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产品型号SW730的Datasheet PDF文件预览

SAMWIN  
SW730  
N-channel MOSFET  
BVDSS : 400V  
TO-220  
Features  
ID  
: 6.5A  
High ruggedness  
RDS(ON) : 1.0ohm  
RDS(ON) (Max 1.0)@VGS=10V  
Gate Charge (Typ 32nC)  
Improved dv/dt Capability  
100% Avalanche Tested  
1
2
2
3
1
1. Gate 2. Drain 3. Source  
General Description  
3
This power MOSFET is produced with advanced VDMOS technology of SAMWIN.  
This technology enable power MOSFET to have better characteristics, such as fast  
switching time, low on resistance, low gate charge and especially excellent avalanche  
characteristics. It is mainly suitable for half bridge or full bridge resonant topology like a  
electronic ballast, and also low power switching mode power appliances.  
Order Codes  
Item  
1
Sales Type  
SW P 730  
Marking  
SW730  
Package  
TO-220  
Packaging  
TUBE  
Absolute maximum ratings  
Symbol  
Parameter  
Value  
Unit  
VDSS  
ID  
Drain to Source Voltage  
400  
6.5  
V
A
Continuous Drain Current (@TC=25oC)  
Continuous Drain Current (@TC=100oC)  
Drain current pulsed  
3.8  
A
IDM  
VGS  
EAS  
(note 1)  
26  
A
Gate to Source Voltage  
± 30  
450  
V
Single pulsed Avalanche Energy  
Repetitive Avalanche Energy  
Peak diode Recovery dv/dt  
Total power dissipation (@TC=25oC)  
Derating Factor above 25oC  
(note 2)  
(note 1)  
(note 3)  
mJ  
mJ  
V/ns  
W
EAR  
dv/dt  
9.2  
5.3  
92  
PD  
TSTG, TJ  
TL  
0.74  
-55 ~ + 150  
W/oC  
oC  
Operating Junction Temperature & Storage Temperature  
Maximum Lead Temperature for soldering  
purpose, 1/8 from Case for 5 seconds.  
300  
oC  
Thermal characteristics  
Value  
Typ.  
Symbol  
Parameter  
Unit  
Min.  
Max.  
1.35  
Rthjc  
Rthcs  
Rthja  
Thermal resistance, Junction to case  
Thermal resistance, Case to Sink  
oC/W  
oC/W  
oC/W  
0.5  
Thermal resistance, Junction to ambient  
62.5  
Mar. 2011. Rev. 2.0  
Copyright@ SEMIPOWER Electronic Technology Co., Ltd. All rights reserved.  
1/7  
SAMWIN  
SW730  
Electrical characteristic ( TC = 25oC unless otherwise specified )  
Symbol  
Parameter  
Test conditions  
Min.  
Typ.  
Max. Unit  
Off characteristics  
BVDSS  
Drain to source breakdown voltage  
