TB6600芯片引脚定义引脚图及功能IC贸易商引脚图技术参数-中国IC网-芯三七

TB6600HG

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TOSHIBA BiCD Integrated Circuit Silicon Monolithic

TB6600HG

PWM Chopper-Type bipolar

Stepping Motor Driver IC

The TB6600HG is a PWM chopper-type single-chip bipolar sinusoidal

micro-step stepping motor driver.

TB6600HG

Forward and reverse rotation control is available with 2-phase,

1-2-phase, W1-2-phase, 2W1-2-phase, and 4W1-2-phase excitation

modes.

2-phase bipolar-type stepping motor can be driven by only clock signal

with low vibration and high efficiency.

Features

HZIP25-P-1.00F

•

Single-chip bipolar sinusoidal micro-step stepping motor driver

Ron (upper + lower) = 0.4 Ω (typ.)

Weight:

Forward and reverse rotation control available

Selectable phase drive (1/1, 1/2, 1/4, 1/8, and 1/16 step)

Output withstand voltage: Vcc = 50 V

HZIP25-P-1.00F: 7.7g (typ.)

Output current: I

= 5.0 A (absolute maximum ratings, peak)

OUT

I

= 4.5 A (operating range, maximal value)

OUT

•

Packages: HZIP25-P-1.00F

Built-in input pull-down resistance: 100 kΩ (typ.), (only TQ terminal: 70ｋΩ(typ.))

Output monitor pins (ALERT): Maximum of I

= 1 mA

ALERT

Output monitor pins (MO): Maximum of I

Equipped with reset and enable pins

Stand by function

= 1 mA

MO

Single power supply

Built-in thermal shutdown (TSD) circuit

Built-in under voltage lock out (UVLO) circuit

Built-in over-current detection (ISD) circuit

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Pin Functions

Pin No.

I/O

Symbol

Functional Description

TSD / ISD monitor pin

Remark

1

2

Output

―

ALERT

SGND

TQ

Pull-up by external resistance

Signal ground

3

Input

Output

―

Torque (output current) setting input pin

Select a return type for TSD.

Voltage input for 100% current level

Power supply

4

Latch/Auto

Vref

L: Latch, H: Automatic return

5

6

Vcc

7

M1

Excitation mode setting input pin

B channel output 2

8

M2

9

M3

10

11

12

13

14

15

16

17

18

19

20

21

22

23

OUT2B

N

FB

B channel output current detection pin

B channel output 1

Output

―

OUT1B

PGNDB

OUT2A

Power ground

Output

―

A channel output 2

N

FA

A channel output current detection pin

A channel output 1

Output

―

OUT1A

PGNDA

ENABLE

RESET

Vcc

Power ground

Input

―

Enable signal input pin

H: Enable, L: All outputs off

L: Initial mode

Reset signal input pin

Power supply

CLK

CLK pulse input pin

CW/CCW

OSC

Forward/reverse control pin

Resistor connection pin for internal oscillation setting

L: CW, H:CCW

Connecting capacitor to

SGND

24

25

Output

Vreg

MO

Control side connection pin for power capacitor

Electrical angle monitor pin

Pull-up by external resistance

Input pins

(M1, M2, M3,CLK, CW/CCW,

ENABLE, RESET, Latch/Auto)

(TQ)

V

DD

10kΩ

70kΩ

10kΩ

100kΩ

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Pin Assignment

（Top View）

2

4

6

8

10

12

14

16

18

20

22

24

1

3

5

7

9

11

13

15

17

19

21

23

25

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Block Diagram

Vreg

24

Vcc

MO

25

ALERT

1

6, 20

OUT1A

16

M1

M2

7

8

Reg(5V)

Pre

H-Bridge

driver A

-drive

14

9

M3

CW/CCW

CLK

OUT2A

TSD / ISD / UVLO

N

FA

22

21

19

18

4

15

Input

circuit

Current selector

circuit A

RESET

OUT1B

OUT2B

ENABLE

Latch/Auto

12

Pre

H-Bridge

driver B

-drive

10

11

OSC

Vref

23

5

OSC

1/3

N

FB

Current selector

circuit B

100%/30%

3

2

17

13

TQ

SGND

PGNDA

PGNDB

Setting of Vref

Input

Voltage ratio

TQ

L

30%

H

100%

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Description of Functions

1. Excitation Settings

The excitation mode can be selected from the following eight modes using the M1, M2 and M3 inputs. New

excitation mode starts from the initial mode when M1, M2, or M3 inputs are shifted during motor operation.

In this case, output current waveform may not continue.

Input

Mode

(Excitation)

M1

L

M2

M3

L

Standby mode

(Operation of the internal circuit is almost turned off.)

