Kintex-7 FPGA系列主要特性和应用优势及相关图形
日期:2012-8-31XILINX公司的7系列FPGA包括Artix-7, Kintex-7 和Virtex-7 三个系列,具有超高端连接带宽,逻辑容量和信号完整性,提供低成本,小型尺寸和大容量的要求最严格的高性能应用.其中的Kintex-7 FPGA具有最高的性价比,其所组成的收发器从600 Mbps到最高的6.6 Gbps ,高达到28.05 Gbps,主要用在航空电子,LED背光的平板电视和3D TV,LTE基带,手持超声设备,多模式无线电,Prosumer数码单反照相机和视频IP网关.本文介绍了7系列FPGA主要特性, Kintex-7 FPGA系列主要特性和应用优势,以及评估板KC705主要特性,方框图, 评估板KC705主要元件, 配置电路图,详细电路图和材料清单.
CDB5484U评估板主要特性:
◎ Standalone Power Meter Application
◎ VOLTAGE and Current Interfaces
◎ Low- and High-voltage Sensor Connections
◎ Adaptable Sensor Filters Onboard
◎ USB Communication with PC
◎ UART/SPI Optically ISOLATED Communication
◎ Onboard C8051F342.html" target="_blank" title="C8051F342">C8051F342 MICROCONTROLLER
◎ SINGLE Supply Operation USB or 5V
◎ Onboard DC-DC CONVERTER and REGULATOR
◎ LabWindows/CVI GUI SOFTWARE
– Full Register Setup and Chip Control
– Simplified Register
– Quick Calibration Control
– FFT Analysis
– Time Domain Analysis
– Noise Histogram Analysis
◎ Voltage Reference AccessXilinx 7 SERIES FPGAs comprise three new FPGA families that address the complete range of SYSTEM requirements, ranging from low cost, small form factor, cost-sensitive, high-volume applications to ultra high-end connectivity bandwidth, logic capacity, and signal processing capability for the most demanding high-performance applications. The 7 series DEVICES are the programmable SILICON foundation for Targeted Design Platforms that enable designers to focus on innovation from the outset of their development cycle. The 7 series FPGAs include:
◎ Artix-7 Family: Optimized for lowest cost and power with small form-factor packaging for the highest volume applications.
◎ Kintex-7 Family: Optimized for best price-performance with a 2X improvement compared to previous generation, enabling a new class of FPGAs.
◎ Virtex-7 Family: Optimized for highest system performance and capacity with a 2X improvement in system performance. Highest capability devices enabled by stacked silicon interconnect (SSI) technology.
Built on a state-of-the-art, high-performance, low-power (HPL), 28 nm, high-k metal gate (HKMG) process technology, 7 series FPGAs enable an unparalleled increase in system performance with 2.9 Tb/s of I/O bandwidth, 2 million logic cell capacity, and 5.3 TMAC/s DSP, while consuming 50% less power than previous generation devices to offer a fully programmable alternative to ASSPs and ASICs. All 7 series devices share a unified fourthgeneration ADVANCED Silicon MODULAR Block (ASMBL) column-based architecture that reduces system development and deployment time with simplified design portability.
7系列FPGA主要特性:
◎ Advanced high-performance FPGA logic based on real 6-input lookup table (LUT) technology configurable as distributed memory.
◎ 36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering.
◎ High-performance SelectIO technology with SUPPORT for DDR3 interfaces up to 1,866 Mb/s.
◎ High-speed serial connectivity with built-in multi-gigabit transceivers from 600 Mb/s to MAXIMUM rates of 6.6 Gb/s up to 28.05 Gb/s, offering a special low-power mode, optimized for chip-to-chip interfaces.
◎ A user configurable ANALOG interface (XADC), incorporating dual 12-bit 1MSPS analog-to-digital converters with on-chip thermal and supply sensors.
◎ DSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high performance filtering, including optimized symmetric coefficient filtering.
◎ Powerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high PRECISION and low jitter.
◎ INTEGRATED block for PCI Express (PCIe), for up to x8 Gen3 Endpoint and Root Port designs.
◎ Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.
◎ Low-cost, wire-bond, lidless FLIP-CHIP, and high signal integrity FLIPCHIP packaging offering easy migration between family members in the same package. All packages available in PB-FREE and selected packages in Pb option.
◎ Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology and 0.9V core voltage option for even lower power.
7系列FPGA特性比较表:
Kintex-7 FPGA系列主要特性:
Kintex-7 FPGA系列主要应用和特点:
ApplicationDescription
AvionicsKintex-7 FPGA price-performance drives SWAP-C benefits for aircraft video data bus systems.
LED Backlit Flat Panel Displays and 3DTVKintex-7 FPGA offers capabilities that enable flat panel display manufacturers to improve image quality, reduce power consumption, and reduce cost.
LTE BasebandMeet stringent latency requirements and enable a COMMON platform supporting Multiple Air Interface Standards such as LTE, WiMAX, and CDMA in a single component with Kintex-7 FPGA.
Portable UltrasoundHigh I/O bandwidth and DSP processing power make Kintex-7 FPGAs highly effective for both front and back-end Ultrasound Processing.
Multi-mode RadioKintex-7 FPGAs help you to reduce cost and power consumption, deliver scalable platforms, and support multiple air interface standards.
Prosumer Digital SLR CamerasKintex-7 FPGA enables manufacturers of Prosumer Digital SLR cameras to implement control functions in auto-focus lenses and rapidly deploy enhancements in camera body controller/image processing ASICs.
Video over IP GatewayReduce cost for Video over IP Gateways by integrating four 3:1, 3G-SDI-to-10GbE bridges in a single FPGA.
1. Kintex-7 FPGA系列在LTE通信应用
Kintex-7 FPGAs offer the best price-performance so designers can meet stringent latency requirements for LTE baseband processing in a common platform.