VGS=0V, ID=250uA  
400  
-
-
-
-
V
ΔBVDSS Breakdown voltage temperature  
ID=250uA, referenced to 25oC  
0.54  
V/oC  
/ ΔTJ  
coefficient  
VDS=400V, VGS=0V  
VDS=320V, TC=125oC  
VGS=30V, VDS=0V  
VGS=-30V, VDS=0V  
-
-
-
-
-
-
-
-
1
uA  
uA  
nA  
nA  
IDSS  
Drain to source leakage current  
20  
100  
-100  
Gate to source leakage current, forward  
Gate to source leakage current, reverse  
IGSS  
On characteristics  
VGS(TH) Gate threshold voltage  
RDS(ON) Drain to source on state resistance  
Dynamic characteristics  
VDS=VGS, ID=250uA  
VGS=10V, ID = 3.25A  
2.0  
-
4.0  
1.0  
V
0.8  
Ciss  
Coss  
Crss  
td(on)  
tr  
Input capacitance  
570  
160  
30  
750  
215  
40  
Output capacitance  
Reverse transfer capacitance  
Turn on delay time  
Rising time  
VGS=0V, VDS=25V, f=1MHz  
pF  
ns  
28  
36  
74  
96  
VDS=200V, ID=6.5A, RG=25Ω  
td(off)  
tf  
Turn off delay time  
Fall time  
128  
30  
230  
50  
Qg  
Total gate charge  
Gate-source charge  
Gate-drain charge  
32  
42  
Qgs  
Qgd  
VDS=320V, VGS=10V, ID=6.5A  
4
nC  
10  
Source to drain diode ratings characteristics  
Symbol  
Parameter  
Continuous source current  
Pulsed source current  
Test conditions  
Min.  
Typ.  
Max. Unit  
IS  
-
-
-
-
-
-
-
6.5  
26  
1.5  
-
A
A
Integral reverse p-n Junction  
diode in the MOSFET  
ISM  
VSD  
Diode forward voltage drop.  
Reverse recovery time  
IS=6.5A, VGS=0V  
-
V
Trr  
320  
1.46  
ns  
uC  
IS=6.5A, VGS=0V,  
dIF/dt=100A/us  
Qrr  
Breakdown voltage temperature  
-
. Notes  
1.  
2.  
3.  
4.  
5.  
Repeatitive rating : pulse width limited by junction temperature.  
L = 19.4mH, IAS = 6.5A, VDD = 50V, RG=50Ω, Starting TJ = 25oC  
ISD ≤ 6.5A, di/dt = 300A/us, VDD ≤ BVDSS, Staring TJ =25oC  
Pulse Test : Pulse Width ≤ 300us, duty cycle ≤ 2%  
Essentially independent of operating temperature.  
Copyright@ SEMIPOWER Electronic Technology Co., Ltd. All rights reserved.  
2/7  
SAMWIN  
SW730  
Fig. 1. On-state characteristics  
Fig. 2. Transfer characteristics  
VGS  
Top :  
15.0 V  
10.0 V  
8.0 V  
7.0 V  
6.0 V  
5.5 V  
5.0 V  
101  
101  
Bottom : 4.5 V  
150oC  
100  
25oC  
-55oC  
100  
،
ط
 Notes :  
1. 250¥
ى
s Pulse Test  
2. TC = 25،
ة
 
