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TJA1042

High-speed CAN transceiver with Standby mode

Rev. 02 — 8 July 2009

Product data sheet

1. General description

The TJA1042 is a high-speed CAN transceiver that provides an interface between a

Controller Area Network (CAN) protocol controller and the physical two-wire CAN bus.

The transceiver is designed for high-speed (up to 1 Mbit/s) CAN applications in the

automotive industry, providing the differential transmit and receive capability to (a

microcontroller with) a CAN protocol controller.

The TJA1042 is a step up from the TJA1040, PCA82C250 and PCA82C251 high-speed

CAN transceivers. It offers improved ElectroMagnetic Compatibility (EMC) and

ElectroStatic Discharge (ESD) performance, and also features:

• Ideal passive behavior to the CAN bus when the supply voltage is off

• A very low-current Standby mode with bus wake-up capability

• Direct interfacing to microcontrollers with 3 V to 5 V supply voltages on TJA1042T/3

and TJA1042TK/3

These features make the TJA1042 an excellent choice for all types of HS-CAN networks,

in nodes that require a low-power mode with wake-up capability via the CAN bus.

2. Features

2.1 General

I Fully ISO 11898-2 and ISO 11898-5 compliant

I Suitable for 12 V and 24 V systems

I Low ElectroMagnetic Emission (EME) and high ElectroMagnetic Immunity (EMI)

I V_IOinput on TJA1042T/3 and TJA1042TK/3 allows for direct interfacing with 3 V to 5 V

microcontrollers (available in SO8 and very small HVSON8 packages respectively)

I SPLIT voltage output on TJA1042T for stabilizing the recessive bus level (available in

SO8 package only)

2.2 Low-power management

I Very low-current Standby mode with host and bus wake-up capability

I Functional behavior predictable under all supply conditions

I Transceiver disengages from the bus when not powered up (zero load)

2.3 Protections

I High ESD handling capability on the bus pins

I Bus pins protected against transients in automotive environments

TJA1042

NXP Semiconductors

High-speed CAN transceiver with Standby mode

I Transmit Data (TXD) dominant time-out function

I Bus-dominant time-out function in Standby mode

I Undervoltage detection on pins V_CCand V_IO

I Thermally protected

3. Ordering information

Table 1.

Ordering information

Type number^[1]

Package

Name

SO8

Description

Version

SOT96

SOT782

TJA1042T

plastic small outline package; 8 leads; body width 3.9 mm

TJA1042T/3

TJA1042TK/3

SO8

HVSON8

plastic thermal enhanced very small outline package; 8 leads; body

width 3 mm; lead pitch 0.65 mm; exposed die pad

[1] TJA1042T with SPLIT pin; TJA1042T/3 and TJA1042TK/3 with V_IOpin.

TJA1042_2

Product data sheet

Rev. 02 — 8 July 2009

2 of 20

TJA1042

NXP Semiconductors

High-speed CAN transceiver with Standby mode

4. Block diagram

V

IO

5

CC

3

V

CC

TJA1042

TEMPERATURE

PROTECTION

(1)

7

6

V

IO

CANH

CANL

SLOPE

CONTROL

AND

1

TIME-OUT

DRIVER

TXD

(1)

V

IO

MODE

CONTROL

5

(1)

SPLIT

8

4

STB

RXD

MUX

AND

DRIVER

WAKE-UP

FILTER

2

015aaa017

GND

(1) In a transceiver with a SPLIT pin, the V_IOinput is internally connected to V_CC

.

Fig 1. Block diagram

TJA1042_2

Product data sheet

Rev. 02 — 8 July 2009

3 of 20

TJA1042

NXP Semiconductors

High-speed CAN transceiver with Standby mode

5. Pinning information

5.1 Pinning

TJA1042T/3

TJA1042T

TJA1042TK/3

1

2

3

4

8

7

6

5

1

2

3

4

8

7

6

5

TXD

STB

TXD

STB

GND

CANH

CANL

SPLIT

GND

CANH

CANL

V

CC

V

CC

RXD

V

IO

015aaa018

015aaa019

Fig 2. Pin conﬁguration diagrams

5.2 Pin description

Table 2.

Pin description

Pin Description

Symbol

TXD

1

2

3

4

5

transmit data input

GND

V_CC

ground supply

supply voltage

RXD

SPLIT

V_IO

receive data output; reads out data from the bus lines

common-mode stabilization output; in TJA1042T version only

supply voltage for I/O level adapter; in TJA1042T/3 and TJA1042TK/3 versions

only

CANL

CANH

STB

6

7

8

LOW-level CAN bus line

HIGH-level CAN bus line

Standby mode control input

TJA1042_2

Product data sheet

Rev. 02 — 8 July 2009

4 of 20

TJA1042

NXP Semiconductors

High-speed CAN transceiver with Standby mode

6. Functional description

The TJA1042 is a HS-CAN stand-alone transceiver with Standby mode. It combines the

functionality of the PCA82C250, PCA82C251 and TJA1040 transceivers with improved

EMC and ESD handling capability and quiescent current performance. Improved slope

control and high DC handling capability on the bus pins provide additional application

ﬂexibility.

