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产品型号SN74AUC1G32的Datasheet PDF文件预览

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SCES377I − SEPTEMBER 2001 − REVISED NOVEMBER 2003

DBV OR DCK PACKAGE

(TOP VIEW)

Available in the Texas Instruments

NanoStar and NanoFree Packages

Optimized for 1.8-V Operation and Is 3.6-V

I/O Tolerant to Support Mixed-Mode Signal

Operation

GND

Supports Partial-Power-Down Mode

off

Operation

YEA, YEP, YZA, OR YZP PACKAGE

(BOTTOM VIEW)

Sub 1-V Operable

Max t of 2.4 ns at 1.8 V

Low Power Consumption, 10-µA Max I

3 4

GND

8-mA Output Drive at 1.8 V

1 5

Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

ESD Protection Exceeds JESD 22

− 2000-V Human-Body Model (A114-A)

− 200-V Machine Model (A115-A)

− 1000-V Charged-Device Model (C101)

description/ordering information

This single 2-input positive-OR gate is operational at 0.8-V to 2.7-V V , but is designed specifically for 1.65-V

to 1.95-V V

operation.

The SN74AUC1G32 performs the Boolean function Y + A ) B or Y + A • B in positive logic.

NanoStar and NanoFree package technology is a major breakthrough in IC packaging concepts, using the

die as the package.

ORDERING INFORMATION

ORDERABLE

PART NUMBER

TOP-SIDE

MARKING

†

PACKAGE

‡

NanoStar − WCSP (DSBGA)

0.17-mm Small Bump − YEA

SN74AUC1G32YEAR

SN74AUC1G32YZAR

SN74AUC1G32YEPR

SN74AUC1G32YZPR

NanoFree − WCSP (DSBGA)

0.17-mm Small Bump − YZA (Pb-free)

Tape and reel

_ _ _UG_

NanoStar − WCSP (DSBGA)

0.23-mm Large Bump − YEP

−40°C to 85°C

NanoFree − WCSP (DSBGA)

0.23-mm Large Bump − YZP (Pb-free)

SOT (SOT-23) − DBV

SOT (SC-70) − DCK

Tape and reel

SN74AUC1G32DBVR

SN74AUC1G32DCKR

U32_

UG_

†

‡

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.

YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code,

and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition

^{(1 = SnPb,}• = Pb-free).

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

NanoStar and NanoFree are trademarks of Texas Instruments.

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POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

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SCES377I − SEPTEMBER 2001 − REVISED NOVEMBER 2003

description/ordering information (continued)

This device is fully specified for partial-power-down applications using I . The I circuitry disables the outputs,

off

preventing damaging current backflow through the device when it is powered down.

For more information about AUC Little Logic devices, please refer to the TI application report, Applications of

Texas Instruments AUC Sub-1-V Little Logic Devices, literature number SCEA027.

FUNCTION TABLE

INPUTS

OUTPUT

logic diagram (positive logic)

†

absolute maximum ratings over operating free-air temperature range (unless otherwise noted)

Supply voltage range, V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 3.6 V

Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 3.6 V

Voltage range applied to any output in the high-impedance or power-off state, V

(see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 3.6 V

Output voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to V + 0.5 V

Input clamp current, I (V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA

Output clamp current, I

(V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA

Continuous output current, I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA

Continuous current through V

or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA

Package thermal impedance, θ (see Note 2): DBV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 206°C/W

DCK package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 252°C/W

YEA/YZA package . . . . . . . . . . . . . . . . . . . . . . . . . . . 154°C/W

YEP/YZP package . . . . . . . . . . . . . . . . . . . . . . . . . . . 132°C/W

Storage temperature range, T

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C

stg

†

Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTES: 1. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.

2. The package thermal impedance is calculated in accordance with JESD 51-7.

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

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SCES377I − SEPTEMBER 2001 − REVISED NOVEMBER 2003

recommended operating conditions (see Note 3)

MIN

MAX

UNIT

Supply voltage

0.8

2.7

= 0.8 V

= 1.1 V to 1.95 V

= 2.3 V to 2.7 V

= 0.8 V

0.65 × V

High-level input voltage

1.7

0.35 × V

0.7

= 1.1 V to 1.95 V

= 2.3 V to 2.7 V

Low-level input voltage

Input voltage

3.6

Output voltage

= 0.8 V

= 1.1 V

= 1.4 V

= 1.65 V

= 2.3 V

= 0.8 V

= 1.1 V

= 1.4 V

= 1.65 V

= 2.3 V

−0.7

−3

−5

−8

−9

0.7

High-level output current

Low-level output current

∆t/∆v

Input transition rise or fall rate

Operating free-air temperature

ns/V

−40

°C

NOTE 3: All unused inputs of the device must be held at V

or GND to ensure proper device operation. Refer to the TI application report,

Implications of Slow or Floating CMOS Inputs, literature number SCBA004.

