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TPS3831

TPS3839

www.ti.com

SBVS193B –JUNE 2012–REVISED APRIL 2013

Ultralow Power, Supply Voltage Supervisor

Check for Samples: TPS3831, TPS3839

FEATURES

DESCRIPTION

The TPS3831 and TPS3839 (both referred to as the

•

Ultralow Supply Current: 150 nA (typ)

Operating Supply Voltage: 0.6 V to 6.5 V

Valid Reset for V_DD> 0.6 V

TPS383x) are ultralow current (150 nA, typical),

voltage supervisory circuit that monitor a single

voltage. Both devices assert an active-low reset

signal whenever the V_DDsupply voltage drops below

the factory-trimmed reset threshold voltage. The reset

output remains asserted for 200 ms (typical) after the

V_DDvoltage rises above the threshold voltage. These

devices are designed to ignore fast transients on the

V_DDpin. Note that the TPS3831 includes a manual

reset input.

Push-Pull RESET Output

Factory-Trimmed Reset Threshold Voltages

Temperature Range: –40°C to +85°C

Packages: 1-mm × 1-mm X2SON or 3-Pin

SOT23

APPLICATIONS

The ultralow current consumption of 150 nA makes

these voltage supervisors ideal for use in low-power

and portable applications. The TPS383x are specified

to have the correct output logic state for supply

voltages down to 0.6 V.

•

Portable and Battery-Powered Equipment

Industrial Equipment

Cell Phones

Glucose Monitors

Metering

The TPS383x feature precision factory-trimmed

threshold voltages and extremely low-power

operation. The TPS3831 is available is a 4-pin 1-mm

× 1-mm (DQN) X2SON package. The TPS3839 is

available in a 3-pin SOT23 (DBZ) package or a 4-pin

1-mm × 1-mm (DQN) X2SON package.

Televisions

TYPICAL APPLICATION

DBZ PACKAGE

SOT23-3

(TOP VIEW)

3.3 V

GND

0.1 mF

VDD

RESET

Microprocessor

RST

TPS383xK33

RESET

GND

TPS3831

DQN PACKAGE

1-mm ´ 1-mm X2SON

(TOP VIEW)

TPS3839

DQN PACKAGE

1-mm ´ 1-mm X2SON

(TOP VIEW)

TPS3831

Only

VDD

RESET

Thermal

Pad

Thermal

Pad

GND

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

All trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

TPS3831

TPS3839

SBVS193B –JUNE 2012–REVISED APRIL 2013

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

PACKAGE INFORMATION⁽¹⁾

PACKAGE

PRODUCT

TPS3831A09

TPS3831G12

TPS3831E16

TPS3831G18

TPS3831L30

TPS3831K33

TPS3831G33

TPS3831K50

THRESHOLD VOLTAGE (V)

PACKAGE-LEAD

X2SON-4

SOT23-3

X2SON-4

SOT23-3

X2SON-4

SOT23-3

X2SON-4

SOT23-3

X2SON-4

SOT23-3

X2SON-4

SOT23-3

X2SON-4

SOT23-3

X2SON-4

SOT23-3

X2SON-4

DESIGNATOR

DQN

DBZ

0.900

1.100

1.520

1.670

2.630

2.930

3.080

4.380

TPS3839A09

TPS3839G12

TPS3839E16

TPS3839G18

TPS3839L30

TPS3839K33

TPS3839G33

TPS3839K50

0.900

1.100

1.520

1.670

2.630

2.930

3.080

4.380

DQN

DBZ

DQN

DBZ

DQN

DBZ

DQN

DBZ

DQN

DBZ

DQN

DBZ

DQN

DBZ

DQN

(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or visit the

device product folder at www.ti.com.

ABSOLUTE MAXIMUM RATINGS⁽¹⁾

Over operating free-air temperature range, unless otherwise noted.

VALUE

MIN

–0.3

MAX

UNIT

VDD

Voltage

On RESET

Current

RESET pin

°C

Operating ambient, T_A

Storage, T_stg

–40

–65

+85

+150

Temperature⁽²⁾

Human body model (HBM)

Charge device model (CDM)

Electrostatic discharge (ESD) rating:

500

(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods my affect device reliability.

(2) As a result of the low dissipated power in this device, it is assumed that the junction temperature is equal to the ambient temperature.

