ST7GEME4各脚功能电路原理芯片引脚定义引脚图及功能IC贸易商-中国IC网-芯三七

ST7GEME4

Full-speed USB MCU with smartcard firmware

and EMV/non-EMV interface

Features

24

■ Clock, reset and supply management

– Low voltage reset

1

VFQFPN24

SO24(9U)

– Halt power saving mode

– PLL for generating 48 MHz USB clock

using a 4 MHz crystal

– Internal Step-up converter for 5V supplied

Smartcards (with a current of up to 55mA)

using only two external components.

■ USB (Universal Serial Bus) interface

– USB 2.0 compliant

– Programmable smartcard internal voltage

regulator (1.8 to 3.0 V) with current

overload protection and 4 kV ESD

protection (Human Body Model) for all

smartcard interface I/Os

– CCID V1.0

– Full speed, hubless

– Bus-powered, low consumption

■ Serial RS232 interface

■ Development tools

– Transmission rate: 9.6 Kbps to 115 Kbps

– Format: 8-bit, no parity

– Application note on PCB recommendations

and component bill of materials

– Auto baud rate

– Full hardware/software kit for performance

evaluation

– CCID V1.0 on serial TTL link

■ ISO 7816-3 UART interface

– 4 Mhz clock generation

Description

– Synchronous/Asynchronous protocols

(T=0, T=1)

The ST7GEME4 is an 8-bit microcontroller

dedicated to smartcard reading applications. It

has been developed to be the core of smartcard

readers communicating through a serial or USB

link. It is pre-programmed using Gemplus

software, and offers a single integrated circuit

solution with very few external components.

– Automatic retry on parity error

– Programmable baud rate from 372 to

11.625 clock pulses (D=32/F=372)

– Card insertion/removal detection

■ Smartcard power supply

– Selectable card V : 1.8 V, 3 V, and 5 V

CC

Table 1.

Device summary

Order codes

Features

ST7GEME4M1

ST7GEME4U1

Program memory

16K ROM

512 + 256

User RAM + USB data buffer (bytes)

Peripherals

USB Full-Speed (7 Ep), TBU, Watchdog timer, ISO 7816-3 Interface

4.0 to 5.5 V

Operating Supply

Package

SO24

VFQFPN24

CPU Frequency

4 or 8 MHz

0 to +70 °C

Operating temperature

September 2007

Rev 2.0

1/28

www.st.com

1

Contents

ST7GEME4

Contents

1

2

3

Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

ST7GEME4 implementation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

3.1

3.2

3.3

Functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Smartcard interface features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

EMV versus PC/SC-ISO mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

4

Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

4.1

4.2

4.3

4.4

Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Supply and reset characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Clock and timing characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

4.4.1

4.4.2

General timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Crystal resonator oscillators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

4.5

4.6

4.7

Memory characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Smartcard supply supervisor electrical characteristics . . . . . . . . . . . . . . 19

EMC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

4.7.1

4.7.2

4.7.3

Functional EMS (electromagnetic susceptibility) . . . . . . . . . . . . . . . . . . 21

Electromagnetic interference (EMI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Absolute maximum ratings (electrical sensitivity) . . . . . . . . . . . . . . . . . 23

4.8

Communication interface characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 24

5

6

Package characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

5.1

Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

2/28

ST7GEME4

List of tables

Table 1.

Table 2.

Table 3.

Table 4.

Table 5.

Table 6.

Table 7.

Table 8.

Device summary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Technical features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Thermal characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

General operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Current injection on I/O port and control pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

I/O port pins characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

LED pins characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Low voltage detector and supervisor characteristics (LVDS) . . . . . . . . . . . . . . . . . . . . . . . 16

General timings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

External clock source . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Crystal resonator oscillator characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Typical crystal resonator characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Recommended values for 4 MHz crystal resonator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

RAM and hardware registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Smartcard supply supervisor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

EMS characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

EMI characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Electrical sensitivities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

USB DC electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

USB full speed electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

24-lead very thin fine pitch quad flat no-lead 5x5mm,0.65mm pitch, mechanical data. . . . 25

24-pin plastic small outline package- 300-mil width, mechanical data . . . . . . . . . . . . . . . . 26

Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

Table 9.

Table 10.

Table 11.

Table 12.

Table 13.

Table 14.

Table 15.

Table 16.

Table 17.

Table 18.

Table 19.

Table 20.

Table 21.

Table 22.

Table 23.

Table 24.

Table 25.

Table 26.

Table 27.

3/28

List of figures

ST7GEME4

List of figures

Figure 1.

Figure 2.

Figure 3.

Figure 4.

Figure 5.

Figure 6.

Figure 7.

Figure 8.

Figure 9.

ST7GEME4 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

24-lead VFQFPN package pinout. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

24-pin SO package pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Smartcard interface reference application - 24-pin SO package . . . . . . . . . . . . . . . . . . . . . 9

Typical application with an external clock source . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Typical application with a crystal resonator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

USB data signal rise and fall time. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

24-lead very thin fine pitch quad flat no-lead 5x5 mm 0.65 mm pitch, package outline . . . 25

24-pin plastic small outline package- 300-mil width, package outline. . . . . . . . . . . . . . . . . 26

4/28

ST7GEME4

Introduction

1

Introduction

The ST7GEME4 device is a member of the ST7 microcontroller family designed for USB

applications. All devices are based on a common industry-standard 8-bit core, featuring an

enhanced instruction set.

