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产品型号TD62783APG_06的Datasheet PDF文件预览

TD62783,784APG/AFWG  
TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC  
TD62783APG,TD62783AFWG,TD62784APG,TD62784AFWG  
(Manufactured by Toshiba Malaysia)  
8CH HIGHVOLTAGE SOURCE DRIVER  
The TD62783APG / AFWG Series are comprised of eight source  
current Transistor Array.  
These drivers are specifically designed for fluorescent display  
TD62783APG  
TD62784APG  
applications.  
Applications include relay, hammer and lamp drivers.  
The suffix (G) appended to the part number represents a Lead  
(Pb)-Free product.  
FEATURES  
High output voltage: V = 50 V MIN.  
CC  
Output current (single output) I  
Output clamp diodes  
= 500 mA MAX.  
OUT  
TD62783AFWG  
TD62784AFWG  
Single supply voltage  
Input compatible with various types of logic  
Package TypeAPG : DIP18 pin  
Package TypeAFWG: SOL18 pin  
TYPE  
DESIGNATION  
Weight  
TD62783APG / AFWG TTL, 5 V CMOS  
DIP18P3002.54F: 1.478 g (Typ.)  
SOL18P3001.27: 0.48 g (Typ.)  
TD62784APG / AFWG 6~15 V PMOS, CMOS  
PIN CONNECTION (TOP VIEW)  
SCHEMATICS (EACH DRIVER)  
Note: The input and output parasitic diodes cannot  
be used as clamp diodes.  
1
2006-09-21  
TD62783,784APG/AFWG  
ABSOLUTE MAXIMUM RATINGS (Ta = 25°C)  
CHARACTERISTIC  
Supply Voltage  
SYMBOL  
RATING  
UNIT  
V
50  
V
CC  
Output Current  
I
500  
mA / ch  
OUT  
V
V
(Note 1)  
(Note 2)  
15  
IN  
Input Voltage  
V
30  
IN  
Clamp Diode Reverse Voltage  
Clamp Diode Forward Current  
V
50  
500  
V
R
I
mA  
F
APG  
AFWG  
1.47  
Power Dissipation  
P
W
D
0.92 / 1.31 (Note 3)  
40~85  
Operating Temperature  
Storage Temperature  
T
opr  
°C  
°C  
T
stg  
55~150  
Note 1: Only TD62783APG / AFWG  
Note 2: Only TD62784APG / AFWG  
Note 3: On Glass Epoxy PCB (75 × 114 × 1.6 mm Cu 20%)  
RECOMMENDED OPERATING CONDITIONS (Ta = −40~85°C)  
CHARACTERISTIC  
Supply Voltage  
SYMBOL  
TEST CONDITION  
MIN  
TYP.  
MAX  
UNIT  
V
V
2.0  
4.5  
0
50  
260  
59  
180  
38  
12  
CC  
Duty = 10% 8Circuits  
TD62783,784APG  
Ta = 85°C  
T = 120°C  
Duty = 50% 8Circuits  
mA /  
ch  
Output Current  
I
OUT  
j
Duty = 10% 8Circuits  
= 25ms  
T
pw  
TD62783,784AFWG  
Duty = 50% 8Circuits  
TD62783APG / AFWG  
TD62784APG / AFWG  
TD62783APG / AFWG  
TD62784APG / AFWG  
TD62783APG / AFWG  
TD62784APG / AFWG  
Input Voltage  
Output  
V
V
V
IN  
24  
5.0  
12.0  
15  
V
IN (ON)  
On  
30  
Input  
Voltage  
0.8  
Output  
V
IN (OFF)  
Off  
0
2.0  
Clamp Diode Reverse Voltage  
Clamp Diode Forward Current  
V
50  
V
R
D
I
400  
0.76  
0.68  
mA  
F
APG  
Ta = 85°C  
Ta = 85°C  
Power Dissipation  
P
W
AFWG  
(Note)  
Note: On Glass Epoxy PCB (75 × 114 × 1.6 mm Cu 20%)  
2
2006-09-21  
TD62783,784APG/AFWG  
ELECTRICAL CHARACTERISTICS (Ta = 25°C)  
TEST  
CIR−  
CUIT  
CHARACTERISTIC  
SYMBOL  
TEST CONDITION  
= V . V = 0.4 V  
MIN  
TYP.  