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SBVS193B –JUNE 2012–REVISED APRIL 2013

THERMAL INFORMATION

TPS3831

TPS3839

THERMAL METRIC⁽¹⁾

UNITS

DBZ (SOT23-3) DQN (X2SON)

3 PINS

286.9

105.6

123.4

25.8

4 PINS

249.9

N/A

θ_JA

Junction-to-ambient thermal resistance

Junction-to-case (top) thermal resistance

Junction-to-board thermal resistance

θ_JCtop

θ_JB

N/A

°C/W

ψ_JT

Junction-to-top characterization parameter

Junction-to-board characterization parameter

Junction-to-case (bottom) thermal resistance

6.0

ψ_JB

107.9

N/A

θ_JCbot

N/A

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

ELECTRICAL CHARACTERISTICS

At T_A= –40°C to +85°C, 0.9 V < V_DD< 6.5 V, and C1 = 0.1 µF, unless otherwise noted.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX UNIT

V_DD

V_(VO)

I_DD

Input supply voltage range

Minimum V_DDvoltage for valid output

Supply current (into VDD pin)

0.9

6.5

0.6

500

0.4

I_OL= 1 µA

Output not connected

150

V_DD= 0.9 V to 1.2 V, I_OL= 120 µA

V_DD= 1.2 V to 2.8 V, I_OL= 0.5 mA

V_DD= 2.8 V to 6.5 V, I_OL= 2 mA

V_DD= 0.9 V to 1.2 V, I_OH= –50 µA

V_DD= 1.2 V to 3.3 V, I_OH= –0.5 mA

V_DD= 3.3 V to 6.5 V, I_OH= –2 mA

V_OL

Low-level output voltage (RESET pin)

High-level output voltage (RESET pin)

V_DD– 0.4

0.3V_DD

V_OH

V_IL

Low-level input voltage (MR pin)

High-level input voltage (MR pin)

MR pin pull-up resistance

V_IH

R_MR

0.7V_DD

±1.0%

0.900

1.100

1.520

1.670

2.630

2.930

3.080

4.380

kΩ

Negative-going input threshold accuracy T_A= +25°C

TPS3839A09

TPS3839G12

TPS3839E16

0.874

1.073

1.482

1.628

2.564

2.857

3.003

4.271

0.914

1.117

1.543

1.695

2.669

2.974

3.126

4.446

TPS3839G18

Negative-going threshold voltage

TPS3839L30

V_IT–

TPS3839K33

TPS3839G33

TPS3839K50

TPS3839A09

TPS3839G12

TPS3839E16

TPS3839G18

V_hys

Hysteresis voltage

TPS3839L30

TPS3839K33

TPS3839G33

TPS3839K50

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TPS3839

SBVS193B –JUNE 2012–REVISED APRIL 2013

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TIMING REQUIREMENTS

PARAMETER

MIN

TYP

200

MAX

UNIT

µs

t_d

RESET delay time (power-up delay)

120

350

t_{pd_vdd}

t_{pd_mr}

Propagation delay, V_DDfalling (power-down delay)

Propagation delay from MR low to RESET low

TIMING DIAGRAM

VDD

0.6 V

0.0 V

RESET

t_d= Reset Delay

= Undefined State

t_d

V_IT-+ V_HYS

V_IT-

0.7V_DD

0.3V_DD

Time

Figure 1. MR and V_DDReset Timing

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SBVS193B –JUNE 2012–REVISED APRIL 2013

PIN CONFIGURATIONS

TPS3831 DQN PACKAGE

1-mm × 1-mm X2SON

(TOP VIEW)

TPS3839 DQN PACKAGE

1-mm × 1-mm X2SON

(TOP VIEW)

VDD

RESET

VDD

RESET

Thermal

Pad

Thermal

Pad

GND

TPS3839 DBZ PACKAGE

SOT23-3

(TOP VIEW)

GND

VDD

RESET

PIN ASSIGNMENTS

PIN NUMBER

TPS3839DQN

NAME

TPS3839DBZ

TPS3831DQN

DESCRIPTION

GND

Ground

Manual reset. Pull this pin to a logic low to assert the RESET

output. After the MR pin is deasserted, the RESET output

deasserts after the reset delay (t_d) elapses.

N/A

No internal connection.

Active-low reset output. RESET has a push-pull output drive and is

capable of directly driving input pins. RESET is low as long as V_DD

remains below the factory threshold voltage, and until the delay

time (t_D) elapses after V_DDrises above the threshold voltage.

