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产品型号TB67S101AFNG的Datasheet PDF文件预览

TB67S101AFG/FTG/FNG  
TOSHIBA BiCD Integrated Circuit Silicon Monolithic  
TB67S101AFG, TB67S101AFTG, TB67S101AFNG  
FG  
PHASE-in controlled Bipolar Stepping Motor Driver  
The TB67S101A is a two-phase bipolar stepping motor driver  
using a PWM chopper. An interface is PHASE in control.  
Fabricated with the BiCD process, rating is 50 V/4.0 A .  
HSOP28-P-0450-0.80  
Features  
Weight 0.79g (Typ.)  
BiCD process integrated monolithic IC.  
Capable of controlling 1 bipolar stepping motor.  
PWM controlled constant-current drive.  
Allows full, half, quarter step operation.  
Low on-resistance (High + Low side=0.49Ω(typ)) MOSFET  
output stage.  
FTG  
High efficiency motor current control mechanism (Advanced  
Dynamic Mixed Decay)  
High voltage and current (For specification, please refer to absolute  
maximum ratings and operation ranges)  
Built-in error detection circuits (Thermal shutdown (TSD),  
over-current shutdown (ISD), and power-on reset (POR))  
Built-in VCC regulator for internal circuit use.  
Chopping frequency of a motor can be customized  
by external resistance and condenser.  
P-WQFN48-0707-0.50-003  
Weight 0.10g (Typ.)  
FNG  
Multi package lineup  
TB67S101AFG: HSOP28-P-450-0.80  
TB67S101AFTG: P-WQFN48-0707-0.50-003  
TB67S101AFNG: HTSSOP48-P-300-0.50  
HTSSOP48-P-300-0.50  
Weight 0.21g (typ.)  
Note) Please be careful about thermal conditions during use.  
2013-11-05  
1
TB67S101AFG/FTG/FNG  
1. Pin assignment (TB67S101A)  
(Top View)  
INA1  
INA2  
1
28  
27  
26  
25  
24  
23  
22  
OSCM  
VREFA  
2
3
4
VREFB  
NC  
NC  
PHASEA  
PHASEB  
INB1  
INB2  
5
6
VCC  
VM  
STANDBY  
7
FIN(GND)  
FIN(GND)  
FG  
RSA  
NC  
OUTA+  
NC  
8
9
21  
20  
19  
18  
17  
RSB  
NC  
10  
11  
OUTB+  
NC  
GND  
12  
13  
14  
GND  
OUTA-  
GND  
16  
15  
OUTB-  
GND  
Please mount the FIN of the HSOP package to the GND area of the PCB.  
(Top View)  
29  
26 25  
28  
27  
32  
30  
31  
36 35  
34 33  
24  
NC  
37  
38  
39  
NC  
NC  
23 NC  
22 GND  
NC  
21 OUTB-  
40  
41  
42  
43  
44  
45  
46  
47  
48  
GND  
VREFB  
VREFA  
OSCM  
20  
OUTB-  
19 GND  
18  
FTG  
GND  
17 OUTA-  
INA1  
INA2  
16  
15  
OUTA-  
GND  
PHASEA  
PHASEB  
NC  
14 NC  
13  
NC  
3
6
9
10  
12  
11  
1
4
7
2
5
8
Please mount the four corner pins of the QFN package and the exposed pad to the GND area of the PCB.  
2013-11-05  
2
TB67S101AFG/FTG/FNG  
(Top View)  
OSCM  
NC  
1
48  
47  
46  
45  
44  
43  
42  
41  
40  
39  
38  
37  
36  
VREFA  
VREFB  
GND  
NC  
2
3
4
INA1  
INA2  
PHASEA  
NC  
5
6
NC  
NC  
PHASEB  
INB1  
NC  
VCC  
NC  
7
8
INB2  
9
VM  
10  
11  
12  
13  
STANDBY  
GND  
NC  
NC  
RSA  
NC  
RSB  
RSB  
NC  
FNG  
RSA  
NC  
OUTA+  
OUTA+  
NC  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
35  
34  
33  
OUTB+  
32  
31  
30  
29  
28  
27  
26  
25  
OUTB+  
NC  
NC  
NC  
GND  
GND  
NC  
OUTA-  
NC  
OUTB-  
OUTA-  
OUTB-  
GND  
GND  
24  
Please mount the exposed pad of the HTSSOP package to the GND area of the PCB.  
2013-11-05  
3
TB67S101AFG/FTG/FNG  
2. TB67S101A Block diagram  
OSCM  
Motor  
Oscillator  
INA1  
INA2  
OSC-Clock  
Converter  
VCC  
VCC  
Regulator  
System  
Oscillator  
Standby  
Control  
+
Phase/Step  
Selector  
+
INB1  
INB2  
VM  
Power-on  
Reset  
PHASEA  
PHASEB  
Signal Decode  
Logic  
VREFA  
Current  
Current  
Level  
Set  
Reference  
VREFB  
STANDBY  
Setting  
Current  
Comp  
Motor Control Logic  
Current  
Comp  
Predriver  
TSD  
ISD  
Predriver  
RSA  
RSB  
GND  
OUTA+  
OUTA-  
OUTB+  
OUTB-  
Functional blocks/circuits/constants in the block chart etc. may be omitted or simplified for explanatory purposes.  
