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芯片TPD7S019-15DBQR的概述 TPD7S019-15DBQR是一款多通道ESD（电静电放电）保护器件，设计用于保护高性能集成电路。这款器件特别适用于USB、HDMI、SD卡、以及其他数据传输接口，在这些接口的设计中，ESD保护是至关重要的。TPD7S019-15DBQR通过提供大量的低电容ESD保护，能够有效地防止因静电放电或电磁干扰（EMI）造成的器件损坏。该芯片配置了七个通道，能够同时保护多个信号线。其低电容设计使得其不仅能有效保护电路，还能保证信号传输的完整性。这对于高速接口尤其重要，因为在这些应用中，任何额外的电容都可能导致信号衰减或失真。TPD7S019-15DBQR的绝缘特性和极低的输入电流，使其能够适应各种不同的工作环境。此外，器件的反向击穿特性确保了在高电压条件下的安全性。芯片TPD7S019-15DBQR的详细参数 TPD7S019-15DBQR的主要...

产品型号TPD7S019-15DBQR的Datasheet PDF文件预览

TPD7S019

www.ti.com

SLLSE33 –MAY 2010

7-CHANNEL INTEGRATED ESD SOLUTION FOR VGA PORT

WITH INTEGRATED LEVEL SHIFTER AND MATCHING IMPEDANCE

Check for Samples: TPD7S019

FEATURES

•

7-Channel ESD Protection Includes ESD

Protection, Level-Shifting, Buffering and Sync

Impedance Matching

•

Bi-Directional Level Shifting N-Channel FETs

Provided for DDC_CLK and DDC_DATA

Channels

•

Exceeds IEC61000-4-2 (Level 4) ESD

Protection to Requirements on the External

Pins

Flow-Through Single-In-Line Pin Mapping

Ensures no Additional Board Layout Burden

while Placing the ESD Protection Chip Near

the Connector

–

±15-kV Human-Body Model (HBM)

±8-kV IEC 61000-4-2 Contact Discharge

APPLICATIONS

•

Very Low Loading Capacitance from ESD

Protection Diodes on VIDEO Lines (2.5 pF)

VGA and DVI-I Ports in:

–

Desktop and Notebook PCs

Graphics Cards

Set Top Boxes

•

5-V Drivers for HSYNC and VSYNC Lines

Integrated Impedance Matching Resistors on

Sync Lines:

–

TPD7S019-65: 65-Ω Termination

TPD7S019-15: 15-Ω Termination

TPD7S019-55: 55-Ω Termination

RSV PACKAGE

(TOP VIEW)

DBQ PACKAGE

(TOP VIEW)

ORDERING INFORMATION

T_A

PACKAGE^{(1) (2)}

ORDERABLE PART NUMBER

TOP-SIDE MARKING

PREVIEW

µQFN – RSV

Tape and reel

TPD7S019-15RSVR

TPD7S019-15DBQR

TPD7S019-55DBQR

TPD7S019-65DBQR

PQ19-15

–40°C to 85°C

SSOP/QSOP – DBQ

PREVIEW

(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

TPD7S019

SLLSE33 –MAY 2010

www.ti.com

TERMINATION AT

SYNC

PITCH

LENGTH (TYP)

WIDTH (TYP)

HEIGHT (MAX)

ORDERABLE PART NO.

15-Ω

55-Ω

65-Ω

15-Ω

TPD7S019-15DBQR

TPD7S019-55DBQR

TPD7S019-65DBQR

TPD7S019-15RSVR

0.635 mm

0.4 mm

4.9 mm

2.6 mm

6.0 mm

1.8 mm

1.75 mm

0.55 mm

DESCRIPTION/ORDERING INFORMATION

The TPD7S019 is an integrated 7-channel ESD solution for the VGA or DVI-I port connector. This device

integrates ESD protection for all signals, level shifting for the DDC signals and buffering for the SYNC signals.