RESET

Thermal pad

VDD

N/A

Available

Connect to ground or floating copper plane for mechanical stability.

Supply voltage

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SBVS193B –JUNE 2012–REVISED APRIL 2013

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DEVICE INFORMATION

FUNCTIONAL BLOCK DIAGRAM

VDD

Delay

RESET

V_REF

GND

VDD

(TPS3831 Only)

Figure 2. TPS383x Block Diagram

APPLICATION CIRCUIT

3.3 V

0.1 mF

VDD

Microprocessor

RST

TPS383xK33

RESET

GND

TPS3831

Only

Figure 3. Typical Application Circuit

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SBVS193B –JUNE 2012–REVISED APRIL 2013

TYPICAL CHARACTERISTICS

At T_A= +25°C and C₁= 0.1 µF, unless otherwise noted.

200

190

180

170

160

150

140

130

120

110

100

220

V_DD= 1.2 V

V_DD= 3.3 V

V_DD= 5.0 V

V_DD= 6.5 V

TPS3839K33

210

200

190

180

−40

−15

−40

−15

Temperature (°C)

G001

G002

Figure 4. SUPPLY CURRENT vs INPUT VOLTAGE AND

TEMPERATURE

Figure 5. RESET DELAY vs TEMPERATURE

0.2

1.8

1.6

1.4

1.2

V_DD= 1.8 V

−0.2

−0.4

−0.6

T_A= −40°C

T_A= 0°C

T_A= +25°C

T_A= +85°C

−0.8

TPS3839A09

TPS3839K50

−1

−40

0.8

−15

60 85

0.5

1.5

2.5

3.5

Temperature (°C)

I_OH(mA)

G003

G004

Figure 6. PERCENTAGE CHANGE IN THRESHOLD

VOLTAGE vs TEMPERATURE

Figure 7. V_OHvs I_OHAND TEMPERATURE FOR V_DD= 1.8 V

3.5

V_DD= 3.3 V

V_DD=4.0 V

3.5

2.5

1.5

0.5

T_A= −40°C

T_A= 0°C

T_A= +25°C

T_A= +85°C

T_A= −40°C

2.5

T_A= 0°C

T_A= +25°C

T_A= +85°C

I_OH(mA)

G005

G006

Figure 8. V_OHvs I_OHAND TEMPERATURE FOR V_DD= 3.3 V

Figure 9. V_OHvs I_OHAND TEMPERATURE FOR V_DD= 4.0 V

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SBVS193B –JUNE 2012–REVISED APRIL 2013

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TYPICAL CHARACTERISTICS (continued)

At T_A= +25°C and C₁= 0.1 µF, unless otherwise noted.

1.6

1.4

1.2

T_A= −40°C

T_A= 0°C

T_A= +25°C

T_A= −40°C

T_A= 0°C

T_A= +25°C

T_A= +85°C

1.4

1.2

0.8

0.6

0.4

0.2

0.8

0.6

0.4

0.2

V_DD= 1.8 V

V_DD= 3.3 V

8 10

I_OL(mA)

G007

G008

Figure 10. V_OLvs I_OLAND TEMPERATURE FOR V_DD= 1.8 V

Figure 11. V_OLvs I_OLAND TEMPERATURE FOR V_DD= 3.3 V

1.4

T_A= −40°C

T_A= 0°C

Reset Occurs Above Line

1.2

T_A= +25°C

T_A= +85°C

0.8

0.6

0.4

0.2

V_DD= 4.0 V

I_OL(mA)

V_DDvoltage drop below V_IT−(%)

G009

G010

Figure 12. V_OLvs I_OLAND TEMPERATURE FOR V_DD= 4.0 V

Figure 13. MAXIMUM PULSE DURATION vs PERCENT OF

THRESHOLD OVERDRIVE

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SBVS193B –JUNE 2012–REVISED APRIL 2013

APPLICATION INFORMATION

VDD TRANSIENT REJECTION

The TPS383x (TPS3831 and TPS3839) has built-in rejection of fast transients on the VDD pin. Transient

rejection depends on both the duration and amplitude of the transient. Transient amplitude is measured from the

bottom of the transient to the negative threshold voltage (V_IT–) of the device, as shown in Figure 14.

V_DD

V_IT-

Transient

Amplitude

Transient

Duration

(t_W)

Figure 14. Voltage Transient Measurement

Figure 15 shows the relationship between the transient amplitude and duration required to trigger a reset. Any

combination of duration and amplitude greater than that shown in Figure 15 generates a reset signal.