2013-11-05  
4
TB67S101AFG/FTG/FNG  
Application Notes  
All the grounding wires of the TB67S101A must run on the solder mask on the PCB and be externally terminated  
at only one point. Also, a grounding method should be considered for efficient heat dissipation.  
Careful attention should be paid to the layout of the output, VDD(VM) and GND traces, to avoid short circuits  
across output pins or to the power supply or ground. If such a short circuit occurs, the device may be permanently  
damaged.  
Also, the utmost care should be taken for pattern designing and implementation of the device since it has power  
supply pins (VM, RS, OUT, GND) through which a particularly large current may run. If these pins are wired  
incorrectly, an operation error may occur or the device may be destroyed.  
The logic input pins must also be wired correctly. Otherwise, the device may be damaged owing to a current  
running through the IC that is larger than the specified current.  
2013-11-05  
5
TB67S101AFG/FTG/FNG  
3. Pin explanations  
TB67S101AFG (HSOP28)  
Pin No.1 – 28  
Pin No.  
Pin Name  
Function  
1
INA1  
INA2  
Motor Ach excitation control input 1  
Motor Ach excitation control input 2  
2
3
PHASEA  
PHASEB  
INB1  
Current direction signal input for motor Ach  
Current direction signal input for motor Bch  
Motor Bch excitation control input 1  
4
5
6
INB2  
Motor Bch excitation control input 2  
7
STANDBY  
RSA  
All-function-initializing and Low power dissipation mode  
Motor Ach current sense pin  
8
9
NC  
Non-connection pin  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
OUTA+  
NC  
Motor Ach (+) output pin  
Non-connection pin  
Ground pin  
GND  
OUTA  
GND  
Motor Ach (-) output pin  
Ground pin  
Ground pin  
GND  
OUTB-  
GND  
Motor Bch (-) output pin  
Ground pin  
NC  
Non-connection pin  
OUTB+  
NC  
Motor Bch (+) output pin  
Non-connection pin  
RSB  
Motor Bch current sense pin  
Motor power supply pin  
VM  
VCC  
Internal VCC regulator monitor pin  
Non-connection pin  
NC  
Non-connection pin  
NC  
VREFB  
VREFA  
OSCM  
Motor Bch output set pin  
Motor Ach output set pin  
Oscillating circuit frequency for chopping set pin  
Please do not run patterns under NC pins.  
2013-11-05  
6
TB67S101AFG/FTG/FNG  
3. Pin explanations  
TB67S101AFTG (QFN48)  
Pin No.1 – 28  
Pin No.  
Pin Name  
Function  
1
NC  
INB1  
Non-connection pin  
2
Motor Bch excitation control input 1  
Motor Bch excitation control input 2  
3
INB2  
4
STANDBY  
GND  
All-function-initializing and Low power dissipation mode  
Ground pin  
5
6
NC  
Non-connection pin  
7
RSA(*)  
RSA(*)  
NC  
Motor Ach current sense pin  
Motor Ach current sense pin  
Non-connection pin  
8
9
Motor Ach (+) output pin  
Motor Ach (+) output pin  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
OUTA(*)  
OUTA(*)  
NC  
Non-connection pin  
Non-connection pin  
Non-connection pin  
NC  
NC  
GND  
Ground pin  
Motor Ach (-) output pin  
Motor Ach (-) output pin  
OUTA(*)  
OUTA(*)  
GND  
Ground pin  
Ground pin  
GND  
Motor Bch (-) output pin  
Motor Bch (-) output pin  
OUTB(*)  
OUTB(*)  
GND  
Ground pin  
Non-connection pin  
NC  
Non-connection pin  
NC  
Non-connection pin  
NC  
Motor Bch (+) output pin  
Motor Bch (+) output pin  
OUTB(*)  
OUTB(*)  
NC  
Non-connection pin  
2013-11-05  
7
TB67S101AFG/FTG/FNG  
Pin No.29 – 48  
Pin No.  
Pin Name  
Function  
29  
30  
31  
32  
33  
34  
35  
36  
37  
38  
39  
40  
41  
42  
43  
44  
RSB(*)  
RSB(*)  
NC  
Motor Bch current sense pin  
Motor Bch current sense pin  
Non-connection pin  
VM  
Motor power supply pin  
Non-connection pin  
NC  
VCC  
NC  
Internal VCC regulator monitor pin  
Non-connection pin  
Non-connection pin  
NC  
Non-connection pin  
NC  
Non-connection pin  
Non-connection pin  
NC  
NC  
GND  
VREFB  
VREFA  
OSCM  
INA1  
Ground pin  
Motor Bch output set pin  
Motor Ach output set pin  
Oscillating circuit frequency for chopping set pin  
Motor Ach excitation control input 1  
45  
46  
47  
48  
INA2  
PHASEA  
PHASEB  
NC  
Motor Ach excitation control input 2  
Current direction signal input for motor Ach  
Current direction signal input for motor Bch  
Non-connection pin  
(*) Note:  
Please do not run patterns under NC pins.  
Please connect the pins with the same pin name, while using the TB67S101A.  
