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  • 北京元坤伟业科技有限公司

         该会员已使用本站17年以上

  • TPS53513RVER
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  • 010-62104931、62106431、62104891、62104791 QQ:857273081QQ:1594462451
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  • TPS53513RVER图
  • 深圳市特拉特科技有限公司

     该会员已使用本站2年以上
  • TPS53513RVER 三甲现货
  • 数量15000 
  • 厂家TI 
  • 封装VQFN28 
  • 批号22+ 
  • 原厂指定分销商,有意请来电或QQ洽谈
  • QQ:709809857QQ:709809857 复制
  • 0755-82531732 QQ:709809857
  • TPS53513RVER图
  • 深圳市恒达亿科技有限公司

     该会员已使用本站12年以上
  • TPS53513RVER 现货库存
  • 数量5000 
  • 厂家TI 
  • 封装VQFN28 
  • 批号23+ 
  • 全新原装,欢迎查询
  • QQ:867789136QQ:867789136 复制
    QQ:1245773710QQ:1245773710 复制
  • 0755-82772189 QQ:867789136QQ:1245773710
  • TPS53513RVER图
  • 深圳市恒达亿科技有限公司

     该会员已使用本站16年以上
  • TPS53513RVER 现货库存
  • 数量8503 
  • 厂家TI 
  • 封装VQFN-28 
  • 批号24+ 
  • 只做原装正品现货销售
  • QQ:867789136QQ:867789136 复制
    QQ:1245773710QQ:1245773710 复制
  • 0755-82723761 QQ:867789136QQ:1245773710
  • TPS53513RVER图
  • 深圳市能元时代电子有限公司

     该会员已使用本站10年以上
  • TPS53513RVER 现货库存
  • 数量92000 
  • 厂家TI/德州仪器 
  • 封装VQFN28 
  • 批号24+ 
  • 原装现货假一罚十!可含税长期供货
  • QQ:2885637848QQ:2885637848 复制
    QQ:2885658492QQ:2885658492 复制
  • 0755-84502810 QQ:2885637848QQ:2885658492
  • TPS53513RVER图
  • 集好芯城

     该会员已使用本站13年以上
  • TPS53513RVER 现货库存
  • 数量23865 
  • 厂家TI(德州仪器) 
  • 封装 
  • 批号22+ 
  • 原装原厂现货
  • QQ:3008092965QQ:3008092965 复制
    QQ:3008092965QQ:3008092965 复制
  • 0755-83239307 QQ:3008092965QQ:3008092965
  • TPS53513RVER图
  • 深圳市拓亿芯电子有限公司

     该会员已使用本站12年以上
  • TPS53513RVER 现货库存
  • 数量12000 
  • 厂家TI/德州仪器 
  • 封装VQFN28 
  • 批号23+ 
  • 现货保证原装假一罚十
  • QQ:2103443489QQ:2103443489 复制
    QQ:2924695115QQ:2924695115 复制
  • 0755-82702619 QQ:2103443489QQ:2924695115
  • TPS53513RVER图
  • 深圳市拓亿芯电子有限公司

     该会员已使用本站12年以上
  • TPS53513RVER 现货库存
  • 数量21000 
  • 厂家TI/德州仪器 
  • 封装VQFN28 
  • 批号23+ 
  • 代理原装现货,价格优势
  • QQ:1774550803QQ:1774550803 复制
    QQ:2924695115QQ:2924695115 复制
  • 0755-82777855 QQ:1774550803QQ:2924695115
  • TPS53513RVER图
  • 深圳市昌和盛利电子有限公司

     该会员已使用本站11年以上
  • TPS53513RVER 现货库存
  • 数量18000 
  • 厂家TI【原装正品】 
  • 封装VQFN28 
  • 批号▊ NEW ▊ 
  • ▊▊★代理TI全系列销售【100%全新原装正品】★长期供应,量大可订,价格优惠!
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    QQ:3059638860QQ:3059638860 复制
  • 0755-23125986 QQ:1551106297QQ:3059638860
  • TPS53513RVER图
  • 深圳市恒意法科技有限公司

     该会员已使用本站17年以上
  • TPS53513RVER 现货库存
  • 数量21000 
  • 厂家TI/德州仪器 
  • 封装VQFN28 
  • 批号21+ 
  • 专营原装正品现货,当天发货,可开发票!
  • QQ:2881514372QQ:2881514372 复制
  • 0755-83247729 QQ:2881514372
  • TPS53513RVER图
  • 深圳市英德州科技有限公司