The TJA1042 is available in two versions, distinguished only by the function of pin 5:

• The TJA1042T is 100 % backwards compatible with the TJA1040, and also covers

existing PCA82C250 and PCA82C251 applications

• The TJA1042T/3 and TJA1042TK/3 allow for direct interfacing to microcontrollers with

supply voltages down to 3 V

6.1 Operating modes

The TJA1042 supports two operating modes, Normal and Standby, which are selectable

via pin STB. See Table 3 for a description of the operating modes under normal supply

conditions.

Table 3.

Mode

Operating modes

Pin STB

Pin RXD

LOW

HIGH

Normal

LOW

bus dominant

bus recessive

Standby

HIGH

wake-up request

detected

no wake-up request

detected

6.1.1 Normal mode

A LOW level on pin STB selects Normal mode. In this mode, the transceiver can transmit

and receive data via the bus lines CANH and CANL (see Figure 1 for the block diagram).

The differential receiver converts the analog data on the bus lines into digital data which is

output to pin RXD. The slope of the output signals on the bus lines is controlled and

optimized in a way that guarantees the lowest possible EME.

6.1.2 Standby mode

A HIGH level on pin STB selects Standby mode. In Standby mode, the transceiver is not

able to transmit or correctly receive data via the bus lines. The transmitter and

Normal-mode receiver blocks are switched off to reduce supply current, and only a

low-power differential receiver monitors the bus lines for activity. The wake-up ﬁlter on the

output of the low-power receiver does not latch bus dominant states, but ensures that only

bus dominant and bus recessive states that persist longer than t_{ﬂtr(wake)bus}are reﬂected on

pin RXD.

In Standby mode, the bus lines are biased to ground to minimize the system supply

current. The low-power receiver is supplied by V , and is capable of detecting CAN bus

IO

activity even if V_IOis the only supply voltage available. When pin RXD goes LOW to signal

a wake-up request, a transition to Normal mode will not be triggered until STB is forced

LOW.

TJA1042_2

Product data sheet

Rev. 02 — 8 July 2009

5 of 20

TJA1042

NXP Semiconductors

High-speed CAN transceiver with Standby mode

6.2 Fail-safe features

6.2.1 TXD dominant time-out function

A ‘TXD dominant time-out’ timer is started when pin TXD is set LOW. If the LOW state on

pin TXD persists for longer than t_to(dom)TXD, the transmitter is disabled, releasing the bus

lines to recessive state. This function prevents a hardware and/or software application

failure from driving the bus lines to a permanent dominant state (blocking all network

communications). The TXD dominant time-out timer is reset when pin TXD is set to HIGH.

The TXD dominant time-out time also deﬁnes the minimum possible bit rate of 40 kbit/s.

6.2.2 Bus dominant time-out function

In Standby mode a 'bus dominant time-out' timer is started when the CAN bus changes

from recessive to dominant state. If the dominant state on the bus persists for longer than

t_to(dom)bus, the RXD pin is reset to HIGH. This function prevents a clamped dominant bus

(due to a bus short-circuit or a failure in one of the other nodes on the network) from

generating a permanent wake-up request. The bus dominant time-out timer is reset when

the CAN bus changes from dominant to recessive state.

6.2.3 Internal biasing of TXD and STB input pins

Pins TXD and STB have internal pull-ups to V_IOto ensure a safe, deﬁned state in case

one or both of these pins are left ﬂoating.

6.2.4 Undervoltage detection on pins V_CCand V_IO

Should V_CCdrop below the V_CCundervoltage detection level, V_uvd(VCC), the transceiver

will switch to Standby mode. The logic state of pin STB will be ignored until V_CChas

recovered.

Should V_IOdrop below the V_IOundervoltage detection level, V_uvd(VIO), the transceiver will

switch off and disengage from the bus (zero load) until V_IOhas recovered.

6.2.5 Over-temperature protection

The output drivers are protected against overtemperature conditions. If the virtual junction

temperature exceeds the shutdown junction temperature, T_j(sd), the output drivers will be

disabled until the virtual junction temperature falls below T_j(sd)and TXD becomes

recessive again. Including the TXD condition ensures that output driver oscillation due to

temperature drift is avoided.

6.3 SPLIT output pin and V_IOsupply pin

Two versions of the TJA1042 are available, only differing in the function of a single pin. Pin

5 is either a SPLIT output pin or a V_IOsupply pin.

6.3.1 SPLIT pin

Using the SPLIT pin on the TJA1042T in conjunction with a split termination network (see

Figure 3 and Figure 4) can help to stabilize the recessive voltage level on the bus. This will

reduce EME in networks with DC leakage to ground (e.g. from deactivated nodes with

poor bus leakage performance). In Normal mode, pin SPLIT delivers a DC output voltage

of 0.5V_CC. In Standby mode or when V_CCis off, pin SPLIT is ﬂoating.

