Tantalum Surface Mount Capacitors – Low ESR
T495 Surge Robust MnO2
Soldering Process
KEMET’sꢀfamiliesꢀofꢀsurfaceꢀmountꢀcapacitorsꢀareꢀcompatibleꢀ
withꢀwaveꢀ(singleꢀorꢀdual),ꢀconvection,ꢀIR,ꢀorꢀvaporꢀphaseꢀ
reflowꢀtechniques.ꢀPreheatingꢀofꢀtheseꢀcomponentsꢀisꢀ
recommended to avoid extreme thermal stress. KEMET's
recommendedꢀprofileꢀconditionsꢀforꢀconvectionꢀandꢀIRꢀ
reflowꢀreflectꢀtheꢀprofileꢀconditionsꢀofꢀtheꢀIPC/J–STD–020Dꢀ
standard for moisture sensitivity testing. The devices can
safelyꢀwithstandꢀaꢀmaximumꢀofꢀthreeꢀreflowꢀpassesꢀatꢀtheseꢀ
conditions.
Profile Feature
Preheat/Soak
SnPb Assembly Pb-Free Assembly
Temperature Minimum (TSmin
)
100°C
150°C
150°C
200°C
Temperature Maximum (TSmax
)
Time (ts)ꢀfromꢀTsmin to Tsmax
Ramp-up Rate (TL to TP)
)
60 – 120 seconds
60 – 120 seconds
3°C/secondꢀmaximum 3°C/secondꢀmaximum
LiquidousꢀTemperatureꢀ(TL)
TimeꢀAboveꢀLiquidousꢀ(tL)
183°C
217°C
60 – 150 seconds
60 – 150 seconds
220°C*ꢀ
235°C**
250°C*
260°C**
Peak Temperature (TP)
Timeꢀwithinꢀ5°CꢀofꢀMaximum
20 seconds maximum 30 seconds maximum
Please note that although the X/7343–43 case size can
withstandꢀwaveꢀsoldering,ꢀtheꢀtallꢀprofileꢀ(4.3ꢀmmꢀmaximum)ꢀ
dictates care in wave process development.
Peak Temperature (tP)
Ramp-down Rate (TP to TL)
6°C/secondꢀmaximum 6°C/secondꢀmaximum
Timeꢀ25°CꢀtoꢀPeakꢀ
Temperature
6 minutes maximum
8 minutes maximum
Note: All temperatures refer to the center of the package, measured on the
package body surface that is facing up during assembly reflow.
*Case Size D, E, P, Y, and X
Hand soldering should be performed with care due to the
difficultyꢀinꢀprocessꢀcontrol.ꢀIfꢀperformed,ꢀcareꢀshouldꢀbeꢀ
taken to avoid contact of the soldering iron to the molded
case. The iron should be used to heat the solder pad, applying
solderꢀbetweenꢀtheꢀpadꢀandꢀtheꢀtermination,ꢀuntilꢀreflowꢀ
occurs.ꢀOnceꢀreflowꢀoccurs,ꢀtheꢀironꢀshouldꢀbeꢀremovedꢀ
immediately. “Wiping” the edges of a chip and heating the top
surface is not recommended.
**Case Size A, B, C, H, I, K, M, R, S, T, U, V, W, and Z
Tꢁ
tꢁ
Maꢀimum Ramp ꢂp Rate ꢃ ꢄꢅCꢆseconꢇ
Maꢀimum Ramp ꢈown Rate ꢃ ꢉꢅCꢆseconꢇ
TL
tL
Tsmaꢀ
Duringꢀtypicalꢀreflowꢀoperations,ꢀaꢀslightꢀdarkeningꢀofꢀtheꢀ
gold-colored epoxy may be observed. This slight darkening is
normal and not harmful to the product. Marking permanency
is not affected by this change.
Tsmin
ts
25
25ꢅC to ꢁeaꢊ
Time
Storage
Tantalum chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in
other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres,
and long term storage. In addition, packaging materials will be degraded by high temperature–reels may soften or warp
andꢀtapeꢀpeelꢀforceꢀmayꢀincrease.ꢀKEMETꢀrecommendsꢀthatꢀmaximumꢀstorageꢀtemperatureꢀnotꢀexceedꢀ40ºCꢀandꢀmaximumꢀ
storageꢀhumidityꢀnotꢀexceedꢀ60%ꢀrelativeꢀhumidity.ꢀTemperatureꢀfluctuationsꢀshouldꢀbeꢀminimizedꢀtoꢀavoidꢀcondensationꢀonꢀ
theꢀpartsꢀandꢀatmospheresꢀshouldꢀbeꢀfreeꢀofꢀchlorineꢀandꢀsulphurꢀbearingꢀcompounds.ꢀForꢀoptimizedꢀsolderabilityꢀchipꢀstockꢀ
should be used promptly, preferably within three years of receipt.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
T2009_T495 • 12/1/2017 21