, using the Si5338 Reference Manual.  
3.5.3. Writing a Custom Configuration to RAM  
Writing a new configuration (register map) to the RAM consists of pausing the LOL state-machine, writing new  
values to the IC accounting for the write-allowed mask (see the Si5338 Reference Manual, “10. Si5338 Registers”),  
validating the input clock or crystal, locking the PLL to the input with the new configuration, restarting the LOL  
state-machine, and calibrating the VCO for robust operation across temperature. The flow chart in Figure 9  
enumerates the details:  
Note: The write-allowed mask specifies which bits must be read and modified before writing the entire register byte (a.k.a.  
read-modify-write). “AN428: Jump Start: In-System, Flash-Based Programming for Silicon Labs’ Timing Products” illus-  
trates the procedure defined in Section 3.5.2 with ANSI C code.  
22  
Rev. 1.6  
 
Si5338  
Disable Outputs  
Set OEB_ALL = 1; reg230[4]  
Pause LOL  
Set DIS_LOL = 1; reg241[7]  
Write new configuration to device  
accounting for the write-allowed mask  
(See Si5338 Reference Manual)  
Register  
Map  
Use ClockBuilder  
Desktop v3.0 or later  
Validate input clock status  
NO  
Input clocks are  
validated with the  
LOS alarms. See  
Register 218 to  
Is input clock valid?  
determine which LOS  
should be monitored  
YES  
Configure PLL for locking  
Set FCAL_OVRD_EN = 0; reg49[7]  
Initiate Locking of PLL  
Set SOFT_RESET = 1; reg246[1]  
Wait 25 ms  
Restart LOL  
Set DIS_LOL = 0; reg241[7]  
Set reg 241 = 0x65  
Confirm PLL lock status  
Is PLL locked?  
NO  
PLL is locked when  
PLL_LOL, SYS_CAL, and  
all other alarms are  
cleared  
YES  
Copy registers as follows:  
237[1:0] to 47[1:0]  
236[7:0] to 46[7:0]  
Copy FCAL values to  
active registers  
235[7:0] to 45[7:0]  
Set 47[7:2] = 000101b  
Set PLL to use FCAL values  
Set FCAL_OVRD_EN = 1; reg49[7]  
If using down-spread:  
Set MS_RESET=1: reg 226[2]=1  
Wait 1 ms  
Set MS_RESET=0: reg 226[2]=0  
Enable Outputs  
Set OEB_ALL = 0; reg230[4]  
Figure 9. I2C Programming Procedure  
Rev. 1.6  
23  
 
Si5338  
3.5.4. Writing a Custom Configuration to NVM  
Control & Memory  
An alternative to ordering an Si5338 with a custom NVM  
configuration is to use the field programming kit  
(Si5338/56-PROG-EVB) to write directly to the NVM of  
a “blank” Si5338. Since NVM is an OTP memory, it can  
only be written once. The default configuration can be  
VDD  
NVM  
(OTP)  
Control  
RAM  
1k  
INTR  
2
reconfigured by writing to RAM through the I C interface  
(see “3.5.2. Creating a New Configuration for RAM”).  
3.6. Status Indicators  
Figure 11. INTR Pin with Required Pull-Up  
A logic-high interrupt pin (INTR) is available to indicate  
a loss of signal (LOS) condition, a PLL loss of lock  
(PLL_LOL) condition, or that the PLL is in process of  
acquiring lock (SYS_CAL). PLL_LOL is held high when  
the input frequency drifts beyond the PLL tracking  
range. It is held low during all other times and during a  
POR or soft_reset. SYS_CAL is held high during a POR  
or SOFT reset so that no chattering occurs during the  
locking process. As shown in Figure 10, a status  
register at address 218 is available to help identify the  
exact event that caused the interrupt pin to become  
active. Register 247 is the sticky version of Register  
218, and Register 6 is the interrupt mask for Register  
218.  
3.7. Output Enable  
There are two methods of enabling and disabling the  
output drivers: Pin control, and I C control.  
2
3.7.1. Enabling Outputs Using Pin Control  
The Si5338K/L/M devices provide an Output Enable pin  
(OEB) as shown in Figure 12. Pulling this pin high will  
turn all outputs off. The state of the individual drivers  
when turned off is controllable. If an individual output is  
set to always on, then the OEB pin will not have an  
effect on that driver. Drive state options and always on  
are explained in “3.7.2. Enabling Outputs through the  
2
I C Interface”.  
Control & Memory  
7
6
5
4
3
2
1
0
Sys  
Cal  
PLL_LOL LOS_FDBK LOS_CLKIN  
218  
NVM  
(OTP)  
Control  
RAM  
System Calibration  
(Lock Acquisition)  
0 = Enabled  
1 = Disabled  
OEB  
Loss Of Signal  
Clock Input  
Loss Of Signal  
Feedback Input  
Figure 12. Output Enable Pin (Si5338K/L/M)  
Loss Of Lock  
2
3.7.2. Enabling Outputs through the I C Interface  
Figure 10. Status Register  
2
Output enable can be controlled through the I C  
interface. As shown in Figure 13, register 230[3:0]  
allows control of each individual output driver. Register  
230[4] controls all drivers at once. When register 230[4]  
is set to disable all outputs, the individual output  
enables will have no effect. Registers 110[7:6], 114[7:6],  
118[7:6], and 112[7:6] control the output disabled state  
as tri-state, low, high, or always on. If always on is set,  
that output will always be on regardless of any other  
register or chip state. In addition, the always on mode  
must be selected for an output that is fed back in a Zero  
Delay application.  
Figure 11 shows a typical connection with the required  
pull-up resistor to VDD.  
2
3.6.1. Using the INTR Pin in Systems with I C  
The INTR output pin is not latched and thus it should not  
be a polled input to an MCU but an edge-triggered  
interrupt. An MCU can process an interrupt event by  
reading the sticky register 247 to see what event  
caused the interrupt. The same register can be cleared  
by writing zeros to the bits that were set. Individual  
interrupt bits can be masked by register 6[4:0].  
2
3.6.2. Using the INTR Pin in Systems without I C  
The INTR pin also provides a useful function in systems  
that require a pin-controlled fault indicator. Pre-setting  
the interrupt mask register allows the INTR pin to  
become an indicator for a specific event, such as LOS  
and/or LOL. Therefore, the INTR pin can be used to  
indicate a single fault event or even multiple events.  
24  
Rev. 1.6  
 
 
 
 
 