2013-11-05  
8
TB67S101AFG/FTG/FNG  
3. Pin explanations  
TB67S101AFNG (HTSSOP48)  
Pin No.1 – 28  
Pin No.  
Pin Name  
Function  
1
OSCM  
NC  
Oscillating circuit frequency for chopping set pin  
Non-connection pin  
2
Motor Ach excitation control input 1  
Motor Ach excitation control input 2  
3
INA1  
4
INA2  
5
PHASEA  
NC  
Current direction signal input for motor Ach  
6
Non-connection pin  
7
PHASEB  
INB1  
Current direction signal input for motor Bch  
Motor Bch excitation control input 1  
8
Motor Bch excitation control input 2  
9
INB2  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
STANDBY  
GND  
All-function-initializing and Low power dissipation mode  
Ground pin  
NC  
Non-connection pin  
Motor Ach current sense pin  
RSA(*)  
RSA(*)  
NC  
Motor Ach current sense pin  
Non-connection pin  
Motor Ach (+) output pin  
OUTA(*)  
OUTA(*)  
NC  
Motor Ach (+) output pin  
Non-connection pin  
Non-connection pin  
Ground pin  
NC  
GND  
NC  
Non-connection pin  
Motor Ach (-) output pin  
OUTA(*)  
OUTA(*)  
GND  
Motor Ach (-) output pin  
Ground pin  
Ground pin  
GND  
Motor Bch (-) output pin  
Motor Bch (-) output pin  
OUTB(*)  
OUTB(*)  
NC  
Non-connection pin  
2013-11-05  
9
TB67S101AFG/FTG/FNG  
Pin No.29 – 48  
Pin No.  
Pin Name  
Function  
29  
30  
31  
32  
33  
34  
35  
36  
37  
38  
39  
40  
41  
42  
43  
44  
GND  
NC  
Ground pin  
Non-connection pin  
Non-connection pin  
Motor Bch (+) output pin  
Motor Bch (+) output pin  
NC  
OUTB(*)  
OUTB(*)  
NC  
Non-connection pin  
Motor Bch current sense pin  
Motor Bch current sense pin  
RSB(*)  
RSB(*)  
NC  
Non-connection pin  
Non-connection pin  
Motor power supply pin  
Non-connection pin  
NC  
VM  
NC  
VCC  
NC  
Internal VCC regulator monitor pin  
Non-connection pin  
Non-connection pin  
Non-connection pin  
Non-connection pin  
NC  
NC  
45  
46  
47  
48  
NC  
GND  
Ground pin  
VREFB  
VREFA  
Motor Bch output set pin  
Motor Ach output set pin  
(*) Note:  
Please do not run patterns under NC pins.  
Please connect the pins with the same pin name, while using the TB67S101A.  
2013-11-05  
10  
TB67S101AFG/FTG/FNG  
4. INPUT/OUTPUT equivalent circuit (TB67S101A)  
Pin name  
IN/OUT signal  
Equivalent circuit  
1kΩ  
INA1  
Logic  
Input  
Pin  
INA2  
PHASEA  
INB1  
Digital Input (VIH/VIL)  
INB2  
VIH: 2.0V(min)~5.5V(max)  
VIL : 0V(min)~0.8V(max)  
PHASEB  
STANDBY  
GND  
VCC  
VCC  
VCC voltage range  
1kΩ  
4.75V(min)~5.0V(typ)~5.25V(max)  
VREF  
VREFA  
VREFB  
VREF voltage range  
0V~3.6V  
GND  
1kΩ  
OSCM  
OSCM frequency setting range  
OSCM  
0.64MHz(min)~1.12MHz(typ)~2.4MHz(max)  
GND  
RS  
OUTA+  
OUTA-  
OUTB+  
OUTB-  
RSA  
VM power supply voltage range  
10V(min)~47V(max)  
OUT-  
OUT+  
OUTPUT pin voltage  
10V(min)~47V(max)  
RSB  
GND  
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes.  
2013-11-05  
11  
TB67S101AFG/FTG/FNG  
5. Function explanation (Stepping motor)  
Motor output current (Iout) : The flow from OUT+ to OUT- is plus current. The flow from OUT- to OUT+ is minus current.  
<Full step resolution>  
Ach  
Bch  
Input  
INA1  
H
Output  
Iout(A)  
+100%  
-100%  
-100%  
+100%  
Input  
INB1  
H
Output  
Iout(B)  
+100%  
+100%  
-100%  
-100%  
PHASEA  
INA2  
H
PHASEB  
INB2  
H
H
L
H
H
L
H
H
H
H
L
H
H
H
H
H
H
H
L
H
H
Please set INA1, INA2, INB1, and INB2 to Low until VM power supply reaches the proper operating range.  
