TDA1009现货热卖使用介绍供应商报价哪里找芯片批发报价-中国IC网-芯三七

INTEGRATED CIRCUITS

DATA SHEET

TDA1010A

6 W audio power amplifier in car

applications

10 W audio power amplifier in

mains-fed applications

November 1982

Product speciﬁcation

File under Integrated Circuits, IC01

Philips Semiconductors

Product speciﬁcation

6 W audio power ampliﬁer in car applications

10 W audio power ampliﬁer in mains-fed

TDA1010A

The TDA1010A is a monolithic integrated class-B audio amplifier circuit in a 9-lead single in-line (SIL) plastic package.

The device is primarily developed as a 6 W car radio amplifier for use with 4 Ω and 2 Ω load impedances. The wide supply

voltage range and the flexibility of the IC make it an attractive proposition for record players and tape recorders with

output powers up to 10 W.

Special features are:

• single in-line (SIL) construction for easy mounting

• separated preamplifier and power amplifier

• high output power

• low-cost external components

• good ripple rejection

• thermal protection

QUICK REFERENCE DATA

Supply voltage range

V_P

6 to 24

3

V

A

Repetitive peak output current

Output power at pin 2; d_tot= 10%

V_P= 14,4 V; R_L= 2 Ω

I_ORM

max.

P_o

typ.

6,4

6,2

3,4

W

V_P= 14,4 V; R_L= 4 Ω

V_P= 14,4 V; R_L= 8 Ω

V_P= 14,4 V; R_L= 2 Ω; with additional bootstrap resistor of 220 Ω between

pins 3 and 4

P_o

typ.

9

W

%

Total harmonic distortion at P_o= 1 W; R_L= 4 Ω

Input impedance

d_tot

0,2

preamplifier (pin 8)

Z_i

typ.

30

20

31

10

kΩ

mA

mV

°C

power amplifier (pin 6)

Total quiescent current at V_P= 14,4 V

Sensitivity for P_o= 5,8 W; R_L= 4 Ω

Operating ambient temperature

Storage temperature

I_tot

V_i

T_amb

T_stg

−25 to + 150

−55 to + 150

°C

PACKAGE OUTLINE

9-lead SIL; plastic (SOT110B); SOT110-1; 1996 Sepetember 06.

November 1982

2

Philips Semiconductors

Product speciﬁcation

6 W audio power ampliﬁer in car applications

10 W audio power ampliﬁer in mains-fed applications

TDA1010A

November 1982

3

Philips Semiconductors

Product speciﬁcation

6 W audio power ampliﬁer in car applications

10 W audio power ampliﬁer in mains-fed applications

TDA1010A

RATINGS

Limiting values in accordance with the Absolute Maximum System (IEC 134)

Supply voltage

V_P

max.

24

5

V

A

Peak output current

I_OM

Repetitive peak output current

Total power dissipation

Storage temperature

I_ORMmax.

3

see derating curve Fig.2

T_stg−55 to +150

T_amb−25 to +150

°C

Operating ambient temperature

°C

A.C. short-circuit duration of load during sine-wave drive; without heatsink at

V_P= 14,4 V

t_sc

max.

100

hours

Fig.2 Power derating curve.

HEATSINK DESIGN

Assume V_P= 14,4 V; R_L= 2 Ω; T_amb= 60 °C maximum; thermal shut-down starts at T_j= 150 °C. The maximum sine-wave

dissipation in a 2 Ω load is about 5,2 W. The maximum dissipation for music drive will be about 75% of the worst-case

sine-wave dissipation, so this will be 3,9 W. Consequently, the total resistance from junction to ambient

150 – 60

R_{th j-a}= R_{th j-tab}+ R_{th tab-h}+ R_{th h-a}

=

= 23 K/W .

----------------------

3, 9

Since R_{th j-tab}= 10 K/W and R_{th tab-h}= 1 K/W,

R_{th h-a}= 23 − (10 + 1) = 12 K/W.