Si5338  
SSTL, it is required to have load circuitry as shown in  
“AN408: Termination Options for Any-Frequency, Any-  
Output Clock Generators and Clock Buffers”. The  
Si5338 EVB has layout pads that can be used for this  
purpose. When testing for output driver current with  
LVPECL the same layout pads can be used to  
implement the LVPECL bias resistor of 130 (2.5 V  
VDDx) or 200 (3.3 V VDDx). See the schematic in the  
Si5338-EVB data sheet and AN408 for additional  
information.  
7
6
5
4
3
2
1
0
OEB OEB OEB OEB OEB  
All  
230  
3
2
1
0
0 = enable  
1 = disable  
Bits reserved  
7
6
5
5
5
5
4
4
4
4
3
3
3
3
2
2
2
2
1
1
1
1
0
0
0
0
CLK0 OEB  
State  
110  
114  
118  
122  
7
6
CLK1 OEB  
State  
7
6
CLK2 OEB  
State  
7
6
CLK3 OEB  
State  
00 = disabled tri-state  
01 = disabled low  
Bits used by other functions  
10 = disabled high  
11 = always enabled  
Figure 13. Output Enable Control Registers  
3.8. Power Consumption  
The Si5338 Power consumption is a function of  
Supply voltage  
Frequency of output Clocks  
Number of output Clocks  
Format of output Clocks  
Because of internal voltage regulation, the current from  
the core V  
is independent of the V  
voltage and  
DD  
DD  
hence the plot shown in Figure 14 can be used to  
estimate the V core (pins 7 and 24) current.  
DD  
The current from the output supply voltages can be  
estimated from the values provided in Table 3, “DC  
Characteristics,” on page 5. To get the most accurate  
value for  
V
currents, the Si5338-EVB with  
DD  
Clockbuilder software should be used. To do this, go to  
the “Power” tab of the Clockbuilder and press  
“Measure”. In this manner, a specific configuration can  
be implemented on the EVB and the actual current for  
each supply voltage measured. When doing this it is  
critical that the output drivers have the proper load  
impedance for the selected format.  
When testing for output driver current with HSTL and  
Rev. 1.6  
25  
Si5338  
80  
75  
70  
65  
60  
55  
50  
45  
40  
35  
4 Active Outputs, Fractional Output MS  
4 Active Outputs, Integer Output MS  
3 Active Outputs, Fractional Output MS  
3 Active Outputs, Integer Output MS  
2 Active Outputs, Fractional Output MS  
2 Active Outputs, Integer Output MS  
1 Active Output, Fractional Output MS  
1 Active Output, Integer Output MS  
30  
0
50  
100  
150  
200  
250  
300  
350  
400  
Output Frequency (MHz)  
Figure 14. Core VDD Supply Average Current vs Output Frequency  
26  
Rev. 1.6  
Si5338  
management, etc.) or in applications where frequency  
3.9. Reset Options  
margining (e.g., f  
±5%) is necessary for design  
out  
There are two types of resets on the Si5338, POR and  
soft reset. A POR reset automatically occurs whenever  
the supply voltage on the VDD is applied.  
verification and manufacturing test. Frequency  
increment or decrement can be applied as fast as  
2
1.5 MHz when it is done by pin control. When under I C  
The soft reset is forced by writing 0x02 to register 246.  
This bit is not self-clearing, and thus it may read back as  
a 1 or a 0. A soft reset will not download any pre-  
programmed NVM and will not change any register  
values in RAM.  
control, the frequency increment and decrement update  
rate is limited by the I C bus speed. The magnitude of  
the frequency step has 0 ppm error. Frequency steps  
are seamless and glitchless.  
2
If a frequency increment/decrement command causes  
the MultiSynth output frequency to exceed the  
maximum/minimum limits, then a glitch on the output is  
likely to occur. The max frequency of a MultiSynth  
output that is using frequency increment/decrement is  
Fvco/8, and the minimum frequency is 5 MHz.  
The soft reset performs the following sequence:  
1. All outputs turn off except if programmed to be  
always on.  
2. Internal calibrations are done and MultiSynths are  
initialized.  
3.10.2. Output Phase Increment/Decrement  
a. Outputs that are synchronous are phase  
aligned (if Rn = 1).  
The Si5338 has a digitally-controlled glitchless phase  
increment and decrement feature that allows adjusting  
the phase of each output clock in relation to the other  
output clocks. The phase of each output clock can be  
adjusted with an accuracy of 20 ps over a range of  
±45 ns. Setting of the step size and control of the phase  
increment or decrement is accomplished through the  
3. 25 ms is allowed for the PLL to lock (no delay occurs  
when FCAL_OVRD_EN = 1).  
4. Turn on all outputs that were turned off in step 1.  
3.10. Features of the Si5338  
The Si5338 offers several features and functions that  
are useful in many timing applications. The following  
paragraphs describe in detail the main features and  
typical applications. All of these features can be easily  
configured using the ClockBuilder Desktop. See "3.1.1.  
ClockBuilder™ Desktop Software" on page 18.  
2
I C interface. Alternatively, the Si5338 can be ordered  
with optional phase increment (PINC) and phase  
decrement (PDEC) pins for pin-controlled applications.  
In pin controlled applications the phase increment and  
2
decrement update rate is as fast as 1.5 MHz. In I C  
applications, the maximum update rate is limited by the  
2
3.10.1. Frequency Increment/Decrement  
speed of the I C. See Table 17 for ordering information  
Each of the output clock frequencies can be of pin-controlled devices. When phase is decremented,  
independently stepped up or down in predefined steps the MultiSynth output clock edge will happen sooner,  
as low as 1 ppm per step and with a resolution of which will create a single half cycle that is shorter than  
1 ppm. Setting of the step size and control of the expected for the MultiSynth output clock frequency.  
frequency increment or decrement is accomplished Care must be taken to insure that a single phase  
2
through the I C interface. Alternatively, the Si5338 can decrement does not produce a half cycle that is less  
be ordered with optional frequency increment (FINC) than 4/fvco or an unwanted glitch in the MultiSynth  
and frequency decrement (FDEC) pins for pin- output may occur.  
controlled applications. Note that FINC and FDEC pins  
The phase increment and decrement feature provides a  
only affect CLK0. Frequency increment and decrement  
useful method for fine tuning setup and hold timing  
2
of all other channels must be performed by I C writes to  
margins or adjusting for mismatched PCB trace lengths.  
the appropriate registers. See Table 17 on page 37 for  
3.10.3. Programmable Initial Phase Offset  
ordering information of pin-controlled devices. When  
Each output clock can be set for its initial phase offset  
phase is decremented, the MultiSynth output clock edge  
up to ±45 ns. In order for the initial phase offset to be  
will happen sooner which will create a single half cycle  
applied correctly at power up, the VDDOx output supply  
that is shorter than expected for the MultiSynth output  
voltage must cross 1.2 V before the VDD (pins 7,24)  
clock frequency. Care must be taken to insure that a  
core power supply voltage crosses 1.45 V. This applies  
single phase decrement does not produce a half cycle  
to the each driver output individually. A soft_reset will  
that is less than 4/fvco or an unwanted glitch in the  
also guarantee that the programmed Initial Phase Offset  
MultiSynth output may occur.  
is applied correctly. The initial phase offset only works  
on outputs that have their R divider set to 1.  
The frequency increment and decrement feature is  
useful in applications requiring a variable clock  
frequency (e.g., CPU speed control, FIFO overflow  
Rev. 1.6  
27  
 