<Half step resolution>  
Ach  
Bch  
Input  
Output  
Iout(A)  
+100%  
0%  
Input  
INB1  
H
Output  
Iout(B)  
+100%  
+100%  
+100%  
0%  
PHASEA  
INA1  
H
INA2  
H
PHASEB  
INB2  
H
H
-
H
H
H
-
L
L
H
H
L
L
L
-
H
H
-100%  
-100%  
-100%  
0%  
H
H
H
H
L
L
H
H
L
L
L
-
H
H
-100%  
-100%  
-100%  
0%  
L
L
H
H
H
H
H
H
+100%  
+100%  
H
H
H
H
L
L
- : Don't care  
2013-11-05  
12  
TB67S101AFG/FTG/FNG  
<Quarter step resolution>  
Ach  
Bch  
Input  
Output  
Iout(A)  
+71%  
+38%  
0%  
Input  
INB1  
H
Output  
Iout(B)  
+71%  
+100%  
+100%  
+100%  
+71%  
+38%  
0%  
PHASEA  
INA1  
H
L
INA2  
L
PHASEB  
INB2  
L
H
H
X
L
H
H
H
H
H
H
X
L
H
L
H
H
H
H
L
L
H
L
H
L
-38%  
H
L
H
H
H
H
H
L
-71%  
H
L
H
H
H
L
-100%  
-100%  
-100%  
-71%  
L
H
L
L
L
L
L
H
L
-38%  
L
L
H
-71%  
L
H
L
-38%  
L
H
H
H
H
L
-100%  
-100%  
-100%  
-71%  
X
H
H
H
H
H
L
0%  
L
H
L
H
L
+38%  
+71%  
+100%  
+100%  
+100%  
L
H
H
H
H
H
L
H
H
H
H
L
L
H
L
-38%  
X
H
L
0%  
L
H
+38%  
X : Don't care  
Others  
Pin Name  
H
L
Notes  
INA1, INA2  
INB1, INB2  
PHASEA  
The current value of each ch is set up with 2 Please refer to the above-mentioned current value  
input 4 value.  
setting table.  
OUT+: H  
OUT-: L  
OUT+: L  
OUT-: H  
In PHASE=H, Charge current flows in the direction  
of OUT- from OUT+.  
PHASEB  
In STANDBY= L, an internal oscillating circuit and a  
motor output part are stopped. (The drive of a motor  
cannot be performed.)  
Standby mode  
STANDBY  
Standby release  
2013-11-05  
13  
TB67S101AFG/FTG/FNG  
Current phasor (Full step resolution)  
100%  
A
D
CCW  
CW  
-100%  
100%  
0%  
C
B
-100%  
Bch current[%]  
A B  
C D A B C D  
A B  
A B C D  
100%  
0%  
Iout(A)  
Iout(B)  
-100%  
100%  
0%  
-100%  
H
PHASEA  
L
H
L
INA1  
H
INA2  
L
H
PHASEB  
L
H
L
INB1  
INB2  
H
L
CCW  
CW  
Timing charts may be simplified for explanatory purpose.  
Please set INA1, INA2, INB1, and INB2 to Low until VM power supply reaches the proper operating range.  
2013-11-05  
14  
TB67S101AFG/FTG/FNG  
Current phasor (Half step resolution)  
G
100%  
A
H
CCW  
CW  
F
B
-100%  
0%  
100%  
C
E
D
Bch current [%]  
-100%  
A B  
G H  
C D E F G H  
E
A B C D  
100%  
0%  
Iout(A)  
-100%  
100%  
Iout(B)  
0%  
-100%  
H
L
PHASEA  
INA1  
H
L
H
INA2  
PHASEB  
INB1  
L
H
L
H
L
H
L
INB2  
CCW  
CW  
Timing charts may be simplified for explanatory purpose.  
Please set INA1, INA2, INB1, and INB2 to Low until VM power supply reaches the proper operating range.  
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TB67S101AFG/FTG/FNG  
Current phasor (Quarter step resolution)  
N
O
P
100%  
M
A
71%  
L
CCW  
38%  
0%  
B
C
D
CW  
K
-71% -38%  
38% 71%  
100%  
-100%  
-38%  
J
-71%  
-100%  
G
I
E
H
F
Bch current [%]  
N O P A B C D E F G H I J K L M N O A B C D E F G H I J K L M N O  
P
P A  
100%  
71%  
38%  
0%  
Iout(A)  
Iout(B)  
-38%  
-71%  
-100%  
100%  
71%  
38%  
0%  
-38%  
-71%  
-100%  
H
L
PHASEA  
INA1  
H
L
H
INA2  
PHASEB  
INB1  
L
H
L
H
L
H
L
INB2  
CCW  
CW  
Timing charts may be simplified for explanatory purpose.  
Please set INA1, INA2, INB1, and INB2 to Low until VM power supply reaches the proper operating range.  
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TB67S101AFG/FTG/FNG  
6. Decay function  
ADMD(Advanced Dynamic Mixed Decay) constant current control  
The Advanced Dynamic Mixed Decay threshold, which determines the current ripple level during current feedback control, is  
a unique value.  
fchop  
Internal  
OSC  
Setting  
NF detect  
current value  
Advanced Dynamic Mixed  
Decay threshold  
Detect  
ADMDth  
Iout  
Charge ModeNF detectFast DecayADMDth detectSlow  
Decayfchop 1 cycleCharge mode  
fchop 1 cycle16clk  
Auto Decay Mode current waveform  
fchop  
fchop  
Internal  
OSC  
NF detect  
Setting  
NF detect  
current value  
Iout  
Fast Decay  
Slow Decay  
ADMDth (Advanced Dynamic Mixed Decay threshold)  
Timing charts may be simplified for explanatory purpose.  
