TJA1040T各脚功能电路原理芯片引脚定义引脚图及功能IC贸易商-中国IC网-芯三七

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产品型号TJA1040T的概述

TJA1040T芯片概述 TJA1040T是由NXP Semiconductors设计和制造的一种高性能CAN（控制器局域网）收发器。该芯片用于汽车和工业控制网络中，能够实现微控制器与CAN网络之间的有效通信。TJA1040T支持符合ISO 11898标准的CANprotocol，具备高噪声容忍度和优良的电气特性，是当今众多应用中不可或缺的关键组件。它的功耗低、集成度高和抗干扰能力强，使其在未来智能交通系统的应用中愈发重要。 TJA1040T的详细参数 TJA1040T芯片的核心参数包括： 1. 工作电压：TJA1040T的工作电压范围为4.5V到5.5V，适合大多数车辆和工业设备。 2. 工作温度：该芯片具有宽广的工作温度范围，通常在-40°C到 +125°C之间，适应各种恶劣环境。 3. 传输速度：最高传输速率可达1Mbps，满足大多数应用的需求。 4. 功耗：在待机模式下，功耗低...

产品型号TJA1040T的Datasheet PDF文件预览

INTEGRATED CIRCUITS

DATA SHEET

TJA1040

High speed CAN transceiver

Product speciﬁcation

2003 Oct 14

Supersedes data of 2003 Feb 19

Philips Semiconductors

Product speciﬁcation

High speed CAN transceiver

TJA1040

FEATURES

GENERAL DESCRIPTION

• Fully compatible with the ISO 11898 standard

• High speed (up to 1 MBaud)

The TJA1040 is the interface between the Controller Area

Network (CAN) protocol controller and the physical bus.

It is primarily intended for high speed applications, up to

1 MBaud, in passenger cars. The device provides

differential transmit capability to the bus and differential

receive capability to the CAN controller.

• Very low-current standby mode with remote wake-up

capability via the bus

• Very low ElectroMagnetic Emission (EME)

• Differential receiver with high common-mode range for

ElectroMagnetic Immunity (EMI)

The TJA1040 is the next step up from the TJA1050 high

speed CAN transceiver. Being pin compatible and offering

the same excellent EMC performance, the TJA1040 also

features:

• Transceiver in unpowered state disengages from the

bus (zero load)

• Input levels compatible with 3.3 V and 5 V devices

• An ideal passive behaviour when supply voltage is off

• Voltage source for stabilizing the recessive bus level if

• A very low-current standby mode with remote wake-up

split termination is used (further improvement of EME)

capability via the bus.

• At least 110 nodes can be connected

This makes the TJA1040 an excellent choice in nodes

which can be in power-down or standby mode in partially

powered networks.

• Transmit Data (TXD) dominant time-out function

• Bus pins protected against transients in automotive

environments

• Bus pins and pin SPLIT short-circuit proof to battery and

ground

• Thermally protected.

QUICK REFERENCE DATA

SYMBOL

V_CC

PARAMETER

supply voltage

CONDITIONS

operating range

MIN.

4.75

MAX.

5.25

UNIT

I_CC

supply current

standby mode

µA

V_CANH

V_CANL

V_SPLIT

V_esd

DC voltage on pin CANH

DC voltage on pin CANL

DC voltage on pin SPLIT

0 < V_CC< 5.25 V; no time limit

−27

+40

electrostatic discharge voltage Human Body Model (HBM)

pins CANH, CANL and SPLIT

−6

°C

all other pins

−4

t_PD(TXD-RXD)propagation delay TXD to RXD V_STB= 0 V

T_vjvirtual junction temperature

255

+150

−40

ORDERING INFORMATION

TYPE

PACKAGE

NUMBER

NAME

DESCRIPTION

VERSION

SOT96-1

−

TJA1040T

TJA1040U

SO8

plastic small outline package; 8 leads; body width 3.9 mm

bare die; die dimensions 1840 × 1440 × 380 µm

−

2003 Oct 14

Philips Semiconductors

Product speciﬁcation

High speed CAN transceiver

TJA1040

BLOCK DIAGRAM

handbook, full pagewidth

TIME-OUT &

SLOPE

TEMPERATURE

PROTECTION

V SPLIT

SPLIT

TXD

STB

CANH

CANL

WAKE-UP

MODE CONTROL

DRIVER

WAKE-UP

FILTER

RXD

GND

MUX

TJA1040

MGU161

Fig.1 Block diagram.

