Fused MnO2 Tantalum Surface Mount Capacitors – T496 Fused MnO2 Series
Soldering Process
KEMET’s families of surface mount capacitors are compatible
withꢀwaveꢀ(singleꢀorꢀdual),ꢀconvection,ꢀIR,ꢀorꢀvaporꢀphaseꢀreflowꢀ
techniques. Preheating of these components is recommended
toꢀavoidꢀextremeꢀthermalꢀstress.ꢀKEMET'sꢀrecommendedꢀprofileꢀ
conditionsꢀforꢀconvectionꢀandꢀIRꢀreflowꢀreflectꢀtheꢀprofileꢀconditionsꢀ
ofꢀtheꢀIPC/J–STD–020Dꢀstandardꢀforꢀmoistureꢀsensitivityꢀtesting.ꢀ
Theꢀdevicesꢀcanꢀsafelyꢀwithstandꢀaꢀmaximumꢀofꢀthreeꢀreflowꢀ
passes at these conditions.
Profile Feature
SnPb Assembly Pb-Free Assembly
Preheat/Soak
Temperature Minimum (TSmin
)
100°C
150°C
150°C
200°C
Temperature Maximum (TSmax
)
Time (ts) from Tsmin to Tsmax
Ramp-up Rate (TL to TP)
)
60 – 120 seconds
3°C/secondsꢀmaximum
183°C
60 – 120 seconds
3°C/secondsꢀmaximum
217°C
LiquidousꢀTemperatureꢀ(TL)
TimeꢀAboveꢀLiquidousꢀ(tL)
60 – 150 seconds
60 – 150 seconds
220°C*ꢀ
235°C**
250°C*
260°C**
Peak Temperature (TP)
Please note that although the X/7343–43 case size can withstand
waveꢀsoldering,ꢀtheꢀtallꢀprofileꢀ(4.3ꢀmmꢀmaximum)ꢀdictatesꢀcareꢀinꢀ
wave process development.
Timeꢀwithinꢀ5°CꢀofꢀMaximum
20 seconds maximum
6°C/secondsꢀmaximum
6 minutes maximum
30 seconds maximum
6°C/secondsꢀmaximum
8 minutes maximum
Peak Temperature (tP)
Ramp-down Rate (TP to TL)
Timeꢀ25°CꢀtoꢀPeakꢀTemperature
Handꢀsolderingꢀshouldꢀbeꢀperformedꢀwithꢀcareꢀdueꢀtoꢀtheꢀdifficultyꢀ
in process control. If performed, care should be taken to avoid
contact of the soldering iron to the molded case. The iron should
be used to heat the solder pad, applying solder between the pad
andꢀtheꢀtermination,ꢀuntilꢀreflowꢀoccurs.ꢀOnceꢀreflowꢀoccurs,ꢀtheꢀ
iron should be removed immediately. “Wiping” the edges of a chip
and heating the top surface is not recommended.
Note: All temperatures refer to the center of the package, measured on the
package body surface that is facing up during assembly reflow.
*Case Size D, E, P, Y, and X
**Case Size A, B, C, H, I, K, M, R, S, T, U, V, W, and Z
TP
tP
Maximum Ramp Up Rate = 3ºC/seconds
Maximum Ramp Down Rate = 6ºC/seconds
TL
tL
Duringꢀtypicalꢀreflowꢀoperations,ꢀaꢀslightꢀdarkeningꢀofꢀtheꢀgold-
colored epoxy may be observed. This slight darkening is normal
and not harmful to the product. Marking permanency is not
affected by this change.
T
smax
T
smin
tS
25
25ºC to Peak
Time
Storage
Tantalum chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other
environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term
storage. In addition, packaging materials will be degraded by high temperature– reels may soften or warp and tape peel force may
increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum storage humidity not exceed 60%
relativeꢀhumidity.ꢀTemperatureꢀfluctuationsꢀshouldꢀbeꢀminimizedꢀtoꢀavoidꢀcondensationꢀonꢀtheꢀpartsꢀandꢀatmospheresꢀshouldꢀbeꢀfreeꢀofꢀ
chlorineꢀandꢀsulphurꢀbearingꢀcompounds.ꢀForꢀoptimizedꢀsolderabilityꢀchipꢀstockꢀshouldꢀbeꢀusedꢀpromptly,ꢀpreferablyꢀwithinꢀthreeꢀyearsꢀ
of receipt.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
T2010_T496 • 4/7/2014 11