TJA1042_2

Product data sheet

Rev. 02 — 8 July 2009

6 of 20

TJA1042

NXP Semiconductors

High-speed CAN transceiver with Standby mode

V

CC

TJA1042T

CANH

SPLIT

CANL

R

60 Ω

V

= 0.5 V

CC

SPLIT

in normal mode;

otherwise floating

015aaa020

GND

Fig 3. Stabilization circuitry and application for version with SPLIT pin

6.3.2 V_IOsupply pin

Pin V_IOon the TTJA1042T/3 and TJA1042TK/3 should be connected to the

microcontroller supply voltage (see Figure 5). This will adjust the signal levels of pins TXD,

RXD and STB to the I/O levels of the microcontroller. Pin V_IOalso provides the internal

supply voltage for the low-power differential receiver of the transceiver. For applications

running in low-power mode, this allows the bus lines to be monitored for activity even if

there is no supply voltage on pin V_CC

.

For versions of the TJA1042 without a V_IOpin, the V_IOinput is internally connected to V_CC

This sets the signal levels of pins TXD, RXD and STB to levels compatible with 5 V

microcontrollers.

.

7. Application design-in information

5 V

BAT

V

CC

V

DD

CANH

STB

Pxx

Pyy

CANH

MICRO-

CONTROLLER

SPLIT

CANL

TJA1042T

TXD

RXD

TX0

RX0

CANL

GND

015aaa022

Fig 4. Typical application with TJA1042T and a 5 V microcontroller.

TJA1042_2

Product data sheet

Rev. 02 — 8 July 2009

7 of 20

TJA1042

NXP Semiconductors

High-speed CAN transceiver with Standby mode

BAT

3 V

5 V

INH

V

IO

CC

V

STB

CANH

DD

Pxx

CANH

CANL

TJA1042T/3

MICRO-

CONTROLLER

TXD

RXD

TJA1042TK/3

TX0

RX0

CANL

GND

015aaa021

Switching off the 5 V supply in Standby mode (dotted line) is optional.

Fig 5. Typical application with TJA1042T/3 or TJA1042TK/3 and a 3 V microcontroller.

8. Limiting values

Table 4.

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are referenced to GND.

Symbol Parameter

Conditions

Min

Max

Unit

V_x

voltage on pin x

no time limit; DC value

on pins CANH and CANL

on any other pin

on pins CANH and CANL

IEC 61000-4-2

at pins CANH and CANL

HBM

−58

+58

+7

V

−0.3

[1]

[2]

[3]

[4]

V_trt

transient voltage

−150 +100

V_ESD

electrostatic discharge voltage

−9

+9

kV

at pins CANH and CANL

at any other pin

MM

−8

−4

+8

+4

kV

[5]

[6]

at any pin

−300 +300

V

CDM

at corner pins

−750 +750

−500 +500

V

at any pin

V

[7]

T_vj

virtual junction temperature

storage temperature

−40

−55

−40

+150

+125

°C

T_stg

T_amb

ambient temperature

[1] Veriﬁed by an external test house to ensure pins CANH and CANL can withstand ISO 7637 part 3 automotive transient test pulses 1, 2a,

3a and 3b.

[2] IEC 61000-4-2 (150 pF, 330 Ω).

TJA1042_2

Product data sheet

Rev. 02 — 8 July 2009

8 of 20

TJA1042

NXP Semiconductors

High-speed CAN transceiver with Standby mode

[3] ESD performance of pins CANH and CANL according to IEC 61000-4-2 (150 pF, 330 Ω) has been be veriﬁed by an external test house.

The result is equal to or better than ±8 kV (unaided).

[4] Human Body Model (HBM): according to AEC-Q100-002 (100 pF, 1.5 kΩ).

[5] Machine Model (MM): according to AEC-Q100-003 (200 pF, 0.75 µH, 10 Ω).

[6] Charged Device Model (CDM): according to AEC-Q100-011 (ﬁeld Induced charge; 4 pF). The classiﬁcation level is C5 (>1000 V).

[7] In accordance with IEC 60747-1. An alternative deﬁnition of virtual junction temperature is: T_vj= T_amb+ P × R_th(vj-a), where R_th(vj-a)is a

ﬁxed value to be used for the calculation of T_vj. The rating for T_vjlimits the allowable combinations of power dissipation (P) and ambient

temperature (T_amb).

9. Thermal characteristics

Table 5.

Thermal characteristics

According to IEC 60747-1.

Symbol

Parameter

Conditions

Value

145

50

Unit

K/W

R_th(vj-a)

thermal resistance from virtual junction to ambient

SO8 package; in free air

HVSON8 package; in free air

10. Static characteristics

Table 6.