PINNING

SYMBOL PIN

DESCRIPTION

TXD

GND

V_CC

transmit data input

ground supply

handbook, halfpage

TXD

STB

GND

CANH

CANL

SPLIT

supply voltage

TJA1040T

RXD

receive data output; reads out data

from the bus lines

RXD

SPLIT

CANL

CANH

STB

common-mode stabilization output

LOW-level CAN bus line

MGU160

HIGH-level CAN bus line

Fig.2 Pin configuration.

standby mode control input

2003 Oct 14

Philips Semiconductors

Product speciﬁcation

High speed CAN transceiver

TJA1040

FUNCTIONAL DESCRIPTION

Operating modes

to the centre tap of the split termination (see Fig.4). In case

of a recessive bus voltage <0.5V_CCdue to the presence of

an unsupplied transceiver in the network with a significant

leakage current from the bus lines to ground, the split

circuit will stabilize this recessive voltage to 0.5V_CC. So a

start of transmission does not cause a step in the

common-mode signal which would lead to poor

The TJA1040 provides two modes of operation which are

selectable via pin STB. See Table 1 for a description of the

modes of operation.

Table 1 Operating modes

ElectroMagnetic Emission (EME) behaviour.

PIN RXD

Wake-up

MODE

STB

LOW

HIGH

In the standby mode the bus lines are monitored via a

low-power differential comparator. Once the low-power

differential comparator has detected a dominant bus level

for more than t_BUS, pin RXD will become LOW.

normal

LOW

bus dominant

bus recessive

standby

HIGH wake-up request no wake-up

detected request detected

Over-temperature detection

NORMAL MODE

The output drivers are protected against over-temperature

conditions. If the virtual junction temperature exceeds the

shutdown junction temperature T_j(sd), the output drivers will

be disabled until the virtual junction temperature becomes

lower than T_j(sd)and TXD becomes recessive again.

By including the TXD condition, the occurrence of output

driver oscillation due to temperature drifts is avoided.

In this mode the transceiver is able to transmit and receive

data via the bus lines CANH and CANL. See Fig.1 for the

block diagram. The differential receiver converts the

analog data on the bus lines into digital data which is

output to pin RXD via the multiplexer (MUX). The slope of

the output signals on the bus lines is fixed and optimized

in a way that lowest ElectroMagnetic Emission (EME) is

guaranteed.

TXD dominant time-out function

STANDBY MODE

A ‘TXD dominant time-out’ timer circuit prevents the bus

lines from being driven to a permanent dominant state

(blocking all network communication) if pin TXD is forced

permanently LOW by a hardware and/or software

application failure. The timer is triggered by a negative

edge on pin TXD.

In this mode the transmitter and receiver are switched off,

and the low-power differential receiver will monitor the bus

lines. A HIGH level on pin STB activates this low-power

receiver and the wake-up filter, and after t_BUSthe state of

the CAN bus is reflected on pin RXD.

If the duration of the LOW level on pin TXD exceeds the

internal timer value (t_dom), the transmitter is disabled,

driving the bus lines into a recessive state. The timer is

reset by a positive edge on pin TXD. The TXD dominant

time-out time t_domdefines the minimum possible bit rate of

40 kBaud.

The supply current on V_CCis reduced to a minimum in

such a way that ElectroMagnetic Immunity (EMI) is

guaranteed and a wake-up event on the bus lines will be

recognized.

In this mode the bus lines are terminated to ground to

reduce the supply current (I_CC) to a minimum. A diode is

added in series with the high-side driver of RXD to prevent

a reverse current from RXD to V_CCin the unpowered state.

In normal mode this diode is bypassed. This diode is not

bypassed in standby mode to reduce current consumption.

Fail-safe features

Pin TXD provides a pull-up towards V_CCin order to force a

recessive level in case pin TXD is unsupplied.

Pin STB provides a pull-up towards V_CCin order to force

the transceiver into standby mode in case pin STB is

unsupplied.