The ST7GEME4 is factory-programmed ROM devices and as such are not

reprogrammable.

It operates at a 4 MHz external oscillator frequency.

Under software control, all devices can be placed in Halt mode, reducing power

consumption when the application is in idle or stand-by state.

The enhanced instruction set and addressing modes of the ST7 offer both power and

flexibility to software developers, enabling the design of highly efficient and compact

application code. In addition to standard 8-bit data management, all ST7 microcontrollers

feature true bit manipulation, 8x8 unsigned multiplication and indirect addressing modes.

The ST7GEME4 includes an ST7 Core, up to 16 Kbytes of program memory, up to 512

bytes of user RAM and the following on-chip peripherals:

■

USB full speed interface with 7 endpoints, programmable in/out configuration and

embedded 3.3 V voltage regulator and transceivers (no external components are

needed).

■

ISO 7816-3 UART interface with programmable baud rate from 372 clock pulses up to

11.625 clock pulses

Smartcard supply block able to provide programmable supply voltage and I/O voltage

levels to the smartcards

Low voltage reset ensuring proper power-on or power-off of the device (selectable by

option)

8-bit timer (TBU)

5/28

Introduction

ST7GEME4

Figure 1.

ST7GEME4 block diagram

OSCIN

OSCOUT

4MHz

OSCILLATOR

PA[1:0]

PORT A

PLL

48 MHz

8 MHz

DIVIDER

or 4 MHz

USB

DATA

BUFFER

(256 bytes)

LED0

LED

USBDP

USBDM

USBVCC

ISO 7816 UART

USB

SUPPLY

MANAGER

8-BIT TIMER

CONTROL

DIODE

PA6

V_PP

SELF

DC/DC

8-BIT CORE

ALU

CRDVCC

CONVERTER

CRDDET

CRDIO

LVD

CRDC4

CRDC8

RAM

(512 Bytes)

3V/1.8V Vreg

CRDRST

CRDCLK

PROGRAM

MEMORY

(16K Bytes)

6/28

ST7GEME4

Pin description

2

Pin description

Figure 2.

24-lead VFQFPN package pinout

24

23

22

21

20

19

18

1

2

3

4

5

6

USBV_CC

DP

CRDVCC

CRDRST

CRDCLK

C4

17

16

15

14

13

DM

LED0

PA6

CRDIO

C8

VPP

7

8

9

10

11

12

Figure 3.

24-pin SO package pinout

24

1

2

3

4

5

6

7

8

SELF

V_DD

V_DDA

USBVcc

DP

DM

LED0

PA6

DIODE

GNDA

GND

CRDVCC

CRDRST

CRDCLK

C4

CRDIO

C8

CRDDET

23

22

21

20

19

18

17

16

15

14

13

9

V_PP

10

11

12

OSCOUT

OSCIN

NC

ICCDATA/WAKUP2/

ICCCLK/WAKUP2/P

7/28

Pin description

ST7GEME4

Legend / Abbreviations

■

Type: I = input, O = output, S = supply

In/Output level: CT = CMOS 0.3VDD/0.7VDD with input trigger

Output level: HS = 10mA high sink (on N-buffer only)

Port and control configuration:

–

Input: float = floating, wpu = weak pull-up, int = interrupt, ana = analog

Output: OD = open drain, PP = push-pull

Table 2.

Pin description

Pin number

Level

Port / Control

Input Output

Main

Pin name

function

Alternate function

(after reset)

2

3

4

5

6

5

6

7

8

9

CRDRST

CRDCLK

C4

O

C_T

X

Smartcard reset

Smartcard clock

Smartcard C4

Smartcard I/O

Smartcard C8

O

C_T

CRDIO

C8

I/O

O

C_T

X

C_T

X

C

7

8

10 CRDDET

I

X

Smartcard detection

T

PA0/WAKUP2/

Interrupt, In-circuit

11

12

I/O

C_T

X

Port A0

Port A1

ICCDATA

communication data input

PA1/WAKUP2/

ICCCLK

Interrupt, In-circuit

9

communication clock input

C

Input/output oscillator pins. These pins

connect a 4 MHz parallel-resonant crystal, or

an external source to the on-chip oscillator.

11

14 OSCIN

T

12

13

15 OSCOUT

16 V_PP

C_T

S

I

Must be held low in normal operating mode.

PA6

C

14

17 PA6

T

15

16

17

18

19

20

18 LED0

19 DM

O

I/O

O

HS

C_T

X

Constant current output

USB Data Minus line

20 DP

C_T

USB Data Plus line

21 USBVCC

22 V_DDA

23 V_DD

C_T

3.3 V output for USB

S

Power Supply voltage 4-5.5 V

S

An external inductance must be connected to

these pins for the step up converter

21

22

24 SELF

O

S

C_T

An external diode must be connected to this

pin for the step up converter

1

DIODE

8/28

ST7GEME4

Pin description

Table 2.

Pin description (continued)

Level

Pin number

Port / Control

Input Output

Main

function

Pin name

Alternate function

(after reset)

23

24

1

2

3

4

GNDA

GND

S

O

Ground

CDRVCC

C_T

X

Smartcard supply pin

Figure 4.