Three individual supply lines control the power rails of the VIDEO, DDC and SYNC channels to facilitate

interfacing with low voltage video controller ICs in mixed supply-voltage environments.

Two non-inverting drivers provide buffering for the HSYNC and VSYNC signals from the video controller IC

(SYNC1, SYNC2). These buffers accept TTL input levels and convert them to CMOS output levels that swing

between Ground and VCC_SYNC, which is typically 5 V. Additionally, each driver has a series termination

resistor (RT) connected to the SYNC_OUT pin, eliminating the external termination resistors typically required for

the HSYNC and VSYNC lines of the video cable. At the SYNC output the TPD7S019 offers 65-Ω, 55-Ω, or 15-Ω

series termination resistor option to match different transmisison line impedances.

Two N-channel MOSFETs provide the level shifting function required when the DDC controller is operated at a

lower supply voltage than the monitor. The gate terminals for the MOSFETs (VCC_DDC) should be connected to

the supply rail (typically 3.3 V) that supplies power to the transceivers of the DDC controller.

The TPD7S019 confirms the IEC61000-4-2 (Level 4) system level ESD protection and ±15KV HBM ESD

protection. This device is offered in space-saving 16-pin DBQ and 16-pin RSV packages.

The TPD7S019 is characterized for operation over ambient air temperature of –40°C to 85°C.

CIRCUIT DIAGRAM

Submit Documentation Feedback

Product Folder Link(s): TPD7S019

TPD7S019

www.ti.com

SLLSE33 –MAY 2010

TERMINAL FUNCTIONS

TERMINAL

NO.

TYPE

DESCRIPTION

NAME

DBQ

RSV

BYP

Bypass pin. Using a 0.2 µF bypass capacitor will increase the ESD robustness of the

system.

Power

DDC_IN1

DDC_IN2

DDC signal input. Connects to the VGA controller side of one of the sync lines.

DDC_OUT1

DDC_OUT2

DDC signal output. Connects to the video connector side of one of the sync lines.

–

GND

Ground

SYNC_IN1

SYNC_IN2

Sync signal buffer input. Connects to the VGA controller side of one of the sync lines.

SYNC_OUT1

SYNC_OUT2

Sync signal buffer output. Connects to the video connector side of one of the sync lines

VCC_DDC

Power Isolated supply input for the DDC_1 and DDC_2 level-shifting N-FET gates

VCC_SYNC

Isolated supply input for the SYNC_1 and SYNC_2 level shifters and their associated

ESD protection circuits

Power

VCC_VIDEO

Power Supply pin specifically for the VIDEO_1, VIDEO_2 and VIDEO_3 ESD protection circuits

VIDEO1

VIDEO2

VIDEO3

High-speed ESD clamp input

ESD

ABSOLUTE MAXIMUM RATINGS⁽¹⁾

over operating free-air temperature range (unless otherwise noted)

MIN

MAX UNIT

V_{CC_VIDEO}

V_{CC_DDC}

Supply voltage

–0.5

6.0

V_{CC_SYNC}

V_IO(VIDEO)

V_I(SYNC)

V_I(DDC)

IO voltage

VIDEOx pins

SYNC pins

–0.5

–55

V_{CC_VIDEO}

V_{CC_SYNC}

6.0

Input voltage

DDC_INx pins

V_O(DDC)

T_stg

Output voltage

6.0

Storage temperature

IEC 61000-4-2 Contact Discharge

HBM ESD

125

°C

VIDEO, DDC_OUT, SYNC_OUT pins

VCC, DDC_IN, SYNC_IN, BYP Pins

±8

±15

±2

(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating

conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

RECOMMENDED OPERATING CONDITIONS

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

V_{CC_VIDEO}

V_{CC_DDC}

Supply voltage

5.5

V_{CC_SYNC}

V_IO(VIDEO)

V_I(SYNC)

V_I(DDC)

V_O(DDC)