electrical characteristics over recommended operating free-air temperature range (unless

otherwise noted)

†

PARAMETER

TEST CONDITIONS

MIN

V −0.1

TYP

MAX

UNIT

= −100 µA

= −0.7 mA

= −3 mA

= −5 mA

= −8 mA

= −9 mA

= 100 µA

= 0.7 mA

= 3 mA

0.8 V to 2.7 V

0.8 V

0.55

1.1 V

0.8

1.4 V

1.2

1.8

1.65 V

2.3 V

0.8 V to 2.7 V

0.8 V

0.2

0.25

1.1 V

0.3

0.4

0.45

0.6

= 5 mA

1.4 V

= 8 mA

1.65 V

2.3 V

= 9 mA

A or B input

V = V

or GND

0 to 2.7 V

µA

V or V = 2.7 V

off

V = V

or GND,

or GND

I = 0

0.8 V to 2.7 V

2.5 V

V = V

†

All typical values are at T = 25°C.

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

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SCES377I − SEPTEMBER 2001 − REVISED NOVEMBER 2003

switching characteristics over recommended operating free-air temperature range, C = 15 pF

(unless otherwise noted) (see Figure 1)

= 1.2 V

0.1 V

= 1.5 V

0.1 V

= 1.8 V

= 2.5 V

0.2 V

0.15 V

= 0.8 V

TYP

4.8

FROM

(INPUT)

(OUTPUT)

PARAMETER

UNIT

MIN MAX

3.5

MIN MAX

0.6 2.3

MIN TYP MAX

MIN MAX

†

A or B

†

This information was not available at the time of publication.

switching characteristics over recommended operating free-air temperature range, C = 30 pF

(unless otherwise noted) (see Figure 1)

= 1.8 V

= 2.5 V

0.2 V

0.15 V

FROM

(INPUT)

(OUTPUT)

PARAMETER

UNIT

MIN TYP MAX

MIN MAX

A or B

0.8

1.4

2.4

0.6

2.1

operating characteristics, T = 25°C

= 0.8 V

TYP

= 1.2 V

TYP

= 1.5 V

= 1.8 V

= 2.5 V

TEST

PARAMETER

UNIT

CONDITIONS

TYP

Power dissipation

capacitance

f = 10 MHz

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

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SCES377I − SEPTEMBER 2001 − REVISED NOVEMBER 2003

PARAMETER MEASUREMENT INFORMATION

2 × V

TEST

Open

From Output

Under Test

PLH PHL

GND

2 × V

GND

PLZ PZL

PHZ PZH

(see Note A)

∆

0.8 V

2 kΩ

1 kΩ

500 Ω

0.1 V

15 pF

1.2 V 0.1 V

1.5 V 0.1 V

1.8 V 0.15 V

2.5 V 0.2 V

1.8 V 0.15 V

2.5 V 0.2 V

15 pF

30 pF

LOAD CIRCUIT

0.1 V

0.15 V

Timing Input

0 V

Input

Data Input

0 V

VOLTAGE WAVEFORMS

PULSE DURATION

VOLTAGE WAVEFORMS

SETUP AND HOLD TIMES

Output

Control

Input

0 V

PHL

PZL

PLZ

+ V

PLH

PHL

Output

Waveform 1

Output

S1 at 2 × V

(see Note B)

∆

PLH

PZH

PHZ

Output

Waveform 2

S1 at GND

− V

∆

Output

≈0 V

(see Note B)

VOLTAGE WAVEFORMS

PROPAGATION DELAY TIMES

INVERTING AND NONINVERTING OUTPUTS

VOLTAGE WAVEFORMS

ENABLE AND DISABLE TIMES

LOW- AND HIGH-LEVEL ENABLING

NOTES: A.

C includes probe and jig capacitance.

B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.

Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.

C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, Z = 50 Ω, slew rate ≥ 1 V/ns.

D. The outputs are measured one at a time with one transition per measurement.

and t

are the same as t

PLZ

PZL

PLH

PHZ

PZH

PHL

dis

are the same as t

are the same as t .