Smartcard interface reference application - 24-pin SO package

V_DD

C1

L1

D1

C3

SELF

V_DD

DIODE

GNDA

V

DD

V_DDA

USBVcc

DP

GND

CRDVCC

CRDRST

CRDCLK

C4

CRDIO

C2

R

C4

D+

D-

C5

C6

DM

LED0

PA6

LED

V

DD

C

C8

V_PP

L1

CRDDET

OSCOUT

OSCIN

NC

PA0

PA1

C

L2

1. Mandatory values for the external components:

C1 = 4.7 µF; C2 = 100 nF. C1 and C2 must be located close to the chip (refer to Section 4.4.2.).

C3 = 1 nF;

C4 = 4.7 µF ESR 0.5 Ω.

C5 : 470 pF;

C6 : 100 pF;

R : 1.5kΩ;

L1 : 10 µH, 2 Ω;

Crystal 4.0 MHz; Impedance max100 Ω

D1: BAT42 SHOTTKY.

9/28

ST7GEME4 implementation

ST7GEME4

3

ST7GEME4 implementation

The ST7GEME4 has been developed to offer a complete ready-to-use firmware solution

which allows fast development and rapid time-to-market of smartcard reader applications.

It offers a single IC solution and simplifies the integration of smartcard interfaces into

electronic devices such as computers, POS terminals, mobile phones, PDAs, home routers,

and set-top boxes. Pre-programmed with communication software from our partner

GEMPLUS, the ST7GEME4 is a complete firmware solution controlling the communication

between ISO 7816 1-2-3-4 cards and a host system. An evaluation kit and reference design

with a complete bill of materials and PCB recommendations are available. The ST7GEME4

complies with EMVCo/EMV2000 standards. Software support and engineering expertise in

system integration and PCB design are available as additional services.

3.1

Functionality

The core functionality of ST7GEME4 resides in its pre-programmed software embedded in

TM

ROM memory. GemCore technology manages the communication protocol to/from the

host computer and the external card. Basic features and compliance are described in the

features section and in Table 3 on page 11.

A dedicated analog block provides smartcard power supplies 1.8 V, 3 V, and 5 V necessary

to interface with different card voltages available on the market. Voltages are selected by

software. External LEDs can also be directly connected to dedicated I/Os.

A dedicated UART interface provides an ISO 7816 communication port for connection with

the smartcard connector. A full-speed USB interface port allows external connection to a

host computer. An optional RS232 connection is also available on dedicated I/Os.

3.2

Smartcard interface features

The ST7GEME4 firmware includes the following features:

■

Compatibility with asynchronous cards

Compatibility with T=0 and T=1 protocols

Compatibility with EMV and PC/SC modes.

Compatibility with ISO 7816-3 and 4 and ability to supply the cards with 5V, 3V or 1.8V

(class A, B or C cards, respectively)

■

Resume/wake-up mode upon smartcard insertion/removal

Further details on smartcard management can be found in "Gemcore USB Pro reference

manual" from Gemplus.

The reader is able to communicate with smartcards up to the maximum baud rate allowed,

namely 344 086 bps (TA1=16) for a clock frequency of 4 MHz. Because the size of the

smartcard buffer is 261 bytes, care must be taken not to exceed this size during APDU

exchanges when the protocol in use is T=1.

10/28

ST7GEME4

ST7GEME4 implementation

3.3

EMV versus PC/SC-ISO mode

The ST7GEME4 supports two operating modes:

■

An EMV mode, based on the EMV4.1 specifications

A PC/SC-ISO mode which allows to manage of a smartcard according to the PC/SC

and ISO 7816-3 standards

The default mode is PC/SC, however, the reader can switch between EMV and PC/SC-ISO

modes.

GemCore2000 is a utility in charge of managing the switching between the two modes.

When the utility is activated, the reader attempts EMV mode management whenever a

smartcard is inserted. If reading is successful, PC/SC mode will not be available.

Caution:

The activation of the GemCore2000 utility must be done before any card command. Any

activation of the GemCore2000 utility is not recommended unless the reader is reset.

The EMV mode fails if:

■

The smartcard has not sent an EMV-compliant answer to reset (ATR)

Negotiation of the buffer size with a T=1 card has failed

Using PC/SC-ISO mode with GemCore2000

The reader switches to PC/SC mode after the application or the driver has sent the

appropriate dedicated command to the reader (with a proprietary Escape command). In this

case, the reader remains in PC/SC mode as long as the card remains in the reader.

Whenever the EMV mode fails, the smartcard is powered off. After the host application has

sent the PC/SC switch (proprietary) Escape command, the application must send a new

Card Power On command.

When the reader deals with an EMV card, the data exchanged between the reader and the

host consists of short APDU messages. When the card is not EMV-compliant and the reader

is set to PC/SC-ISO mode, the reader exchanges TPDU messages with the host.

Restriction: character level and the extended APDU are not implemented in ST7GEME4

solution.

Table 3.

Technical features

Description

Features

Characteristics

– Microprocessor cards

Asynchronous

– T=0, T=1 protocols

Supported

smartcards

– Transmission rate: 2 Kbps to 344 Kbps

Synchronous

– Through a comprehensive API

– 5V/55mA and 3V/50mA and 1.8V/20mA

– Short circuit current limitation

Smartcard power supply

Smartcard

electrical interface

– Power up/power down control sequences

Smartcard management

– Card insertion/extraction detection

– 4 kV Human Body Model

ESD protection on card I/O

11/28

ST7GEME4 implementation

ST7GEME4

Table 3.