1/1 (2-phase excitation, full-step)

1/2A type (1-2 phase excitation A type)

( 0%, 71%, 100% )

L

H

L

H

L

1/2B type (1-2 phase excitation B type)

( 0%, 100% )

L

H

L

H

L

1/4 (W1-2 phase excitation)

1/8 (2W1-2 phase excitation)

H

1/16 (4W1-2 phase excitation)

Standby mode

H

(Operation of the internal circuit is almost turned off.)

Note: To change the exciting mode by changing M1, M2, and M3, make sure not to set M1 = M2 = M3 = L or M1 = M2 =

M3 = H.

Standby mode

The operation mode moves to the standby mode under the condition M1 = M2 = M3 = L or M1 = M2 = M3

= H.

The power consumption is minimized by turning off all the operations except protecting operation.

In standby mode, output terminal MO is HZ.

Standby mode is released by changing the state of M1=M2=M3=L and M1=M2=M3=H to other state.

Input signal is not accepted for about 200 μs after releasing the standby mode.

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2. Function

(1)To turn on the output, configure the ENABLE pin high. To turn off the output, configure the ENABLE

pin low.

(2) The output changes to the Initial mode shown in the table below when the ENABLE signal goes High

level and the RESET signal goes Low level. (In this mode, the status of the CLK and CW/CCW pins are

irrelevant.)

(3) As shown in the below figure of Example 1, when the ENABLE signal goes Low level, it sets an OFF on

the output. In this mode, the output changes to the initial mode when the RESET signal goes Low level.

Under this condition, the initial mode is output by setting the ENABLE signal High level. And the motor

operates from the initial mode by setting the RESET signal High level.

^(E（^xa例^mp1^le）¹⁾

CLK

RESET

ENABLE

Internal current set

内部電流設定

(*)

出力電流(A相)

Output current

(phase A )

Z

(*: Output current starts rising at the timing of PWM frequency just after ENABLE pin outputs high.)

Command of the standby has a higher priority

than ENABLE. Standby mode can be turned on

and off regardless of the state of ENABLE.

Input

Output mode

CLK

CW/CCW RESET

ENABLE

L

H

X

H

L

H

L

CW

CCW

X:

Don’t Care

X

Initial mode

Z

X

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3. Initial Mode

When RESET is used, the phase currents are as follows.

Excitation Mode

Phase A Current

Phase B Current

1/1 (2-phase excitation, full-step)

1/2A type (1-2 phase excitation A type) (0%, 71%, 100%)

1/2B type (1-2 phase excitation B type) (0%, 100%)

1/4 (W1-2 phase excitation)

100%

-100%

0%

1/8 (2W1-2 phase excitation)

0%

1/16 (4W1-2 phase excitation)

current direction is defined as follows.

OUT1A → OUT2A: Forward direction

OUT1B → OUT2B: Forward direction

4. 100% current settings (Current value)

100% current value is determined by Vref inputted from external part and the external resistance for

detecting output current. Vref is doubled 1/3 inside IC.

Io (100%) = (1/3 × Vref) ÷ RNF

The average current is lower than the calculated value because this IC has the method of peak current

detection.

Pleas use the IC under the conditions as follows;

0.11Ω ≤ R

≤ 0.5Ω, 0.3V ≤ Vref ≤ 1.95V

NF

5. OSC

Triangle wave is generated internally by CR oscillation by connecting external resistor to OSC terminal.

Rosc should be from 30kΩ to 120kΩ. The relation of Rosc and fchop is shown in below table and figure. The

values of fchop of the below table are design guarantee values. They are not tested for pre-shipment.

Rosc(kΩ)

fchop(kHz)

Min

Typ.

60

Max

30

51

-

40

120

20

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6. Decay Mode

It takes approximately five OSCM cycles for charging-discharging a current in PWM mode. The 40% fast

decay mode is created by inducing decay during the last two cycles in Fast Decay mode.

The ratio 40% of the fast decay mode is always fixed.

The relation between the master clock frequency (fMCLK), the OSCM frequency (fOSCM) and the PWM

frequency (fchop) is shown as follows:

fOSCM = 1/20 ×fMCLK

fchop = 1/100 ×fMCLK

When Rosc=51kΩ, the master clock=4MHz, OSCM=200kHz, the frequency of PWM(fchop)=40kHz.

6-1. Current Waveform and Mixed Decay Mode settings

The period of PWM operation is equal to five periods of OSCM.

The ratio 40% of the fast decay mode is always fixed.

The “NF” refers to the point at which the output current reaches its predefined current level.