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TB67S101AFG/FTG/FNG  
ADMD current waveform  
When the next current step is higher :  
fchop  
fchop  
fchop  
fchop  
Internal  
OSC  
Setting  
current value  
NF  
NF  
Fast  
Slow  
Fast  
Charge  
Slow  
NF  
NF  
Fast  
Setting  
current value  
Fast  
Charge  
Charge  
Charge  
Slow  
Slow  
When Charge period is more than 1 fchop cycle :  
fchop  
fchop  
fchop  
fchop  
Internal  
OSC  
Setting  
current value  
NF  
Fast  
Slow  
Charge  
NF  
NF  
Fast  
Setting  
current value  
Fast  
Charge  
Charge  
Slow  
Slow  
When the Charge period is longer than fchop cycle, the Charge period will be extended until the motor current reaches the  
NF threshold. Once the current reaches the next current step, then the sequence will go on to decay  
mode.  
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TB67S101AFG/FTG/FNG  
When the next current step is lower :  
f
f
chop  
f
chop  
f
chop  
chop  
Internal  
OSC  
The operation mode will be switched to ‘Charge’ to  
monitor the motor current with the RS comparator;  
then will be switched to ‘Fast’ because the motor  
current is above the threshold.  
Setting  
current value  
NF  
NF  
Fast  
Fast  
NF  
Charge  
Charge  
Slow  
Slow  
Charge  
Fast  
Setting  
current value  
Fast  
Charge  
Slow  
Slow  
When the Fast continues past 1 fchop cycle (the motor current not reaching the ADMD  
threshold during 1 fchop cycle)  
f
f
chop  
f
chop  
f
chop  
chop  
Internal  
OSC  
NF  
Setting  
current value  
The operation mode will be switched to ‘Charge’ to  
monitor the motor current with the RS comparator;  
then will be switched to ‘Fast’ because the motor  
current is above the threshold.  
Fast  
NF  
Charge  
Slow  
Charge  
If the motor current is still above the ADMD threshold  
Fast  
after reaching 1 fchop cycle, the output stage function  
will stay ‘Fast’ until the current reaches the ADMDth.  
Setting  
current value  
Fast  
Charge  
Slow  
Slow  
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TB67S101AFG/FTG/FNG  
7Output transistor function mode  
VM  
VM  
VM  
RRS  
RRS  
RRS  
RSpin  
RSpin  
RSpin  
U1  
U2  
U1  
U2  
U1  
U2  
OFF  
OFF  
OFF  
OFF  
ON  
ON  
Load  
Load  
Load  
L1  
L2  
L1  
L2  
L1  
L2  
OFF  
ON  
ON  
ON  
ON  
OFF  
PGND  
Charge mode  
PGND  
Slow mode  
PGND  
Fast mode  
Output transistor function  
MODE  
U1  
U2  
L1  
L2  
CHARGE  
SLOW  
ON  
OFF  
OFF  
OFF  
OFF  
ON  
OFF  
ON  
ON  
ON  
FAST  
ON  
OFF  
Note: This table shows an example of when the current flows as indicated by the arrows in the figures shown above.  
If the current flows in the opposite direction, refer to the following table.  
MODE  
U1  
U2  
L1  
L2  
CHARGE  
SLOW  
OFF  
OFF  
ON  
ON  
OFF  
OFF  
ON  
ON  
OFF  
ON  
FAST  
OFF  
ON  
This IC controls the motor current to be constant by 3 modes listed above.  
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes.  
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TB67S101AFG/FTG/FNG  
8Calculation of the Predefined Output Current  
For PWM constant-current control, this IC uses a clock generated by the OSCM oscillator.  
The peak output current (Setting current value) can be set via the current-sensing resistor (RS) and the reference  
voltage (Vref), as follows:  
Vref(V)  
Iout(max) = Vref(gain)  
×
RRS(Ω)  
Vref(gain) : the Vref decay rate is 1/ 5.0 (typ.)  
For example : In the case of a 100% setup  
when Vref = 3.0 V, Torque=100%,RS=0.51Ω, the motor constant current (Setting current value) will be  
calculated as:  
I
= 3.0V / 5.0 / 0.51Ω= 1.18 A  
out  
9Calculation of the OSCM oscillation frequency (chopper reference frequency)  
An approximation of the OSCM oscillation frequency (fOSCM) and chopper frequency (fchop)  
can be calculated by the following expressions.  
fOSCM=1/[0.56x{Cx(R1+500)}]  
………C,R1: External components for OSCM (C=270pF , R1=5.1kΩ => fOSCM =About 1.12MHz(Typ.))  
fchop = fOSCM / 16  
………fOSCM=1.12MHz => fchop =About 70kHz  
If chopping frequency is raised, Rippl of current will become small and wave-like reproducibility will improve. However, the  
gate loss inside IC goes up and generation of heat becomes large.  
By lowering chopping frequency, reduction in generation of heat is expectable. However, Rippl of current may become large.  
It is a standard about about 70 kHz. A setup in the range of 50 to 100 kHz is recommended.  