Technical features (continued)

– Microsoft Windows 2000/XP/Server 2003

– Microsoft Windows CE 4.1/4.2/5.0

– Linux Red Hat/SUSE/Debian

USB and serial versions

– Microsoft Windows XP 64-bit on AMD64 and

EMT64

Drivers

– Microsoft Windows Server 2003 64-bit

– Mac OS 10.3/10.4

– Microsoft Windows 2000/XP/Server 2003

Compliance with class drivers – Microsoft Windows Vista (beta version)

– Mac OS 10.3/10.4

– CCID V1.0

USB interface

USB 2.0 compliant

– Full speed, hubless

– Bus powered, low consumption

– Transmission rate: 9.6 Kbps to 115 Kbps

– Format: 8-bit, no parity

Serial asynchronous link

Serial host

interface

– Auto baud rate

Communication protocol

Temperature range

– CCID V1.0 on serial TTL link

– Operating range: 0 to +70°C

– Storage: -65 to +150°C

Other features

Environmental standard

– RoHS compliant

12/28

ST7GEME4

Electrical characteristics

4

Electrical characteristics

4.1

Absolute maximum ratings

The ST7GEME4 contains circuitry to protect the inputs against damage due to high static

voltages. However it is advisable to take normal precautions to avoid applying any voltage

higher than the specified maximum rated voltages.

For proper operation it is recommended that V and V be higher than V and lower than

I

O

SS

V

. Reliability is enhanced if unused inputs are connected to an appropriate logic voltage

DD

level (V or V ).

DD

SS

Power considerations

The average chip-junction temperature, T , in Celsius can be obtained by the following

J

equation:

T

= T + PD × RthJA

J

A

where:

T = Ambient temperature

A

RthJA = Package thermal resistance (junction-to ambient)

P = P + P

D

INT

PORT

P

= I x V (chip internal power)

DD DD

INT

= Port power dissipation determined by the user

PORT

Stresses above those listed as “absolute maximum ratings” may cause permanent damage

to the device. This is a stress rating only and functional operation of the device at these

conditions is not implied. Exposure to maximum rating for extended periods may affect

device reliability.

Table 4.

Symbol

V_DD- V_SS

Absolute maximum ratings

Ratings

Value

Unit

Supply voltage

Input voltage

Output voltage

6.0

V

V_IN

V_OUT

V_SS- 0.3 to V_DD+ 0.3

ESD

ESD susceptibility

2000

4000

250

ESDCard

I_{VDD_i}

I_{VSS_i}

ESD susceptibility for card pads

Total current into V_{DD_i}(source)

Total current out of V_{SS_i}(sink)

mA

250

Warning: Direct connection to V or V of the I/O pins could damage

DD

SS

the device in case of program counter corruption (due to

unwanted change of the I/O configuration). To guarantee safe

conditions, this connection has to be done through a typical

10kΩ pull-up or pull-down resistor.

13/28

Electrical characteristics

ST7GEME4

Unit

Table 5.

Symbol

Thermal characteristics

Ratings

Value

VFQFPN24

SO24

42

80

°C/W

°C

R_thJA

Package thermal resistance

T_Jmax

T_STG

Max. junction temperature

Storage temperature range

150

-65 to +150

600

°C

VFQFPN24

SO24

mW

PD_max

Power dissipation

500

4.2

Recommended operating conditions

Table 6.

Symbol

General operating conditions

Parameter Conditions

Supply voltage

Min

Typ

Max

Unit

V_DD

f_OSC

T_A

4.0

5.5

V

External clock source

4

MHz

°C

Ambient temperature range

0

70

Operating conditions are given for T = 0 to +70 °C unless otherwise specified.

A

(1)

Table 7.

Symbol

Current injection on I/O port and control pins

Parameter

Conditions

Min Typ Max Unit

V_EXTERNAL>V_DD(Standard I/Os)

Total positive injected

current⁽²⁾⁽³⁾

I_INJ+

20 mA

V_EXTERNAL>V_CRDVCC(Smartcard

I/Os)

V_EXTERNAL<V_SS

Digital pins

Analog pins

Total negative injected current

I_INJ-

20 mA

(4)(5)

V_EXTERNAL<V_SS

1. When several inputs are submitted to a current injection, the maximum injected current is the sum of the

positive (resp. negative) currents (instantaneous values).

2. Positive injection. The I_INJ+is done through protection diodes insulated from the substrate of the die.

3. For SmartCard I/Os, V_CRDVCChas to be considered.

4. The negative injected current, I_INJ-, passes through protection diodes which are NOT INSULATED from the

substrate of the die. The drawback is a small leakage (few µA) induced inside the die when a negative

injection is performed. This leakage is tolerated by the digital structure. The effect depends on the pin

which is submitted to the injection. Of course, external digital signals applied to the component must have

a maximum impedance close to 50kΩ.

5. Location of the negative current injection: Pure digital pins can tolerate 1.6mA. In addition, the best choice

is to inject the current as far as possible from the analog input pins.

14/28

ST7GEME4

Electrical characteristics

o

Table 8 characteristics are measured at T =0 to +70 C, and V -V =5.5V unless

A

DD SS

otherwise specified.

(1)

Table 8.

Symbol

Current consumption

Parameter

Supply current in RUN mode⁽²⁾f_OSC= 4MHz

External I_LOAD= 0mA

Conditions

Min

Typ. Max

Unit

10

50

15

mA

Supply current in suspend mode

500

(USB transceiver

enabled)

I_DD

µA

External I_LOAD= 0mA

Supply current in Halt mode

100

(USB transceiver

disabled)

1. All I/O pins are in input mode with a static value at V_DDor V_SS; clock input (OSCIN) driven by external

square wave.