November 1982

4

Philips Semiconductors

Product speciﬁcation

6 W audio power ampliﬁer in car applications

10 W audio power ampliﬁer in mains-fed applications

TDA1010A

D.C. CHARACTERISTICS

Supply voltage range

V_P

6 to 24 V

Repetitive peak output current

Total quiescent current at V_P= 14,4 V

I_ORM

I_tot

<

3

A

typ.

31 mA

A.C. CHARACTERISTICS

T_amb= 25 °C; V_P= 14,4 V; R_L= 4 Ω; f = 1 kHz unless otherwise speciﬁed; see also Fig.3.

A.F. output power (see Fig.4) at d_tot= 10%;

measured at pin 2; with bootstrap

V_P= 14,4 V; R_L= 2 Ω (note 1)

P_o

typ.

>

6,4 W

5,9 W

6,2 W

3,4 W

5,7 W

V_P= 14,4 V; R_L= 4 Ω (note 1 and 2)

typ.

V_P= 14,4 V; R_L= 8 Ω (note 1)

P_o

V_P= 14,4 V; R_L= 4 Ω; without bootstrap

V_P= 14,4 V; R_L= 2 Ω; with additional bootstrap resistor of 220 Ω between pins 3 and 4 P_o

9

W

Voltage gain

preamplifier (note 3)

power amplifier

total amplifier

G_v1

typ.

24 dB

21 to 27 dB

30 dB

G_v2

27 to 33 dB

54 dB

G_{v tot}

51 to 57 dB

0,2 %

Total harmonic distortion at P_o= 1 W

Efﬁciency at P_o= 6 W

d_tot

η

typ.

75

%

Frequency response (−3 dB)

Input impedance

B

80 Hz to 15 kHz

preamplifier (note 4)

Z_i

typ.

30 kΩ

20 to 40 kΩ

20 kΩ

power amplifier (note 5)

Z_i

typ.

14 to 26 kΩ

20 kΩ

Output impedance of preampliﬁer; pin 7 (note 5)

Output voltage preampliﬁer (r.m.s. value)

Z_o

14 to 26 kΩ

d

_tot< 1% (pin 7) (note 3)

V_o(rms)

>

0,7 V

Noise output voltage (r.m.s. value; note 6)

R_S= 0 Ω

V_n(rms)typ.

<

0,3 mV

0,7 mV

1,4 mV

42 dB

37 dB

10 mV

30 mA

R_S= 8,2 kΩ

Ripple rejection at f = 1 kHz to 10 kHz (note 7)

at f = 100 Hz; C2 = 1 µF

RR

V_i

>

Sensitivity for P_o= 5,8 W

typ.

Bootstrap current at onset of clipping; pin 4 (r.m.s. value)

I_4(rms)typ.

November 1982

5

Philips Semiconductors

Product speciﬁcation

6 W audio power ampliﬁer in car applications

10 W audio power ampliﬁer in mains-fed applications

TDA1010A

Notes

1. Measured with an ideal coupling capacitor to the speaker load.

2. Up to P_o≤ 3 W : d_tot≤ 1%.

3. Measured with a load impedance of 20 kΩ.

4. Independent of load impedance of preamplifier.

5. Output impedance of preamplifier ( Z_Ο) is correlated (within 10%) with the input impedance ( Z_i) of the power

amplifier.

6. Unweighted r.m.s. noise voltage measured at a bandwidth of 60 Hz to 15 kHz (12 dB/octave).

7. Ripple rejection measured with a source impedance between 0 and 2 kΩ (maximum ripple amplitude: 2 V).

8. The tab must be electrically floating or connected to the substrate (pin 9).

Fig.3 Test circuit.

November 1982

6

Philips Semiconductors

Product speciﬁcation

6 W audio power ampliﬁer in car applications

10 W audio power ampliﬁer in mains-fed applications

TDA1010A

Fig.4 Output power of the circuit of Fig.3 as a function of the supply voltage with the load impedance as a

parameter; typical values. Solid lines indicate the power across the load, dashed lines that available at pin

2 of the TDA1010. R_L= 2 Ω ⁽¹⁾has been measured with an additional 220 Ω bootstrap resistor between

pins 3 and 4. Measurements were made at f = 1 kHz, d_tot= 10%, T_amb= 25 °C.