Split circuit

Pin SPLIT provides a DC stabilized voltage of 0.5V_CC. It is

turned on only in normal mode. In standby mode pin SPLIT

is floating. The V_SPLITcircuit can be used to stabilize the

recessive common-mode voltage by connecting pin SPLIT

In the event that the V_CCis lost, pins TXD, STB and RXD

will become floating to prevent reverse supplying

conditions via these pins.

2003 Oct 14

Philips Semiconductors

Product speciﬁcation

High speed CAN transceiver

TJA1040

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134).

SYMBOL

PARAMETER

supply voltage

CONDITIONS

no time limit

MIN.

−0.3

MAX.

5.25

UNIT

V_CC

operating range

4.75

−0.3

−27

V_TXD

V_RXD

V_STB

V_CANH

V_CANL

V_SPLIT

V_trt

DC voltage on pin TXD

DC voltage on pin RXD

DC voltage on pins STB

DC voltage on pin CANH

DC voltage on pin CANL

DC voltage on pin SPLIT

V_CC+ 0.3 V

0 < V_CC< 5.25 V; no time limit

+40

+200

transient voltages on pins CANH, according to ISO 7637; see Fig.5 −200

CANL and SPLIT

V_esd

electrostatic discharge voltage

Human Body Model (HBM); note 1

pins CANH and CANL

and SPLIT

−6

all other pins

−4

Machine Model (MM); note 2

note 3

−200

−40

−55

+200

+150

T_vj

virtual junction temperature

storage temperature

°C

T_stg

Notes

1. Equivalent to discharging a 100 pF capacitor via a 1.5 kΩ series resistor.

2. Equivalent to discharging a 200 pF capacitor via a 0.75 µH series inductor and a 10 Ω series resistor.

3. Junction temperature in accordance with IEC 60747-1. An alternative definition of T_vjis: T_vj= T_amb+ P × R_th(vj-amb)

where R_th(vj-amb)is a fixed value to be used for the calculating of T_vj. The rating for T_vjlimits the allowable

combinations of power dissipation (P) and ambient temperature (T_amb).

THERMAL CHARACTERISTICS

In accordance with IEC 60747-1.

SYMBOL

R_th(vj-a)

PARAMETER

CONDITIONS

VALUE

UNIT

thermal resistance from virtual junction in free air

to ambient in SO8 package

145

K/W

R_th(vj-s)

thermal resistance from virtual junction in free air

to substrate of bare die

K/W

QUALITY SPECIFICATION

Quality specification in accordance with “AEC-Q100”.

2003 Oct 14

Philips Semiconductors

Product speciﬁcation

High speed CAN transceiver

TJA1040

CHARACTERISTICS

V_CC= 4.75 to 5.25 V, T_vj= −40 to +150 °C and R_L= 60 Ω unless speciﬁed otherwise; all voltages are deﬁned with

respect to ground; positive currents ﬂow into the IC; note 1.

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

Supply (pin V_CC

)

I_CC

supply current

standby mode

µA

normal mode

recessive; V_TXD= V_CC

dominant; V_TXD= 0 V

2.5

Transmit data input (pin TXD)

V_IH

V_IL

I_IH

I_IL

HIGH-level input voltage

−

V_CC+ 0.3 V

LOW-level input voltage

HIGH-level input current

LOW-level input current

input capacitance

−0.3

−5

+0.8

V_TXD= V_CC

µA

normal mode; V_TXD= 0 V −100

−200

−300

C_i

not tested

−

Standby mode control input (pin STB)

V_IH

V_IL

I_IH

HIGH-level input voltage

LOW-level input voltage

HIGH-level input current

LOW-level input current

−

V_CC+ 0.3 V

−0.3

−

+0.8

−

V_STB= V_CC

V_STB= 0 V

µA

I_IL

−1

−4

−10

Receive data output (pin RXD)

V_OH

I_OH

I_OL

HIGH-level output voltage

standby mode;

I_RXD= −100 µA

V_CC− 1.1 V_CC− 0.7 V_CC− 0.4 V

HIGH-level output current

normal mode;

V_RXD= V_CC− 0.4 V

−0.1

−0.4

−1

LOW-level output current

V_RXD= 0.4 V

Common-mode stabilization output (pin SPLIT)

V_O

output voltage

normal mode;

−500 µA < I_O< +500 µA

0.3V_CC

0.5V_CC

0.7V_CC

I_L

leakage current

standby mode;