2. CPU running with memory access, all I/O pins in input mode with a static value at V_DDor V_SS; clock input

(OSCIN) driven by external square wave.

o

Table 9 characteristics are measured at T =0 to +70 C. Voltage are referred to V unless

A

SS

otherwise specified.

Table 9.

Symbol

I/O port pins characteristics

Parameter

Conditions

Min

Typ

Max

Unit

V_IL

V_IH

Input low level voltage

Input high level voltage

V_DD=5V

0.3V_DD

V

0.7V_DD

Schmidt trigger voltage

hysteresis⁽¹⁾

V_HYS

400

mV

V

I=-5mA

I=-2mA

1.3

0.4

Output low level voltage for

Standard I/O port pins

V_OL

V_DD

0.8

-

V_OH

Output high level voltage

I=3mA

I_L

Input leakage current

V_SS<V_PIN<V_DD

1

µA

R_PU

Pull-up equivalent resistor

50

6

90

8

170

kΩ

Output high to low level fall time

for high sink I/O port pins (Port

D)⁽²⁾

t_OHL

13

23

Output high to low level fall time

for standard I/O port pins (Port A,

B or C)⁽²⁾

t_OHL

t_OLH

18

C_l=50pF

ns

Output L-H rise time (Port D)⁽²⁾

7

19

1

9

14

28

Output L-H rise time for standard

I/O port pins (Port A, B or C)⁽²⁾

t_ITEXTExternal interrupt pulse time

t_CPU

1. Hysteresis voltage between Schmitt trigger switching levels. Based on characterization results, not tested.

2. Guaranteed by design, not tested in production.

15/28

Electrical characteristics

ST7GEME4

Table 10. LED pins characteristics

Symbol

Parameter

Low current

High current

Conditions

Min

Typ

Max

Unit

I_Lsink

V_PAD> V_DD-2.4

2

5

4

mA

V_PAD> V_DD-2.4 for ROM

6

8.4

4.3

Supply and reset characteristics

o

Table 11 characteristics are measured at T = 0 to +70 C, V - V = 5.5 V unless

DD

SS

otherwise specified.

Table 11. Low voltage detector and supervisor characteristics (LVDS)

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Reset release threshold

(V_DDrising)

V_IT+

3.7

3.9

V

Reset generation threshold

(V_DDfalling)

V_IT-

3.3

20

3.5

V

(1)

V_hys

Hysteresis V_IT+- V_IT-

200

mV

V_tPORV_DDrise time rate ¹⁾

ms/V

1. Hysteresis voltage between Schmitt trigger switching levels. Based on characterization results, not tested.

4.4

Clock and timing characteristics

4.4.1

General timings

o

Table 12 characteristics are measured at T = 0 to +70 C unless otherwise specified.

Table 12. General timings

Symbol

Parameter

Conditions

Min

Typ⁽¹⁾

Max

Unit

2

3

12

3000

22

t_CPU

ns

t_c(INST)Instruction cycle time

f_CPU=4 MHz

500

10

750

Interrupt reaction time⁽²⁾

t_v(IT)

t_CPU

µs

t_v(IT)= ∆t_c(INST)+ 10⁽³⁾

f_CPU=4 MHz

2.5

5.5

1. Data based on typical application software.

2. Time measured between interrupt event and interrupt vector fetch. ∆t_c(INST)is the number of t_CPUcycles

needed to finish the current instruction execution.

3. ∆t_INSTis the number of t_CPUto finish the current instruction execution.

16/28

ST7GEME4

Electrical characteristics

Table 13. External clock source

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

OSCIN input pin high level

voltage

V_OSCINH

0.7V_DD

V_SS

V_DD

V

V_OSCINLOSCIN input pin low level voltage

0.3V_DD

see Figure 5

t_w(OSCINH)

t_w(OSCINL)

OSCIN high or low time⁽¹⁾

15

ns

t_r(OSCIN)

t_f(OSCIN)

OSCIN rise or fall time⁽¹⁾

15

±1

I_L

OSCx Input leakage current

V_SS≤V_IN≤V_DD

µA

1. Data based on design simulation and/or technology characteristics, not tested in production.

Figure 5.

Typical application with an external clock source

90%

V_OSCINH

10%

V_OSCINL

t_f(OSCIN)

t_w(OSCINH)

t_r(OSCIN)

t_w(OSCINL)

OSCOUT

f_OSC

EXTERNAL

CLOCK SOURCE

I_L

OSCIN

ST7XXX

17/28

Electrical characteristics

ST7GEME4

4.4.2

Crystal resonator oscillators

The ST7 internal clock is supplied with one Crystal resonator oscillator. All the information

given in this paragraph are based on characterization results with specified typical external

components. In the application, the resonator and the load capacitors have to be placed as

close as possible to the oscillator pins in order to minimize output distortion and start-up

stabilization time. Refer to the crystal resonator manufacturer for more details (frequency,

package, accuracy...).

Table 14. Crystal resonator oscillator characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

f_OSC

R_F

Oscillator Frequency⁽¹⁾

Feedback resistor

MP: Medium power oscillator

4

MHz

90

22

150

56

kΩ

Recommended load

C_L1

C_L2

capacitances versus equivalent

serial resistance of the crystal

resonator (R_S)

See Table 16

(MP oscillator)

pF

i₂

OSCOUT driving current

V_DD=5V, V_IN=V_SS(MP oscillator)

1.5

3.5

mA

1. The oscillator selection can be optimized in terms of supply current using an high quality resonator with small R_Svalue.

