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产品型号TC1264-3.0VAB的概述

TC1264-3.0VAB 芯片概述 TC1264-3.0VAB 是一款高性能的低压线性稳压器,专门设计用于满足各种电子产品对稳定电压的需求。这款芯片由 Microchip Technology Inc. 生产,集成了多种功能,具备宽范围的供电电压和高效率,适用于消费电子、工业设备和汽车电子等多个领域。 详细参数 TC1264-3.0VAB 的关键参数包括: - 输出电压:3.0V 精确输出 - 输入电压范围:2.5V至16V - 最大负载电流:可达1A - 温度范围:-40°C至85°C - 线性调节率:优于0.1%/V - 负载调节率:优于0.2% - 静态电流:最大为2.5mA - 噪声:低于40μV 在10Hz至100kHz的频率范围内 - 短路保护:内置保护功能 - 封装类型:SOT-23-5,TSOT-23 厂家、包装及封装 TC1264-3.0VAB 的生产商为 Mic...

产品型号TC1264-3.0VAB的Datasheet PDF文件预览

TC1264  
800 mA Fixed-Output CMOS LDO with Shutdown  
Features  
Description  
• Very Low Dropout Voltage  
The TC1264 is a fixed output, high accuracy (typically  
±0.5%) CMOS low dropout regulator. Designed  
specifically for battery-operated systems, the TC1264’s  
CMOS construction eliminates wasted ground current,  
significantly extending battery life. Total supply current  
is typically 80 µA at full load (20 to 60 times lower than  
in bipolar regulators).  
• 800 mA Output Current  
• High Output Voltage Accuracy  
• Standard or Custom Output Voltages  
• Overcurrent and Overtemperature Protection  
Applications  
TC1264 key features include ultra low noise operation,  
very low dropout voltage (typically 450 mV at full load),  
and fast response to step changes in load.  
• Battery Operated Systems  
• Portable Computers  
• Medical Instruments  
• Instrumentation  
The TC1264 incorporates both over temperature and  
over current protection. The TC1264 is stable with an  
output capacitor of only 1μF and has a maximum  
output current of 800 mA. It is available in 3-Pin  
SOT-223, 3-Pin TO-220 and 3-Pin DDPAK packages.  
• Cellular/GSM/PHS Phones  
• Linear Post-Regulators for SMPS  
Pagers  
Package Type  
Typical Application  
3-Pin DDPAK  
3-Pin TO-220  
FRONT VIEW  
TAB IS GND  
VOUT  
VOUT  
VIN  
VIN  
+
C1  
1 µF  
TC1264  
TC1264  
TC1264  
GND  
1
2
3
1
2
3
3-Pin SOT-223  
FRONT VIEW  
VOUT  
3
2 GND  
1 VIN  
TC1264  
© 2006 Microchip Technology Inc.  
DS21375C-page 1  
TC1264  
† Notice: Stresses above those listed under "Maximum  
Ratings" may cause permanent damage to the device. This is  
a stress rating only and functional operation of the device at  
those or any other conditions above those indicated in the  
operation listings of this specification is not implied. Exposure  
to maximum rating conditions for extended periods may affect  
device reliability.  
1.0  
ELECTRICAL  
CHARACTERISTICS  
Absolute Maximum Ratings †  
Input Voltage .........................................................6.5V  
Output Voltage.................. (VSS – 0.3V) to (VIN + 0.3V)  
Power Dissipation................Internally Limited (Note 8)  
Maximum Voltage on Any Pin ........VIN +0.3V to -0.3V  
Operating Temperature Range...... -40°C < TJ < 125°C  
Storage Temperature..........................-65°C to +150°C  
DC CHARACTERISTICS  
Electrical Specifications: Unless otherwise indicated, VIN = VR + 1.5V, (Note 1), IL = 100 µA, CL = 3.3 µF, SHDN > VIH  
TA = +25°C. Boldface type specifications apply for junction temperatures of -40°C to +125°C.  