Static characteristics

T_vj= −40 °C to +150 °C; V_CC= 4.5 V to 5.5 V; V_IO= 2.8 V to 5.5 V^[1]; R_L= 60 Ω unless speciﬁed otherwise; All voltages are

deﬁned with respect to ground; Positive currents ﬂow into the IC.^[2]

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Supply; pin V_CC

V_CC

I_CC

supply voltage

4.5

-

5.5

V

supply current

Standby mode

TJA1042T; includes I_IO

TJA1042T/3 or TJA1042TK/3

Normal mode

-

10

-

15

5

µA

recessive; V_TXD= V_IO

dominant; V_TXD= 0 V

2.5

20

5

10

70

4.5

mA

V

45

-

V_uvd(VCC)

undervoltage detection

voltage on pin V_CC

[1]

3.5

I/O level adapter supply; pin V_IO

V_IO

I_IO

supply voltage on pin V_IO

supply current on pin V_IO

2.8

5

-

5.5

14

V

Standby mode

µA

Normal mode

recessive; V_TXD= V_IO

dominant; V_TXD= 0 V

15

80

200

1000

2.7

µA

V

100

1.3

350

2.0

V_uvd(VIO)

undervoltage detection

voltage on pin V_IO

Standby mode control input; pin STB

V_IH

HIGH-level input voltage

0.7V_IO

-

V_IO

0.3

+

V

V_IL

I_IH

LOW-level input voltage

HIGH-level input current

−0.3

−1

-

0.3V_IO

+1

V

V_STB= V_IO

µA

TJA1042_2

Product data sheet

Rev. 02 — 8 July 2009

9 of 20

TJA1042

NXP Semiconductors

High-speed CAN transceiver with Standby mode

Table 6.

Static characteristics …continued

T_vj= −40 °C to +150 °C; V_CC= 4.5 V to 5.5 V; V_IO= 2.8 V to 5.5 V^[1]; R_L= 60 Ω unless speciﬁed otherwise; All voltages are

deﬁned with respect to ground; Positive currents ﬂow into the IC.^[2]

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

I_IL

LOW-level input current

V_STB= 0 V

−15

-

−1

µA

CAN transmit data input; pin TXD

V_IH

HIGH-level input voltage

0.7V_IO

-

V_IO

0.3

+

V

V_IL

I_IH

I_IL

LOW-level input voltage

HIGH-level input current

LOW-level input current

input capacitance

−0.3

−5

-

0.3V_IO

+5

V

V_TXD= V_IO

-

µA

pF

Normal mode; V_TXD= 0 V

−260

-

−150

−30

10

[3]

C_i

5

CAN receive data output; pin RXD

I_OH

I_OL

HIGH-level output current

LOW-level output current

V_RXD= V_IO− 0.4 V; V_IO= V_CC

−8

−3

−1

mA

V_RXD= 0.4 V; bus dominant

2

5

12

Bus lines; pins CANH and CANL

V_O(dom)dominant output voltage

V_TXD= 0 V; t < t_to(dom)TXD

pin CANH

2.75

0.5

3.5

1.5

-

4.5

V

pin CANL

2.25

+400

V

V_dom(TX)sytransmitter dominant voltage V_dom(TX)sym= V_CC− V_CANH− V_CANL

−400

mV

symmetry

m

V_O(dif)bus

bus differential output voltage V_TXD= 0 V; t < t_to(dom)TXD

V_CC= 4.75 V to 5.25 V

1.5

-

3

V

R_L= 45 Ω to 65 Ω

V_TXD= V_IO; V_CC= 4.75 V to 5.25 V

−50

+50

mV

recessive; no load

V_O(rec)

recessive output voltage

Normal mode; V_TXD= V_IO; no load

Standby mode; no load

2

0.5V_CC

-

3

V

−0.1

+0.1

[4]

[5]

V_th(RX)dif

differential receiver threshold V_cm(CAN)= −30 V to +30 V

voltage

Normal mode

0.5

0.4

50

0.7

120

0.9

V

Standby mode

1.15

200

V

V_hys(RX)difdifferential receiver hysteresis V_cm(CAN)= −30 V to +30 V

mV

voltage

Normal mode

I_O(dom)

dominant output current

V_TXD= 0 V; t < t_to(dom)TXD; V_CC= 5 V

pin CANH; V_CANH= 0 V

pin CANL; V_CANL= 5 V / 40 V

−100

40

−70

70

-

−40

100

+5

mA

I_O(rec)

recessive output current

Normal mode; V_TXD= V_IO

−5

V_CANH= V_CANL= −27 V to +32 V

I_L

leakage current

V_CC= V_IO= 0 V; V_CANH= V_CANL= 5 V

between V_CANHand V_CANL

−5

9

-

+5

28

+1

52

20

µA

kΩ

%

R_i

input resistance

15

-

∆R_i

R_i(dif)

C_i(cm)

input resistance deviation

differential input resistance

−1

19

-

30

-

kΩ

pF

[3]

common-mode input

capacitance

C_i(dif)

differential input capacitance

-

10

pF

TJA1042_2

Product data sheet

Rev. 02 — 8 July 2009

10 of 20

TJA1042

NXP Semiconductors

High-speed CAN transceiver with Standby mode

Table 6.