T_A

IO voltage

VIDEOx pins

SYNC pins

VCC_VIDEO

Input voltage

VCC_SYNC

Input voltage

DDC_INx pins

DDC_INx Pins

5.5

Output voltage

Operating temperature

–40

°C

Submit Documentation Feedback

Product Folder Link(s): TPD7S019

TPD7S019

SLLSE33 –MAY 2010

www.ti.com

MAX UNIT

ELECTRICAL CHARACTERISTICS

over operating free-air temperature range (unless otherwise noted)

PARAMETER

TEST CONDITION

MIN

TYP

I_{CC_VIDEO}

V_{CC_VIDEO}supply current

V_{CC_VIDEO}= 5 V, VIDEO inputs at V_{CC_VIDEO}or

GND

µA

I_{CC_DDC}

V_{CC_DDC}supply current

V_{CC_SYNC}supply current

V_{CC_DDC}= 5 V

10 µA

I_{CC_SYNC}

V_{CC_SYNC}= 5 V, SYNC inputs at GND or

V_{CC_SYNC}

µA

SYNC outputs unloaded

SYNC inputs at 3 V;

SYNC outputs unloaded

2.0

I_{IO_VIDEO}

I_OFF

VIDEO input/output pins

V_{IO_VIDEO}= 3 V

V_{CC_DDC}≤ 0.4 V, V_{DDC_OUT}= 5 V

0.01

–0.8

1.0 µA

DDC pin powerdown leakage current

V_D

Diode forward voltage for lower clamp of

VIDEO, DDC, SYNC output pins

I_D= 8 mA, lower clamp diode

–0.6

2.0

–0.95

R_{DYN_VIDEO}Dynamic resistance (VIDEO pins)

I = 1 A

1.0

V_IH

High-level SYNC logic input voltage

Low-level SYNC logic input voltage

High-level SYNC logic output voltage

V_{CC_SYNC}= 5 V

I_OH= 0 mA, V_{CC_SYNC}= 5 V

V_IL

0.6

V_OH

V_OH-15

4.85

High-level SYNC logic

output voltage

TPD7S019-15 I_OH= 24 mA, V_{CC_SYNC}= 5 V

V_OL

Low-level SYNC logic output voltage

I_OH= 0 mA, V_{CC_SYNC}= 5 V

0.15

0.8

V_OL-15

Low-level SYNC logic

output voltage

TPD7S019-15 I_OH= 24 mA, V_{CC_SYNC}= 5 V

R_T

SYNC driver output

resistance

TPD7S019-15 V_{CC_SYNC}= 5 V, SYNC inputs at GND or 3 V

TPD7S019-55

TPD7S019-65

C_{IO_VIDEO}

t_PLH

IO capacitance of VIDEO pins

V_IO= 2.5 V

2.5

SYNC driver L => H propagation delay

SYNC driver H => L propagation delay

SYNC driver output rise & fall times

VIDEO ESD diode break-down voltage

C_L= 50 pF; V_CC= 5 V, input t_Rand t_F≤ 5ns

I_IO= 1 mA

12 ns

t_PHL

t_R, t_F

V_BR

Typical Characteristics

Figure 1. TPD7S019-xx TLP VID1 to GND, Barth, T_rf= 10 ns

Submit Documentation Feedback

Product Folder Link(s): TPD7S019

TPD7S019

www.ti.com

SLLSE33 –MAY 2010

Typical Characteristics (continued)

Figure 2. TPD7S019-xx IEC Clamping Waveforms Positive Contact

Figure 3. TPD7S019-xx IEC Clamping Waveforms Negative Contact

Submit Documentation Feedback

Product Folder Link(s): TPD7S019

TPD7S019

SLLSE33 –MAY 2010

www.ti.com

Typical Characteristics (continued)

Figure 4. Leakage Current Trough VIDEO Pins

V_{CC_VIDEO}= 5 V

Figure 5. I_OFF(DDC_OUTx)

V_{CC_DDC}= 0 V

Submit Documentation Feedback

Product Folder Link(s): TPD7S019

TPD7S019

www.ti.com

SLLSE33 –MAY 2010

APPLICATION INFORMATION

Figure 6. Typical Application Schematics with TPD7S019

R_P: Pullup resistor for the DDC data and clock lines. Typically system designer selects 47 kΩ pullup values

R_T: Line termination resistor for the RGB lines. RT is selected to match the transmission line. For a single-ended

transmission line, RT can be anywhere from 50 Ω to 75 Ω depending on board trace impedance.