Reset Occurs Above Line

V_DDvoltage drop below V_IT−(%)

G010

Figure 15. TPS3839 Transient Rejection

INPUT CAPACITOR

The TPS383x uses a unique sampling scheme to maintain an extremely low average quiescent current of 150

nA. The TPS383x typically consumes only about 100 nA of dc current. However, this current rises to

approximately 15 µA for around 200 µs while the TPS383x samples the input voltage. If the source impedance

back to the supply voltage is high, then the additional current during sampling may trigger a false reset as a

result of the apparent voltage drop at VDD. For high VDD source or trace impedance applications, it is

recommended to add a small 0.1-µF bypass capacitor near the TPS3839 VDD pin. This bypass capacitor

effectively keeps the average current at 150 nA and reduces the effects of a high-impedance voltage source.

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SBVS193B –JUNE 2012–REVISED APRIL 2013

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MANUAL RESET (MR) INPUT (TPS3831 Only)

The manual reset (MR) input allows a processor, or other logic devices, to initiate a reset (TPS3831 only). A logic

low (0.3 V_DD) on MR causes RESET to assert. After MR returns to a logic high and V_DDis greater than the

threshold voltage, RESET is deasserted after the reset delay time, t_d, elapses. Note that MR is internally tied to

VDD with a 20-kΩ resistor; therefore, this pin can be left unconnected if MR is not used. If a logic signal driving

MR does not go fully to VDD, there will be some additional current draw into VDD as a result of the internal pull-

up resistor on MR. To minimize current draw, a logic-level FET can be used, as illustrated in Figure 16.

V_DD

20 kW

TPS3831

GND

Figure 16. Using Logic-Level FET to Minimize Current Draw

BIDIRECTIONAL RESET PINS

Some microcontrollers have bidirectional reset pins that act both as an input and an output. A series resistor

should be placed between the TPS383x output and the microcontroller reset pin to protect against excessive

current flow when both the TPS383x and the microcontroller attempt to drive the reset line. Figure 17 shows the

connection of the TPS3839K33 with a microcontroller using a series resistor to drive a bidirectional reset line.

3.3 V

V_CC

VDD

Microprocessor

TPS3839K33

47 kW

RST

RESET

GND

Figure 17. Connection to Bidirectional Reset Pin

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SBVS193B –JUNE 2012–REVISED APRIL 2013

APPLICATION EXAMPLE: SINGLE ALKALINE CELL MONITORING

Low operating voltage and threshold options make the TPS383x well-suited for monitoring single-cell, alkaline-

battery applications. Figure 18 shows the TPS3839A09 used to disable a boost converter when the cell voltage

reaches 0.9 V, which is the end of the discharge voltage for a single alkaline battery cell. When the cell voltage

reaches 0.9 V, the TPS61261 enable pin is driven low. This setting disables the TPS61261 and places it in a

low-current shutdown state. The combination of the TPS3839 and TPS61261 consumes only 250 nA (typical)

from the discharged battery.

VIN

VOUT

3.3 V at 40 mA

4.7 mH

10 mF

VDD

TPS61261

TPS3839A09

One-Cell

Alkaline

RESET

GND

5 kW

GND

Figure 18. Disabled Boost Converter

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SBVS193B –JUNE 2012–REVISED APRIL 2013

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REVISION HISTORY

NOTE: Page numbers for previous revisions may differ from page numbers in the current verison.

Changes from Revision A (September 2012) to Revision B

Page

•

Changed V_DDtest conditions for high-level output voltage parameter ................................................................................. 3

Changes from Original (June 2012) to Revision A

Page

•

Changed data sheet status from product preview to production data .................................................................................. 1

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PACKAGE OPTION ADDENDUM

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21-May-2013

PACKAGING INFORMATION

Orderable Device

TPS3831A09DQNR

TPS3831A09DQNT

TPS3831E16DQNR

TPS3831E16DQNT

TPS3831G12DQNR

TPS3831G12DQNT

TPS3831G18DQNR

TPS3831G18DQNT

TPS3831G33DQNR

TPS3831G33DQNT

TPS3831K33DQNR

TPS3831K33DQNT

TPS3831K50DQNR

TPS3831K50DQNT

TPS3831L30DQNR

TPS3831L30DQNT

TPS3839A09DBZR

Status Package Type Package Pins Package

Eco Plan Lead/Ball Finish

MSL Peak Temp

Op Temp (°C)