Static characteristics …continued

T_vj= −40 °C to +150 °C; V_CC= 4.5 V to 5.5 V; V_IO= 2.8 V to 5.5 V^[1]; R_L= 60 Ω unless speciﬁed otherwise; All voltages are

deﬁned with respect to ground; Positive currents ﬂow into the IC.^[2]

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Common mode stabilization output; pin SPLIT; only for TJA1042T

V_O

output voltage

Normal mode

_SPLIT= −500 µA to +500 µA

0.3V_CC0.5V_CC0.7V_CC

0.45V_CC0.5V_CC0.55V_CC

V

I

Normal mode; R_L= 1 MΩ

V

I_L

leakage current

Standby mode

−5

-

+5

µA

V_SPLIT= −58 V to +58 V

Temperature detection

T_j(sd)shutdown junction

temperature

[3]

-

190

-

°C

[1] Only TJA1042T/3 and TJA1042TK/3 have a V_IOpin. With TJA1042T, the V_IOinput is internally connected to V_CC

.

[2] All parameters are guaranteed over the virtual junction temperature range by design. Products are 100 % tested at 125 °C ambient

temperature (wafer level pretesting), and 100 % tested at 25 °C ambient temperature (ﬁnal testing). Both pretesting and ﬁnal testing use

correlated test conditions to cover the speciﬁed temperature and power supply voltage range.

[3] Not tested in production.

[4] V_cm(CAN)is the common mode voltage of CANH and CANL.

[5] For TJA1042T/3 and TJA1042TK/3: values valid when V_IO= 4.5 V to 5.5 V; when V_IO= 2.8 V to 4.5 V, values valid when

V_cm(CAN)= −12 V to +12 V.

TJA1042_2

Product data sheet

Rev. 02 — 8 July 2009

11 of 20

TJA1042

NXP Semiconductors

High-speed CAN transceiver with Standby mode

11. Dynamic characteristics

Table 7.

Dynamic characteristics

T_vj= −40 °C to +150 °C; V_CC= 4.5 V to 5.5 V; V_IO= 2.8 V to 5.5 V^[1]; R_L= 60 Ω unless speciﬁed otherwise. All voltages are

deﬁned with respect to ground. Positive currents ﬂow into the IC.^[2]

Symbol

Parameter

Conditions

Min Typ

Max

Unit

Transceiver timing; pins CANH, CANL, TXD and RXD; see Figure 6 and Figure 7

t_{d(TXD-busdom)}delay time from TXD to bus dominant

t_{d(TXD-busrec)}delay time from TXD to bus recessive

t_{d(busdom-RXD)}delay time from bus dominant to RXD

t_{d(busrec-RXD)}delay time from bus recessive to RXD

Normal mode

-

65

90

60

65

-

ns

-

t_PD(TXD-RXD)

propagation delay from TXD to RXD

version with SPLIT pin

Normal mode

60

220

versions with V_IOpin

Normal mode

60

-

250

ns

t_to(dom)TXD

t_to(dom)bus

t_{ﬂtr(wake)bus}

TXD dominant time-out time

bus dominant time-out time

bus wake-up ﬁlter time

V_TXD= 0 V; Normal mode

Standby mode

0.3

0.5

2

1

12

3

ms

µs

version with SPLIT pin

Standby mode

versions with V_IOpin

Standby mode

0.5

7

1.5

25

5

µs

t_d(stb-norm)

standby to normal mode delay time

47

[1] Only TJA1042T/3 and TJA1042TK/3 have a V_IOpin. With TJA1042T, the V_IOinput is internally connected to V_CC

.

[2] All parameters are guaranteed over the virtual junction temperature range by design. Products are 100 % tested at 125 °C ambient

temperature (wafer level pretesting), and 100 % tested at 25 °C ambient temperature (ﬁnal testing). Both pretesting and ﬁnal testing use

correlated test conditions to cover the speciﬁed temperature and power supply voltage range.

+5 V

47 µF

100 nF

(1)

V

CC

IO

TXD

CANH

TJA1042

R

L

100 pF

SPLIT

CANL

RXD

GND

STB

15 pF

015aaa024

(1) For versions with a V_IOpin (TJA1042T/3 and TJA1042TK/3), the V_IOpin is connected to pin V_CC

.