Fig. 5 See next page.

Total harmonic distortion in the circuit of Fig.3 as a function of the output power with the load impedance as a parameter;

typical values. Solid lines indicate the power across the load, dashed lines that available at pin 2 of the TDA1010.

R_L= 2 Ω ⁽¹⁾has been measured with an additional 220 Ω bootstrap resistor between pins 3 and 4. Measurements were

made at f = 1 kHz, V_P= 14,4 V.

November 1982

7

Philips Semiconductors

Product speciﬁcation

6 W audio power ampliﬁer in car applications

10 W audio power ampliﬁer in mains-fed applications

TDA1010A

Fig.5 For caption see preceding page.

Fig.6 Frequency characteristics of the circuit of Fig.3 for three values of load impedance; typical values.

P_orelative to 0 dB = 1 W; V_P= 14,4 V.

November 1982

8

Philips Semiconductors

Product speciﬁcation

6 W audio power ampliﬁer in car applications

10 W audio power ampliﬁer in mains-fed applications

TDA1010A

Fig.7 Total power dissipation (solid lines) and the efficiency (dashed lines) of the circuit of Fig.3 as a function of

the output power with the load impedance as a parameter (for R_L= 2 Ω an external bootstrap resistor of

220 Ω has been used); typical values. V_P= 14,4 V; f = 1 kHz.

November 1982

9

Philips Semiconductors

Product speciﬁcation

6 W audio power ampliﬁer in car applications

10 W audio power ampliﬁer in mains-fed applications

TDA1010A

Fig.8 Thermal resistance from heatsink to ambient of a 1,5 mm thick bright aluminium heatsink as a function of

the single-sided area of the heatsink with the total power dissipation as a parameter.

November 1982

10

Philips Semiconductors

Product speciﬁcation

6 W audio power ampliﬁer in car applications

10 W audio power ampliﬁer in mains-fed applications

TDA1010A

APPLICATION INFORMATION

November 1982

11

Philips Semiconductors

Product speciﬁcation

6 W audio power ampliﬁer in car applications

10 W audio power ampliﬁer in mains-fed applications

TDA1010A

Fig.10 Track side of printed-circuit board used for the circuit of Fig.9; p.c. board dimensions 92 mm × 52 mm.

Fig.11 Component side of printed-circuit board showing component layout used for the circuit of Fig.9.

November 1982

12

Philips Semiconductors

Product speciﬁcation

6 W audio power ampliﬁer in car applications

10 W audio power ampliﬁer in mains-fed applications

TDA1010A

November 1982

13

Philips Semiconductors

Product speciﬁcation

6 W audio power ampliﬁer in car applications

10 W audio power ampliﬁer in mains-fed applications

TDA1010A

Fig.13 Track side of printed-circuit board used for the circuit of Fig.12; p.c. board dimensions 83 mm × 65 mm.

November 1982

14

Philips Semiconductors

Product speciﬁcation

6 W audio power ampliﬁer in car applications

10 W audio power ampliﬁer in mains-fed applications

TDA1010A

Fig.14 Component side of printed-circuit board showing component layout used for the circuit of Fig.12.

Balance control is not on the p.c. board.

November 1982

15

Philips Semiconductors

Product speciﬁcation

6 W audio power ampliﬁer in car applications

10 W audio power ampliﬁer in mains-fed applications

TDA1010A

Fig.15 Channel separation of the circuit of Fig.12 as a function of the frequency.

Fig.16 Power supply of circuit of Fig.17.

16

November 1982

Philips Semiconductors

Product speciﬁcation

6 W audio power ampliﬁer in car applications

10 W audio power ampliﬁer in mains-fed applications

TDA1010A

November 1982

17

Philips Semiconductors

Product speciﬁcation

6 W audio power ampliﬁer in car applications

10 W audio power ampliﬁer in mains-fed applications

TDA1010A

Fig.18 Track side of printed-circuit board used for the circuit of Fig.17 (Fig.16 partly); p.c. board dimensions

169 mm × 118 mm.

