Tantalum Surface Mount Capacitors – Low ESR MnO2 Tantalum & Aluminum Surface Mount Capacitors
T494 Industrial Grade Low ESR MnO2 Series
Soldering Process
KEMET’sꢀfamiliesꢀofꢀsurfaceꢀmountꢀcapacitorsꢀareꢀcompatibleꢀ
Profile Feature
SnPb Assembly Pb-Free Assembly
withꢀwaveꢀ(singleꢀorꢀdual),ꢀconvection,ꢀIR,ꢀorꢀvaporꢀphaseꢀreflowꢀ
Preheat/Soak
techniques. Preheating of these components is recommended
toꢀavoidꢀextremeꢀthermalꢀstress.ꢀKEMET'sꢀrecommendedꢀprofileꢀ
Temperature Minimum (TSmin
)
100°C
150°C
150°C
200°C
Temperature Maximum (TSmax
)
conditionsꢀforꢀconvectionꢀandꢀIRꢀreflowꢀreflectꢀtheꢀprofileꢀconditionsꢀ
of the IPC/J–STD–020D standard for moisture sensitivity testing.
Theꢀdevicesꢀcanꢀsafelyꢀwithstandꢀaꢀmaximumꢀofꢀthreeꢀreflowꢀ
passes at these conditions.
Time (ts) from Tsmin to Tsmax
Ramp-up Rate (TL to TP)
)
60 – 120 seconds
3°C/seconds maximum
183°C
60 – 120 seconds
3°C/seconds maximum
217°C
Liquidous Temperature (TL)
Time Above Liquidous (tL)
60 – 150 seconds
60 – 150 seconds
220°C*
235°C**
250°C*
260°C**
Peak Temperature (TP)
Please note that although the X/7343–43 case size can withstand
waveꢀsoldering,ꢀtheꢀtallꢀprofileꢀ(4.3ꢀmmꢀmaximum)ꢀdictatesꢀcareꢀinꢀ
wave process development.
Time within 5°C of Maximum
Peak Temperature (tP)
20 seconds maximum
6°C/seconds maximum
6 minutes maximum
30 seconds maximum
6°C/seconds maximum
8 minutes maximum
Ramp-down Rate (TP to TL)
Time 25°C to Peak Temperature
Handꢀsolderingꢀshouldꢀbeꢀperformedꢀwithꢀcareꢀdueꢀtoꢀtheꢀdifficultyꢀ
in process control. If performed, care should be taken to avoid
contact of the soldering iron to the molded case. The iron should
be used to heat the solder pad, applying solder between the pad
andꢀtheꢀtermination,ꢀuntilꢀreflowꢀoccurs.ꢀOnceꢀreflowꢀoccurs,ꢀtheꢀ
iron should be removed immediately. “Wiping” the edges of a chip
and heating the top surface is not recommended.
Note: All temperatures refer to the center of the package, measured on the
package body surface that is facing up during assembly reflow.
*Case Size D, E, P, Y, and X
**Case Size A, B, C, H, I, K, M, R, S, T, U, V, W, and Z
TP
tP
Maximum Ramp Up Rate = 3ºC/seconds
Maximum Ramp Down Rate = 6ºC/seconds
TL
tL
Duringꢀtypicalꢀreflowꢀoperations,ꢀaꢀslightꢀdarkeningꢀofꢀtheꢀgold-
colored epoxy may be observed. This slight darkening is normal
and not harmful to the product. Marking permanency is not
affected by this change.
T
smax
T
smin
tS
25
25ºC to Peak
Time
Construction
MnO2 /Ta2O5/Ta
Silver Adhesive
Silver Paint
Washer
Leadframe
Leadframe
(-Cathode)
(+Anode)
Carbon
Tantalum Wire
Weld
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
T2008_T494 • 10/7/2013 14