Fig 6. Timing test circuit for CAN transceiver

TJA1042_2

Product data sheet

Rev. 02 — 8 July 2009

12 of 20

TJA1042

NXP Semiconductors

High-speed CAN transceiver with Standby mode

HIGH

LOW

TXD

CANH

CANL

dominant

0.9 V

V

O(dif)(bus)

0.5 V

recessive

HIGH

0.7V

IO

RXD

0.3V

IO

LOW

t

d(TXD-busrec)

d(TXD-busdom)

t

d(busrec-RXD)

d(busdom-RXD)

t

PD(TXD-RXD)

015aaa025

Fig 7. CAN transceiver timing diagram

12. Test information

12.1 Quality information

This product has been qualiﬁed to the appropriate Automotive Electronics Council (AEC)

standard Q100 or Q101 and is suitable for use in automotive applications.

TJA1042_2

Product data sheet

Rev. 02 — 8 July 2009

13 of 20

TJA1042

NXP Semiconductors

High-speed CAN transceiver with Standby mode

13. Package outline

SO8: plastic small outline package; 8 leads; body width 3.9 mm

SOT96-1

D

E

A

X

v

c

y

H

M

A

E

Z

5

8

Q

A

2

A

(A )

3

A

1

pin 1 index

θ

L

p

L

1

4

e

w

M

detail X

b

p

0

2.5

5 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

(1)

(2)

UNIT

A

b

c

D

E

e

H

L

p

Q

v

w

y

Z

θ

1

2

3

p

E

max.

0.25

0.10

1.45

1.25

0.49

0.36

0.25

0.19

5.0

4.8

4.0

3.8

6.2

5.8

1.0

0.4

0.7

0.6

0.7

0.3

mm

1.27

0.05

1.05

0.041

1.75

0.25

0.01

0.25

0.01

0.25

0.1

8^o

0^o

0.010 0.057

0.004 0.049

0.019 0.0100 0.20

0.014 0.0075 0.19

0.16

0.15

0.244

0.228

0.039 0.028

0.016 0.024

0.028

0.012

inches 0.069

0.01 0.004

Notes

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

PROJECTION

ISSUE DATE

VERSION

IEC

JEDEC

JEITA

99-12-27

03-02-18

SOT96-1

076E03

MS-012

Fig 8. Package outline SOT96-1 (SO8)

TJA1042_2

Product data sheet

Rev. 02 — 8 July 2009

14 of 20

TJA1042

NXP Semiconductors

High-speed CAN transceiver with Standby mode

HVSON8: plastic thermal enhanced very thin small outline package; no leads;

8 terminals; body 3 x 3 x 0.85 mm

SOT782-1

0

1

2 mm

scale

X

B

A

D

A

1

E

c

terminal 1

index area

detail X

C

e

1

terminal 1

index area

y

C

1

v

M

C

A B

y

b

e

w M

1

4

L

E

h

8

5

D

h

DIMENSIONS (mm are the original dimensions)

(1)

A

(1)

UNIT

A

b

c

D

E

e

1

L

v

w

y

1

h

max.

0.05 0.35

0.00 0.25

3.1

2.9

2.55

2.25

3.1

2.9

1.75

1.45

0.5

0.3

mm

1

0.65 1.95

0.1

0.05 0.05

0.1

0.2

Note

1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

PROJECTION

ISSUE DATE

VERSION

IEC

JEDEC

JEITA

03-01-29

SOT782-1

- - -

MO-229

- - -

Fig 9. Package outline SOT782-1 (HVSON8)

TJA1042_2

Product data sheet

Rev. 02 — 8 July 2009

15 of 20

TJA1042

NXP Semiconductors

High-speed CAN transceiver with Standby mode

14. Soldering of SMD packages

This text provides a very brief insight into a complex technology. A more in-depth account

of soldering ICs can be found in Application Note AN10365 “Surface mount reﬂow

soldering description”.

14.1 Introduction to soldering

Soldering is one of the most common methods through which packages are attached to

Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both

the mechanical and the electrical connection. There is no single soldering method that is

ideal for all IC packages. Wave soldering is often preferred when through-hole and

Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not

suitable for ﬁne pitch SMDs. Reﬂow soldering is ideal for the small pitches and high

densities that come with increased miniaturization.

14.2 Wave and reﬂow soldering

Wave soldering is a joining technology in which the joints are made by solder coming from

a standing wave of liquid solder. The wave soldering process is suitable for the following:

• Through-hole components

• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board

Not all SMDs can be wave soldered. Packages with solder balls, and some leadless

packages which have solder lands underneath the body, cannot be wave soldered. Also,

leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,

due to an increased probability of bridging.

The reﬂow soldering process involves applying solder paste to a board, followed by

component placement and exposure to a temperature proﬁle. Leaded packages,

packages with solder balls, and leadless packages are all reﬂow solderable.