Some systems may require additional filters at the SYNC and RGB lines.

The TPD7S019 should be placed as close to the VGA port as possible.

The ESD protection channels VIDEO1, VIDEO2, VIDEO3 are identical circuits, they can be used interchangeably

between the R, G, B signals.

Submit Documentation Feedback

Product Folder Link(s): TPD7S019

TPD7S019

SLLSE33 –MAY 2010

www.ti.com

Figure 7. Simplified Layout with TPD7S019 (Only IO Lines are Shown)

Submit Documentation Feedback

Product Folder Link(s): TPD7S019

PACKAGE OPTION ADDENDUM

www.ti.com

21-Jun-2010

PACKAGING INFORMATION

Status ⁽¹⁾

Eco Plan ⁽²⁾

MSL Peak Temp ⁽³⁾

Samples

Orderable Device

Package Type Package

Drawing

Pins

Package Qty

Lead/

Ball Finish

(Requires Login)

TPD7S019-15DBQR

ACTIVE

SSOP/QSOP

DBQ

2500

Green (RoHS

& no Sb/Br)

CU NIPDAU Level-2-260C-1 YEAR

Request Free Samples

TPD7S019-55DBQR

TPD7S019-65DBQR

PREVIEW SSOP/QSOP

DBQ

2500

TBD

Call TI

Samples Not Available

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

⁽²⁾Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

⁽³⁾MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 1

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,

and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should

obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are

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TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard

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TPD7S019-15DBQR产品参数

型号:	TPD7S019-15DBQR
Brand Name：	Texas Instruments
是否无铅：	不含铅
是否Rohs认证：	符合
生命周期：	Active
零件包装代码：	SOIC
包装说明：	SSOP, SSOP16,.25
针数：	16
Reach Compliance Code：	compliant
ECCN代码：	EAR99
HTS代码：	8542.39.00.01
Factory Lead Time：	1 week
风险等级：	1.59
Samacsys Confidence：
Samacsys Status：	Released
Samacsys PartID：	417603
Samacsys Pin Count：	16
Samacsys Part Category：	Integrated Circuit
Samacsys Package Category：	Other
Samacsys Footprint Name：	SOP63P600X175-16N
Samacsys Released Date：	2017-01-12 12:59:53
Is Samacsys：	N
商用集成电路类型：	CONSUMER CIRCUIT
JESD-30 代码：	R-PDSO-G16
JESD-609代码：	e4
长度：	4.9 mm
湿度敏感等级：	1
功能数量：	1
端子数量：	16
最高工作温度：	85 °C
最低工作温度：	-40 °C
封装主体材料：	PLASTIC/EPOXY
封装代码：	SSOP
封装等效代码：	SSOP16,.25
封装形状：	RECTANGULAR
封装形式：	SMALL OUTLINE, SHRINK PITCH
峰值回流温度（摄氏度）：	260
电源：	5 V
认证状态：	Not Qualified
座面最大高度：	1.75 mm
子类别：	Other Consumer ICs
最大压摆率：	2 mA
最大供电电压 (Vsup)：	5.5 V
最小供电电压 (Vsup)：
表面贴装：	YES
温度等级：	INDUSTRIAL
端子面层：	Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式：	GULL WING
端子节距：	0.64 mm
端子位置：	DUAL
处于峰值回流温度下的最长时间：	NOT SPECIFIED
宽度：	3.9 mm
Base Number Matches：	1

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