MDT means the point of MDT (MIXED DECAY TIMMING) in the below diagram.

f

chop

OSCM

Internal

Waveform

Predefined Current Level

NF

40%

fast

Decay

Mode

MDT

Charge mode → NF: Predefined current level → Slow mode →

MDT(Mixed decay timing) → Fast mode → Current monitoring →

(When predefined current level ＞ Output current) Charge mode

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6-2. Effect of Decay Mode

•

Increasing the current (sine wave)

Predefined

Slow

Current Level

Fast

Charge

Predefined

Slow

Charge

Current Level

Fast

Charge

•

Decreasing the current (In case the current is decreased to the predefined value in a short time because

it decays quickly.)

Predefined

Slow

Current Level

Fast

Charge

Slow

Predefined

Current Level

Slow

Charge

Fast

Charge

Even if the output current rises above the predefined current at the RNF point, the

current control mode is briefly switched to Charge mode for current sensing.

•

Decreasing the current (In case it takes a long time to decrease the current to the predefined value

because the current decays slowly.)

Predefined

Slow

Current Level

Fast

Slow

Charge

Fast

Slow

Fast

Predefined

Current Level

Charge

Even if the output current rises above the predefined current at the RNF point, the

current control mode is briefly switched to Charge mode for current sensing.

During Mixed Decay and Fast Decay modes, if the predefined current level is less than the output current at

the RNF (current monitoring point), the Charge mode in the next chopping cycle will disappear (though the

current control mode is briefly switched to Charge mode in actual operations for current sensing) and the

current is controlled in Slow and Fast Decay modes (mode switching from Slow Decay mode to Fast Decay

mode at the MDT point).

Note: The above figures are rough illustration of the output current. In actual current waveforms, transient response

curves can be observed.

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Current Waveforms in Mixed Decay Mode

6-3.

f

chop

OSCM

Internal

waveform

Predefined Current Level

I

OUT

NF

Predefined

Current Level

NF

40%

Fast

DECAY

MODE

MDT (MIXED DECAY TIMMING) points

•

When the NF points come after Mixed Decay Timing points

Switches to Fast mode after Charge mode

f

chop

Predefined

Current Level

I

NF

OUT

MDT (MIXED DECAY TIMMING) points

NF

Predefined

Current Level

40%

Fast

DECAY

MODE

CLK signal input

•

When the output current value > predefined current level in Mixed Decay mode

f

chop

f

chop

Predefined

Current

Level

NF

I

OUT

NF

Predefined Current

Level

40%

Fast

DECAY

MODE

MDT (MIXED DECAY TIMMING) points

CLK signal input

Even if the output current rises above the predefined current at the

RNF point, the current control mode is briefly switched to Charge

mode for current sensing.

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Output Stage Transistor Operation Mode

Vcc

U1

U2

U1

U2

U1

U2

OFF

ON

Note

OUT1

OUT2

OUT1

OUT2

Load

OUT1 Load OUT2

Load

OFF

L1

L2

L1

L2

ON

L2

ON

L1

ON

OFF

R

NF

R

NF

R

NF

PGND

Charge Mode

Slow Mode

Fast Mode

Output Stage Transistor Operation Functions

CLK

U1

U2

L1

L2

CHARGE

SLOW

ON

OFF

ON

OFF

ON

FAST

ON

OFF

Note: The above chart shows an example of when the current flows as indicated by the arrows in the above figures.

If the current flows in the opposite direction, refer to the following chart:

CLK

U1

U2

L1

L2

CHARGE

SLOW

OFF

ON

OFF

ON

OFF

ON

FAST

OFF

ON

Upon transitions of above-mentioned functions, a dead time of about 300 ns (Design guarantee value) is inserted

respectively.

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Thermal Shut-Down circuit (TSD)

(1) Automatic return

TSD = 160°C (typ.) (Note)

TSDhys = 70°C (typ.) (Note)

160°C (typ.) (Note)

Junction temperature (Chip temperature)

90°C (typ.) (Note)

Output state

Output on

Output off

Output on

H

ALERT output

L

Automatic return has a temperature hysteresis shown in the above figure.

In case of automatic return, the return timing is adjusted at charge start of fchop after the temperature falls to the

return temperature (90°C (typ.) in the above figure).

The return period after the temperature falls corresponds to one cycle to two cycles of fchop.

(2) Latch type

(*)^{Output current starts rising at the}

timing of PWM frequency just after

ENABLE pin outputs high.

TSD = 160°C (typ.)

(Note)

160°C (typ.)

(Note)

(*)

Junction temperature (Chip temperature)

Output state

Output on

Output off

Output on

H

ALERT output

L

H

ENABLE input

L

0.3ms or more when Rosc=51kΩ

The operation returns by programming the ENABLE as H → L → H shown in above figure or turning on power

supply and turning on UVLO function. In this time, term of L level of ENABLE should be 0.3ms or more.

To recover the operation, the junction temperature (the chip temperature) should be 90°C or less when ENABLE

input is switched from L to H level. Otherwise, the operation does not recover.

Note: Pre-shipment testing is not performed.