 
Si5338  
3.10.4. Output Synchronization  
Si5338  
Upon power up or a soft_reset the Si5338 synchronizes  
the output clocks. With normal output polarity (no output  
clock inversion), the Si5338 synchronizes the output  
clocks to the falling, not rising edge. Synchronization at  
the rising edge can be done by inverting all the clocks  
that are to be synchronized.  
MS0  
MS1  
MS2  
MS3  
R0  
R1  
R2  
R3  
Clk0  
Clk1  
Clk2  
Clk  
Input  
P1  
P2  
PLL  
3.10.5. Output R Divider  
When the requested output frequency of a channel is  
below 5 MHz, the Rn (n = 0,1,2,3) divider needs to be  
set and enabled. This is automatically done in register  
maps generated by the ClockBuilder Desktop. When  
the Rn divider is active the step size range of the  
frequency increment and decrement function will  
decrease by the Rn divide ratio. The Rn divider can be  
set to {1, 2, 4, 8, 16, 32}.  
Clk3  
Figure 15. Si5338 in Zero Delay Clock  
Generator Mode  
3.10.7. Spread Spectrum  
Non-unity settings of R0 will affect the Finc/Fdec step  
size at the MultiSynth0 output. For example, if the  
MultiSynth0 output step size is 2.56 MHz and R0 = 8,  
the step size at the output of R0 will be 2.56 MHz  
divided by 8 = .32 MHz. When the Rn divider is set to  
non-unity, the initial phase offset of the CLKn output with  
respect to other CLKn outputs is not guaranteed.  
To help reduce electromagnetic interference (EMI), the  
Si5338 supports spread spectrum modulation. The  
output clock frequencies can be modulated to spread  
energy across a broader range of frequencies, lowering  
system EMI. The Si5338 implements spread spectrum  
using its patented MultiSynth technology to achieve  
previously unattainable precision in both modulation  
rate and spreading magnitude as shown in Figure 16.  
3.10.6. Zero-Delay Mode  
2
Through I C control, the Spread spectrum can be  
The Si5338 supports an optional zero delay mode of  
operation for applications that require minimal input-to-  
output delay. In this mode, one of the device output  
clocks is fed back to the feedback input pin (IN4 or IN5/  
IN6) to implement an external feedback path which  
nullifies the delay between the reference input and the  
output clocks. Figure 15 shows the Si5338 in a typical  
zero-delay configuration. It is generally recommended  
that Clk3 be LVDS and that the feedback input be pins 5  
and 6. For the differential input configuration to pins 5  
and 6, see Figure 3 on page 19. The zero-delay mode  
combined with the phase increment/decrement feature  
allows unprecedented flexibility in generating clocks  
with precise edge alignment.  
applied to any output clock, any clock frequency, and  
any spread amount from ±0.1% to ±2.5% center spread  
and –0.1% to –5% down spread.  
The spreading rate is limited to 30 to 63 kHz.  
The Spread Spectrum is generated digitally in the output  
MultiSynths which means that the Spread Spectrum  
parameters are virtually independent of process,  
voltage and temperature variations. Since the Spread  
Spectrum is created in the output MultiSynths, through  
2
I C each output channel can have independent Spread  
2
Spectrum parameters. Without the use of I C (NVM  
download only) the only supported Spread Spectrum  
parameters are for PCI Express compliance composing  
100 MHz clock, 31.5 kHz spreading frequency with the  
choice of the spreading.  
Rev A devices provide native support for both down and  
center spread. Center spread is supported in rev B  
devices by up-shifting the nominal frequency and using  
down-spread register parameters. Consult the Si5338  
Reference Manual for details.  
Note: If you currently use center spread on a revision A and  
would like to migrate to a revision B device, you must  
generate a new register map using either ClockBuilder  
Desktop or the equations in the Si5338 Reference  
Manual. Center spread configurations for Revisions A  
and B are not compatible.  
28  
Rev. 1.6  
 
 
Si5338  
4. Applications of the Si5338  
20  
10  
Because of its flexible architecture, the Si5338 can be  
configured to serve several functions in the timing path.  
The following sections describe some common  
applications.  
+/- 0%  
+/- 1%  
0
+/- 2.5%  
+/- 5%  
-10  
-20  
-30  
-40  
-50  
-60  
-70  
-80  
4.1. Free-Running Clock Generator  
Using the internal oscillator (Osc) and an inexpensive  
external crystal (XTAL), the Si5338 can be configured  
as a free-running clock generator for replacing high-end  
and long-lead-time crystal oscillators found on many  
printed circuit boards (PCBs). Replacing several crystal  
oscillators with a single IC solution helps consolidate the  
bill of materials (BOM), reduces the number of  
suppliers, and reduces the number of long-lead-time  
components on the PCB. In addition, since crystal  
oscillators tend to be the least reliable aspect of many  
systems, the overall FIT rate improves with the  
elimination of each oscillator.  
-10%  
-8%  
-6%  
-4%  
-2%  
0%  
2%  
4%  
6%  
8%  
10%  
Relative Frequency  
Figure 16. Configurable Spread Spectrum  
Up to four independent clock frequencies can be  
generated at any rate within its supported frequency  
range and with any of supported output types. Features,  
such as frequency increment and decrement and phase  
adjustments on  
a
per-output basis, provide  
unprecedented flexibility for PCB designs. Figure 17  
shows the Si5338 configured as a free-running clock  
generator.  
ref  
Osc  
PLL  
XTAL  
MS0  
MS1  
MS2  
MS3  
R0  
R1  
R2  
R3  
F0  
F1  
F2  
F3  
Si5338  
Figure 17. Si5338 as a Free-Running Clock  
Generator  
Rev. 1.6  
29  
 