,
Parameters  
Sym  
Min  
Typ  
Max  
Units  
Conditions  
Input Operating Voltage  
Maximum Output Current  
Output Voltage  
VIN  
2.7  
6.0  
V
mA  
V
Note 2  
IOUTMAX  
VOUT  
800  
VR – 2.5% VR ± 0.5% VR + 2.5%  
VR – 2% VR ± 0.5% VR + 3%  
VR 2.5V  
VR = 1.8V  
VR – 7%  
VR + 3%  
IL = 0.1 mA to 800 mA  
(Note 3)  
V
OUT Temperature Coefficient  
ΔVOUT/ΔT  
ΔVOUT/ΔVIN  
ΔVOUT/VOUT  
VIN–VOUT  
40  
0.007  
0.002  
20  
0.35  
0
ppm/°C Note 4  
Line Regulation  
%
(VR + 1V) VIN 6V  
Load Regulation (Note 5)  
Dropout Voltage (Note 6)  
-0.01  
%/mA IL = 0.1 mA to IOUTMAX  
30  
mV  
VR 2.5V, IL = 100 µA  
VR 2.5V, IL = 100 mA  
VR 2.5V, IL = 300 mA  
VR 2.5V, IL = 500 mA  
VR 2.5V, IL = 800 mA  
VR = 1.8V, IL = 500 mA  
IL = 800 mA  
50  
160  
480  
800  
1300  
1200  
1400  
130  
150  
260  
450  
1000  
1200  
80  
Supply Current  
IDD  
µA  
db  
SHDN = VIH, IL = 0  
F 1 kHz  
Power Supply Rejection Ratio  
Output Short Circuit Current  
PSRR  
IOUTSC  
64  
1200  
mA  
VOUT = 0V  
Note 1: VR is the regulator output voltage setting.  
2: The minimum VIN has to justify the conditions: VIN VR + VDROPOUT and VIN 2.7V for IL = 0.1 mA to IOUTMAX  
3: This accuracy represents the worst-case over the entire output current and temperature range.  
.
(VOUTMAX VOUTMIN) – 106  
4:  
TCVOUT = -------------------------------------------------------------------------  
VOUT × ΔT  
5: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested  
over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating  
effects are covered by the thermal regulation specification.  
6: Dropout voltage is defined as the input-to-output differential at which the output voltage drops 2% below its nominal  
value measured at a 1.5V differential.  
7: Thermal regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied,  
excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 ms.  
8: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction tem-  
perature and the thermal resistance from junction-to-air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power dis-  
sipation causes the device to initiate thermal shutdown. Please see Section 5.0 “Thermal Considerations” for more  
details..  
DS21375C-page 2  
© 2006 Microchip Technology Inc.  
TC1264  
DC CHARACTERISTICS (CONTINUED)  
Electrical Specifications: Unless otherwise indicated, VIN = VR + 1.5V, (Note 1), IL = 100 µA, CL = 3.3 µF, SHDN > VIH  
TA = +25°C. Boldface type specifications apply for junction temperatures of -40°C to +125°C.  
,
Parameters  
Thermal Regulation  
Output Noise  
Sym  
Min  
Typ  
Max  
Units  
Conditions  
ΔVOUT/ΔPD  
0.04  
260  
V/W  
Note 7  
eN  
nV/Hz IL = IOUTMAX, F = 10 kHZ  
Note 1: VR is the regulator output voltage setting.  
2: The minimum VIN has to justify the conditions: VIN VR + VDROPOUT and VIN 2.7V for IL = 0.1 mA to IOUTMAX  
3: This accuracy represents the worst-case over the entire output current and temperature range.  
.
(VOUTMAX VOUTMIN) – 106  
4:  
TCVOUT = -------------------------------------------------------------------------  
VOUT × ΔT  
5: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested  
over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating  
effects are covered by the thermal regulation specification.  
6: Dropout voltage is defined as the input-to-output differential at which the output voltage drops 2% below its nominal  
value measured at a 1.5V differential.  
7: Thermal regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied,  
excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 ms.  
8: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction tem-  
perature and the thermal resistance from junction-to-air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power dis-  
sipation causes the device to initiate thermal shutdown. Please see Section 5.0 “Thermal Considerations” for more  
details..  
TEMPERATURE CHARACTERISTICS  
Electrical Specifications: Unless otherwise indicated, VIN = VR + 1.5V, IL = 100 µA, CL = 3.3 µF, SHDN > VIH, TA = +25°C.  
Parameters  
Temperature Ranges  
Sym  
Min  
Typ  
Max  
Units  
Conditions  
Specified Temperature Range  
Operating Temperature Range  
Storage Temperature Range  
TA  
TJ  
TA  
-40  
-40  
-65  
+125  
+125  
+150  
°C  
°C  
°C  
(Note 1)  
Thermal Package Resistances  
Thermal Resistance, 3L-SOT-223  
Thermal Resistance, 3L-DDPAK  
Thermal Resistance, 3L-TO-220  
θJA  
θJA  
θJA  
59  
71  
71  
°C/W  
°C/W  
°C/W  
Note 1: Operation in this range must not cause TJ to exceed Maximum Junction Temperature (+125°C).  