November 1982

18

Philips Semiconductors

Product speciﬁcation

6 W audio power ampliﬁer in car applications

10 W audio power ampliﬁer in mains-fed applications

TDA1010A

Fig.19 Component side of printed-circuit board showing component layout used for the circuit of Fig.17

(Fig.16 partly).

November 1982

19

Philips Semiconductors

Product speciﬁcation

6 W audio power ampliﬁer in car applications

10 W audio power ampliﬁer in mains-fed applications

TDA1010A

Fig.20 Channel separation of the circuit of Fig.18 as a function of frequency.

November 1982

20

Philips Semiconductors

Product speciﬁcation

6 W audio power ampliﬁer in car applications

10 W audio power ampliﬁer in mains-fed applications

TDA1010A

PACKAGE OUTLINE

SIL9MPF: plastic single in-line medium power package with fin; 9 leads

SOT110-1

D

1

q

A

2

P

1

A

3

q

2

q

1

A

4

E

pin 1 index

c

L

1

9

b

Q

e

Z

b

w

M

2

b

1

0

5

10 mm

scale

DIMENSIONS (mm are the original dimensions)

(1)

Z

max.

A

max.

2

(1)

E

UNIT

A

b

c

D

e

L

P

Q

q

2

w

A

3

4

1

2

1

18.5

17.8

8.7 15.8 1.40 0.67 1.40 0.48 21.8 21.4 6.48

8.0 15.4 1.14 0.50 1.14 0.38 21.4 20.7 6.20

3.9 2.75 3.4 1.75 15.1

3.4 2.50 3.2 1.55 14.9

4.4

4.2

5.9

5.7

2.54

mm

3.7

0.25 1.0

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

PROJECTION

ISSUE DATE

VERSION

IEC

JEDEC

EIAJ

92-11-17

95-02-25

SOT110-1

November 1982

21

Philips Semiconductors

Product speciﬁcation

6 W audio power ampliﬁer in car

applications

TDA1010A

The device may be mounted up to the seating plane, but

the temperature of the plastic body must not exceed the

specified maximum storage temperature (T_{stg max}). If the

printed-circuit board has been pre-heated, forced cooling

may be necessary immediately after soldering to keep the

temperature within the permissible limit.

SOLDERING

Introduction

There is no soldering method that is ideal for all IC

packages. Wave soldering is often preferred when

through-hole and surface mounted components are mixed

on one printed-circuit board. However, wave soldering is

not always suitable for surface mounted ICs, or for

printed-circuits with high population densities. In these

situations reflow soldering is often used.

Repairing soldered joints

Apply a low voltage soldering iron (less than 24 V) to the

lead(s) of the package, below the seating plane or not

more than 2 mm above it. If the temperature of the

soldering iron bit is less than 300 °C it may remain in

contact for up to 10 seconds. If the bit temperature is

between 300 and 400 °C, contact may be up to 5 seconds.

This text gives a very brief insight to a complex technology.

A more in-depth account of soldering ICs can be found in

our “IC Package Databook” (order code 9398 652 90011).

Soldering by dipping or by wave

The maximum permissible temperature of the solder is

260 °C; solder at this temperature must not be in contact

with the joint for more than 5 seconds. The total contact

time of successive solder waves must not exceed

5 seconds.

DEFINITIONS

Data sheet status

Objective speciﬁcation

Preliminary speciﬁcation

Product speciﬁcation

This data sheet contains target or goal speciﬁcations for product development.

This data sheet contains preliminary data; supplementary data may be published later.

This data sheet contains ﬁnal product speciﬁcations.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or

more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation

of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation

is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the speciﬁcation.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these

products can reasonably be expected to result in personal injury. Philips customers using or selling these products for

use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such

improper use or sale.

November 1982

22

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