-40 to 85

Device Marking

Samples

Drawing

Qty

(1)

(2)

(3)

(4/5)

ACTIVE

X2SON

SOT-23

DQN

3000

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

PZDI

ACTIVE

DQN

DBZ

250

3000

250

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

3000

250

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

3000

250

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

3000

250

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

3000

250

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

3000

250

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

3000

250

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

3000

Green (RoHS

& no Sb/Br)

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

21-May-2013

Orderable Device

Status Package Type Package Pins Package

Eco Plan Lead/Ball Finish

MSL Peak Temp

Op Temp (°C)

-40 to 85

Device Marking

Samples

Drawing

Qty

(1)

(2)

(3)

(4/5)

TPS3839A09DBZT

TPS3839A09DQNR

TPS3839A09DQNT

TPS3839E16DBZR

TPS3839E16DBZT

TPS3839E16DQNR

TPS3839E16DQNT

TPS3839G12DBZR

TPS3839G12DBZT

TPS3839G12DQNR

TPS3839G12DQNT

TPS3839G18DBZR

TPS3839G18DBZT

TPS3839G18DQNR

TPS3839G18DQNT

TPS3839G33DBZR

TPS3839G33DBZT

TPS3839G33DQNR

ACTIVE

SOT-23

X2SON

SOT-23

X2SON

SOT-23

X2SON

SOT-23

X2SON

SOT-23

X2SON

DBZ

250

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

PZDI

ACTIVE

DQN

DBZ

DQN

DBZ

DQN

DBZ

DQN

DBZ

DQN

3000

250

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

3000

250

Green (RoHS

& no Sb/Br)

PZCI

Green (RoHS

& no Sb/Br)

3000

250

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

3000

250

Green (RoHS

& no Sb/Br)

PZBI

Green (RoHS

& no Sb/Br)

3000

250

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

3000

250

Green (RoHS

& no Sb/Br)

PZAI

Green (RoHS

& no Sb/Br)

3000

250

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

3000

250

Green (RoHS

& no Sb/Br)

PYZI

Green (RoHS

& no Sb/Br)

3000

Green (RoHS

& no Sb/Br)

Addendum-Page 2

PACKAGE OPTION ADDENDUM

www.ti.com

21-May-2013

Orderable Device

Status Package Type Package Pins Package

Eco Plan Lead/Ball Finish

MSL Peak Temp

Op Temp (°C)

-40 to 85

Device Marking

Samples

Drawing

Qty

(1)

(2)

(3)

(4/5)

TPS3839G33DQNT

TPS3839K33DBZR

TPS3839K33DBZT

TPS3839K33DQNR

TPS3839K33DQNT

TPS3839K50DBZR

TPS3839K50DBZT

TPS3839K50DQNR

TPS3839K50DQNT

TPS3839L30DBZR

TPS3839L30DBZT

TPS3839L30DQNR

TPS3839L30DQNT

ACTIVE

X2SON

SOT-23

X2SON

SOT-23

X2SON

SOT-23

X2SON

DQN

250

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

ACTIVE

DBZ

DQN

DBZ

DQN

DBZ

DQN

3000

250

Green (RoHS

& no Sb/Br)

PYYI

Green (RoHS

& no Sb/Br)

3000

250

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

3000

250

Green (RoHS

& no Sb/Br)

PYXI

Green (RoHS

& no Sb/Br)

3000

250

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

3000

250

Green (RoHS

& no Sb/Br)

PYWI

Green (RoHS

& no Sb/Br)

3000

250

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

⁽²⁾Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Addendum-Page 3

PACKAGE OPTION ADDENDUM

www.ti.com

21-May-2013

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

⁽³⁾MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

⁽⁴⁾There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

⁽⁵⁾Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 4

PACKAGE MATERIALS INFORMATION

www.ti.com

12-Jul-2013

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package Package Pins

Type Drawing

SPQ

Reel

Pin1

Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant

(mm) W1 (mm)