Key characteristics in both wave and reﬂow soldering are:

• Board speciﬁcations, including the board ﬁnish, solder masks and vias

• Package footprints, including solder thieves and orientation

• The moisture sensitivity level of the packages

• Package placement

• Inspection and repair

• Lead-free soldering versus SnPb soldering

14.3 Wave soldering

Key characteristics in wave soldering are:

• Process issues, such as application of adhesive and ﬂux, clinching of leads, board

transport, the solder wave parameters, and the time during which components are

exposed to the wave

• Solder bath speciﬁcations, including temperature and impurities

TJA1042_2

Product data sheet

Rev. 02 — 8 July 2009

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TJA1042

NXP Semiconductors

High-speed CAN transceiver with Standby mode

14.4 Reﬂow soldering

Key characteristics in reﬂow soldering are:

• Lead-free versus SnPb soldering; note that a lead-free reﬂow process usually leads to

higher minimum peak temperatures (see Figure 10) than a SnPb process, thus

reducing the process window

• Solder paste printing issues including smearing, release, and adjusting the process

window for a mix of large and small components on one board

• Reﬂow temperature proﬁle; this proﬁle includes preheat, reﬂow (in which the board is

heated to the peak temperature) and cooling down. It is imperative that the peak

temperature is high enough for the solder to make reliable solder joints (a solder paste

characteristic). In addition, the peak temperature must be low enough that the

packages and/or boards are not damaged. The peak temperature of the package

depends on package thickness and volume and is classiﬁed in accordance with

Table 8 and 9

Table 8.

SnPb eutectic process (from J-STD-020C)

Package thickness (mm) Package reﬂow temperature (°C)

Volume (mm³)

< 350

≥ 350

220

< 2.5

235

220

≥ 2.5

220

Table 9.

Lead-free process (from J-STD-020C)

Package thickness (mm) Package reﬂow temperature (°C)

Volume (mm³)

< 350

260

350 to 2000

> 2000

260

< 1.6

260

250

245

1.6 to 2.5

> 2.5

260

245

250

245

Moisture sensitivity precautions, as indicated on the packing, must be respected at all

times.

Studies have shown that small packages reach higher temperatures during reﬂow

soldering, see Figure 10.

TJA1042_2

Product data sheet

Rev. 02 — 8 July 2009

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TJA1042

NXP Semiconductors

High-speed CAN transceiver with Standby mode

maximum peak temperature

= MSL limit, damage level

temperature

minimum peak temperature

= minimum soldering temperature

peak

temperature

time

001aac844

MSL: Moisture Sensitivity Level

Fig 10. Temperature proﬁles for large and small components

For further information on temperature proﬁles, refer to Application Note AN10365

“Surface mount reﬂow soldering description”.

15. Revision history

Table 10. Revision history

Document ID

TJA1042_2

Release date

20090708

Data sheet status

Change notice

Supersedes

Product data sheet

-

TJA1042_1

Modiﬁcations

• Revised parameter values in Table 4 (V_ESD

)

• Revised parameter values in Table 6 (V_Ofor SPLIT pin)

TJA1042_1

20090309

Product data sheet

-

TJA1042_2

Product data sheet

Rev. 02 — 8 July 2009

18 of 20

TJA1042

NXP Semiconductors

High-speed CAN transceiver with Standby mode

16. Legal information

16.1 Data sheet status

Document status^[1][2]

Product status^[3]

Development

Deﬁnition

Objective [short] data sheet

This document contains data from the objective speciﬁcation for product development.

This document contains data from the preliminary speciﬁcation.

This document contains the product speciﬁcation.

Preliminary [short] data sheet Qualiﬁcation

Product [short] data sheet Production

[1]

[2]

[3]

Please consult the most recently issued document before initiating or completing a design.

The term ‘short data sheet’ is explained in section “Deﬁnitions”.

The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

damage. NXP Semiconductors accepts no liability for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

16.2 Deﬁnitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modiﬁcations or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of

use of such information.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

speciﬁed use without further testing or modiﬁcation.

Limiting values — Stress above one or more limiting values (as deﬁned in

the Absolute Maximum Ratings System of IEC 60134) may cause permanent

damage to the device. Limiting values are stress ratings only and operation of

the device at these or any other conditions above those given in the

Characteristics sections of this document is not implied. Exposure to limiting

values for extended periods may affect device reliability.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is intended

for quick reference only and should not be relied upon to contain detailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

ofﬁce. In case of any inconsistency or conﬂict with the short data sheet, the

full data sheet shall prevail.

Terms and conditions of sale — NXP Semiconductors products are sold

subject to the general terms and conditions of commercial sale, as published

at http://www.nxp.com/proﬁle/terms, including those pertaining to warranty,

intellectual property rights infringement and limitation of liability, unless

explicitly otherwise agreed to in writing by NXP Semiconductors. In case of

any inconsistency or conﬂict between information in this document and such

terms and conditions, the latter will prevail.

16.3 Disclaimers

General — Information in this document is believed to be accurate and

reliable. However, NXP Semiconductors does not give any representations or

warranties, expressed or implied, as to the accuracy or completeness of such

information and shall have no liability for the consequences of use of such

information.

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from national authorities.