Si5338  
4.2. Synchronous Frequency Translation  
4.3. Configurable Buffer and Level Transla-  
tor  
In other cases, it is useful to generate an output  
frequency that is synchronous (or phase-locked) to  
another clock frequency. The Si5338 is the ideal choice  
for generating up to four clocks with different  
frequencies with a fixed phase relationship to an input  
reference. Because of its highly precise frequency  
synthesis, the Si5338 can generate all four output  
frequencies with 0 ppm error to the input reference. The  
Si5338 is an ideal choice for applications that have  
traditionally required multiple stages of frequency  
synthesis to achieve complex frequency translations.  
Examples are in broadcast video (e.g., 148.5 MHz to  
148.351648351648 MHz), WAN/LAN applications (e.g.  
155.52 MHz to 156.25 MHz), and Forward Error  
Correction (FEC) applications (e.g., 156.25 MHz to  
161.1328125 MHz). Using the input reference selectors,  
the Si5338 can select from one of four inputs (IN1/IN2,  
IN3, IN4, and IN5/IN6). Figure 18 shows the Si5338  
Using the output selectors, the synthesis stage can be  
entirely bypassed allowing the Si5338 to act as a  
configurable clock buffer/divider with level translation  
and selectable inputs. Because of its highly selectable  
configuration, virtually any combination is possible. The  
configurable output drivers allow four differential  
outputs, eight single-ended outputs, or a combination of  
both. Figure 19 shows the Si5338 configured as a  
flexible clock buffer.  
Si5338  
1
R0  
R1  
R2  
R3  
Fin  
Fin  
Fin  
Fin  
*
*
*
*
R0  
1
R1  
Fin  
1
R2  
configured as  
a
synchronous clock generator.  
Frequencies and multiplication ratios may be entered  
into ClockBuilder Desktop using fractional notation to  
ensure that the exact scaling ratios can be achieved.  
1
R3  
Figure 19. Si5338 as a Configurable Clock  
Buffer/Divider with Level Translation  
Si5338  
MS0  
MS1  
MS2  
MS3  
R0  
R1  
R2  
R3  
F0  
F1  
F2  
F3  
4.3.1. Combination Free-Running and Synchronous  
Clock Generator  
P1  
P2  
Another application of the Si5338 is in generating both  
free-running and synchronous clocks in one device.  
This is accomplished by configuring the input and  
output selectors for the desired split configuration. An  
example of such an application is shown in Figure 20.  
ref  
Fin  
PLL  
Figure 18. Si5338 as a Synchronous Clock  
Generator or Frequency Translator  
Si5338  
Osc  
F0  
F1  
F2  
F3  
XTAL  
R0  
R1  
R2  
R3  
MS2  
MS3  
ref  
Fin  
PLL  
P2  
Figure 20. Si5338 In a Free-Running and  
Synchronous Clock Generator Application  
30  
Rev. 1.6  
 
 
 
Si5338  
5. I2C Interface  
Write Operation – Single Byte  
Slv Addr [6:0] Reg Addr [7:0]  
S
0
A
A
Data [7:0]  
A
P
Configuration and operation of the Si5338 is controlled  
by reading and writing to the RAM space using the I C  
2
interface. The device operates in slave mode with 7-bit  
addressing and can operate in Standard-Mode  
(100 kbps) or Fast-Mode (400 kbps) and supports burst  
data transfer with auto address increments.  
Write Operation - Burst (Auto Address Increment)  
Slv Addr [6:0] Reg Addr [7:0] Data [7:0]  
S
0
A
A
A
Data [7:0] A P  
Reg Addr +1  
2
The I C bus consists of a bidirectional serial data line  
(SDA) and a serial clock input (SCL) as shown in  
Figure 21. Both the SDA and SCL pins must be  
connected to the VDD supply via an external pull-up as  
1 – Read  
0 – Write  
A – Acknowledge (SDA LOW)  
N – Not Acknowledge (SDA HIGH)  
S – START condition  
From slave to master  
Frommaster to slave  
2
recommended by the I C specification.  
P – STOP condition  
Figure 23. I2C Write Operation  
OEB/PINC/FINC  
I2C_LSB/PDEC/FDEC  
VDD  
I2C_LSB  
0/1  
A read operation is performed in two stages. A data  
write is used to set the register address, then a data  
read is performed to retrieve the data from the set  
address. A read burst operation is also supported. This  
is shown in Figure 24.  
Control  
SCL  
SDA  
I2C Bus  
Figure 21. I2C and Control Signals  
Read Operation – Single Byte  
The 7-bit device (slave) address of the Si5338 consists  
of a 6-bit fixed address plus a user-selectable LSB bit as  
shown in Figure 22. The LSB bit is selectable using the  
optional I2C_LSB pin which is available as an ordering  
option for applications that require more than one  
S
Slv Addr [6:0]  
0
A
Reg Addr [7:0]  
A
P
P
S
Slv Addr [6:0]  
1
A
Data [7:0]  
N
2
Si5338 on a single I C bus. Devices without the  
Read Operation - Burst (Auto Address Increment)  
I2C_LSB pin option have a fixed 7-bit address of 70h  
(111 0000) as shown in Figure 22. Other custom I C  
addresses are also possible. See Table 17 for details on  
device ordering information with the optional I2C_LSB  
pin.  
S
S
Slv Addr [6:0]  
Slv Addr [6:0]  
0
1
A
A
Reg Addr [7:0]  
Data [7:0]  
A P  
2
A
Data [7:0]  
N P  
Reg Addr +1  
6
5
4
3
2
1
0
Slave Address  
(with I2C_LSB Option)  
1 – Read  
0 – Write  
A – Acknowledge (SDA LOW)  
N – Not Acknowledge (SDA HIGH)  
S – START condition  
1
1
1
0
0
0
0/1  
From slave to master  
Frommaster to slave  
I2C_LSB pin  
6
5
4
3
2
1
0
P – STOP condition  
Slave Address  
(without I2C_LSB Option)  
1
1
1
0
0
0
0
Figure 24. I2C Read Operation  
AC and dc electrical specifications for the SCL and SDA  
pins are shown in Table 15. The timing specifications  
Figure 22. Si5338 I2C Slave Address  
2
and timing diagram for the I C bus are compatible with  
Data is transferred MSB first in 8-bit words as specified  
2
2
the I C-Bus Standard. SDA timeout is supported for  
by the I C specification. A write command consists of a  
compatibility with SMBus interfaces.  
7-bit device (slave) address + a write bit, an 8-bit  
register address, and 8 bits of data as shown in  
Figure 23. A write burst operation is also shown where  
every additional data word is written using an auto-  
incremented address.  
2
The I C bus can be operated at a bus voltage of 1.71 to  
3.63 V and is 3.3 V tolerant. If a bus voltage of less than  
2.5 V is used, register 27[7] = 1 must be written to  
2
maintain compatibility with the I C bus standard.  
Rev. 1.6  
31  
 
 
 