،
ط
 Notes :  
1. VDS = 30V  
2. 250¥
ى
s Pulse Test  
10-1  
100  
101  
2
3
4
5
6
7
8
9
10  
VDS, Drain-Source Voltage [V]  
VGS, Gate-Source Voltage [V]  
Fig. 3. On-resistance variation vs.  
Fig. 4. On state current vs.  
diode forward voltage  
drain current and gate voltage  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
101  
VGS = 10V  
100  
150،
ة
 
25،
ة
 
VGS = 20V  
،
ط
 Notes :  
1. VGS = 0V  
،
ط
 Note : TJ = 25،
ة
 
2. 250¥
ى
s Pulse Test  
10-1  
0.2  
0
2
4
6
8
10  
12  
14  
16  
0.4  
0.6  
0.8  
1.0  
1.2  
1.4  
1.6  
ID, Drain Current [A]  
VSD, Source-Drain voltage [V]  
Fig. 5. Capacitance characteristics  
(Non-Repetitive)  
Fig. 6. Gate charge characteristics  
Copyright@ SEMIPOWER Electronic Technology Co., Ltd. All rights reserved.  
3/7  
SAMWIN  
SW730  
Fig 7. Breakdown Voltage Variation  
vs. Junction Temperature  
Fig. 8. On resistance variation  
vs. junction temperature  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
1.2  
1.1  
1.0  
،
ط
 Notes :  
1. VGS = 0 V  
،
ط
 Notes :  
1. VGS = 10 V  
0.9  
2. ID = 250 ¥
ى
A  
2. ID = 3 A  
0.8  
-100  
-100  
-50  
0
50  
100  
150  
200  
-50  
0
50  
100  
150  
200  
TJ, Junction Temperature [oC]  
TJ, Junction Temperature [oC]  
Fig. 9. Maximum drain current vs.  
case temperature.  
Fig. 10. Maximum safe operating area  
102  
7
6
5
4
3
2
1
0
Operation in This Area  
is Limited by R DS(on)  
100 s  
101  
1 ms  
10 ms  
DC  
100  
،
ط
 Notes :  
1. TC = 25 o  
C
2. TJ = 150 o  
C
3. Single Pulse  
10-1  
10-1  
100  
101  
102  
103  
25  
50  
75  
100  
125  
150  
TC, Case Temperature [،
ة
]  
VDS, Drain-Source Voltage [V]  
Fig. 11. Transient thermal response curve  
100  
D=0.5  
،
ط
 Notes :  
1. Z¥èJC(t) = 1.28 ،
ة
/W Max.  
0.2  
0.1  
2. Duty Factor, D=t1/t2  
3. TJM - TC = PDM * Z¥èJC(t)  
10-1  
0.05  
0.02  
0.01  
single pulse  
10-2  
10-5  
10-4  
10-3  
10-2  
10-1  
100  
101  
t1, Square Wave Pulse Duration [sec]  
Copyright@ SEMIPOWER Electronic Technology Co., Ltd. All rights reserved.  
4/7  
SAMWIN  
SW730  
Fig. 12. Gate charge test circuit & waveform  
VGS  
Same type  
as DUT  
QG  
VDS  
QGD  
QGS  
DUT  
VGS  
1mA  
Charge  
Fig. 13. Switching time test circuit & waveform  
VDS  
90%  
RL  
VDS  
RG  
VDD  
10%  
10%  
td(on)  
VIN  
tf  
td(off)  
10VIN  
DUT  
tr  
tON  
tOFF  
Fig. 14. Unclamped Inductive switching test circuit & waveform  
BVDSS  
1
2
L X IAS2 X  
EAS =  
BVDSS - VDD  
L
BVDSS  
IAS  
IAS  
VDS  
RG  
VDD  
ID(t)  
DUT  
10VIN  
VDS(t)  
time  
tp  
Copyright@ SEMIPOWER Electronic Technology Co., Ltd. All rights reserved.  
5/7  
SAMWIN  
SW730  
Fig. 15. Peak diode recovery dv/dt test circuit & waveform  
DUT  
10V  
+
-
VGS (DRIVER)  
VDS  
L
di/dt  
IS  
IS (DUT)  
IRM  
VDS  
RG  
Diode reverse current  
VDD  
Diode recovery dv/dt  
Same type  
as DUT  
10VGS  
VDD  
VDS (DUT)  
VF  
*. dv/dt controlled by RG  
*. Is controlled by pulse period  
Body diode forward voltage drop  
Copyright@ SEMIPOWER Electronic Technology Co., Ltd. All rights reserved.  
6/7  
SAMWIN  
SW730  
REVISION HISTORY  
Revision No.  
Changed Characteristics  
Responsible  
Date  
Issuer  
REV 1.0  
REV 2.0  
Origination, First Release  
Alice Nie  
2007.12.05  
XZQ  
Updated the format of datasheet and added  
Order Codes.  
Alice Nie  
2011.03.24  
XZQ  
WWW.SEMIPOWER.COM.CN  
西安芯派电子科技有限公司  
深圳市南方芯源科技有限公司  
地址:西安市高新区高新一路25号创新大厦MF6  
电话:029 - 88253717 传真:029 - 88251977  
地址:深圳市福田区天安数码城时代大厦A2005  
电话:0755 - 83981818 传真:0755 - 83476838  
Copyright@ SEMIPOWER Electronic Technology Co., Ltd. All rights reserved.  
7/7  
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SW7310产品参数
型号:SW7310
生命周期:Active
Reach Compliance Code:unknown
风险等级:5.57
Base Number Matches:1
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