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TB67S101AFG/FTG/FNG  
Absolute Maximum Ratings (Ta = 25°C)  
Symbol  
Rating  
Unit  
Remarks  
Characteristics  
Motor power supply  
Motor output voltage  
VM  
Vout  
Iout  
50  
50  
V
V
A
V
-
-
Motor output current  
4.0  
6.0  
Note1  
Internal Logic power supply  
VCC  
When externally  
applied.  
VIN(H)  
VIN(L)  
Vref  
6.0  
-0.4  
V
V
-
Logic input voltage  
-
Vref input voltage  
QFN48  
5.0  
V
-
PD  
1.3  
W
W
W
Note2  
Note2  
Note2  
-
Power dissipation  
HTSSOP48  
HSOP28  
PD  
1.3  
PD  
1.15  
-2085  
TOPR  
Operating temperature  
TSTR  
-55150  
-
-
Storage temperature  
Junction temperature  
Tj(max)  
150  
Note 1: Usually, the maximum current value at the time should use 70% or less of the absolute maximum ratings for a  
standard on thermal rating. The maximum output current may be further limited in view of thermal  
considerations, depending on ambient temperature and board conditions.  
Note 2: Device alone (Ta =25°C)  
Ta: Ambient temperature  
Topr: Ambient temperature while the IC is active  
Tj: Junction temperature while the IC is active. The maximum junction temperature is limited by the thermal  
shutdown (TSD) circuitry. It is advisable to keep the maximum current below a certain level so that the  
maximum junction temperature, Tj (MAX), will not exceed 120°C.  
CautionAbsolute maximum ratings  
The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for  
a moment. Do not exceed any of these ratings.  
Exceeding the rating (s) may cause device breakdown, damage or deterioration, and may result in injury by  
explosion or combustion.  
The value of even one parameter of the absolute maximum ratings should not be exceeded under any  
circumstances. The TB67S101A does not have overvoltage detection circuit. Therefore, the device is damaged if a  
voltage exceeding its rated maximum is applied.  
All voltage ratings, including supply voltages, must always be followed. The other notes and considerations  
described later should also be referred to.  
Operation Ranges (Ta=-20 to 85°C)  
Min  
Typ.  
Max  
Unit  
Remarks  
Note1  
Characteristics  
Symbol  
Motor power supply  
Motor output current  
VM  
10  
-
24  
47  
V
A
Iout  
1.5  
3.0  
VIN(H)  
VIN(L)  
2.0  
0
-
-
5.5  
0.8  
400  
150  
3.6  
V
V
Logic input High Level  
Logic input Low Level  
Logic input voltage  
Phase input frequency  
Chopper frequency  
Vref input voltage  
fPHASE  
fchop(range)  
Vref  
-
-
kHz  
kHz  
V
40  
GND  
70  
2.0  
Note 1: Maximum current for actual usage may be limited by the operating circumstances such as operating conditions  
(exciting mode, operating time, and so on), ambient temperature, and heat conditions (board condition and so on).  
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TB67S101AFG/FTG/FNG  
Electrical Specifications 1 (Ta = 25°C, VM = 24 V, unless specified otherwise)  
Characteristics  
Symbol  
Test condition  
Min  
Typ.  
Max  
Unit  
HIGH  
LOW  
VIN(H)  
VIN(L)  
VIN(HYS)  
IIN(H)  
IIN(L)  
Logic input pin (*)  
Logic input pin (*)  
2.0  
-
-
5.5  
0.8  
300  
-
V
Logic input voltage  
0
V
Logic input hysteresis voltage  
Logic input pin (*)  
100  
-
mV  
µA  
µA  
mA  
mA  
HIGH  
Logic input voltage=3.3V  
Logic input voltage=0V  
Output pins=open, STANDBY=L  
-
-
-
-
33  
-
Logic input current  
LOW  
1
IM1  
2
3.5  
5.5  
IM2  
Output pins=open, STANDBY=H  
Output pins=open  
3.5  
Power consumption  
IM3  
-
5.5  
7
mA  
Full step resolution  
High-side  
Low-side  
IOH  
IOL  
VRS=VM=50V,Vout=0V  
VRS=VM=Vout=50V  
-
-
-
1
-
µA  
µA  
%
Output leakage current  
1
Motor current channel differential  
ΔIout1  
ΔIout2  
IRS  
Current differential between Ch  
-5  
-5  
0
0
0
-
5
Motor current setting accuracy  
RS pin current  
Iout=1.5A  
VRS=VM=24V  
5
%
10  
µA  
Motor output ON-resistance  
(High-side+Low-side)  
Tj=25°C, Forward direction  
(High-side+Low-side)  
Ron(S)_PN  
0.49  
0.6  
Ω
*: VIN (H) is defined as the VIN voltage that causes the outputs (OUTA,OUTB) to change when a pin under test is  
gradually raised from 0 V. VIN (L) is defined as the V IN voltage that causes the outputs (OUTA, OUTB) to change  
when the pin is then gradually lowered. The difference between VIN (H) and VIN (L) is defined as the input  
hysteresis.  