TPS3831A09DQNR

TPS3831A09DQNT

TPS3831E16DQNR

TPS3831E16DQNT

TPS3831G12DQNR

TPS3831G12DQNT

TPS3831G18DQNR

TPS3831G18DQNT

TPS3831G33DQNR

TPS3831G33DQNT

TPS3831K33DQNR

TPS3831K33DQNT

TPS3831K50DQNR

TPS3831K50DQNT

TPS3831L30DQNR

TPS3831L30DQNT

TPS3839A09DBZR

TPS3839A09DBZT

X2SON

SOT-23

DQN

DBZ

3000

250

180.0

179.0

9.5

8.4

1.16

3.15

1.16

2.95

0.63

1.22

4.0

8.0

3000

250

3000

250

3000

250

3000

250

3000

250

3000

250

3000

250

3000

250

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

12-Jul-2013

Device

Package Package Pins

Type Drawing

SPQ

Reel

Pin1

Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant

(mm) W1 (mm)

TPS3839A09DQNR

TPS3839A09DQNT

TPS3839E16DBZR

TPS3839E16DBZT

TPS3839E16DQNR

TPS3839E16DQNT

TPS3839G12DBZR

TPS3839G12DBZT

TPS3839G12DQNR

TPS3839G12DQNT

TPS3839G18DBZR

TPS3839G18DBZT

TPS3839G18DQNR

TPS3839G18DQNT

TPS3839G33DBZR

TPS3839G33DBZT

TPS3839G33DQNR

TPS3839G33DQNT

TPS3839K33DBZR

TPS3839K33DBZT

TPS3839K33DQNR

TPS3839K33DQNT

TPS3839K50DBZR

TPS3839K50DBZT

TPS3839K50DQNR

TPS3839K50DQNT

TPS3839L30DBZR

TPS3839L30DBZT

TPS3839L30DQNR

TPS3839L30DQNT

X2SON

SOT-23

X2SON

SOT-23

X2SON

SOT-23

X2SON

SOT-23

X2SON

SOT-23

X2SON

SOT-23

X2SON

SOT-23

X2SON

DQN

DBZ

DQN

DBZ

DQN

DBZ

DQN

DBZ

DQN

DBZ

DQN

DBZ

DQN

DBZ

DQN

3000

250

180.0

179.0

180.0

179.0

180.0

179.0

180.0

179.0

180.0

179.0

180.0

179.0

180.0

179.0

180.0

9.5

8.4

9.5

8.4

9.5

8.4

9.5

8.4

9.5

8.4

9.5

8.4

9.5

8.4

9.5

1.16

3.15

1.16

3.15

1.16

3.15

1.16

3.15

1.16

3.15

1.16

3.15

1.16

3.15

1.16

2.95

1.16

2.95

1.16

2.95

1.16

2.95

1.16

2.95

1.16

2.95

1.16

2.95

1.16

0.63

1.22

0.63

1.22

0.63

1.22

0.63

1.22

0.63

1.22

0.63

1.22

0.63

1.22

0.63

4.0

8.0

3000

250

3000

250

3000

250

3000

250

3000

250

3000

250

3000

250

3000

250

3000

250

3000

250

3000

250

3000

250

3000

250

3000

250

Pack Materials-Page 2

PACKAGE MATERIALS INFORMATION

www.ti.com

12-Jul-2013

*All dimensions are nominal

Device

Package Type Package Drawing Pins

SPQ

Length (mm) Width (mm) Height (mm)

TPS3831A09DQNR

TPS3831A09DQNT

TPS3831E16DQNR

TPS3831E16DQNT

TPS3831G12DQNR

TPS3831G12DQNT

TPS3831G18DQNR

TPS3831G18DQNT

TPS3831G33DQNR

TPS3831G33DQNT

TPS3831K33DQNR

TPS3831K33DQNT

TPS3831K50DQNR

TPS3831K50DQNT

TPS3831L30DQNR

TPS3831L30DQNT

TPS3839A09DBZR

TPS3839A09DBZT

TPS3839A09DQNR

TPS3839A09DQNT

X2SON

SOT-23

X2SON

DQN

DBZ

3000

250

180.0

203.0

180.0

203.0

180.0

30.0

35.0

30.0

3000

250

3000

250

3000

250

3000

250

3000

250

3000

250

3000

250

3000

250

DBZ

DQN

3000

250

Pack Materials-Page 3

PACKAGE MATERIALS INFORMATION

www.ti.com

12-Jul-2013

Device

Package Type Package Drawing Pins

SPQ

Length (mm) Width (mm) Height (mm)