Refer to crystal resonator manufacturer for more details.

Table 15. Typical crystal resonator characteristics

CL1 CL2 tSU(osc)

[pF] [pF]

Oscillator

Reference

Freq.

Characteristic⁽¹⁾

[ms]⁽²⁾

SS3-400-30-

30/30

∆f_OSC=[±30ppm_25°C,±30ppm_∆Ta],

Typ. R_S=60Ω

MP JAUCH

4 MHz

33 33

7~10

1. Resonator characteristics given by the crystal resonator manufacturer.

2. t_SU(OSC)is the typical oscillator start-up time measured between V_DD=2.8 V and the fetch of the first instruction (with a quick

V_DDramp-up from 0 to 5 V (<50 µs).

Table 16. Recommended values for 4 MHz crystal resonator

Symbol

Min

Typ

Max

Unit

(1)

R_SMAX

20

56

25

47

70

22

Ω

C_OSCIN

pF

C_OSCOUT

1. R_SMAXis the equivalent serial resistor of the crystal (see crystal specification).

18/28

ST7GEME4

Electrical characteristics

Figure 6.

Typical application with a crystal resonator

WHEN RESONATOR WITH

INTEGRATED CAPACITORS

i₂

f_OSC

C_L1

OSCIN

RESONATOR

R_F

C_L2

OSCOUT

ST7XXX

4.5

Memory characteristics

Subject to general operating conditions for V , f

, and T unless otherwise specified.

A

DD OSC

Table 17. RAM and hardware registers

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

V_RM

Data retention mode⁽¹⁾

Halt mode (or Reset)

2

V

1. Minimum V_DDsupply voltage without losing data stored in RAM (in Halt mode or under Reset) or in

hardware registers (only in Halt mode). Not tested in production.

4.6

Smartcard supply supervisor electrical characteristics

o

Table 18 characteristics are measured at T = 0 to +70 C, 4.0 V < V - V < 5.5 V unless

A

DD

SS

otherwise specified.

Table 18. Smartcard supply supervisor characteristics

Symbol Parameter Conditions

Min

Typ

Max

Unit

5 V regulator output (for IEC 7816-3 Class A Cards)

SmartCard power supply

V_CRDVCC

voltage

4.6

5.00

5.4

55

V

I_SC

SmartCard supply current

mA

I_OVDETCurrent overload detection

120⁽¹⁾

Detection time on current

overload

t_IDET

170⁽¹⁾

1400⁽¹⁾

µs

t_OFF

t_ON

V_CRDVCCturn-off time

V_CRDVCCturn-on time

C_LOADmax≤ 4.7µF

750

500

µs

150

V_CARDabove minimum supply

voltage

V_CRDVCC

I_VDD

4.52⁽¹⁾

4.76⁽¹⁾

100

V

(2)

V_DDsupply current

mA

19/28

Electrical characteristics

ST7GEME4

Table 18. Smartcard supply supervisor characteristics (continued)

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

3 V regulator output (for IEC 7816-3 Class B Cards)

SmartCard power supply

V_CRDVCC

voltage

2.7

3.3

V

I_SC

SmartCard supply current

50

mA

I_OVDETCurrent overload detection

100⁽¹⁾

Detection time on current

overload

t_IDET

170⁽¹⁾

1400⁽¹⁾

µs

t_OFF

t_ON

V_CRDVCCturn-off time

V_CRDVCCturn-on time

C_LOADmax≤ 4.7µF

750

500

µs

150

1.8V regulator output (for IEC 7816-3 Class C Cards)

SmartCard power supply

V_CRDVCC

voltage

1.65

1.95

V

I_SC

SmartCard supply current

20

mA

I_OVDETCurrent overload detection

100⁽¹⁾

Detection time on current

overload

t_IDET

170⁽¹⁾

1400⁽¹⁾

µs

t_OFF

t_ON

V_CRDVCCturn-off time

V_CRDVCCturn-on time

C_LOADmax≤ 4.7µF

750

500

µs

150

Smartcard CLKPin

V_OL

V_OH

Output low level voltage

I = -50 µA

I = 50 µA

C_l= 30 pF

-

0.4⁽³⁾

-

V

Output high level voltage

Output high to low fall time⁽¹⁾

Output low to high rise time⁽¹⁾

Frequency variation⁽¹⁾

Duty cycle⁽¹⁾

V_CRDVCC-0.5⁽³⁾

T_OHL

T_OLH

F_VAR

F_DUTY

P_OL

-

20

1

ns

%

V

-

45

55

0.4

Signal low perturbation⁽¹⁾

-0.25

V_CRDVCC

+0.25

P_OH

Signal high perturbation⁽¹⁾

Short-circuit to ground⁽¹⁾

V_CRDVCC-0.5

V

I_SGND

15

mA

Smartcard I/O Pin

V_IL

V_IH

V_OL

V_OH

I_L

Input low level voltage

-

0.5⁽³⁾

-

V

(3)

Input high level voltage

Output low Level Voltage

Output high level voltage

Input leakage current⁽¹⁾

Pull-up equivalent resistance

0.6V_CRDVCC

I = -0.5 mA

I = 20 µA

-

0.4⁽³⁾

V

(3)

