TPA3138D2
ZHCSHR9A –MARCH 2018–REVISED JUNE 2018
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Typical Applications (接下页)
10.2.1.3 Decoupling Capacitor Recommendations
In order to design an amplifier that has robust performance, passes regulatory requirements, and exhibits good
audio performance, good quality decoupling capacitors should be used. In practice, X7R should be used in this
application.
The voltage of the decoupling capacitors should be selected in accordance with good design practices.
Temperature, ripple current, and voltage overshoot must be considered. This fact is particularly true in the
selection of the ceramic capacitors that are placed on the power supply to each full-bridge. They must withstand
the voltage overshoot of the PWM switching, the heat generated by the amplifier during high power output, and
the ripple current created by high power output. A minimum voltage rating of 16 V is required for use with a 12-V
power supply.
10.2.2 Detailed Design Procedure
A rising-edge transition on SD/FAULT input allows the device to start switching. It is recommended to ramp the
PVCC voltage to its desired value before releasing SD/FAULT for minimum audible artifacts.
The device is not inverting the audio signal from input to output.
The GVDD pin is not recommended to be used as a voltage source for external circuitry.
10.2.2.1 Ferrite Bead Filter Considerations
With Advanced Emissions Suppression Technology, the TPA3138D2 amplifier delivers high-efficiency Class-D
performance while minimizing interference to surrounding circuits, even with a low-cost ferrite bead filter. But
couple factors need to be taken into considerations when selecting the ferrite beads.
One important aspect of the ferrite bead selection is the type of material used in the ferrite bead. Not all ferrite
material is alike, so it is important to select a material that is effective in the 10 to 100 MHz range which is key to
the operation of the Class-D amplifier. Many of the specifications regulating consumer electronics have
emissions limits as low as 30 MHz. It is important to use the ferrite bead filter to block radiation in the 30-MHz
and above range from appearing on the speaker wires and the power supply lines which are good antennas for
these signals. The impedance of the ferrite bead can be used along with a small capacitor with a value in the
range of 1000 pF to reduce the frequency spectrum of the signal to an acceptable level. For best performance,
the resonant frequency of the ferrite bead and capacitor filter should be less than 10 MHz.
Also, it is important that the ferrite bead is large enough to maintain its impedance at the peak currents expected
for the amplifier. Some ferrite bead manufacturers specify the bead impedance at a variety of current levels. If it
is possible, make sure the ferrite bead maintains an adequate amount of impedance at the peak current that the
amplifier detects. If these specifications are not available, it is possible to estimate the bead's current handling
capability by measuring the resonant frequency of the filter output at low power and at maximum power. A
change of resonant frequency of less than fifty percent under this condition is desirable. Examples of ferrite
beads which have been tested and work well with the TPA3138D2 device include NFZ2MSM series from Murata.
A high-quality ceramic capacitor is also required for the ferrite bead filter. A low ESR capacitor with good
temperature and voltage characteristics works best.
Additional EMC improvements may be obtained by adding snubber networks from each of the class-D outputs to
ground. Suggested values for a simple RC series snubber network would be 68 Ω in series with a 100-pF
capacitor although design of the snubber network is specific to every application and must be designed taking
into account the parasitic reactance of the printed circuit board as well as the audio amp. Take care to evaluate
the stress on the component in the snubber network especially if the amp is running at high PVCC. Also, make
sure the layout of the snubber network is tight and returns directly to the GND or the thermal pad beneath the
chip.
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