◎ Programmability enables a cost-effective common platform supporting multiple air interfaces such as LTE, WiMAX, and WCDMA
◎ Reduce total cost of ownership with the ability to scale and reuse designs from picocell to macrocell
◎ 3x capacity at the same cost of previous-generation FPGAs while consuming 40% less power
◎ Support for 9.8Gbps CPRI/OBSAI for high throughput
◎ Support for 6.144Gbps CPRI/OBSAI in a low-cost package option
图1. Kintex-7 FPGA单片LTE通信基带框图(2x4MIMO)
2. Kintex-7 FPGA系列在医疗电子应用
Support for 6.144Gbps CPRI/OBSAI in a low-cost package optionHigh I/O bandwidth and 144GMACS DSP processing power in chip-scale packaging make the Kintex-7 70T FPGA highly effective for both front- and back-end ultrasound processing. Designers can deploy a fully programmable 128-channel ultrasound implementation that scales up to 196 or 256 channels for high-end cart solutions or down to 64 or 32 channels for hand-held solutions.
◎ 128-channel implementation in a modular set of five Kintex-7 70T FPGAs offers 44% lower power, 45% lower cost, and 57% smaller form factor compared to previous-generation FPGAs
◎ Kintex-7 70T FPGAs offer 144GMACS from 240 DSP slices (288GMACS for symmetric filters)
◎ Built-in support for eight PCI Express Gen1/Gen2 channels enables high-bandwidth interface to host system
◎ Chip-scale packaging for small form factor
图2. Kintex-7 FPGA系列在手持超声设备的应用框图
3. Kintex-7 FPGA系列在广播设备的应用
Kintex-7 FPGAs enable cost-effective, low-power bridging of the serial digital interface (SDI) protocol onto IP technology for long-distance WAN transport to link local studios/live events, broadcast facilities, and satellite uplink stations using standard IP networks.
Reduce power by 64% and reduce cost by 85% with a single XC7K160T FPGA implementation of a 12x 3G-SDI over 4x10GbE bridge compared to the equivalent function implemented in two Virtex-6 XC6L130T devices
Reduce cost further with high-bandwidth interfaces that SHRINK BOM: 72-bit x 1,600Mbps DDR3 memory interface capability enables a single memory buffer that would require two or four memory buffers in previous-generation FPGAs
图3. Kintex-7 FPGA系列在视频IP网关的应用框图
Kintex-7 FPGA系列评估板KC705
The KC705 EVALUATION board for the Kintex?-7 FPGA provides a HARDWARE environment for developing and evaluating designs targeting the Kintex-7 XC7K325T-2FFG900C FPGA. The KC705 board provides features common to many embedded processing systems, including a DDR3 SODIMM memory, an 8-lane PCI Express? interface, a tri-mode Ethernet PHY, GENERAL purpose I/O, and a UART interface. Other features can be added by using mezzanine cards attached to either of two VITA-57 FPGA mezzanine connectors (FMC) provided on the board. High pin count (HPC) and low pin count (LPC) FMCs are provided.
评估板KC705主要特性:
◎ Kintex-7 XC7K325T-2FFG900C FPGA
◎ 1 GB DDR3 memory SODIMM
◎ 128 MB LINEAR BPI Flash memory
◎ 128 Mb Quad-SPI Flash memory
◎ Secure Digital (SD) connector
◎ USB JTAG via Digilent MODULE
◎ Clock Generation
◎ Fixed 200 MHz LVDS oscillator (differential)
◎ I2C programmable LVDS oscillator (differential)
◎ SMA connectors (differential)
◎ SMA connectors for GTX transceiver clocking
◎ GTX transceivers
◎ FMC HPC connector (four GTX transceivers)
◎ FMC LPC connector (one GTX transceiver)
◎ SMA connectors (one pair each for TX, RX and REFCLK)
◎ PCI Express (eight lanes)
◎ Small form-factor pluggable plus (SFP+) connector
◎ Ethernet PHY SGMII interface (RJ-45 connector)
◎ PCI Express endpoint connectivity
◎ Gen1 8-lane (x8)
◎ Gen2 8-lane (x8)
◎ SFP+ Connector
◎ 10/100/1000 tri-speed Ethernet PHY
◎ USB-TO-UART bridge
◎ HDMI codec
◎ I2C bus
◎ I2C MUX
◎ I2C EEPROM (1 KB)
◎ USER I2C programmable 3.3V LVDS oscillator
◎ DDR3 SODIMM SOCKET
◎ HDMI codec
◎ FMC HPC connector
◎ FMC LPC connector
◎ SFP+ connector
◎ I2C programmable jitter-attenuating precision clock multiplier
◎ Status LEDs
◎ Ethernet status
◎ Power good
◎ FPGA INIT
◎ FPGA DONE
◎ User I/O
◎ USER LEDs (eight GPIO)
◎ User pushbuttons (five directional)
◎ CPU reset pushbutton
◎ User DIP SWITCH (4-pole GPIO)
◎ User SMA GPIO connectors (one pair)
◎ LCD character display (16 characters x 2 lines)
◎ SWITCHES
◎ Power on/off slide switch
◎ Configuration mode DIP switch
◎ VITA 57.1 FMC HPC Connector
◎ VITA 57.1 FMC LPC Connector
◎ Power management
◎ PMBus voltage and current monitoring via TI power controller
◎ XADC HEADER
◎ Configuration options
◎ Linear BPI Flash memory
◎ Quad SPI
◎ USB JTAG configuration port
◎ Platform cable header JTAG configuration port
图4.评估板KC705方框图
图5.评估板KC705外形图
评估板KC705主要元件:
图6.评估板KC705配置电路图