0.8V_CRDVCC

-

V_CRDVCC

V

V_SS<V_IN<V_{SC_PWR}

V_IN=V_SS

-10

-

10

30

µA

kΩ

I_RPU

24

20/28

ST7GEME4

Electrical characteristics

Table 18. Smartcard supply supervisor characteristics (continued)

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

T_OHL

T_OLH

I_SGND

Output high to low fall time⁽¹⁾

Output low to high rise time⁽¹⁾

Short-circuit to ground⁽¹⁾

C_l= 30 pF

-

0.8

µs

15

mA

Smartcard RST C4 and C8 Pin

V_OL

V_OH

Output low Level Voltage

Output high level voltage

Output high to low fall time⁽¹⁾

Output low to high rise time⁽¹⁾

Short-circuit to ground⁽¹⁾

I = -0.5 mA

-

0.4 ⁽³⁾

V_CRDVCC

0.8

V

V_CRDVCC-0.5⁽³⁾

(3)

I = 20 µA

C_l= 30 pF

T_OHL

T_OLH

I_SGND

-

µs

mA

0.8

15

1. Guaranteed by design.

2. V_DD= 4.75 V, Card consumption = 55mA, CRDCLK frequency = 4MHz, LED with a 3mA current, USB in reception mode

and CPU in WFI mode.

3. Data based on characterization results, not tested in production.

4.7

EMC characteristics

Susceptibility tests are performed on a sample basis during product characterization.

4.7.1

Functional EMS (electromagnetic susceptibility)

Based on a simple running application on the product (toggling 2 LEDs through I/O ports),

the product is stressed by two electromagnetic events until a failure occurs (indicated by the

LEDs).

■

ESD: electrostatic discharge (positive and negative) is applied on all pins of the device

until a functional disturbance occurs. This test conforms with the IEC 1000-4-2

standard.

■

FTB: a burst of fast transient voltage (positive and negative) is applied to V and V

DD

SS

through a 100 pF capacitor, until a functional disturbance occurs. This test conforms

with the IEC 1000-4-4 standard.

A device reset allows normal operations to be resumed. The test results are given in the

table below based on the EMS levels and classes defined in application note AN1709.

Designing hardened software to avoid noise problems

EMC characterization and optimization are performed at component level with a typical

application environment and simplified MCU software. It should be noted that good EMC

performance is highly dependent on the user application and the software in particular.

Therefore it is recommended that the user applies EMC software optimization and

prequalification tests in relation with the EMC level requested for his application.

21/28

Electrical characteristics

ST7GEME4

Software recommendations

The software flowchart must include the management of runaway conditions such as:

■

Corrupted program counter

Unexpected reset

Critical Data corruption (control registers...)

Prequalification trials

Most of the common failures (unexpected reset and program counter corruption) can be

reproduced by manually forcing a low state on the RESET pin or the Oscillator pins for 1

second.

To complete these trials, ESD stress can be applied directly on the device, over the range of

specification values. When unexpected behavior is detected, the software can be hardened

to prevent unrecoverable errors occurring (see application note AN1015).

Table 19. EMS characteristics

Level/

Class

Symbol

Parameter

Conditions

Voltage limits to be applied on any I/O pin to V_DD=5 V, T_A=+25 °C, f_OSC=8 MHz

V_FESD

2B

induce a functional disturbance

conforms to IEC 1000-4-2

Fast transient voltage burst limits to be

V_FFTBapplied through 100 pF on V_DDand V_DDpins

to induce a functional disturbance

V_DD=5 V, T_A=+25 °C, f_OSC=8 MHz

conforms to IEC 1000-4-4

4B

4.7.2

Electromagnetic interference (EMI)

Based on a simple application running on the product (toggling 2 LEDs through the I/O

ports), the product is monitored in terms of emission. This emission test is in line with the

norm SAE J 1752/3 which specifies the board and the loading of each pin.

Table 20. EMI characteristics

Max vs.

(1)

Monitored

frequency band

[f_OSC/f_CPU

]

Symbol Parameter

Conditions

Unit

4/8 MHz 4/4 MHz

0.1 MHz to

30 MHz

19

32

18

27

30 MHz to

130 MHz

dBµ

V

V_DD=5 V, T_A=+25 °C,

conforming to SAE J 1752/3

S_EMI

Peak level

130 MHz to

1 GHz

31

4

26

SAE EMI Level

3.5

-

1. Data based on characterization results, not tested in production.

22/28

ST7GEME4

Electrical characteristics

4.7.3

Absolute maximum ratings (electrical sensitivity)

Based on three different tests (ESD, LU and DLU) using specific measurement methods, the

product is stressed in order to determine its performance in terms of electrical sensitivity.

For more details, refer to the application note AN1181.

Electrostatic discharge (ESD)

Electrostatic discharges (a positive then a negative pulse separated by 1 second) are

applied to the pins of each sample according to each pin combination. The sample size

depends on the number of supply pins in the device (3 parts*(n+1) supply pin). The Human

Body Model is simulated. This test conforms to the JESD22-A114A standard.

Table 21. Absolute maximum ratings

Maximum

Symbol

Ratings

Conditions

Unit

value⁽¹⁾

Electrostatic discharge voltage

(Human Body Model)

V_ESD(HBM)

T_A=+25 °C

2000

V

1. Data based on characterization results, not tested in production.

Static and dynamic latch-up

■

LU: 3 complementary static tests are required on 10 parts to assess the latch-up

performance. A supply overvoltage (applied to each power supply pin) and a current

injection (applied to each input, output and configurable I/O pin) are performed on each

sample. This test conforms to the EIA/JESD 78 IC latch-up standard. For more details,

refer to the application note AN1181.