･State of internal IC when TSD circuit operates.

The states of the internal IC and outputs, while the shutdown circuit is operating, correspond to the state when

ENABLE is L.

The state after automatic return corresponds to the state when ENABLE is H. Please configure the Reset L to

rotate the motor from the initial state.

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Latch/Auto is an input pin for determining the return method of TSD.

If Latch/Auto pin outputs low, TSD function returns by either of turning on power supply again or programming

the ENABLE as H → L → H.

If Latch/Auto pin outputs high, it returns automatically.

In standby mode, TSD function returns automatically regardless of the state of the Latch/Auto pin.

When power supply voltage Vcc is less than 8V, TSD function cannot operate regardless of the state of the

Latch/Auto pin.

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ISD (Over current detection)

Current that flows through output power MOSFETs are monitored individually. If over-current is detected

in at least one of the eight output power MOSFETs, all output power MOSFETs are turned off then this

status is kept until ENABLE signal is input. In this time, term of L level of ENABLE should be 0.3ms or

more.

Masking term of 1μs or more (typ. when Rosc=51kΩ) (Note) should be provided in order to protect detection

error by noise. ISD does not work during the masking term.

Over current detection value ISD=6.5 A

6.5A (typ.)

(Note)

(*)^{Output current starts rising at the}

timing of PWM frequency just after

ENABLE pin outputs high.

(*)

DMOS

Power transistor current

Dead band

1μs or more(typ.)

Output state

Output on

Output off

Output on

H

ALERT output

L

H

ENABLE input

L

0.3ms or more when Rosc=51kΩ

The operation returns by programming the ENABLE as H → L → H shown in above figure or turning

on power supply and turning on UVLO function.

Note: Pre-shipment testing is not performed.

･State of internal IC when ISD circuit operates.

The states of the internal IC and outputs, while the over current detection circuit is operating, correspond to the

state when ENABLE is L.

The state after automatic return corresponds to the state when ENABLE is H. Please configure the Reset L to

rotate the motor from the initial state.

Return method of ISD

ISD function returns by either of turning on power supply again or programming the ENABLE as H → L → H

regardless of the state of the Latch/Auto pin.

In standby mode, ISD function cannot operate.

When power supply voltage Vcc is less than 8V, ISD function cannot operate.

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Under Voltage Lock Out (UVLO) circuit

Outputs are shutoff by operating at 5.5 V (Typ.) of Vcc or less.

It has a hysteresis of 0.5 V (Typ.) and returns to output when Vcc reaches 6.0 V (Typ.). The following values are

design guarantee values.

･State of internal IC when UVLO circuit operates.

The states of the internal IC and outputs correspond to the state in the ENABLE mode and the initial mode at

the same time.

After a return, it can start from the initial mode.

When Vcc falls to around 5.5 V and UVLO operates, output turns off.

It recovers automatically from the initial mode when both Vcc rise to around 6.0 V or more. The following

values are design guarantee values.

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ALERT output

ALERT terminal outputs low in detecting either TSD or ISD.

ALERT terminal is connected to power supply externally via pull-up resistance.

V_ALERT= 0.5 V (max.) at 1 mA

TSD

ISD

ALERT

Under TSD detection Under ISD detection

Normal

Under TSD detection

Normal

Under ISD detection

Normal

Low

Z

Normal

Applied voltage to pull-up resistance is up to 5.5 V. And conducted current is up to 1 mA.

It is recommended to gain 5 V by connecting the external pull-up resistance to Vreg pin.

MO output

MO turns on at the predetermined state and output low.

MO terminal is connected to power supply externally via pull-up resistance.

V_MO= 0.5 V (max.) at 1 mA

State

MO

Initial

Low

Z

Not initial

Applied voltage to pull-up resistance is up to 5.5 V. And conducted current is up to 1 mA.

It is recommended to gain 5 V by connecting the external pull-up resistance to Vreg pin.

(To pull-up resistance)

(To Vreg in the IC)

Voltage pull-up of MO and ALERT pins

･It is recommended to pull-up voltage to Vreg pin.

･In case of pull-up to except 5 V (for instance, 3.3 V etc.), it is recommended to use other power supply (ex. 3.3 V)

while Vcc output between the operation range. When Vcc decreases lower than the operation range and Vreg

decreases from 5 V to 0 V under the condition that other power supply is used to pull-up voltage, the current

continues to conduct from other power supply to the IC inside through the diode shown in the figure. Though this

phenomenon does not cause destruction and malfunction of the IC, please consider the set design not to continue

such a state for a long time.

･As for the pull-up resistance for MO and ALERT pins, please select large resistance enough for the conducting

current so as not to exceed the standard value of 1 mA.

Please use the resistance of 30 kΩ or more in case of applying 5 V, and 20 kΩ or more in case of applying 3.3 V.