−

µA

−22 V < V_SPLIT< +35 V

Bus lines (pins CANH and CANL)

V_O(dom)

dominant output voltage

V_TXD= 0 V

pin CANH

pin CANL

3.6

1.4

4.25

1.75

+150

0.5

−100

V_O(dom)(m)

V_O(dif)(bus)

matching of dominant output

voltage (V_CC- V_CANH- V_CANL

)

differential bus output voltage V_TXD= 0 V; dominant;

1.5

−

3.0

(V_CANH− V_CANL

)

45 Ω < R_L< 65 Ω

V_TXD= V_CC; recessive;

no load

−50

+50

2003 Oct 14

Philips Semiconductors

Product speciﬁcation

High speed CAN transceiver

TJA1040

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

V_O(reces)

recessive output voltage

normal mode; V_TXD= V_CC

;

0.5V_CC

no load

standby mode; no load

V_TXD= 0 V

−0.1

+0.1

I_O(sc)

short-circuit output current

pin CANH; V_CANH= 0 V −40

−70

−

−95

100

+2.5

pin CANL; V_CANL= 40 V 40

I_O(reces)

V_dif(th)

recessive output current

−27 V < V_CAN< +32 V

−2.5

differential receiver threshold −12 V < V_CANL< +12 V;

voltage −12 V < V_CANH< +12 V

normal mode (see Fig.6) 0.5

0.7

0.9

standby mode

0.4

1.15

100

V_hys(dif)

differential receiver hysteresis normal mode;

voltage

−12 V < V_CANL< +12 V;

−12 V < V_CANH< +12 V

I_LI

input leakage current

V_CC= 0 V;

V_CANH= V_CANL= 5 V

−5

−3

µA

kΩ

R_i(cm)

R_i(cm)(m)

common-mode input

resistance

standby or normal mode

V_CANH= V_CANL

common-mode input

resistance matching

R_i(dif)

C_i(cm)

differential input resistance

standby or normal mode

V_TXD= V_CC; not tested

kΩ

common-mode input

capacitance

−

C_i(dif)

differential input capacitance

V_TXD= V_CC; not tested

normal mode

−

Timing characteristics; see Fig.8

t_d(TXD-BUSon)delay TXD to bus active

t_{d(TXD-BUSoff)}delay TXD to bus inactive

t_d(BUSon-RXD)delay bus active to RXD

t_{d(BUSoff-RXD)}delay bus inactive to RXD

110

µs

115

160

255

1000

100

−

t_PD(TXD-RXD)propagation delay TXD to RXD V_STB= 0 V

t_dom(TXD)TXD dominant time-out V_TXD= 0 V

t_BUS

300

0.75

600

1.75

dominant time for wake-up via standby mode

bus

t_d(stb-norm)

delay standby mode to normal normal mode

mode

7.5

µs

Thermal shutdown

T_j(sd)

shutdown junction temperature

155

165

180

°C

Note

1. All parameters are guaranteed over the virtual junction temperature range by design, but only 100% tested at 125 °C

ambient temperature for dies on wafer level, and in addition to this 100% tested at 25 °C ambient temperature for

cased products; unless speciﬁed otherwise. For bare dies, all parameters are only guaranteed with the backside of

the die connected to ground.

2003 Oct 14

Philips Semiconductors

Product speciﬁcation

High speed CAN transceiver

TJA1040

APPLICATION AND TEST INFORMATION

handbook, full pagewidth

5 V

BAT

STB

CANH

SPLIT

CANL

Port x

TJA1040

MICROCONTROLLER

RXD

TXD

RXD

TXD

MGU164

More application information is available in a separate application note.

Fig.3 Typical application for 5 V microcontroller.

handbook, full pagewidth

TJA1040

CANH

60 Ω

= 0.5V

SPLIT

CANL

in normal mode;

otherwise floating

MGU162

GND

Fig.4 Stabilization circuitry and application.

2003 Oct 14

Philips Semiconductors

Product speciﬁcation

High speed CAN transceiver

TJA1040

5 V

handbook, full pagewidth

47 µF

100 nF

1 nF

TXD

CANH

TRANSIENT

GENERATOR

CANL

SPLIT

TJA1040

500 kHz

RXD

15 pF

GND STB

MGW336

The waveforms of the applied transients will be in accordance with ISO 7637 part 1, test pulses 1, 2, 3a, 3b, 5, 6 and 7.