© 2006 Microchip Technology Inc.  
DS21375C-page 3  
TC1264  
2.0  
TYPICAL PERFORMANCE CURVES  
Note:  
The graphs and tables provided following this note are a statistical summary based on a limited number of  
samples and are provided for informational purposes only. The performance characteristics listed herein  
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified  
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.  
150  
135  
0.020  
0.018  
0.016  
120  
105  
90  
0.014  
0.012  
0.010  
0.008  
0.006  
0.004  
V
= 3V  
OUT  
75  
60  
45  
30  
0.002  
0.000  
15  
0
-40°C 0°C  
25°C 70°C 85°C 125°C  
TEMPERATURE (°C)  
-40°C 0°C  
25°C 70°C 85°C 125°C  
TEMPERATURE (°C)  
FIGURE 2-1:  
Line Regulation vs.  
FIGURE 2-4:  
I
vs. Temperature.  
DD  
Temperature.  
0.600  
0.550  
0.500  
0.450  
0.400  
10.0  
1.0  
125°C  
85°C  
R
C
= 50  
:
LOAD  
OUT  
= 1  
μF  
70°C  
25°C  
0.350  
0.300  
0.250  
0.200  
0.150  
0.100  
0.050  
0.000  
0°C  
0.1  
0.0  
-40°C  
400 500 600 700 800  
(mA)  
0
100  
200 300  
I
0.01  
10  
0.01  
1
100  
1000  
LOAD  
FREQUENCY (kHz)  
FIGURE 2-5:  
3.0V Dropout Voltage vs.  
FIGURE 2-2:  
Output Noise vs. Frequency.  
I
.
LOAD  
0.0100  
0.0090  
0.0080  
0.0070  
0.0060  
0.0050  
0.0040  
0.0030  
3.030  
3.020  
3.010  
3.000  
2.990  
2.980  
I
= 0.1 mA  
LOAD  
I
= 300 mA  
= 500 mA  
LOAD  
I
LOAD  
V
= 3V  
1 mA to 800 mA  
OUT  
2.970  
2.960  
2.950  
2.940  
2.930  
2.920  
I
= 800 mA  
LOAD  
0.0020  
0.0010  
0.0100  
-40°C  
-40°C 0°C  
25°C 70°C 85°C 125°C  
TEMPERATURE (°C)  
0°C  
25°C 70°C  
85°C 125°C  
TEMPERATURE (°C)  
FIGURE 2-3:  
Load Regulation vs.  
FIGURE 2-6:  
3.0V V  
vs.Temperature.  
OUT  
Temperature.  
DS21375C-page 4  
© 2006 Microchip Technology Inc.  
TC1264  
3.0  
PIN DESCRIPTIONS  
The descriptions of the pins are listed in Table 3-1.  
TABLE 3-1:  
PIN FUNCTION TABLE  
Symbol  
Pin No.  
3-Pin SOT-223  
3-Pin TO-220  
3-Pin DDPAK  
Description  
1
2
3
VIN  
Unregulated supply input  
GND  
VOUT  
Ground terminal  
Regulated voltage output.  
3.1  
Unregulated Supply (VIN)  
3.3  
Regulated Output Voltage (VOUT  
)
Unregulated supply input.  
Regulated voltage output.  
3.2  
Ground (GND)  
Ground terminal.  
© 2006 Microchip Technology Inc.  
DS21375C-page 5  
TC1264  
4.1  
Output Capacitor  
4.0  
DETAILED DESCRIPTION  
A 1 µF (min) capacitor from VOUT to ground is required.  
The output capacitor should have an effective series  
resistance greater than 0.1Ω and less than 5Ω. A 1 µF  
capacitor should be connected from VIN to GND if there  
is more than 10 inches of wire between the regulator  
and the AC filter capacitor, or if a battery is used as the  
power source. Aluminum electrolytic or tantalum  
capacitor types can be used. (Since many aluminum  
electrolytic capacitors freeze at approximately -30°C,  
solid tantalums are recommended for applications  
operating below -25°C.) When operating from sources  
other than batteries, supply-noise rejection and  
transient response can be improved by increasing the  
value of the input and output capacitors and employing  
passive filtering techniques.  
