集成电路封装
日期：2007-4-29标签：
（来源：互联网）
| ac97 | ac97v2.2 specification |
| agp 3.3vaccelerated graphics portspecification 2.0 |
| agp proaccelerated graphics port prospecification 1.01 |
| agpaccelerated graphics portspecification 2.0 |
| amraudio/modem riser |
| ax078 |
| ax14 |
| bgaball grid array |
| bqfp132 |
| ebga 680l |
| lbga 160l |
| pbga 217lplastic ball grid array |
| sbga 192l |
| tepbga 288l | tepbga 288l |
| tsbga 680l |
| c-bend lead |
| cerquadceramic quad flat pack |
| clcc |
| cnrcommunication and border=0> | cpgaceramic pin grid array |
| ceramic case |
| laminate csp 112lchip scale package |