 
Si5338  
6. Si5338 Registers  
For many applications, the Si5338's register values are easily configured using ClockBuilder Desktop (see "3.1.1.  
ClockBuilder™ Desktop Software" on page 18). However, for customers interested in using the Si5338 in operating  
modes beyond the capabilities available with ClockBuilder™, refer to the Si5338 Reference Manual: Configuring  
the Si5338 without ClockBuilder Desktop for a detailed description of the Si5338 registers and their usage. Also  
refer to “AN428: Jump Start: In-System, Flash-Based Programming for Silicon Labs’ Timing Products” for a working  
application example using Silicon Labs' F301 MCU to program the Si5338 register set.  
32  
Rev. 1.6  
Si5338  
7. Pin Descriptions  
Top View  
24  
23 22  
21  
20  
19  
1
2
3
4
IN1  
18  
17  
16  
15  
CLK1A  
IN2  
IN3  
IN4  
CLK1B  
VDDO1  
GND  
Pad  
VDDO2  
CLK2A  
CLK2B  
5
6
14  
13  
IN5  
IN6  
7
8
9
10  
12  
11  
Note: Center pad must be tied to GND for normal operation.  
Table 16. Si5338 Pin Descriptions  
Pin #  
Pin Name  
I/O  
Signal Type  
Description  
CLKIN/CLKINB.  
These pins are used as the main differential clock input or as the  
XTAL input. See "3.2. Input Stage" on page 19, Figure 3 and  
Figure 4, for connection details. Clock inputs to these pins must be  
ac-coupled. Keep the traces from pins 1,2 to the crystal as short as  
possible and keep other signals and radiating sources away from  
the crystal.  
1,2  
IN1/IN2  
I
Multi  
When not in use, leave IN1 unconnected and IN2 connected to  
GND.  
Rev. 1.6  
33  
Si5338  
Table 16. Si5338 Pin Descriptions (Continued)  
Pin #  
Pin Name  
I/O  
Signal Type  
Description  
This pin can have one of the following functions depending on the  
part number:  
CLKIN (for Si5338A/B/C and Si5338N/P/Q devices only)  
Provides a high-impedance clock input for single ended clock  
signals. This input should be dc-coupled as shown in “3.2. Input  
Stage”, Figure 3.  
If this pin is not used, it should be connected to ground.  
PINC (for Si5338D/E/F devices only)  
Used as the phase increment pin. See "3.10.2. Output Phase  
Increment/Decrement" on page 27 for more details. Minimum  
pulse width of 100 ns is required for proper operation. If this pin is  
not used, it should be connected to ground.  
3
IN3  
I
Multi  
FINC (for Si5338G/H/J devices only)  
Used as the frequency increment pin. See "3.10.1. Frequency  
Increment/Decrement" on page 27 for more details. Minimum  
pulse width of 100 ns is required for proper operation. If this pin is  
not used, it should be connected to ground.  
OEB (for Si5338K/L/M devices only)  
Used as an output enable pin. 0 = All outputs enabled; 1 = All  
outputs disabled. By default, outputs are tri-stated when disabled.  
This pin can have one of the following functions depending on the  
part number  
2
I C_LSB (for Si5338A/B/C and Si5338K/L/M devices only)  
2
2
This is the LSB of the Si5338 I C address. 0 = I C address  
2
70h (111 0000), 1 = I C address 71h (111 0001).  
FDBK (for Si5338N/P/Q devices only)  
Provides a high-impedance feedback input for single-ended clock  
signals. This input should be dc-coupled as shown in “3.2. Input  
Stage”, Figure 3. If this pin is not used, it should be connected to  
ground.  
4
IN4  
I
Multi  
PDEC (for Si5338D/E/F) devices only)  
Used as the phase decrement pin. See “3.10.2. Output Phase  
Increment/Decrement” for more details. Minimum pulse width of  
100 ns is required for proper operation. If this pin is not used, it  
should be connected to ground.  
FDEC (for Si5338G/H/J devices only)  
Used as the frequency decrement pin. See “3.10.1. Frequency  
Increment/Decrement” for more details. Minimum pulse width of  
100 ns is required for proper operation. If this pin is not used, it  
should be connected to ground.  
34  
Rev. 1.6  
Si5338  
Table 16. Si5338 Pin Descriptions (Continued)  
Pin #  
Pin Name  
I/O  
Signal Type  
Description  
FDBK/FDBKB.  
These pins can be used as a differential feedback input in zero  
delay mode or as a secondary clock input. See section 3.2,  
Figure 3, for termination details. See "3.10.6. Zero-Delay Mode" on  
page 28 for zero delay mode set-up. Inputs to these pins must be  
ac-coupled.  
5,6  
IN5/IN6  
I
Multi  
When not in use, leave IN5 unconnected and IN6 connected to  
GND.  
Core Supply Voltage.  
This is the core supply voltage, which can operate from a 1.8, 2.5,  
or 3.3 V supply. A 0.1 µF bypass capacitor should be located very  
close to this pin.  
7
8
VDD  
VDD  
Supply  
Interrupt.  
A typical pullup resistor of 1–4 kis used on this pin. This pin can  
be pulled up to a supply voltage as high as 3.6 V regardless of the  
other supply voltages on pins 7, 11, 15, 16, 20, and 24. The inter-  
rupt condition allows the pull up resistor to pull the output up to the  
supply voltage.  
INTR  
O
Open Drain  
Output Clock B for Channel 3.  
May be a single-ended output or half of a differential output with  
CLK3A being the other differential half. If unused, leave this pin  
floating.  
9
CLK3B  
CLK3A  
VDDO3  
O
O
Multi  
Multi  
Output Clock A for Channel 3.  
May be a single-ended output or half of a differential output with  
CLK3B being the other differential half. If unused, leave this pin  
floating.  
10  
11  
Output Clock Supply Voltage.  
Supply voltage (3.3, 2.5, 1.8, or 1.5 V) for CLK3A,B. A 0.1 µF  
capacitor must be located very close to this pin. If CLK3 is not  