The TC1264 is a precision, fixed output LDO. Unlike  
bipolar regulators, the TC1264’s supply current does  
not increase with load current. In addition, VOUT  
remains stable and within regulation over the entire  
0mA to ILOADMAX load current range (an important  
consideration in RTC and CMOS RAM battery back-up  
applications).  
Figure 4-1 shows a typical application circuit.  
FIGURE 4-1:  
TYPICAL APPLICATION  
CIRCUIT  
VOUT  
VOUT  
VIN  
VIN  
+
C1  
1 µF  
TC1264  
GND  
SHDN  
DS21375C-page 6  
© 2006 Microchip Technology Inc.  
TC1264  
TABLE 5-2:  
THERMAL RESISTANCE  
5.0  
5.1  
THERMAL CONSIDERATIONS  
Thermal Shutdown  
GUIDELINES FOR TC1264 IN  
3-PIN DDPAK/TO-220  
PACKAGE  
Integrated thermal protection circuitry shuts the  
regulator off when die temperature exceeds 160°C.  
The regulator remains off until the die temperature  
drops to approximately 150°C.  
Copper  
Area  
(Topside)*  
Copper  
Area  
(Backside)  
Thermal  
Resistance  
Board  
Area  
(θ  
)
JA  
2500 sq mm 2500 sq mm 2500 sq mm  
1000 sq mm 2500 sq mm 2500 sq mm  
125 sq mm 2500 sq mm 2500 sq mm  
* Tab of device attached to topside copper  
25°C/W  
27°C/W  
35°C/W  
5.2  
Power Dissipation  
The amount of power the regulator dissipates is  
primarily a function of input and output voltage, and  
output current. The following equation is used to  
calculate worst-case actual power dissipation:  
Equation 5-1 can be used in conjunction with  
Equation 5-2 to ensure regulator thermal operation is  
within limits. For example:  
EQUATION 5-1:  
PD = (VINMAX VOUTMIN)ILOADMAX  
Given:  
Where:  
VINMAX = 3.3V ± 10%  
VOUTMIN = 2.7V ± 0.5%  
ILOADMAX = 275 mA  
TJMAX = 125°C  
PD = Worst-case actual power dissipation  
VINMAX  
VOUTMIN = Minimum regulator output voltage  
LOADMAX = Maximum output (load) current  
= Maximum voltage on VIN  
I
TAMAX = 95°C  
θJA = 59°C/W (SOT-223)  
The  
maximum  
allowable  
power  
dissipation  
(Equation 5-2) is a function of the maximum ambient  
temperature (TAMAX), the maximum allowable die tem-  
perature (TJMAX) and the thermal resistance from junc-  
tion-to-air (θJA).  
Find:  
1. Actual power dissipation.  
2. Maximum allowable dissipation  
Actual power dissipation:  
EQUATION 5-2:  
PD ≈ (VINMAX VOUTMIN)ILOADMAX  
PD = (3.3 × 1.1) (2.7 × .995)275 × 10–3  
PD = 260 mW  
PDMAX = (TJMAX TAMAX  
)
θJA  
Where all terms are previously defined.  
Maximum allowable power dissipation:  
Table 5-1 and Table 5-2 show various values of θJA for  
the TC1264 packages.  
TJMAX TAMAX  
PDMAX = --------------------------------------  
θJA  
(125 – 95)  
TABLE 5-1:  
THERMAL RESISTANCE  
GUIDELINES FOR TC1264 IN  
SOT-223 PACKAGE  
PDMAX = -------------------------  
59  
PDMAX = 508 mW  
In this example, the TC1264 dissipates a maximum of  
260 mW; below the allowable limit of 508 mW. In a  
similar manner, Equation 5-1 and Equation 5-2 can be  
used to calculate maximum current and/or input  
voltage limits. For example, the maximum allowable  
VIN, is found by substituting the maximum allowable  
power dissipation of 508mW into Equation 5-1, from  
which VINMAX = 4.6V.  
Copper  
Area  
(Topside)*  
Copper  
Area  
(Backside)  
Thermal  
Resistance  
Board  
Area  
(θ  
)
JA  
2500 sq mm 2500 sq mm 2500 sq mm  
1000 sq mm 2500 sq mm 2500 sq mm  
225 sq mm 2500 sq mm 2500 sq mm  
100 sq mm 2500 sq mm 2500 sq mm  
1000 sq mm 1000 sq mm 1000 sq mm  
45°C/W  
45°C/W  
53°C/W  
59°C/W  
52°C/W  
55°C/W  
1000 sq mm  
0 sq mm  
1000 sq mm  
* Tab of device attached to topside copper  
© 2006 Microchip Technology Inc.  