*: When the logic signal is applied to the device whilst the VM power supply is not asserted; the device is designed not  
to function, but for safe usage, please apply the logic signal after the VM power supply is asserted and the VM voltage  
reaches the proper operating range.  
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TB67S101AFG/FTG/FNG  
Electrical Specifications 2 (Ta =25°C, VM = 24 V, unless specified otherwise)  
Characteristics  
Vref input current  
VCC voltage  
Symbol  
Iref  
Test condition  
Vref=2.0V  
ICC=5.0mA  
VCC=5.0V  
Vref=2.0V  
Min  
-
Typ.  
0
Max  
1
Unit  
μA  
V
VCC  
4.75  
-
5.0  
5.25  
5
VCC current  
ICC  
2.5  
mA  
Vref gain rate  
Thermal shutdown(TSD)  
threshold (Note1)  
Vref(gain)  
TjTSD  
1/5.2  
145  
1/5.0  
160  
1/4.8  
175  
°C  
VM recovery voltage  
Over-current detection (ISD)  
threshold (Note2)  
VMR  
ISD  
7.0  
4.1  
8.0  
4.9  
9.0  
5.7  
V
A
Note1: About TSD  
When the junction temperature of the device reached the TSD threshold, the TSD circuit is triggered; the internal reset circuit  
then turns off the output transistors. Noise rejection blanking time is built-in to avoid misdetection. Once the TSD circuit is triggered,  
the device will be set to standby mode, and can be cleared by reasserting the VM power source, or setting the DMODE pins  
to standby mode. The TSD circuit is a backup function to detect a thermal error, therefore is not recommended to be used  
aggressively.  
Note2: About ISD  
When the output current reaches the threshold, the ISD circuit is triggered; the internal reset circuit then turns off the output transistors.  
Once the ISD circuit is triggered, the device keeps the output off until power-on reset (POR), is reasserted or the device is set to standby  
mode by DMODE pins. For fail-safe, please insert a fuse to avoid secondary trouble.  
Back-EMF  
While a motor is rotating, there is a timing at which power is fed back to the power supply. At that timing, the  
motor current recirculates back to the power supply due to the effect of the motor back-EMF.  
If the power supply does not have enough sink capability, the power supply and output pins of the device might  
rise above the rated voltages. The magnitude of the motor back-EMF varies with usage conditions and motor  
characteristics. It must be fully verified that there is no risk that the TB67S101A or other components will  
be damaged or fail due to the motor back-EMF.  
Cautions on Overcurrent Shutdown (ISD) and Thermal Shutdown (TSD)  
The ISD and TSD circuits are only intended to provide temporary protection against irregular conditions such as an  
output short-circuit; they do not necessarily guarantee the complete IC safety.  
If the device is used beyond the specified operating ranges, these circuits may not operate properly: then the device  
may be damaged due to an output short-circuit.  
The ISD circuit is only intended to provide a temporary protection against an output short-circuit. If such a  
condition persists for a long time, the device may be damaged due to overstress. Overcurrent conditions must be  
removed immediately by external hardware.  
IC Mounting  
Do not insert devices incorrectly or in the wrong orientation. Otherwise, it may cause breakdown, damage and/or  
deterioration of the device.  
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TB67S101AFG/FTG/FNG  
AC Electrical Specification (Ta = 25°C, VM = 24 V, 6.8 mH/5.7 )  
Characteristics  
Symbol  
Test condition  
Min  
100  
Typ.  
-
Max  
-
Unit  
ns  
fPHASE(min)  
-
-
-
-
Minimum PHASE pulse width  
twp  
50  
50  
twn  
tr  
30  
80  
90  
-
130  
140  
tf  
40  
Output transistor  
switching specific  
ns  
ns  
tpLH(PHASE)  
tpHL(PHASE)  
PHASE - Output  
250  
250  
1200  
1200  
PHASE - Output  
VM=24V,Iout=1.5A  
Analog tblank  
-
Analog noise blanking time  
AtBLK  
250  
400  
550  
Oscillator frequency accuracy  
Oscillator reference frequency  
fOSCM  
COSC=270pF, ROSC=5.1kΩ  
COSC=270pF, ROSC=5.1kΩ  
-15  
-
+15  
%
fOSCM  
952  
1120  
1288  
kHz  
Output:Active(IOUT =1.5 A),  
fOSC = 1120 kHz  
Chopping frequency  
fchop  
-
70  
-
kHz  
AC Electrical Specification Timing chart  
1/fPHASE  
twn  
50%  
50%  
50%  
twp  
PHASE】  
tpHL(PHASE)  
tpLH(PHASE)  
90%  
90%  
50%  
50%  
10%  
OUT】  
10%  
tf  
tr  
Timing charts may be simplified for explanatory purpose.  
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TB67S101AFG/FTG/FNG  
Package Dimensions  
HSOP28-P-0450-0.80  
(unit :mm)  
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TB67S101AFG/FTG/FNG  
P-WQFN48-0707-0.50-003  
(unit :mm)  
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TB67S101AFG/FTG/FNG  
HTSSOP48-P-300-0.50  
(unit :mm)  
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TB67S101AFG/FTG/FNG  
Notes on Contents  
Block Diagrams  
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory  
purposes.  
Equivalent Circuits  
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes.  