used, this pin must be tied to VDD (pin 7, 24).  
VDD  
Supply  
2
I C Serial Clock Input.  
This is the serial clock input for the I C bus. A pullup resistor at this  
pin is required. Typical values would be 1–4 k. See the I C bus  
2
2
12  
SCL  
I
LVCMOS  
spec for more information. This pin is 3.3 V tolerant regardless of  
the other supply voltages on pins 7, 11, 15, 16, 20, 24. See Regis-  
ter 27.  
Output Clock B for Channel 2.  
May be a single-ended output or half of a differential output with  
CLK2A being the other differential half. If unused, leave this pin  
floating.  
13  
14  
CLK2B  
CLK2A  
O
O
Multi  
Multi  
Output Clock A for Channel 2.  
May be a single-ended output or half of a differential output with  
CLK2B being the other differential half. If unused, leave this pin  
floating.  
Rev. 1.6  
35  
Si5338  
Table 16. Si5338 Pin Descriptions (Continued)  
Pin #  
Pin Name  
I/O  
Signal Type  
Description  
Output Clock Supply Voltage.  
Supply voltage (3.3, 2.5, 1.8, or 1.5 V) for CLK2A,B.  
A 0.1 µF capacitor must be located very close to this pin. If CLK2 is  
not used, this pin must be tied to VDD (pin 7, 24).  
15  
VDDO2  
VDDO1  
CLK1B  
CLK1A  
VDD  
Supply  
Output Clock Supply Voltage.  
Supply voltage (3.3, 2.5, 1.8, or 1.5 V) for CLK1A,B.  
A 0.1 µF capacitor must be located very close to this pin. If CLK1 is  
not used, this pin must be tied to VDD (pin 7, 24).  
16  
17  
18  
VDD  
O
Supply  
Multi  
Output Clock B for Channel 1.  
May be a single-ended output or half of a differential output with  
CLK1A being the other differential half. If unused, leave this pin  
floating.  
Output Clock A for Channel 1.  
May be a single-ended output or half of a differential output with  
CLK1B being the other differential half. If unused, leave this pin  
floating.  
O
Multi  
2
I C Serial Data.  
2
This is the serial data for the I C bus. A pullup resistor at this pin is  
required. Typical values would be 1–4 k. See the I C bus spec  
2
19  
SDA  
I/O  
LVCMOS  
for more information. This pin is 3.3 V tolerant regardless of the  
other supply voltages on pins 7, 11, 15, 16, 20, 24. See Register  
27.  
Output Clock Supply Voltage.  
Supply voltage (3.3, 2.5, 1.8, or 1.5 V) for CLK0A,B.  
A 0.1 µF capacitor must be located very close to this pin. If CLK0 is  
not used, this pin must be tied to VDD (pin 7, 24).  
20  
21  
VDDO0  
CLK0B  
VDD  
O
Supply  
Multi  
Output Clock B for Channel 0.  
May be a single-ended output or half of a differential output with  
CLK0A being the other differential half. If unused, leave this pin  
floating.  
22  
CLK0A  
O
Multi  
Output Clock A for Channel 0.  
May be a single-ended output or half of a differential output with  
CLK0B being the other differential half. If unused, leave this pin  
floating.  
23  
24  
RSVD_GND GND  
GND  
Supply  
GND  
Ground.  
Must be connected to system ground. Minimize the ground path  
impedance for optimal performance of this device.  
VDD  
GND  
VDD  
GND  
Core Supply Voltage.  
The device operates from a 1.8, 2.5, or 3.3 V supply. A 0.1 µF  
bypass capacitor should be located very close to this pin.  
GND  
PAD  
Ground Pad.  
This is the large pad in the center of the package. Device  
specifications cannot be guaranteed unless the ground pad is  
properly connected to a ground plane on the PCB. See Table 19,  
“PCB Land Pattern,” on page 40 for ground via requirements.  
36  
Rev. 1.6  
Si5338  
8. Device Pinout by Part Number  
The Si5338 is orderable in three different speed grades: Si5338A/D/G/K/N have a maximum output clock  
frequency limit of 710 MHz. Si5338B/E/H/L/P have a maximum output clock frequency of 350 MHz. Si5338C/F/J/  
M/Q have a maximum output clock frequency of 200 MHz.  
Devices are also orderable according to the pin control functions available on Pins 3 and 4:  
CLKIN—single-ended clock input  
2
I2C_LSB—determines the LSB bit of the 7-bit I C address  
FINC—frequency increment pin  
FDEC—frequency decrement pin  
PINC—phase increment pin  
PDEC—phase decrement pin  
FDBK—single-ended feedback input  
OEB—output enable  
Table 17. Pin Function by Part Number  
Pin # Si5338A: 710 MHz Si5338D: 710 MHz Si5338G: 710 MHz Si5338K: 710 MHz Si5338N: 710 MHz  
Si5338B: 350 MHz Si5338E: 350 MHz Si5338H: 350 MHz Si5338L: 350 MHz Si5338P: 350 MHz  
Si5338C: 200 MHz Si5338F: 200 MHz Si5338J: 200 MHz Si5338M: 200 MHz Si5338Q: 200 MHz  
1
1
1
1
1
1
2
CLKIN  
CLKIN  
CLKIN  
CLKIN  
CLKIN  
1
1
1
1
1
CLKINB  
CLKINB  
PINC  
CLKINB  
FINC  
CLKINB  
OEB  
CLKINB  
2
2
3
CLKIN  
CLKIN  
3
4
I2C_LSB  
PDEC  
FDEC  
I2C_LSB  
FDBK  
FDBK  
4
4
4
4
4
5
FDBK  
FDBK  
FDBK  
FDBK  
4
4
4
4
4
6
FDBKB  
FDBKB  
VDD  
FDBKB  
VDD  
FDBKB  
FDBKB  
VDD  
7
VDD  
INTR  
VDD  
INTR  
8
INTR  
INTR  
INTR  
9
CLK3B  
CLK3A  
VDDO3  
SCL  
CLK3B  
CLK3A  
CLK3B  
CLK3A  
CLK3B  
CLK3A  
VDDO3  
SCL  
CLK3B  
CLK3A  
10  
11  
12  
13  
14  
15  
16  
Notes:  
VDDO3  
SCL  
VDDO3  
SCL  
VDDO3  
SCL  
CLK2B  
CLK2A  
VDDO2  
VDDO1  
CLK2B  
CLK2A  
VDDO2  
VDDO1  
CLK2B  
CLK2A  
VDDO2  
VDDO1  
CLK2B  
CLK2A  
VDDO2  
VDDO1  
CLK2B  
CLK2A  
VDDO2  
VDDO1  
1. CLKIN/CLKINB on pins 1 and 2 are differential clock inputs or XTAL inputs.  
2. CLKIN on pin 3 is a single-ended clock input.  
3. FDBK on pin 4 is a single-ended feedback input.  
4. FDBK/FDBKB on pins 5 and 6 are differential feedback inputs.  
Rev. 1.6  
37  
 