DS21375C-page 7  
TC1264  
6.0  
6.1  
PACKAGING INFORMATION  
Package Marking Information  
3-Lead DDPAK  
Example  
TC1264  
1.8VEB^
0643256  
XXXXXXXXX  
XXXXXXXXX  
YYWWNNN  
e
3
3-Lead SOT-223  
Example  
1264-25  
VDB0643  
256  
XXXXXXX  
XXXYYWW  
NNN  
3-Lead TO-220  
Example  
TC1264  
3.0VAB^
0643256  
XXXXXXXXX  
XXXXXXXXX  
YYWWNNN  
e3  
Legend: XX...X Customer-specific information  
Y
YY  
WW  
NNN  
Year code (last digit of calendar year)  
Year code (last 2 digits of calendar year)  
Week code (week of January 1 is week ‘01’)  
Alphanumeric traceability code  
e
3
Pb-free JEDEC designator for Matte Tin (Sn)  
*
This package is Pb-free. The Pb-free JEDEC designator (  
can be found on the outer packaging for this package.  
)
e3  
Note: In the event the full Microchip part number cannot be marked on one line, it will  
be carried over to the next line, thus limiting the number of available  
characters for customer-specific information.  
DS21375C-page 8  
© 2006 Microchip Technology Inc.  
TC1264  
3-Lead Plastic (EB) (DDPAK)  
Note: For the most current package drawings, please see the Microchip Packaging Specification located at  
http://www.microchip.com/packaging  
E
L3  
E1  
D2  
D
D1  
1
b
e
BOTTOM VIEW  
TOP VIEW  
α
b1  
(5X)  
c2  
A
φ
A1  
c
L
Units  
Dimension Limits  
INCHES  
*
MILLIMETERS  
MIN  
NOM  
MAX  
MIN  
NOM  
3
MAX  
Number of Pins  
Pitch  
3
e
A
1.00 BSC  
2.54 BSC  
4.50  
Overall Height  
Standoff  
.170  
.000  
.385  
.177  
.005  
.398  
.183  
4.32  
0.00  
9.78  
4.65  
§
A1  
E
.010  
.410  
0.13  
0.25  
Overall Width  
10.11  
6.50 REF  
8.89  
10.41  
Exposed Pad Width  
Molded Package Length  
Overall Length  
E1  
.256 REF  
D
D1  
D2  
c
.330  
.549  
.350  
.577  
.370  
.605  
8.38  
9.40  
13.94  
14.66  
7.70 REF  
0.51  
15.37  
Exposed Pad Length  
Lead Thickness  
Pad Thickness  
.303 REF  
.014  
.045  
.026  
.049  
.068  
.045  
--  
.020  
--  
.026  
.055  
.037  
.051  
.110  
.067  
0.36  
1.14  
0.66  
1.24  
1.73  
1.14  
--  
0.66  
1.40  
0.94  
1.30  
2.79  
1.70  
c2  
b
--  
Lower Lead Width  
Upper Lead Width  
Foot Length  
.032  
.050  
--  
0.81  
b1  
L
1.27  
--  
Pad Length  
L3  
φ
--  
--  
Foot Angle  
--  
8°  
7°  
--  
8°  
7°  
α
Mold Draft Angle  
3°  
--  
3°  
--  
*
Controlling Parameter  
§
Significant Characteristic  
Notes:  
Dimensions D and E do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.  
BSC: Basic Dimension. Theoretically, exact value shown without tolerances.  
See ASME Y14.5M  
REF: Reference Dimension, usually without tolerance, for information purposes only.  
See ASME Y14.5M  
Revised 07-19-05  
JEDEC equivalent: TO-252  
Drawing No. C04-011  
© 2006 Microchip Technology Inc.  