MAX  
UNIT  
µA  
V
CC  
CC MAX IN  
Output Leakage Current  
I
1
2
100  
2.0  
1.9  
1.8  
CEX  
Ta = 25°C  
V
= V  
,
IN  
IN (ON)  
I
= −350 mA  
OUT  
V
= V  
,
IN  
IN (ON)  
Output Saturation Voltage  
V
V
CE (sat)  
I
= −225 mA  
OUT  
V
= V  
,
IN  
IN (ON)  
I
= −100 mA  
OUT  
V
V
V
V
V
= 2.4 V  
36  
180  
92  
52  
260  
130  
1130  
2.0  
4.5  
IN  
IN  
TD62783APG / AFWG  
= 3.85 V  
= 5 V  
Input Current  
I
3
µA  
IN (ON)  
IN  
TD62784APG / AFWG  
= 12 V  
790  
IN  
TD62783APG / AFWG  
TD62784APG / AFWG  
TD62783APG / AFWG  
TD62784APG / AFWG  
= 2.0 V  
CE  
OUT  
V
IN (ON)  
I
= −350 mA  
Input Voltage  
4
3
V
0.8  
2.0  
V
I
= −500 µA  
IN (OFF)  
OUT  
mA /  
ch  
Supply Current  
I
V
V
= V  
, V = 50 V  
2.5  
CC (ON)  
IN  
R
IN (ON) CC  
Clamp Diode Reverse Current  
Clamp Diode Forward Voltage  
TurnOn Delay  
I
5
6
= 50 V  
50  
2.0  
µA  
V
R
V
I = 350 mA  
F
F
t
0.15  
1.8  
ON  
V
C
= V  
. R = 125 Ω  
CC  
= 15 pF  
CC MAX L  
7
µs  
L
TurnOff Delay  
t
OFF  
3
2006-09-21  
TD62783,784APG/AFWG  
TEST CIRCUIT  
1. I  
2. V  
CEX  
CE (sat)  
3. I  
, I  
4. V  
, V  
IN (ON) CC  
IN (ON) IN (OFF)  
5. I  
6. V  
R
F
7. t , t  
ON OFF  
Note 1: Pulse width 50 µs, duty cycle 10%  
Output impedance 50 , t 5 ns, t 10 ns  
r
f
Note 2: C includes probe and jig capacitance  
L
PRECAUTIONS for USING  
This IC does not integrate protection circuits such as overcurrent and overvoltage protectors.  
Thus, if excess current or voltage is applied to the IC, the IC may be damaged. Please design the IC so that  
excess current or voltage will not be applied to the IC.  
Utmost care is necessary in the design of the output line, V  
CC  
and GND line since IC may be destroyed due to  
shortcircuit between outputs, air contamination fault, or fault by improper grounding.  
4
2006-09-21  
TD62783,784APG/AFWG  
5
2006-09-21  
TD62783,784APG/AFWG  
6
2006-09-21  
TD62783,784APG/AFWG  
PACKAGE DIMENSIONS  
Weight: 1.478 g (typ.)  
7
2006-09-21  
TD62783,784APG/AFWG  
PACKAGE DIMENSIONS  
Weight: 0.48 g (typ.)  
8
2006-09-21  
TD62783,784APG/AFWG  
Notes on Contents  
Equivalent Circuits  
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory  
purposes.  
Test Circuits  
Components in the test circuits are used only to obtain and confirm the device characteristics. These  
components and circuits are not guaranteed to prevent malfunction or failure from occurring in the  
application equipment.  
IC Usage Considerations  
Notes on Handling of ICs  
(1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be  
exceeded, even for a moment. Do not exceed any of these ratings.  
Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result  
injury by explosion or combustion.  
(2) Use an appropriate power supply fuse to ensure that a large current does not continuously flow in  
case of over current and/or IC failure. The IC will fully break down when used under conditions that  
exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal  
pulse noise occurs from the wiring or load, causing a large current to continuously flow and the  
breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of  
breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are  
required.  