Timing Charts  
Timing charts may be simplified for explanatory purposes.  
Application Circuits  
The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is  
required, especially at the mass-production design stage.  
Toshiba does not grant any license to any industrial property rights by providing these examples of application  
circuits.  
Test Circuits  
Components in the test circuits are used only to obtain and confirm the device characteristics. These components and  
circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment.  
IC Usage Considerations  
Notes on handling of ICs  
(1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded,  
even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause device  
breakdown, damage or deterioration, and may result in injury by explosion or combustion.  
(2)  
Use an appropriate power supply fuse to ensure that a large current does not continuously flow in the  
case of overcurrent and/or IC failure. The IC will fully break down when used under conditions that  
exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse  
noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can  
lead to smoke or ignition. To minimize the effects of the flow of a large current in the case of breakdown,  
appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required.  
(3) If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the  
design to prevent device malfunction or breakdown caused by the current resulting from the inrush  
current at power ON or the negative current resulting from the back electromotive force at power OFF.  
IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in  
protection functions. If the power supply is unstable, the protection function may not operate, causing IC  
breakdown. IC breakdown may cause injury, smoke or ignition.  
(4) Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative  
terminals of power supplies are connected properly.  
Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding  
the rating(s) may cause device breakdown, damage or deterioration, and may result in injury by  
explosion or combustion.  
In addition, do not use any device inserted in the wrong orientation or incorrectly to which current is  
applied even just once.  
(5) Carefully select external components (such as inputs and negative feedback capacitors) and load  
components (such as speakers), for example, power amp and regulator.  
If there is a large amount of leakage current such as from input or negative feedback condenser, the IC  
output DC voltage will increase. If this output voltage is connected to a speaker with low input withstand  
voltage, overcurrent or IC failure may cause smoke or ignition. (The overcurrent may cause smoke or  
ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load (BTL)  
connection-type IC that inputs output DC voltage to a speaker directly.  
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TB67S101AFG/FTG/FNG  
Points to remember on handling of ICs  
Overcurrent detection Circuit  
Overcurrent detection circuits (referred to as current limiter circuits) do not necessarily protect ICs under all  
circumstances. If the overcurrent detection circuits operate against the overcurrent, clear the overcurrent status  
immediately.  
Depending on the method of use and usage conditions, exceeding absolute maximum ratings may cause the  
overcurrent detection circuit to operate improperly or IC breakdown may occur before operation. In addition,  
depending on the method of use and usage conditions, if overcurrent continues to flow for a long time after operation,  
the IC may generate heat resulting in breakdown.  
Thermal Shutdown Circuit  
Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the thermal shutdown circuits  
operate against the over-temperature, clear the heat generation status immediately.  
Depending on the method of use and usage conditions, exceeding absolute maximum ratings may cause the thermal  
shutdown circuit to operate improperly or IC breakdown to occur before operation.  
Heat Radiation Design  
When using an IC with large current flow such as power amp, regulator or driver, design the device so that heat is  
appropriately radiated, in order not to exceed the specified junction temperature (TJ) at any time or under any  
condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to  
decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, when designing the device, take  
into consideration the effect of IC heat radiation with peripheral components.  
Back-EMF  
When a motor rotates in the reverse direction, stops or slows abruptly, current flows back to the motor’s power  
supply owing to the effect of back-EMF. If the current sink capability of the power supply is small, the device’s motor  
power supply and output pins might be exposed to conditions beyond the absolute maximum ratings. To avoid this  
problem, take the effect of back-EMF into consideration in system design.  
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TB67S101AFG/FTG/FNG  
RESTRICTIONS ON PRODUCT USE  
Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information in  
this document, and related hardware, software and systems (collectively "Product") without notice.  
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's  
written permission, reproduction is permissible only if reproduction is without alteration/omission.  
Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are  
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and  
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury  
or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or  
incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant  
TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product  
and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the  
application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or  
applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b)  
evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms,  
sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and  
applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.  
PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE  
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH MAY  
CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT  
("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without  
limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for  
automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions,  
safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE  
PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your TOSHIBA  
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FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER,  
INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING  
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AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.  
2013-11-05  
31  
配单直通车
TB67S101AFG产品参数
型号:TB67S101AFG
生命周期:Active
IHS 制造商:TOSHIBA CORP
包装说明:HSOP,
Reach Compliance Code:unknown
HTS代码:8542.39.00.01
风险等级:5.66
模拟集成电路 - 其他类型:STEPPER MOTOR CONTROLLER
JESD-30 代码:R-PDSO-G28
长度:16 mm
功能数量:1
端子数量:28
最高工作温度:85 °C
最低工作温度:-20 °C
最大输出电流:4 A
封装主体材料:PLASTIC/EPOXY
封装代码:HSOP
封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, HEAT SINK/SLUG
座面最大高度:2.7 mm
最大供电电压 (Vsup):5.25 V
最小供电电压 (Vsup):4.75 V
标称供电电压 (Vsup):5 V
表面贴装:YES
技术:BCDMOS
温度等级:OTHER
端子形式:GULL WING
端子位置:DUAL
宽度:8.8 mm
Base Number Matches:1
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