DS21375C-page 9  
TC1264  
3-Lead Plastic Small Outline Transistor (DB) (SOT-223)  
Note: For the most current package drawings, please see the Microchip Packaging Specification located at  
http://www.microchip.com/packaging  
D
b2  
E1  
E
1
e
e1  
α
A2  
A
c
φ
β
L
b
A1  
Units  
e
INCHES  
NOM  
MILLIMETERS  
NOM  
*
Dimension Limits  
MIN  
MAX  
MIN  
MAX  
Pitch  
.091 BSC  
.181 BSC  
2.30 BSC  
4.60 BSC  
Outside lead pitch (basic)  
Overall Height  
e1  
A
.071  
.004  
.065  
.287  
.146  
.264  
.014  
.033  
.124  
1.80  
Standoff  
A1  
A2  
E
.001  
.061  
.264  
.130  
.248  
.009  
.026  
.114  
.035  
0°  
0.02  
0.10  
1.65  
7.30  
3.70  
6.70  
0.35  
0.85  
3.15  
Molded Package Height  
Overall Width  
.063  
.276  
.138  
.256  
.012  
.030  
.118  
1.55  
6.70  
3.30  
6.30  
0.23  
0.65  
2.90  
0.90  
1.60  
7.00  
3.50  
6.50  
0.30  
0.76  
3.00  
Molded Package Width  
Overall Length  
E1  
D
c
Lead Thickness  
Lead Width  
b
Tab Lead Width  
Foot Length  
b2  
L
φ
Lead Angle  
10°  
0.37  
10°  
α
β
Mold Draft Angle, Top  
Mold Draft Angle, Bottom  
10°  
16°  
10°  
16°  
10°  
16°  
10°  
16°  
*
Controlling Parameter  
Notes:  
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side.  
BSC: Basic Dimension. Theoretically exact value shown without tolerances.  
See ASME Y14.5M  
JEDEC Equivalent TO-261 AA  
Drawing No. C04-032  
Revised 09-13-05  
DS21375C-page 10  
© 2006 Microchip Technology Inc.  
TC1264  
3-Lead Plastic Transistor Outline (AB) (TO-220)  
Note: For the most current package drawings, please see the Microchip Packaging Specification located at  
http://www.microchip.com/packaging  
A
E
φP  
A1  
E3  
E/2  
E1  
Q
H1  
D3  
D4  
D2  
α
D
5X  
D1  
L1  
BOTTOM: VARIANT A  
BOTTOM: VARIANT B  
L
b2  
PIN 1  
PIN n  
b
c
e
A2  
e1  
Units  
INCHES*  
NOM  
3
MILLIMETERS  
NOM  
Dimension Limits  
MIN  
MAX  
MIN  
MAX  
n
e
Number of Pins  
Pitch  
3
.100 BSC  
2.54 BSC  
Overall Pin Pitch  
Overall Height  
Tab Thickness  
Base to Lead  
Overall Width  
e1  
A
A1  
A2  
E
.200 BSC  
5.08 BSC  
.140  
-
.190  
3.56  
0.51  
2.03  
9.65  
6.86  
6.38  
2.54  
14.22  
8.38  
12.19  
6.17  
7.70  
5.84  
3.53  
12.70  
2.10  
0
-
4.83  
.020  
.080  
.380  
.270  
.251  
.100  
.560  
.330  
.480  
.243  
.303  
.230  
.139  
.500  
-
-
.055  
.120  
.420  
.350  
.261  
.120  
.650  
.361  
.507  
.253  
.313  
.270  
.156  
.580  
.250  
8°  
-
1.40  
3.05  
10.67  
8.89  
6.63  
3.05  
16.51  
9.17  
12.88  
6.43  
7.95  
6.86  
3.96  
14.73  
6.35  
8°  
-
-
-
-
Exposed Tab Width  
E1  
-
-
– (SEE BOTTOM VARIANT B)  
Hole Center to Tab Edge  
Overall Length  
E3  
.256  
6.50  
Q
-
-
D
-
-
Molded Package Length  
Exposed Tab Length  
– (SEE BOTTOM VARIANT B)  
– (SEE BOTTOM VARIANT B)  
Tab Length  
D1  
D2  
D3  
D4  
H1  
-
-
-
-
.248  
6.30  
.308  
7.82  
-
-
Mounting Hole Diameter  
Lead Length  
φP  
L
-
-
-
-
Lead Shoulder  
L1  
-
-
-
-
Foot Angle  
α
0
c
Lead Thickness  
.012  
.015  
.045  
-
.024  
.040  
.070  
0.30  
0.38  
1.14  
-
0.61  
1.02  
1.78  
Lead Width  
b
.027  
.057  
0.69  
1.45  
Shoulder Width  
b2  
*Controlling Parameter  
Notes:  
Dimensions D1 and E do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.  