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Sequence and current level in each excitation mode

1/1-step Excitation Mode (M1: L, M2: L, M3: H, CW Mode)

CLK

MO

(%)

100

I

0

A

−100

(%)

100

I

0

B

−100

3

0

1

2

4

5

6

7

8

t

1/1-step Excitation Mode (M1: L, M2: L, M3: H, CCW Mode)

CLK

MO

(%)

100

I

0

A

−100

(%)

100

I

0

B

−100

t

8

0

1

2

3

4

5

6

7

It operates from the initial state after the excitation mode is switched.

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1/2-step Excitation Mode (A type) (M1: L, M2: H, M3: L, CW Mode)

CLK

MO

(%)

100

71

I

0

A

−71

−100

(%)

100

71

I

0

B

−71

−100

t

8

0

1

2

3

4

5

6

7

1/2-step Excitation Mode (A type) (M1: L, M2: H, M3: L, CCW Mode)

CLK

MO

(%)

100

71

I

0

A

−71

−100

(%)

100

71

I

0

B

−71

−100

t

8

0

1

2

3

4

5

6

7

It operates from the initial state after the excitation mode is switched.

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1/2-step Excitation Mode (B type) (M1: L, M2: H, M3: H, CW Mode)

CLK

MO

(%)

100

I

0

A

−100

(%)

100

I

0

B

−100

t

8

0

1

2

3

4

5

6

7

1/2-step Excitation Mode (B type) (M1: L, M2: H, M3: H, CCW Mode)

CLK

MO

(%)

100

I

0

A

−100

(%)

100

71

I

0

B

−71

−100

t

8

0

1

2

3

4

5

6

7

It operates from the initial state after the excitation mode is switched.

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1/4-step Excitation Mode (M1: H, M2: L, M3: L, CW Mode)

CLK

MO

(%)

100

92

71

38

I

0

A

−38

−71

−92

−100

(%)

100

92

71

38

I

0

B

−38

−71

−92

−100

t

16

0

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

1/4-step Excitation Mode (M1: H, M2: L, M3: L, CCW Mode)

CLK

MO

(%)

100

92

71

38

I

0

A

−38

−71

−92

−100

(%)

100

92

71

38

I

0

B

−38

−71

−92

−100

t

16

0

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

It operates from the initial state after the excitation mode is switched.

20

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1/8-Step Excitation Mode (M1: H, M2: L, M3: H, CW Mode)

CLK

MO

(%)

100

98

92

83

71

56

38

20

0

I

A

−20

−38

−56

−71

−83

−92

−98

−100

(%)

100

98

92

83

71

56

38

20

0

I

B

−20

−38

−56

−71

−83

−92

−98

−100

t

t t t t t t t t t t t t t t t t t t t t t t t t

9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32

0

1

2

3

4

5

6

7

8

It operates from the initial state after the excitation mode is switched.

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1/8-Step Excitation Mode (M1: H, M2: L, M3: H, CCW Mode)

CLK

MO

(%)

100

98

92

83

71

56

38

20

0

I

A

−20

−38

−56

−71

−83

−92

−98

−100

(%)

100

98

92

83

71

56

38

20

0

I

B

−20

−38

−56

−71

−83

−92

−98

−100

t

t t t t t t t t t t t t t t t t t t t t t t t t

9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32

0

1

2

3

4

5

6

7

8

It operates from the initial state after the excitation mode is switched.

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1/16-step Excitation Mode (M1: H, M2: H, M3: L, CW Mode)

CLK

MO

[%]

100

98

96

92

88

83

77

71

63

I

A

56

47

38

I

B

29

20

10

0

−10

−20

−29

−38

−47

−56

−63

−71

−77

−83

−88

−92

−96

−98

−100

t0･･･････････････････････････････････････････････････････････････････････････････････････････････････････････････････････t64

It operates from the initial state after the excitation mode is switched.

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1/16-step Excitation Mode (M1: H, M2: H, M3: L, CCW Mode)

CLK

MO

[%]

100

98

96

92

88

83

77

I

A

71

63

56

47

38

I

B

29

20

10

0

−10

−20

−29

−38

−47

−56

−63

−71

−77

−83

−88

−92

−96

−98

−100

t0･･･････････････････････････････････････････････････････････････････････････････････････････････････････････････････････t64

It operates from the initial state after the excitation mode is switched.

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Current level

2-phase, 1-2-phase, W1-2-phase, 2W1-2-phase, 4W1-2-phase excitation (unit: %)

Current level (1/16, 1/8, 1/4, 1/2, 1/1 )

1/16,

Min.

Typ.

Max.