Fig.5 Test circuit for automotive transients.

handbook, full pagewidth

MGS378

RXD

HIGH

LOW

(V)

hysteresis

0.5

0.9

i(dif)(bus)

Fig.6 Hysteresis of the receiver.

2003 Oct 14

Philips Semiconductors

Product speciﬁcation

High speed CAN transceiver

TJA1040

5 V

handbook, full pagewidth

47 µF

100 nF

TXD

CANH

CANL

SPLIT

RXD

100 pF

TJA1040

60 Ω

15 pF

GND STB

MGW335

Fig.7 Test circuit for timing characteristics.

HIGH

LOW

handbook, full pagewidth

TXD

CANH

CANL

dominant

(BUS on)

0.9 V

0.5 V

(1)

i(dif)(bus)

RXD

recessive

(BUS off)

HIGH

0.7V

0.3V

LOW

d(TXD-BUSon)

d(TXD-BUSoff)

d(BUSon-RXD)

d(BUSoff-RXD)

PD TXD-RXD

(

)

(

)

PD TXD-RXD

MGS377

(1) V_i(dif)(bus)= V_CANH− V_CANL

Fig.8 Timing diagram.

2003 Oct 14

Philips Semiconductors

Product speciﬁcation

High speed CAN transceiver

TJA1040

BONDING PAD LOCATIONS

COORDINATES⁽¹⁾

SYMBOL

TXD

PAD

handbook, halfpage

119.5

648.5

114.5

GND

V_CC

test pad 1

test pad 2

1214.25

1635.25

1516.5

990.5

114.5

1275

TJA1040U

RXD

SPLIT

CANL

CANH

STB

1273.75

1246

530.25

113.75

MBL584

Note

The backside of the bare die must be connected to ground.

1. All x/y coordinates represent the position of the centre

of each pad (in µm) with respect to the left hand

bottom corner of the top aluminium layer (see Fig.9).

Fig.9 Bonding pad locations.

2003 Oct 14

Philips Semiconductors

Product speciﬁcation

High speed CAN transceiver

TJA1040

PACKAGE OUTLINE

SO8: plastic small outline package; 8 leads; body width 3.9 mm

SOT96-1

(A )

pin 1 index

detail X

2.5

5 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

(1)

(2)

UNIT

max.

0.25

0.10

1.45

1.25

0.49

0.36

0.25

0.19

5.0

4.8

4.0

3.8

6.2

5.8

1.0

0.4

0.7

0.6

0.7

0.3

1.27

0.05

1.05

0.041

1.75

0.25

0.01

0.25

0.01

0.25

0.1

8^o

0^o

0.010 0.057

0.004 0.049

0.019 0.0100 0.20

0.014 0.0075 0.19

0.16

0.15

0.244

0.228

0.039 0.028

0.016 0.024

0.028

0.012

inches 0.069

0.01 0.004

Notes

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

PROJECTION

ISSUE DATE

VERSION

IEC

JEDEC

JEITA

99-12-27

03-02-18

SOT96-1

076E03

MS-012

2003 Oct 14

Philips Semiconductors

Product speciﬁcation

High speed CAN transceiver

TJA1040

SOLDERING

To overcome these problems the double-wave soldering

method was specifically developed.

Introduction to soldering surface mount packages

If wave soldering is used the following conditions must be

observed for optimal results:

This text gives a very brief insight to a complex technology.

A more in-depth account of soldering ICs can be found in

our “Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).

• Use a double-wave soldering method comprising a

turbulent wave with high upward pressure followed by a

smooth laminar wave.

There is no soldering method that is ideal for all surface

mount IC packages. Wave soldering can still be used for

certain surface mount ICs, but it is not suitable for fine pitch

SMDs. In these situations reflow soldering is

recommended.

• For packages with leads on two sides and a pitch (e):

– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the

transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the

printed-circuit board.

Reﬂow soldering

Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied

to the printed-circuit board by screen printing, stencilling or

pressure-syringe dispensing before package placement.

Driven by legislation and environmental forces the

The footprint must incorporate solder thieves at the

downstream end.

• For packages with leads on four sides, the footprint must

be placed at a 45° angle to the transport direction of the

printed-circuit board. The footprint must incorporate

solder thieves downstream and at the side corners.

worldwide use of lead-free solder pastes is increasing.