BSC: Basic Dimension. Theoretically exact value shown without tolerances.  
See ASME Y14.5M  
Drawing No. C04-158  
© 2006 Microchip Technology Inc.  
DS21375C-page 11  
TC1264  
NOTES:  
DS21375C-page 12  
© 2006 Microchip Technology Inc.  
TC1264  
APPENDIX A: REVISION HISTORY  
Revision C (October 2006)  
Section 1.0 “Electrical Characteristics”:  
Changed dropout voltage voltage typical value for  
IL = 500 mA from 700 to 1000 and maximum  
value from 1000 to 1200 for. Changed typical  
value for IL = 800 mA from 890 to 1200  
Section 6.0 “PackAging Information”: Added  
package marking information and package outline  
drawings  
• Added disclaimer to package outline drawings.  
Revision B (May 2002)  
• Not Documented  
Revision A (March 2002)  
• Original Release of this Document.  
© 2006 Microchip Technology Inc.  
DS21375C-page 13  
TC1264  
NOTES:  
DS21375C-page 14  
© 2006 Microchip Technology Inc.  
TC1264  
PRODUCT IDENTIFICATION SYSTEM  
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.  
Examples:  
PART NO.  
Device  
X.XX  
XX  
XX  
a)  
b)  
c)  
d)  
TC1264-1.8VAB  
1.8V LDO, TO-220-3 pkg.  
2.5V LDO, TO-220-3 pkg.  
3.0V LDO, TO-220-3 pkg.  
3.3V LDO, TO-220-3 pkg.  
Voltage  
Option  
Package  
Tape and  
Reel  
TC1264-2.5VAB  
TC1264-3.0VAB  
TC1264-3.3VAB  
a)  
b)  
TC1264-1.8VEBTR 1.8V LDO, DDPAK-3 pkg.,  
Tape and Reel  
TC1264-2.5VEBTR 2.5V LDO, DDPAK-3 pkg.,  
Tape and Reel  
TC1264-3.0VEBTR 3.0V LDO, DDPAK-3 pkg.,  
Tape and Reel  
TC1264-3.3VEBTR 3.3V LDO, DDPAK-3 pkg.,  
Tape and Reel  
Device  
TC1264 Fixed Output CMOS LDO  
Voltage Option:*  
1.8V  
2.5V  
3.0V  
3.3V  
=
=
=
=
1.8V  
2.5V  
3.0V  
3.3V  
c)  
d)  
* Other output voltages are available. Please contact your local  
Microchip sales office for details.  
a)  
b)  
TC1264-1.8VDB  
1.8V LDO, SOT-223 pkg.  
TC1264-1.8VDBTR 1.8V LDO, SOT-223 pkg.,  
Tape and Reel  
Package  
AB  
=
=
=
Plastic (TO-220), 3-Lead  
c)  
d)  
TC1264-2.5VDB  
2.5V LDO, SOT-223 pkg.  
DB  
Plastic (SOT-223), 3-lead  
Plastic (SOT-223), 3-lead,  
Tape and Reel  
TC1264-2.5VDBTR 2.5V LDO, SOT-223 pkg.,  
Tape and Reel  
DBTR  
EB  
EBTR  
=
=
Plastic Transistor Outline (DDPAK), 3-Lead  
Plastic Transistor Outline (DDPAK), 3-Lead,  
Tape and Reel  
e)  
f)  
TC1264-3.0VDB  
3.0V LDO, SOT-223 pkg.  
TC1264-3.0VDBTR 3.0V LDO, SOT-223 pkg.,  
Tape and Reel  
g)  
h)  
TC1264-3.3VDB  
TC1264-3.3VDBTR 3.3V LDO, SOT-223 pkg.,  
Tape and Reel  
3.3V LDO, SOT-223 pkg.  
© 2006 Microchip Technology Inc.  
DS21375C-page 15  
TC1264  
NOTES:  
DS21375C-page 16  
© 2006 Microchip Technology Inc.  
Note the following details of the code protection feature on Microchip devices:  
Microchip products meet the specification contained in their particular Microchip Data Sheet.  
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the  
intended manner and under normal conditions.  
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our  
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data  
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.  
Microchip is willing to work with the customer who is concerned about the integrity of their code.  
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not  
mean that we are guaranteeing the product as “unbreakable.”  
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our  
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts  
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.  