 
 
 
Si5338  
Table 17. Pin Function by Part Number (Continued)  
Pin # Si5338A: 710 MHz Si5338D: 710 MHz Si5338G: 710 MHz Si5338K: 710 MHz Si5338N: 710 MHz  
Si5338B: 350 MHz Si5338E: 350 MHz Si5338H: 350 MHz Si5338L: 350 MHz Si5338P: 350 MHz  
Si5338C: 200 MHz Si5338F: 200 MHz Si5338J: 200 MHz Si5338M: 200 MHz Si5338Q: 200 MHz  
17  
18  
CLK1B  
CLK1A  
SDA  
CLK1B  
CLK1A  
SDA  
CLK1B  
CLK1A  
SDA  
CLK1B  
CLK1A  
SDA  
CLK1B  
CLK1A  
SDA  
19  
20  
VDDO0  
CLK0B  
CLK0A  
GND  
VDDO0  
CLK0B  
CLK0A  
GND  
VDDO0  
CLK0B  
CLK0A  
GND  
VDDO0  
CLK0B  
CLK0A  
GND  
VDDO0  
CLK0B  
CLK0A  
GND  
21  
22  
23  
24  
VDD  
VDD  
VDD  
VDD  
VDD  
Notes:  
1. CLKIN/CLKINB on pins 1 and 2 are differential clock inputs or XTAL inputs.  
2. CLKIN on pin 3 is a single-ended clock input.  
3. FDBK on pin 4 is a single-ended feedback input.  
4. FDBK/FDBKB on pins 5 and 6 are differential feedback inputs.  
38  
Rev. 1.6  
Si5338  
9. Package Outline: 24-Lead QFN  
Figure 25. 24-Lead Quad Flat No-lead (QFN)  
Table 18. Package Dimensions  
Dimension  
Min  
Nom  
Max  
A
A1  
b
0.80  
0.00  
0.18  
0.85  
0.02  
0.90  
0.05  
0.30  
0.25  
D
4.00 BSC.  
2.50  
D2  
e
2.35  
2.65  
0.50 BSC.  
4.00 BSC.  
2.50  
E
E2  
L
2.35  
0.30  
2.65  
0.50  
0.40  
aaa  
bbb  
ccc  
ddd  
eee  
0.10  
0.10  
0.08  
0.10  
0.05  
Notes:  
1. All dimensions shown are in millimeters (mm) unless otherwise noted.  
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.  
3. This drawing conforms to the JEDEC Outline MO-220, variation VGGD-8.  
4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body  
Components.  
Rev. 1.6  
39  
Si5338  
10. Recommended PCB Land Pattern  
Table 19. PCB Land Pattern  
Dimension  
Min  
Nom  
Max  
2.60  
2.60  
0.30  
0.85  
P1  
P2  
X1  
Y1  
C1  
C2  
E
2.50  
2.50  
0.20  
0.75  
2.55  
2.55  
0.25  
0.80  
3.90  
3.90  
0.50  
Notes:  
General  
1. All dimensions shown are in millimeters (mm) unless otherwise noted.  
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994 specification.  
3. This Land Pattern Design is based on the IPC-7351 guidelines.  
4. Connect the center ground pad to a ground plane with no less than five vias. These 5 vias should have a length of no  
more than 20 mils to the ground plane. Via drill size should be no smaller than 10 mils. A longer distance to the ground  
plane is allowed if more vias are used to keep the inductance from increasing.  
Solder Mask Design  
5. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is  
to be 60 µm minimum, all the way around the pad.  
Stencil Design  
6. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder  
paste release.  
7. The stencil thickness should be 0.125 mm (5 mils).  
8. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pins.  
9. A 2x2 array of 1.0 mm square openings on 1.25 mm pitch should be used for the center ground pad.  
Card Assembly  
10. A No-Clean, Type-3 solder paste is recommended.  
11. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.  
40  
Rev. 1.6  
Si5338  
11. Top Marking  
11.1. Si5338 Top Marking  
Si5338  
Xxxxxx  
RTTTTT  
YYWW  
11.2. Top Marking Explanation  
Table 20. Top Marking Explanation  
Line  
Characters  
Description  
Line 1  
Si5338  
Base part number.  
X = Frequency and configuration code.  
xxxxx = Optional NVM code for custom factory-programmed devices  
(characters are not included for blank devices).  
See "12. Ordering Information" on page 42.  
Line 2  
Line 3  
Xxxxxx  
R = Product revision.  
TTTTT = Manufacturing trace code.  
RTTTTT  
Circle with 0.5 mm diameter;  
left-justified  
Pin 1 indicator.  
YY = Year.  
Line 4  
WW = Work week.  
YYWW  
Characters correspond to the year and work week of package assem-  
bly.  
Rev. 1.6  
41  
 
 
Si5338  
12. Ordering Information  
GMR  
Si5338X  
BXXXXX  
Operating Temp Range: -40 to +85 °C  
Package: 4 x 4 mm QFN, ROHS6, Pb-free  
R = Tape & Reel (ordering option)  
When ordering non Tape & Reel shipment  
media, contact your sales representative  
for more information.  
B = Product Revision B  
XXXXX = NVM code (optional).  
For blank devices, order Si5338X-B-GM(R).  
For custom NVM configurations, a unique 5-digit ordering code  
will be assigned by the factory. Consult your sales representative  
for custom NVM configurations.  
Si5338A  
Si5338B  
Si5338C  
Si5338D  
Si5338E  
Si5338F  
Si5338G  
Si5338H  
Si5338J  
Si5338K  
Si5338L  
Si5338M  
Si5338N  
Si5338P  
Si5338Q  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
0.16 MHz to 710 MHz I2C_LSB  
0.16 MHz to 350 MHz I2C_LSB  
0.16 MHz to 200 MHz I2C_LSB  
0.16 MHz to 710 MHz Phase Inc/Dec Pin Control  
0.16 MHz to 350 MHz Phase Inc/Dec Pin Control  
0.16 MHz to 200 MHz Phase Inc/Dec Pin Control  
0.16 MHz to 710 MHz Freq Inc/Dec Pin Control  
0.16 MHz to 350 MHz Freq Inc/Dec Pin Control  
0.16 MHz to 200 MHz Freq Inc/Dec Pin Control  
0.16 MHz to 710 MHz OEB Pin Control + I2C_LSB  
0.16 MHz to 350 MHz OEB Pin Control + I2C_LSB  
0.16 MHz to 200 MHz OEB Pin Control + I2C_LSB  
0.16 MHz to 710 MHz Four Inputs (2 Differential, 2 Single-ended)  
0.16 MHz to 350 MHz Four Inputs (2 Differential, 2 Single-ended)  
0.16 MHz to 200 MHz Four Inputs (2 Differential, 2 Single-ended)  
Evaluation Boards  
Si5338  
Si5338 Evaluation Board  
Si5338 Field Programmer  
EVB  
PROG - EVB  
Si5338/56  
42  
Rev. 1.6  
 