Several methods exist for reflowing; for example,

convection or convection/infrared heating in a conveyor

type oven. Throughput times (preheating, soldering and

cooling) vary between 100 and 200 seconds depending

on heating method.

During placement and before soldering, the package must

be fixed with a droplet of adhesive. The adhesive can be

applied by screen printing, pin transfer or syringe

dispensing. The package can be soldered after the

adhesive is cured.

Typical reflow peak temperatures range from

215 to 270 °C depending on solder paste material. The

top-surface temperature of the packages should

preferably be kept:

Typical dwell time of the leads in the wave ranges from

3 to 4 seconds at 250 °C or 265 °C, depending on solder

material applied, SnPb or Pb-free respectively.

• below 220 °C (SnPb process) or below 245 °C (Pb-free

process)

A mildly-activated flux will eliminate the need for removal

of corrosive residues in most applications.

– for all BGA and SSOP-T packages

Manual soldering

– for packages with a thickness ≥ 2.5 mm

– for packages with a thickness < 2.5 mm and a

Fix the component by first soldering two

diagonally-opposite end leads. Use a low voltage (24 V or

less) soldering iron applied to the flat part of the lead.

Contact time must be limited to 10 seconds at up to

300 °C.

volume ≥ 350 mm³so called thick/large packages.

• below 235 °C (SnPb process) or below 260 °C (Pb-free

process) for packages with a thickness < 2.5 mm and a

volume < 350 mm³so called small/thin packages.

When using a dedicated tool, all other leads can be

soldered in one operation within 2 to 5 seconds between

270 and 320 °C.

Moisture sensitivity precautions, as indicated on packing,

must be respected at all times.

Wave soldering

Conventional single wave soldering is not recommended

for surface mount devices (SMDs) or printed-circuit boards

with a high component density, as solder bridging and

non-wetting can present major problems.

2003 Oct 14

Philips Semiconductors

Product speciﬁcation

High speed CAN transceiver

TJA1040

Suitability of surface mount IC packages for wave and reﬂow soldering methods

SOLDERING METHOD

PACKAGE⁽¹⁾

WAVE

not suitable

REFLOW⁽²⁾

BGA, LBGA, LFBGA, SQFP, SSOP-T⁽³⁾, TFBGA, VFBGA

suitable

DHVQFN, HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP,

HTSSOP, HVQFN, HVSON, SMS

not suitable⁽⁴⁾

suitable

PLCC⁽⁵⁾, SO, SOJ

LQFP, QFP, TQFP

SSOP, TSSOP, VSO, VSSOP

PMFP⁽⁸⁾

suitable

not recommended⁽⁵⁾⁽⁶⁾suitable

not recommended⁽⁷⁾

suitable

not suitable

Notes

1. For more detailed information on the BGA packages refer to the “(LF)BGA Application Note” (AN01026); order a copy

from your Philips Semiconductors sales office.

2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

temperature (with respect to time) and body size of the package, there is a risk that internal or external package

cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the

Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.

3. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account

be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature

exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature

must be kept as low as possible.

4. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder

cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,

the solder might be deposited on the heatsink surface.

5. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.

The package footprint must incorporate solder thieves downstream and at the side corners.

6. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not

suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

7. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than

0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

8. Hot bar or manual soldering is suitable for PMFP packages.

REVISION HISTORY

REV

DATE

CPCN

DESCRIPTION

Product speciﬁcation (9397 750 11837)

Modiﬁcation:

20031014

200307014

• Change ‘V_th(dif)= 0.5 V’ in standby mode into ‘V_dif(th)= 0.4 V’

• Add Chapter REVISION HISTORY

Product speciﬁcation (9397 750 10887)

20030219

−

2003 Oct 14

Philips Semiconductors

Product speciﬁcation

High speed CAN transceiver

TJA1040

DATA SHEET STATUS

DATA SHEET

STATUS⁽¹⁾

PRODUCT

STATUS⁽²⁾⁽³⁾

LEVEL

DEFINITION

Objective data

Development This data sheet contains data from the objective speciﬁcation for product

development. Philips Semiconductors reserves the right to change the

speciﬁcation in any manner without notice.

Preliminary data Qualiﬁcation

This data sheet contains data from the preliminary speciﬁcation.