Information contained in this publication regarding device  
applications and the like is provided only for your convenience  
and may be superseded by updates. It is your responsibility to  
ensure that your application meets with your specifications.  
MICROCHIP MAKES NO REPRESENTATIONS OR  
WARRANTIES OF ANY KIND WHETHER EXPRESS OR  
IMPLIED, WRITTEN OR ORAL, STATUTORY OR  
OTHERWISE, RELATED TO THE INFORMATION,  
INCLUDING BUT NOT LIMITED TO ITS CONDITION,  
QUALITY, PERFORMANCE, MERCHANTABILITY OR  
FITNESS FOR PURPOSE. Microchip disclaims all liability  
arising from this information and its use. Use of Microchip  
devices in life support and/or safety applications is entirely at  
the buyer’s risk, and the buyer agrees to defend, indemnify and  
hold harmless Microchip from any and all damages, claims,  
suits, or expenses resulting from such use. No licenses are  
conveyed, implicitly or otherwise, under any Microchip  
intellectual property rights.  
Trademarks  
The Microchip name and logo, the Microchip logo, Accuron,  
dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART,  
PRO MATE, PowerSmart, rfPIC, and SmartShunt are  
registered trademarks of Microchip Technology Incorporated  
in the U.S.A. and other countries.  
AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB,  
SEEVAL, SmartSensor and The Embedded Control Solutions  
Company are registered trademarks of Microchip Technology  
Incorporated in the U.S.A.  
Analog-for-the-Digital Age, Application Maestro, CodeGuard,  
dsPICDEM, dsPICDEM.net, dsPICworks, ECAN,  
ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,  
In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active  
Thermistor, Mindi, MiWi, MPASM, MPLIB, MPLINK, PICkit,  
PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal,  
PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB,  
rfPICDEM, Select Mode, Smart Serial, SmartTel, Total  
Endurance, UNI/O, WiperLock and ZENA are trademarks of  
Microchip Technology Incorporated in the U.S.A. and other  
countries.  
SQTP is a service mark of Microchip Technology Incorporated  
in the U.S.A.  
All other trademarks mentioned herein are property of their  
respective companies.  
© 2006, Microchip Technology Incorporated, Printed in the  
U.S.A., All Rights Reserved.  
Printed on recycled paper.  
Microchip received ISO/TS-16949:2002 certification for its worldwide  
headquarters, design and wafer fabrication facilities in Chandler and  
Tempe, Arizona, Gresham, Oregon and Mountain View, California. The  
Company’s quality system processes and procedures are for its PIC®  
8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs,  
microperipherals, nonvolatile memory and analog products. In addition,  
Microchip’s quality system for the design and manufacture of  
development systems is ISO 9001:2000 certified.  
© 2006 Microchip Technology Inc.  
DS21375C-page 17  
WORLDWIDE SALES AND SERVICE  
AMERICAS  
ASIA/PACIFIC  
ASIA/PACIFIC  
EUROPE  
Corporate Office  
Asia Pacific Office  
Suites 3707-14, 37th Floor  
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Tel: 852-2401-1200  
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Tel: 480-792-7200  
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Technical Support:  
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Tel: 45-4450-2828  
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Tel: 91-11-4160-8631  
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Taiwan - Taipei  
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Santa Clara  
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China - Wuhan  
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Thailand - Bangkok  
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Toronto  
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Canada  
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Fax: 86-29-8833-7256  
10/19/06  
DS21375C-page 18  
© 2006 Microchip Technology Inc.  
配单直通车
TC1264-3.0VAB产品参数
型号:TC1264-3.0VAB
生命周期:Transferred
IHS 制造商:TELCOM SEMICONDUCTOR INC
包装说明:TO-220, 3 PIN
Reach Compliance Code:unknown
风险等级:5.67
Is Samacsys:N
最大回动电压 1:1.3 V
最大输入电压:6 V
最小输入电压:4 V
JESD-30 代码:R-PSFM-T3
功能数量:1
端子数量:3
工作温度TJ-Max:125 °C
工作温度TJ-Min:-40 °C
最大输出电流 1:0.8 A
最大输出电压 1:3.075 V
最小输出电压 1:2.925 V
标称输出电压 1:3 V
封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR
封装形式:FLANGE MOUNT
认证状态:Not Qualified
调节器类型:FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
表面贴装:NO
技术:CMOS
端子形式:THROUGH-HOLE
端子位置:SINGLE
Base Number Matches:1
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