DLU: Electrostatic discharges (one positive then one negative test) are applied to each

pin of 3 samples when the micro is running to assess the latch-up performance in

dynamic mode. Power supplies are set to the typical values, the oscillator is connected

as near as possible to the pins of the micro and the component is put in reset mode.

This test conforms to the IEC1000-4-2 and SAEJ1752/3 standards. For more details,

refer to the application note AN1181.

Table 22. Electrical sensitivities

Symbol

Parameter

Conditions

Class⁽¹⁾

LU

Static latch-up class

T_A=+25 °C

A

V_DD=5.5 V, f_OSC=4 MHz,

T_A=+25 °C

DLU

Dynamic latch-up class

A

1. Class description: A Class is an STMicroelectronics internal specification. All its limits are higher than the

JEDEC specifications, that means when a device belongs to Class A it exceeds the JEDEC standard. B

Class strictly covers all the JEDEC criteria (international standard).

23/28

Electrical characteristics

ST7GEME4

4.8

Communication interface characteristics

(1)

Table 23. USB DC electrical characteristics

Parameter

Symbol

Conditions

Min.

Max.

Unit

Input Levels

Differential input sensitivity

VDI

I(D+, D-)

0.2

0.8

V

Differential common mode

range

VCM

Includes VDI range

2.5

2.0

Single ended receiver

threshold

VSE

1.3

V

Output levels

Static output low

VOL

VOH

RL of 1.5 kΩ to 3.6 V

RL of 15 kΩ to V_SS

V_DD=5 V

0.3

3.6

V

Static Output high

USBVCC: voltage level

2.8

USBV

3.00

3.60

1. RL is the load connected on the USB drivers. All the voltages are measured from the local ground

potential.

Figure 7.

USB data signal rise and fall time

Differential

Data Lines

Crossover

points

VCRS

V_SS

tr

tf

Table 24. USB full speed electrical characteristics

Parameter

Symbol

Conditions

Min

Max

Unit

Driver characteristics:

Rise time

t_r

t_f

CL = 50 pF⁽¹⁾

4

20

ns

Fall time

Rise/ fall time

matching

t_rfm

t_r/t_f

90

110

2.0

%

V

Output signal

crossover Voltage

VCRS

1.3

1. Measured from 10% to 90% of the data signal. For more detailed informations, please refer to Chapter 7

(Electrical) of the USB specification (version 1.1).

24/28

ST7GEME4

Package characteristics

5

Package characteristics

5.1

Package mechanical data

Figure 8.

24-lead very thin fine pitch quad flat no-lead 5x5 mm 0.65 mm pitch, package outline

D

C

e

24

19

1

6

18

13

12

7

A1

b

L

A

D2

Table 25. 24-lead very thin fine pitch quad flat no-lead 5x5mm,0.65mm pitch, mechanical data

mm

Typ

inches⁽¹⁾

Dim.

Min

Max

1.00

0.05

0.35

Min

Typ

Max

0.039

0.002

0.014

A

A1

b

0.80

0.90

0.02

0.30

5.00

3.60

5.00

3.60

0.65

0.45

0.08

0.031

0.035

0.001

0.012

0.197

0.142

0.197

0.142

0.026

0.018

0.003

0.25

3.50

0.35

0.010

0.138

0.014

D

D2

E

3.70

0.146

0.022

E2

e

L

0.55

ddd

Number of pins

N

24

1. Values in inches are converted from mm and rounded to 3 decimal digits.

25/28

Package characteristics

ST7GEME4

Figure 9.

24-pin plastic small outline package- 300-mil width, package outline

D

12

1

h x 45˚

C

E

H

13

B

28

A

ddd

A1

e

A1

α

L

9U_ME

Table 26. 24-pin plastic small outline package- 300-mil width, mechanical data

mm

Typ

inches

Typ

Dim.

Min

2.35

0.10

0.33

0.23

15.20

7.40

Max

2.65

0.30

0.51

0.32

15.60

7.60

Min

Max

A

A1

B

0.093

0.004

0.013

0.009

0.599

0.291

0.104

0.012

0.020

0.619

0.299

C

D

E

e

1.27

0.050

H

10.00

0.25

0°

10.65

0.394

0.010

0°

0.419

0.030

8°

h

0.75

α

8°

1.27

L

0.40

0.016

0.050

0.004

ddd

0.10

Number of pins

N

24

26/28

ST7GEME4

Revision history

6

Revision history

Table 27. Document revision history

Date

Revision

Changes

01-Aug-06

0.1

1

Initial release

10-May-2007

Root part number changed from ST7GEM to ST7GEME4.

Document reformatted.

Modified Figure 1 title.

USB host interface replaced by USB interface in Section 1:

Introduction and Table 3: Technical features.

Updated Figure 9: 24-pin plastic small outline package- 300-mil

width, package outline. ddd tolerance and maximum values in inched

added in Table 26: 24-pin plastic small outline package- 300-mil

width, mechanical data.

21-Sep-2007

2

QFN24 package renamed VFQFPN24. Figure 8: 24-lead very thin

fine pitch quad flat no-lead 5x5 mm 0.65 mm pitch, package outline

updated to remove A2 and A3 dimensions.

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ST7GEME4

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