(3) If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the  
design to prevent device malfunction or breakdown caused by the current resulting from the inrush  
current at power ON or the negative current resulting from the back electromotive force at power OFF.  
IC breakdown may cause injury, smoke or ignition.  
Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable,  
the protection function may not operate, causing IC breakdown. IC breakdown may cause injury,  
smoke or ignition.  
(4) Do not insert devices in the wrong orientation or incorrectly.  
Make sure that the positive and negative terminals of power supplies are connected properly.  
Otherwise, the current or power consumption may exceed the absolute maximum rating, and  
exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result  
injury by explosion or combustion.  
In addition, do not use any device that is applied the current with inserting in the wrong orientation  
or incorrectly even just one time.  
(5) Carefully select external components (such as inputs and negative feedback capacitors) and load  
components (such as speakers), for example, power amp and regulator.  
If there is a large amount of leakage current such as input or negative feedback condenser, the IC  
output DC voltage will increase. If this output voltage is connected to a speaker with low input  
withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause  
smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied  
Load (BTL) connection type IC that inputs output DC voltage to a speaker directly.  
9
2006-09-21  
TD62783,784APG/AFWG  
Points to Remember on Handling of ICs  
(1) Heat Radiation Design  
In using an IC with large current flow such as power amp, regulator or driver, please design the  
device so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at  
any time and condition. These ICs generate heat even during normal use. An inadequate IC heat  
radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In  
addition, please design the device taking into considerate the effect of IC heat radiation with  
peripheral components.  
(2) Back-EMF  
When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to  
the motor’s power supply due to the effect of back-EMF. If the current sink capability of the power  
supply is small, the device’s motor power supply and output pins might be exposed to conditions  
beyond absolute maximum ratings. To avoid this problem, take the effect of back-EMF into  
consideration in system design.  
10  
2006-09-21  
TD62783,784APG/AFWG  
About solderability, following conditions were confirmed  
Solderability  
(1) Use of Sn-37Pb solder Bath  
· solder bath temperature = 230°C  
· dipping time = 5 seconds  
· the number of times = once  
· use of R-type flux  
(2) Use of Sn-3.0Ag-0.5Cu solder Bath  
· solder bath temperature = 245°C  
· dipping time = 5 seconds  
· the number of times = once  
· use of R-type flux  
RESTRICTIONS ON PRODUCT USE  
060116EBA  
The information contained herein is subject to change without notice. 021023_D  
TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor  
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical  
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of  
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of  
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.  
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as  
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and  
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability  
Handbook” etc. 021023_A  
The TOSHIBA products listed in this document are intended for usage in general electronics applications  
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,  
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires  
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or  
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or  
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,  
medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this  
document shall be made at the customer’s own risk. 021023_B  
The products described in this document shall not be used or embedded to any downstream products of which  
manufacture, use and/or sale are prohibited under any applicable laws and regulations. 060106_Q  
The information contained herein is presented only as a guide for the applications of our products. No  
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which  
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of  
TOSHIBA or others. 021023_C  
The products described in this document are subject to the foreign exchange and foreign trade laws. 021023_E  
11  
2006-09-21  
配单直通车
TD62783F产品参数
型号:TD62783F
是否Rohs认证:不符合
生命周期:Obsolete
IHS 制造商:MARKTECH OPTOELECTRONICS
包装说明:SOP, SOP18,.4
Reach Compliance Code:unknown
风险等级:5.87
Is Samacsys:N
驱动器位数:8
JESD-30 代码:R-PDSO-G18
JESD-609代码:e0
端子数量:18
最高工作温度:85 °C
最低工作温度:-40 °C
最大输出电流:0.26 A
封装主体材料:PLASTIC/EPOXY
封装代码:SOP
封装等效代码:SOP18,.4
封装形状:RECTANGULAR
封装形式:SMALL OUTLINE
电源:5 V
认证状态:Not Qualified
子类别:Peripheral Drivers
标称供电电压:5 V
表面贴装:YES
技术:BIPOLAR
温度等级:INDUSTRIAL
端子面层:Tin/Lead (Sn/Pb)
端子形式:GULL WING
端子节距:1.27 mm
端子位置:DUAL
Base Number Matches:1
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