TPS3839E16DBZR

TPS3839E16DBZT

TPS3839E16DQNR

TPS3839E16DQNT

TPS3839G12DBZR

TPS3839G12DBZT

TPS3839G12DQNR

TPS3839G12DQNT

TPS3839G18DBZR

TPS3839G18DBZT

TPS3839G18DQNR

TPS3839G18DQNT

TPS3839G33DBZR

TPS3839G33DBZT

TPS3839G33DQNR

TPS3839G33DQNT

TPS3839K33DBZR

TPS3839K33DBZT

TPS3839K33DQNR

TPS3839K33DQNT

TPS3839K50DBZR

TPS3839K50DBZT

TPS3839K50DQNR

TPS3839K50DQNT

TPS3839L30DBZR

TPS3839L30DBZT

TPS3839L30DQNR

TPS3839L30DQNT

SOT-23

X2SON

SOT-23

X2SON

SOT-23

X2SON

SOT-23

X2SON

SOT-23

X2SON

SOT-23

X2SON

SOT-23

X2SON

DBZ

DQN

DBZ

DQN

DBZ

DQN

DBZ

DQN

DBZ

DQN

DBZ

DQN

DBZ

DQN

3000

250

203.0

180.0

203.0

180.0

203.0

180.0

203.0

180.0

203.0

180.0

203.0

180.0

203.0

180.0

203.0

180.0

203.0

180.0

203.0

180.0

203.0

180.0

203.0

180.0

203.0

180.0

203.0

180.0

35.0

30.0

35.0

30.0

35.0

30.0

35.0

30.0

35.0

30.0

35.0

30.0

35.0

30.0

3000

250

3000

250

3000

250

3000

250

3000

250

3000

250

3000

250

3000

250

3000

250

3000

250

3000

250

3000

250

3000

250

Pack Materials-Page 4

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other

changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest

issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and

complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale

supplied at the time of order acknowledgment.

TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms

and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary

to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily

performed.

TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and

applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide

adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or

other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information

published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or

endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the

third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration

and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered

documentation. Information of third parties may be subject to additional restrictions.

Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service

voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.

TI is not responsible or liable for any such statements.

Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements

concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support

that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which

anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause

harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use

of any TI components in safety-critical applications.

In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to

help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and

requirements. Nonetheless, such components are subject to these terms.

No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties

have executed a special agreement specifically governing such use.

Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in

military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components

which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and

regulatory requirements in connection with such use.

TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of

non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.

Products

Applications

Audio

www.ti.com/audio

amplifier.ti.com

dataconverter.ti.com

www.dlp.com

Automotive and Transportation www.ti.com/automotive

Communications and Telecom www.ti.com/communications

Amplifiers

Data Converters

DLP® Products

DSP

Computers and Peripherals

Consumer Electronics

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www.ti.com/computers

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www.ti.com/clocks

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OMAP Applications Processors

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TI E2E Community

e2e.ti.com

www.ti.com/wirelessconnectivity

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

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TPS3839E16DBZR产品参数

型号:	TPS3839E16DBZR
Brand Name：	Texas Instruments
是否无铅：	不含铅
是否Rohs认证：	符合
生命周期：	Active
包装说明：	TSSOP, TO-236
Reach Compliance Code：	compliant
ECCN代码：	EAR99
HTS代码：	8542.39.00.01
风险等级：	1.62
Is Samacsys：	N
其他特性：	RESET THRESHOLD VOLTAGE IS 1.52V
可调阈值：	NO
模拟集成电路 - 其他类型：	POWER SUPPLY SUPPORT CIRCUIT
JESD-30 代码：	R-PDSO-G3
JESD-609代码：	e4
长度：	2.92 mm
湿度敏感等级：	1
信道数量：	1
功能数量：	1
端子数量：	3
最高工作温度：	85 °C
最低工作温度：	-40 °C
封装主体材料：	PLASTIC/EPOXY
封装代码：	TSSOP
封装等效代码：	TO-236
封装形状：	RECTANGULAR
封装形式：	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度（摄氏度）：	260
电源：	1.2/6 V
认证状态：	Not Qualified
座面最大高度：	1.22 mm
子类别：	Power Management Circuits
最大供电电流 (Isup)：	0.0005 mA
最大供电电压 (Vsup)：	6.5 V
最小供电电压 (Vsup)：	0.9 V
表面贴装：	YES
温度等级：	INDUSTRIAL
端子面层：	Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式：	GULL WING
端子节距：	0.96 mm
端子位置：	DUAL
阈值电压标称：	+1.52V
处于峰值回流温度下的最长时间：	NOT SPECIFIED
宽度：	1.3 mm
Base Number Matches：	1

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