H. All parameters and waveforms are not applicable to all devices.

Figure 1. Load Circuit and Voltage Waveforms

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

PACKAGE OPTION ADDENDUM

www.ti.com

30-Mar-2005

PACKAGING INFORMATION

Orderable Device

SN74AUC1G32DBVR

SN74AUC1G32DCKR

Status ⁽¹⁾

ACTIVE

Package Package

Pins Package Eco Plan ⁽²⁾Lead/Ball Finish MSL Peak Temp ⁽³⁾

Qty

Type

Drawing

SOT-23

DBV

3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM

no Sb/Br)

SC70

DCK

3000

Pb-Free

(RoHS)

CU NIPDAU Level-1-260C-UNLIM

SN74AUC1G32YEAR

SN74AUC1G32YEPR

SN74AUC1G32YZAR

SN74AUC1G32YZPR

ACTIVE

WCSP

YEA

YEP

YZA

YZP

3000

TBD

SNPB

Level-1-260C-UNLIM

Call TI

Pb-Free

(RoHS)

SNAGCU

Level-1-260C-UNLIM

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan

The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS

no Sb/Br)

please check

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame

retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is

provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the

accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take

reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on

incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited

information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI

to Customer on an annual basis.

Addendum-Page 1

MECHANICAL DATA

MPDS025C – FEBRUARY 1997 – REVISED FEBRUARY 2002

DCK (R-PDSO-G5)

PLASTIC SMALL-OUTLINE PACKAGE

0,30

0,15

0,10

0,65

0,13 NOM

1,40 2,40

1,10 1,80

Gage Plane

2,15

1,85

0,15

0°–8°

0,46

0,26

Seating Plane

0,10

1,10

0,80

0,10

0,00

4093553-2/D 01/02

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusion.

D. Falls within JEDEC MO-203

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,

enhancements, improvements, and other changes to its products and services at any time and to discontinue

any product or service without notice. Customers should obtain the latest relevant information before placing

orders and should verify that such information is current and complete. All products are sold subject to TI’s terms

and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its hardware products to the specifications applicable at the time of sale in

accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI

deems necessary to support this warranty. Except where mandated by government requirements, testing of all

parameters of each product is not necessarily performed.

TI assumes no liability for applications assistance or customer product design. Customers are responsible for

their products and applications using TI components. To minimize the risks associated with customer products

and applications, customers should provide adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,

in which TI products or services are used. Information published by TI regarding third-party products or services

does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.

Use of such information may require a license from a third party under the patents or other intellectual property

of the third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of information in TI data books or data sheets is permissible only if reproduction is without

alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction

of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for

such altered documentation.

Resale of TI products or services with statements different from or beyond the parameters stated by TI for that

product or service voids all express and any implied warranties for the associated TI product or service and

is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.

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Mailing Address:

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Post Office Box 655303 Dallas, Texas 75265

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SN74AUC1G32DBVR产品参数

型号:	SN74AUC1G32DBVR
是否无铅：	不含铅
是否Rohs认证：	符合
生命周期：	Active
IHS 制造商：	ROCHESTER ELECTRONICS LLC
零件包装代码：	SOT-23
包装说明：	GREEN, PLASTIC, SOT-23, 5 PIN
针数：	5
Reach Compliance Code：	unknown
风险等级：	5.67
Is Samacsys：	N
系列：	AUC
JESD-30 代码：	R-PDSO-G5
JESD-609代码：	e4
长度：	2.9 mm
逻辑集成电路类型：	OR GATE
湿度敏感等级：	1
功能数量：	1
输入次数：	2
端子数量：	5
最高工作温度：	85 °C
最低工作温度：	-40 °C
封装主体材料：	PLASTIC/EPOXY
封装代码：	LSSOP
封装形状：	RECTANGULAR
封装形式：	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
峰值回流温度（摄氏度）：	260
传播延迟（tpd）：	3.5 ns
座面最大高度：	1.45 mm
最大供电电压 (Vsup)：	2.7 V
最小供电电压 (Vsup)：	0.8 V
标称供电电压 (Vsup)：	1.2 V
表面贴装：	YES
技术：	CMOS
温度等级：	INDUSTRIAL
端子面层：	NICKEL PALLADIUM GOLD
端子形式：	GULL WING
端子节距：	0.95 mm
端子位置：	DUAL
处于峰值回流温度下的最长时间：	NOT SPECIFIED
宽度：	1.6 mm
Base Number Matches：	1

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