No offer to sell or license — Nothing in this document may be interpreted

or construed as an offer to sell products that is open for acceptance or the

grant, conveyance or implication of any license under any copyrights, patents

or other industrial or intellectual property rights.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation speciﬁcations and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in medical, military, aircraft,

space or life support equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in personal injury, death or severe property or environmental

16.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks

are the property of their respective owners.

17. Contact information

For more information, please visit: http://www.nxp.com

For sales ofﬁce addresses, please send an email to: salesaddresses@nxp.com

TJA1042_2

Product data sheet

Rev. 02 — 8 July 2009

19 of 20

TJA1042

NXP Semiconductors

High-speed CAN transceiver with Standby mode

18. Contents

1

General description . . . . . . . . . . . . . . . . . . . . . . 1

2

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

General. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Low-power management . . . . . . . . . . . . . . . . . 1

Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

2.1

2.2

2.3

3

4

Ordering information. . . . . . . . . . . . . . . . . . . . . 2

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3

5

5.1

5.2

Pinning information. . . . . . . . . . . . . . . . . . . . . . 4

Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4

6

6.1

Functional description . . . . . . . . . . . . . . . . . . . 5

Operating modes . . . . . . . . . . . . . . . . . . . . . . . 5

Normal mode . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Standby mode. . . . . . . . . . . . . . . . . . . . . . . . . . 5

Fail-safe features . . . . . . . . . . . . . . . . . . . . . . . 6

TXD dominant time-out function . . . . . . . . . . . . 6

Bus dominant time-out function . . . . . . . . . . . . 6

Internal biasing of TXD and STB input pins . . . 6

Undervoltage detection on pins V_CCand V_IO. . 6

Over-temperature protection. . . . . . . . . . . . . . . 6

SPLIT output pin and V_IOsupply pin . . . . . . . . 6

SPLIT pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

6.1.1

6.1.2

6.2

6.2.1

6.2.2

6.2.3

6.2.4

6.2.5

6.3

6.3.1

6.3.2

V_IOsupply pin . . . . . . . . . . . . . . . . . . . . . . . . . . 7

7

Application design-in information . . . . . . . . . . 7

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 8

Thermal characteristics. . . . . . . . . . . . . . . . . . . 9

Static characteristics. . . . . . . . . . . . . . . . . . . . . 9

Dynamic characteristics . . . . . . . . . . . . . . . . . 12

Test information. . . . . . . . . . . . . . . . . . . . . . . . 13

Quality information . . . . . . . . . . . . . . . . . . . . . 13

Package outline . . . . . . . . . . . . . . . . . . . . . . . . 14

8

9

10

11

12

12.1

13

14

Soldering of SMD packages . . . . . . . . . . . . . . 16

Introduction to soldering . . . . . . . . . . . . . . . . . 16

Wave and reﬂow soldering . . . . . . . . . . . . . . . 16

Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 16

Reﬂow soldering . . . . . . . . . . . . . . . . . . . . . . . 17

14.1

14.2

14.3

14.4

15

Revision history. . . . . . . . . . . . . . . . . . . . . . . . 18

16

Legal information. . . . . . . . . . . . . . . . . . . . . . . 19

Data sheet status . . . . . . . . . . . . . . . . . . . . . . 19

Deﬁnitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 19

16.1

16.2

16.3

16.4

17

18

Contact information. . . . . . . . . . . . . . . . . . . . . 19

Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 8 July 2009

Document identifier: TJA1042_2

型号:	TJA1042T
是否无铅：	不含铅
是否Rohs认证：	符合
生命周期：	Active
零件包装代码：	SOIC
包装说明：	SOP, SOP8,.25
针数：	8
Reach Compliance Code：	compliant
HTS代码：	8542.39.00.01
风险等级：	5.35
数据速率：	1000 Mbps
JESD-30 代码：	R-PDSO-G8
JESD-609代码：	e4
长度：	4.9 mm
湿度敏感等级：	1
功能数量：	1
端子数量：	8
收发器数量：	1
最高工作温度：	125 °C
最低工作温度：	-40 °C
封装主体材料：	PLASTIC/EPOXY
封装代码：	SOP
封装等效代码：	SOP8,.25
封装形状：	RECTANGULAR
封装形式：	SMALL OUTLINE
峰值回流温度（摄氏度）：	260
电源：	5 V
认证状态：	Not Qualified
筛选级别：	AEC-Q100
座面最大高度：	1.75 mm
子类别：	Network Interfaces
最大压摆率：	0.07 mA
标称供电电压：	5 V
表面贴装：	YES
电信集成电路类型：	INTERFACE CIRCUIT
温度等级：	AUTOMOTIVE
端子面层：	NICKEL PALLADIUM GOLD SILVER
端子形式：	GULL WING
端子节距：	1.27 mm
端子位置：	DUAL
处于峰值回流温度下的最长时间：	30
宽度：	3.9 mm
Base Number Matches：	1

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