Unit

1/8, 1/4,

1/2, 1/1

θ16

θ15

θ14

θ13

θ12

θ11

θ10

θ9

---

95.5

94.1

91.7

88.4

84.2

79.1

73.3

66.7

59.4

51.6

43.1

34.3

25.0

15.5

5.8

100.0

99.5

98.1

95.7

92.4

88.2

83.1

77.3

70.7

63.4

55.6

47.1

38.3

29.0

19.5

9.8

---

100.0

99.7

96.4

92.2

87.1

81.3

74.7

67.4

59.6

51.1

42.3

33.0

23.5

13.8

---

％

θ8

θ7

θ6

θ5

θ4

θ3

θ2

θ1

θ0

---

0.0

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Absolute Maximum Ratings (Ta = 25°C)

Characteristic

Symbol

Rating

50

Unit

V

Power supply voltage

Vcc

I

O

Output current (per one phase)

5.0

1

A

(PEAK)

I

(ALERT)

Drain current (ALERT, MO)

Input voltage

mA

V

I

(MO)

V

6

IN

3.2 (Note 1)

40 (Note 2)

-30 to 85

Power dissipation

P

W

D

Operating temperature

Storage temperature

T

opr

°C

T

stg

-55 to 150

Note 1:

Note 2:

Ta = 25°C, No heatsink

Ta = 25°C, with infinite heatsink.

The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a

moment. Do not exceed any of these ratings.

Exceeding the rating (s) may cause the device breakdown, damage or deterioration, and may result injury by explosion

or combustion.

Please use the IC within the specified operating ranges.

Operating Range (Ta = −30~85°C)

Characteristic

Symbol

Vcc

Test Condition

Min

8.0

Typ.

Max

42

Unit

V

Power supply voltage

―

Output current

Input voltage

I

―

0

―

4.5

5.5

A

V

OUT

V

IN

V

0.3

―

1.95

200

V

ref

Clock frequency in logical part

Chopping frequency

f

kHz

CLK

f

20

40

60

kHz

See page 7.

chop

Note:

Two Vcc terminals should be programmed the same voltage.

The maximum current of the operating range can not be necessarily conducted depending on various

conditions because output current is limited by the power dissipation P_D.

Make sure to avoid using the IC in the condition that would cause the temperature to exceed Tj (avg.)

=107°C.

The power supply voltage of 42 V and the output current of 4.5 A are the maximum values of operating range.

Please design the circuit with enough derating within this range by considering the power supply variation, the

external resistance, and the electrical characteristics of the IC. In case of exceeding the power supply voltage

of 42 V and the output current of 4.5 A, the IC will not operate normally.

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Electrical Characteristics (Ta = 25°C, Vcc = 24 V)

Characteristic

Symbol

Test Condition

Min

Typ.

Max

Unit

High

Low

V

2.0

-0.2

―

5.5

0.8

―

IN (H)

Input voltage

V

M1, M2, M3, CW/CCW, CLK,

RESET, ENABLE, Latch/Auto, TQ

V

IN (L)

Input hysteresis voltage

V

400

mV

H

M1, M2, M3, CW/CCW, CLK,

RESET, ENABLE, Latch/Auto

―

50

70

―

75

105

1

I

V

= 5.0 V

IN (H)

IN

Input current

TQ,

V

= 5.0 V

μA

IN

M1, M2, M3, CW/CCW, CLK,

RESET, ENABLE, Latch/Auto, TQ

I

IN (L)

V

= 0 V

IN

Output open,

RESET: H, ENABLE: H､

M1:L, M2:L, M3:H (1/1-step mode)

CLK:L

Icc

―

4.2

3.6

7

1

2

Vcc supply current

Output open,

mA

RESET: L, ENABLE: L

M1:L, M2:L, M3:H (1/1-step mode)

CLK:L

Icc

Standby mode (M1:L, M2:L, M3:L)

Vref = 3.0 V(Note 1), TQ=H

―

1.8

1.0

4

3

NF

V

Current limit

voltage

V

0.9

1.1

V

Vref input

circuit

―

Input current

Divider ratio

I

Vref = 3.0 V(Note 1)

1

μA

IN( ref)

―

V

/V

ref NF

Maximum current: 100%, TQ=H

3

tw

CLKH

Minimum CLK pulse width

Output residual voltage

CLK

2.2

―

μs

tw

CLKL

V

MO

OL

I

= 1 mA

―

0.5

V

OL

V

ALERT

OL

External capacitor = 0.1 μF

(in standby mode)

Internal constant voltage

Chopping frequency

Vreg

f_chop

4.5

28

5.0

40

5.5

52

V

Rosc=51kΩ

kHz

Note 1: Though Vref of the test condition for pre-shipment is 3.0V, make sure to configure Vref within the operating

range which is written in page 26 in driving the motor.

Electrical Characteristics (Ta = 25°C, Vcc = 24 V)

Characteristic

Symbol

Test Condition

I = 4 A

OUT

Min

Typ.