Supplementary data will be published at a later date. Philips

Semiconductors reserves the right to change the speciﬁcation without

notice, in order to improve the design and supply the best possible

product.

III

Product data

Production

This data sheet contains data from the product speciﬁcation. Philips

Semiconductors reserves the right to make changes at any time in order

to improve the design, manufacturing and supply. Relevant changes will

be communicated via a Customer Product/Process Change Notiﬁcation

(CPCN).

Notes

1. Please consult the most recently issued data sheet before initiating or completing a design.

2. The product status of the device(s) described in this data sheet may have changed since this data sheet was

published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.

3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.

DEFINITIONS

DISCLAIMERS

Short-form specification

The data in a short-form

Life support applications

These products are not

specification is extracted from a full data sheet with the

same type number and title. For detailed information see

the relevant data sheet or data handbook.

designed for use in life support appliances, devices, or

systems where malfunction of these products can

reasonably be expected to result in personal injury. Philips

Semiconductors customers using or selling these products

for use in such applications do so at their own risk and

agree to fully indemnify Philips Semiconductors for any

damages resulting from such application.

Limiting values definition Limiting values given are in

accordance with the Absolute Maximum Rating System

(IEC 60134). Stress above one or more of the limiting

values may cause permanent damage to the device.

These are stress ratings only and operation of the device

at these or at any other conditions above those given in the

Characteristics sections of the specification is not implied.

Exposure to limiting values for extended periods may

affect device reliability.

Right to make changes

Philips Semiconductors

reserves the right to make changes in the products -

including circuits, standard cells, and/or software -

described or contained herein in order to improve design

and/or performance. When the product is in full production

(status ‘Production’), relevant changes will be

Application information

Applications that are

communicated via a Customer Product/Process Change

Notification (CPCN). Philips Semiconductors assumes no

responsibility or liability for the use of any of these

products, conveys no licence or title under any patent,

makes no representations or warranties that these

products are free from patent, copyright, or mask work

right infringement, unless otherwise specified.

described herein for any of these products are for

illustrative purposes only. Philips Semiconductors make

no representation or warranty that such applications will be

suitable for the specified use without further testing or

modification.

2003 Oct 14

Philips Semiconductors

Product speciﬁcation

High speed CAN transceiver

TJA1040

Bare die

All die are tested and are guaranteed to

comply with all data sheet limits up to the point of wafer

sawing for a period of ninety (90) days from the date of

Philips' delivery. If there are data sheet limits not

guaranteed, these will be separately indicated in the data

sheet. There are no post packing tests performed on

individual die or wafer. Philips Semiconductors has no

control of third party procedures in the sawing, handling,

packing or assembly of the die. Accordingly, Philips

Semiconductors assumes no liability for device

functionality or performance of the die or systems after

third party sawing, handling, packing or assembly of the

die. It is the responsibility of the customer to test and

qualify their application in which the die is used.

2003 Oct 14

Philips Semiconductors – a worldwide company

Contact information

For additional information please visit http://www.semiconductors.philips.com.

Fax: +31 40 27 24825

For sales ofﬁces addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.

SCA75

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed

without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license

under patent- or other industrial or intellectual property rights.

Printed in The Netherlands

R16/06/pp17

Date of release: 2003 Oct 14

Document order number: 9397 750 11837

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TJA1040T产品参数

型号:	TJA1040T
是否Rohs认证：	符合
生命周期：	Transferred
包装说明：	SOP, SOP8,.25
Reach Compliance Code：	unknown
风险等级：	5.77
数据速率：	1000 Mbps
JESD-30 代码：	R-PDSO-G8
JESD-609代码：	e4
端子数量：	8
收发器数量：	1
封装主体材料：	PLASTIC/EPOXY
封装代码：	SOP
封装等效代码：	SOP8,.25
封装形状：	RECTANGULAR
封装形式：	SMALL OUTLINE
电源：	5 V
认证状态：	Not Qualified
子类别：	Network Interfaces
最大压摆率：	70 mA
标称供电电压：	5 V
表面贴装：	YES
技术：	CMOS
电信集成电路类型：	CAN TRANSCEIVER
端子面层：	Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式：	GULL WING
端子节距：	1.27 mm
端子位置：	DUAL
Base Number Matches：	1

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