     该会员已使用本站2年以上
  • TPS53513RVER 现货库存
  • 数量32500 
  • 厂家TI(德州仪器) 
  • 封装VQFN-28 
  • 批号1年内 
  • 全新原装 货源稳定 长期供应 提供配单
  • QQ:2355734291QQ:2355734291 复制
  • -0755-88604592 QQ:2355734291
  • TPS53513RVER图
  • 深圳市欧昇科技有限公司

     该会员已使用本站10年以上
  • TPS53513RVER 现货库存
  • 数量9000 
  • 厂家TI 
  • 封装VQFN28 
  • 批号2021+ 
  • 一定原装柜台现货
  • QQ:2885514621QQ:2885514621 复制
    QQ:1017582752QQ:1017582752 复制
  • 0755-83237676 QQ:2885514621QQ:1017582752
  • TPS53513RVER图
  • 深圳市宗天技术开发有限公司

     该会员已使用本站10年以上
  • TPS53513RVER 现货库存
  • 数量23100 
  • 厂家TI 
  • 封装N/A 
  • 批号21+ 
  • 全新原装有现货库存--价格有优势
  • QQ:444961496QQ:444961496 复制
    QQ:2824256784QQ:2824256784 复制
  • 0755-88601327 QQ:444961496QQ:2824256784
  • TPS53513RVER图
  • 深圳市华来深电子有限公司

     该会员已使用本站13年以上
  • TPS53513RVER 现货库存
  • 数量2500 
  • 厂家TI 
  • 封装QFN-28 
  • 批号22+ 
  • 进口原装现货假一罚百
  • QQ:1258645397QQ:1258645397 复制
    QQ:876098337QQ:876098337 复制
  • 0755-83238902 QQ:1258645397QQ:876098337
  • TPS53513RVER图
  • 深圳市嘉胜威科技有限公司

     该会员已使用本站7年以上
  • TPS53513RVER 现货库存
  • 数量26985 
  • 厂家TI 
  • 封装QFN28 
  • 批号22+ 
  • 专注品牌推广原盒原装进口现货
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  • 0755-82736771 QQ:611095588
  • TPS53513RVER图
  • 深圳市特拉特科技有限公司

     该会员已使用本站2年以上
  • TPS53513RVER 现货库存
  • 数量15000 
  • 厂家TI 
  • 封装VQFN28 
  • 批号22+ 
  • 原厂指定分销商,有意请来电或QQ洽谈
  • QQ:709809857QQ:709809857 复制
  • 0755-82531732 QQ:709809857
  • TPS53513RVER图
  • 深圳市芯脉实业有限公司

     该会员已使用本站11年以上
  • TPS53513RVER 现货库存
  • 数量3000 
  • 厂家TI 
  • 封装VQFN-CLIP (RVE) 
  • 批号新批次 
  • 新到现货、一手货源、当天发货、bom配单
  • QQ:2881512844QQ:2881512844 复制
  • 075584507705 QQ:2881512844
  • TPS53513RVER图
  • 深圳市炎凯科技有限公司

     该会员已使用本站7年以上
  • TPS53513RVER 现货库存
  • 数量9827 
  • 厂家TI 
  • 封装VQFN28 
  • 批号24+ 
  • 全新原装,特价,假一罚十
  • QQ:354696650QQ:354696650 复制
    QQ:2850471056QQ:2850471056 复制
  • 0755-89587732 QQ:354696650QQ:2850471056
  • TPS53513RVER图
  • 深圳市想亚微电子有限公司

     该会员已使用本站14年以上
  • TPS53513RVER 现货库存
  • 数量20000 
  • 厂家TI德州仪器 
  • 封装VQFN28 
  • 批号22+ 
  • 原厂货源/正品保证/专注品牌/诚信经营/至尊服务
  • QQ:1272309311QQ:1272309311 复制
    QQ:756385723QQ:756385723 复制
  • 13714575141 QQ:1272309311QQ:756385723
  • TPS53513RVER图
  • 深圳市宗天技术开发有限公司

     该会员已使用本站10年以上
  • TPS53513RVER 现货热卖
  • 数量30000 
  • 厂家TI 
  • 封装QFN28 
  • 批号21+ 
  • 宗天技术 原装现货/假一赔十
  • QQ:444961496QQ:444961496 复制
    QQ:2824256784QQ:2824256784 复制
  • 0755-88601327 QQ:444961496QQ:2824256784
  • TPS53513RVER图
  • 深圳市欧昇科技有限公司