Si5338  
13. Device Errata  
Please visit www.silabs.com to access the device errata document.  
Rev. 1.6  
43  
Si5338  
Updated Figure 9 to include the entire programming  
DOCUMENT CHANGE LIST  
Revision 0.2 to Revision 0.3  
procedure.  
Added "3.2.1. Loss-of-Signal (LOS) Alarm  
Detectors" on page 19 to show the location of the  
LOS detector circuits.  
Changed minimum output clock frequency from  
5 MHz to 1 MHz.  
Updated input circuit diagrams in "3.2. Input Stage"  
Updated slew rates.  
on page 19.  
Updated " Features" on page 1.  
Update block diagrams with new input circuit  
Updated Table 6, “Input and Output Clock  
diagrams.  
Characteristics,” on page 8.  
Revision 0.6 to Revision 0.65  
Deleted Table 12, “Output Driver Slew Rate Control”.  
Updated Figure 9, “I2C Programming Procedure,” on  
Revision 0.3 to Revision 0.5  
page 23 for consistency with register description.  
Major editorial changes to all sections to improve  
Revision 0.65 to Revision 1.0  
clarity  
Completed electrical specification tables with final  
Expanded PCI jitter specifications in Table 12.  
Moved “Si5338 Registers” section to AN411.  
characterization results  
Revised the maximum input and output frequencies  
2
Added I C data rate specifications to Table 15.  
from 700 MHz to 710 MHz  
Revised CMOS output currents down for each  
Improved jitter specifications to reflect updated  
CMOS driver that is active in Table 3.  
characterization results  
Clarified CMOS output loads in Table 3  
Added new Si5338N/P/Q ordering codes  
Added typical application diagrams  
Added peak reflow temperature and footnote in  
Table 2.  
Added an application section to highlight the  
Added sticky and mask register info in "3.6. Status  
flexibility of the Si5338 in various timing functions  
Indicators" on page 24.  
Added a configuration section to clarify configuration  
Added more information to Table note about CMOS  
options  
outputs and jitter in Table 12.  
Revision 0.5 to Revision 0.55  
Changed all reference of MultiSynth Mn to MSn  
Added "11. Top Marking" on page 41.  
Reworded 3.5.2 and 3.5.3 for clarity.  
Editorial changes to section 3.5 “Configuring the  
Si5338” to improve clarity on ordering custom  
Si5338 and on configuring “blank” Si5338.  
Added pin numbers to device package drawings.  
Updated ordering information to include evaluation  
boards.  
Revision 1.0 to Revision 1.1  
Replaced all references to AN411 with "Si5338  
Reference Manual" (AN411 has been replaced by  
the Si5338 Reference Manual).  
Updated first page description and applications  
Clarified crystal specifications in Tables 8, 9, 10, 11  
Added to specification tables.  
JC  
and added references to AN360.  
Added GbE RM jitter specification with 1.875–  
Revision 1.1 to Revision 1.2  
20 MHz integration band.  
Updated Table 2 on page 4.  
Added CML current consumption specification.  
Updated Table 6 on page 8.  
Revision 0.55 to Revision 0.6  
Changed output duty cycle to 45–55%.  
2
All I C address now in binary.  
Corrected tR/tF for output clocks (single-ended) from  
1.7 ns (max ) to 2.0 ns (max).  
Changed ordering information to reflect 710 MHz  
limit.  
Added CML Output Voltage parameter.  
Updated Table 12 on page 13.  
Info on POR and soft reset added.  
Updated Figure 15 on page 28.  
Added register section.  
Updated typical specifications for total jitter for PCI  
Express 1.1 Common clocked topology.  
Updated typical specifications for RMS jitter for PCI  
Express 2.1 Common clocked topology.  
Update programming procedure in “3.5. Configuring  
the Si5338” to improve robustness.  
Removed RMS jitter specification for PCI Express 2.1  
44  
Rev. 1.6  
Si5338  
and 3.0 Data clocked topology.  
Added Table 13, “Jitter Specifications, Clock Buffer  
Mode (PLL Bypass)*,” on page 15.  
Updated typical additive jitter (12 kHz–20 MHz) from  
0.150 to 0.165 ps RMS.  
Updated Figure 9 on page 23 to provide work-  
around for spread spectrum errata.  
Removed "3.5.4. Modifying a MultiSynth Output  
Divider Ratio/Frequency Configuration". A soft reset  
is now recommended after any changes to the  
feedback or output dividers.  
Added " " on page 42.  
Revision 1.2 to Revision 1.3  
Removed down spread spectrum errata that has  
been corrected in revision B.  
Updated ordering information to refer to revision B  
silicon.  
Updated top marking explanation in Table 20.  
Added further explanation to describe revision-  
specific behavior of center spread spectrum in  
section 3.10.7.  
Revision 1.3 to Revision 1.4  
Added link to errata document.  
Revision 1.4 to Revision 1.5  
2
Added setup and hold time specifications for I C in  
Table 15.  
Revision 1.5 to Revision 1.6  
Updated Features on page 1.  
Updated Description on page 1.  
Updated specs in Table 12.  
Rev. 1.6  
45  
ClockBuilder Pro  
One-click access to Timing tools,  
documentation, software, source  
code libraries & more. Available for  
Windows and iOS (CBGo only).  
www.silabs.com/CBPro  
Timing Portfolio  
www.silabs.com/timing  
SW/HW  
www.silabs.com/CBPro  
Quality  
www.silabs.com/quality  
Support and Community  
community.silabs.com  
Disclaimer  
Silicon Laboratories intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers  
using or intending to use the Silicon Laboratories products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific  
device, and "Typical" parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Laboratories  
reserves the right to make changes without further notice and limitation to product information, specifications, and descriptions herein, and does not give warranties as to the accuracy  
or completeness of the included information. Silicon Laboratories shall have no liability for the consequences of use of the information supplied herein. This document does not imply  
or express copyright licenses granted hereunder to design or fabricate any integrated circuits. The products must not be used within any Life Support System without the specific  
written consent of Silicon Laboratories. A "Life Support System" is any product or system intended to support or sustain life and/or health, which, if it fails, can be reasonably expected  
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配单直通车
SI5338A-B08585-GM产品参数
型号:SI5338A-B08585-GM
是否Rohs认证: 符合
生命周期:Active
包装说明:HVQCCN,
Reach Compliance Code:unknown
风险等级:5.54
其他特性:IT ALSO OPERATES AT 2.5V AND 3.3V NOMINAL
JESD-30 代码:S-XQCC-N24
长度:4 mm
端子数量:24
最高工作温度:85 °C
最低工作温度:-40 °C
最大输出时钟频率:710 MHz
封装主体材料:UNSPECIFIED
封装代码:HVQCCN
封装形状:SQUARE
封装形式:CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度(摄氏度):260
主时钟/晶体标称频率:30 MHz
座面最大高度:0.9 mm
最大供电电压:1.98 V
最小供电电压:1.71 V
标称供电电压:1.8 V
表面贴装:YES
技术:CMOS
温度等级:INDUSTRIAL
端子形式:NO LEAD
端子节距:0.5 mm
端子位置:QUAD
处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:4 mm
uPs/uCs/外围集成电路类型:CLOCK GENERATOR, PROCESSOR SPECIFIC
Base Number Matches:1
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