0.4

Max

0.6

Unit

Output ON resistor

Ron + Ron

―

Ω

U

L

t

―

50

500

―

5

r

Output transistor switching characteristics

V

= 0 V, Output: Open

ns

NF

t

f

I_LH

Upper side

Output leakage

Vcc = 50 V

μA

current

Lower side

I

―

5

LL

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Timing Waveforms and Names

tw

CLKH

tw

CLKH

CLK

tw

CLKL

Figure 1 Timing Waveforms and Names

Vcc

90%

OUT1A, OUT2A,

OUT1B, OUT2B

10%

GND

t

f

r

Figure 2 Timing Waveforms and Names

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Power Dissipation

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P

– Ta

D

80

60

40

20

0

①

②

③

Infinite heatsink

Rθj-c = 1°C/W

HEATSINK (RθHS = 3.5°C/W)

Rθj-c + RθHS = 4.5°C/W

IC only

Rθj-a = 39°C/W

①

②

③

0

25

50

75

100

125

150

Ambient temperature Ta (°C)

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1. How to Turn on the Power

In applying Vcc or shutdown, ENABLE should be Low.

See Example 1(ENABLE = High → RESET = High) and Example 2(RESET = High → ENABLE = High)

as follows. In example 1, a motor can start driving from the initial mode.

(1) CLK: Current step proceeds to the next mode with respect to every rising edge of CLK.

(2) ENABLE: It is in Hi-Z state in low level. It is output in high level.

RESET: It is in the initial mode (Phase A=100% and Phase B=0%) in low level.

①ENABLE=Low and RESET=Low: Hi-Z. Internal current setting is in initial mode.

②ENABLE=Low and RESET=High: Hi-Z. Internal current setting proceeds by internal counter.

③ENABLE=High and RESET=Low: Output in the initial mode (Phase A=100% and Phase B=0%).

④ENABLE=High and RESET=High: Output at the value which is determined by the internal counter.

^(E（^xa例^mp1^le）¹⁾

CLK

RESET

ENABLE

Internal current set

内部電流設定

(*)

Output current

(Phase A)

出力電流(A相)

Z

^(Ex（^am例^pl2^e）²⁾

CLK

RESET

ENABLE

Internal current set

内部電流設定

(*)

Output current

(Phase A)

出力電流(A相)

Z

(*：Output current starts rising at the timing of PWM frequency just after ENABLE pin outputs high.)

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Application Circuit

0.1μF 47μF

fuse

24V

0.1μF

Vreg

MO

ALERT

Vcc

OUT1A

Reg (5V)

M1

M2

H-Bridge

Pre

driver A

-drive

M3

OUT2A

MCU

N

FA

TSD/ISD/UVLO

Control

logic

CW/CCW

CLK

0.2Ω

Current selector

circuit A

24V

RESET

ENABLE

Pre

H-Bridge

driver B

OUT1B

OUT2B

-drive

Latch/Auto

TQ

100%/

30%

N

FB

Current selector

circuit B

1/3

Vref

0.2Ω

OSC

51kΩ

SGND

PGNDA PGNDB

Note 1:

Capacitors for the power supply lines should be connected as close to the IC as possible.

Note 2:

Note 3:

Note 4:

Current detecting resistances (RNFA and RNFB) should be connected as close to the IC as possible.

Pay attention for wire layout of PCB not to allow GND line to have large common impedance.

External capacitor connecting to Vreg should be 0.1μF. Pay attention for the wire between this

capacitor and Vreg terminal and the wire between this capacitor and SGND not to be influenced by

noise.

Note 5:

The IC may not operate normally when large common impedance is existed in GND line or the IC is

easily influenced by noise. For example, if the IC operates continuously for a long time under the

circumstance of large current and high voltage, the number of clock signals inputted to CLK

terminal and that of steps of output current waveform may not proportional. And so, the IC may not

operate normally. To avoid this malfunction, make sure to conduct Note.1 to Note.4 and evaluate

the IC enough before using the IC.

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Package Dimensions

Unit: mm

Note

Note：These dimensions are measured from the surface of the heat sink.

Weight: 7.7 g (typ.)

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Notes on Contents

1. Block Diagrams

Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for

explanatory purposes.

2. Equivalent Circuits

The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory

purposes.

3. Timing Charts

Timing charts may be simplified for explanatory purposes.

4. Application Circuits

The application circuits shown in this document are provided for reference purposes only. Thorough evaluation

is required, especially at the mass production design stage.

Toshiba does not grant any license to any industrial property rights by providing these examples of application

circuits.

5. Test Circuits

Components in the test circuits are used only to obtain and confirm the device characteristics. These components

and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment.

IC Usage Considerations

Notes on handling of ICs

[1] The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even

for a moment. Do not exceed any of these ratings.

Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by

explosion or combustion.

[2] Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over

current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute

maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the

wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To

minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse

capacity, fusing time and insertion circuit location, are required.

[3] If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to

prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON

or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause

injury, smoke or ignition.

Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the

protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition.

[4] Do not insert devices in the wrong orientation or incorrectly.

Make sure that the positive and negative terminals of power supplies are connected properly.

Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the

rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or

combustion.

In addition, do not use any device that is applied the current with inserting in the wrong orientation or

incorrectly even just one time.

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Points to remember on handling of ICs

(1) Over current Detection Circuit

Over current detection circuits (referred to as current limiter circuits) do not necessarily protect ICs under all

circumstances. If the over current detection circuits operate against the over current, clear the over current

status immediately.

Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause

the over current detection circuit to not operate properly or IC breakdown before operation. In addition,

depending on the method of use and usage conditions, if over current continues to flow for a long time after

operation, the IC may generate heat resulting in breakdown.

(2) Thermal Shutdown Circuit

Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the thermal shutdown

circuits operate against the over temperature, clear the heat generation status immediately.

Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause

the thermal shutdown circuit to not operate properly or IC breakdown before operation.

(3) Heat Radiation Design

In using an IC with large current flow such as power amp, regulator or driver, please design the device so that

heat is appropriately radiated, not to exceed the specified junction temperature (T_j) at any time and condition.

These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease

in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into

considerate the effect of IC heat radiation with peripheral components.

(4) Back-EMF

When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor’s

power supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the

device’s motor power supply and output pins might be exposed to conditions beyond absolute maximum ratings.

To avoid this problem, take the effect of back-EMF into consideration in system design.

(5) Short-circuiting between outputs, air contamination faults, faults due to improper grounding, short-circuiting

between contiguous pins

Utmost care is necessary in the design of the power supply lines, GND lines, and output lines since the IC may

be destroyed by short-circuiting between outputs, air contamination faults, or faults due to improper grounding,

or by short-circuiting between contiguous pins. They may destroy not only the IC but also peripheral parts and

may contribute to injuries for users. Over current may continue to flow in the IC because of this destruction

and cause smoke or ignition of the IC. Expect the volume of this over current and add an appropriate power

supply fuse in order to minimize the effects of the over current. Capacity of the fuse, fusing time, and the

inserting position in the circuit should be configured suitably.

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RESTRICTIONS ON PRODUCT USE

•

Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information

in this document, and related hardware, software and systems (collectively "Product") without notice.

This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with

TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.

Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are

responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and

systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily

injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the

Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of

all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes

for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the

instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their

own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such

design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,

diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating

parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR

APPLICATIONS.

•

PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE

EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH

MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT

("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without

limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for

automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions,

safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE

PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your

TOSHIBA sales representative.

•

Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.

Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any

applicable laws or regulations.

•

The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any

infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to

any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.

ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE

FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY

WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR

LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND

LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO

SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS

FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.

•

Do not use or otherwise make available Product or related software or technology for any military purposes, including without

limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile

technology products (mass destruction weapons). Product and related software and technology may be controlled under the

applicable export laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the

U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited

except in compliance with all applicable export laws and regulations.

Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.

Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,

including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES

OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.

35

北京芯时代电话：010-81595170 网址：www.chipspower.com

2014-01-30

型号:	TB6607FLG
是否Rohs认证：	符合
生命周期：	Obsolete
零件包装代码：	QFN
包装说明：	HVQCCN, LCC36,.25SQ,20
针数：	36
Reach Compliance Code：	unknown
ECCN代码：	EAR99
HTS代码：	8542.39.00.01
风险等级：	5.84
模拟集成电路 - 其他类型：	STEPPER MOTOR CONTROLLER
JESD-30 代码：	S-PQCC-N36
长度：	6.21 mm
功能数量：	3
端子数量：	36
最高工作温度：	85 °C
最低工作温度：	-20 °C
最大输出电流：	0.8 A
封装主体材料：	PLASTIC/EPOXY
封装代码：	HVQCCN
封装等效代码：	LCC36,.25SQ,20
封装形状：	SQUARE
封装形式：	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
电源：	3 V
认证状态：	Not Qualified
座面最大高度：	0.9 mm
子类别：	Motion Control Electronics
最大供电电流 (Isup)：	2 mA
最大供电电压 (Vsup)：	5.5 V
最小供电电压 (Vsup)：	2.7 V
标称供电电压 (Vsup)：	3 V
表面贴装：	YES
技术：	BICMOS
温度等级：	OTHER
端子形式：	NO LEAD
端子节距：	0.5 mm
端子位置：	QUAD
宽度：	6.21 mm
Base Number Matches：	1

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