     该会员已使用本站2年以上
  • TPS53513RVER 现货热卖
  • 数量3000 
  • 厂家TI 
  • 封装28-VFQFN 
  • 批号22+ 
  • 支持终端,略低市场价,紧缺物料需分货
  • QQ:2885528234QQ:2885528234 复制
  • -0755-83220848 QQ:2885528234
  • TPS53513RVER图
  • 深圳市富莱微科技有限公司

     该会员已使用本站6年以上
  • TPS53513RVER 热卖库存
  • 数量15000 
  • 厂家TI 
  • 封装N/A 
  • 批号22+ 
  • 只做原装,现货库存,价格优势
  • QQ:1968343307QQ:1968343307 复制
    QQ:2885835292QQ:2885835292 复制
  • 0755-83210149 QQ:1968343307QQ:2885835292
  • TPS53513RVER图
  • 深圳市拓森弘电子有限公司

     该会员已使用本站1年以上
  • TPS53513RVER
  • 数量5000 
  • 厂家TI/德州仪器 
  • 封装VQFN28 
  • 批号21+ 
  • 原厂原包装,库存现货实报
  • QQ:1300774727QQ:1300774727 复制
  • 13714410484 QQ:1300774727
  • TPS53513RVER图
  • 深圳市恒益昌科技有限公司

     该会员已使用本站6年以上
  • TPS53513RVER
  • 数量5000 
  • 厂家TI 
  • 封装VQFN28 
  • 批号23+ 
  • 原装正品长期供货
  • QQ:3336148967QQ:3336148967 复制
    QQ:974337758QQ:974337758 复制
  • 0755-82723761 QQ:3336148967QQ:974337758
  • TPS53513RVER图
  • 深圳市羿芯诚电子有限公司

     该会员已使用本站7年以上
  • TPS53513RVER
  • 数量65 
  • 厂家TI/德州仪器 
  • 封装VQFN28 
  • 批号21+ 
  • 羿芯诚只做原装 原厂渠道 价格优势
  • QQ:2881498351QQ:2881498351 复制
  • 0755-22968581 QQ:2881498351
  • TPS53513RVER图
  • 深圳市美思瑞电子科技有限公司

     该会员已使用本站12年以上
  • TPS53513RVER
  • 数量12245 
  • 厂家TI/德州仪器 
  • 封装QFN 
  • 批号22+ 
  • 现货,原厂原装假一罚十!
  • QQ:2885659458QQ:2885659458 复制
    QQ:2885657384QQ:2885657384 复制
  • 0755-83952260 QQ:2885659458QQ:2885657384
  • TPS53513RVER图
  • 深圳市能元时代电子有限公司

     该会员已使用本站10年以上
  • TPS53513RVER
  • 数量50000 
  • 厂家TI 
  • 封装VQFN28 
  • 批号24+ 
  • 公司原装现货可含税!假一罚十!
  • QQ:2885637848QQ:2885637848 复制
    QQ:2885658492QQ:2885658492 复制
  • 0755-84502810 QQ:2885637848QQ:2885658492
  • TPS53513RVER图
  • 深圳市羿芯诚电子有限公司

     该会员已使用本站7年以上
  • TPS53513RVER
  • 数量8500 
  • 厂家TI(德州仪器) 
  • 封装原厂封装 
  • 批号新年份 
  • 羿芯诚只做原装长期供,支持实单
  • QQ:2880123150QQ:2880123150 复制
  • 0755-82570600 QQ:2880123150
  • TPS53513RVER图
  • 深圳市和诚半导体有限公司

     该会员已使用本站11年以上
  • TPS53513RVER
  • 数量5600 
  • 厂家TI 
  • 封装QFN28 
  • 批号23+ 
  • 只做原装正品,深圳现货
  • QQ:2276916927QQ:2276916927 复制
    QQ:1977615742QQ:1977615742 复制
  • 18929336553 QQ:2276916927QQ:1977615742
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  • 深圳市得捷芯城科技有限公司

     该会员已使用本站11年以上
  • TPS53513RVER
  • 数量3286 
  • 厂家TI/德州仪器 
  • 封装NA/ 
  • 批号23+ 
  • 原装现货,当天可交货,原型号开票
  • QQ:3007977934QQ:3007977934 复制
    QQ:3007947087QQ:3007947087 复制
  • 0755-82546830 QQ:3007977934QQ:3007947087
  • TPS53513RVER图
  • 深圳市晶美隆科技有限公司

     该会员已使用本站15年以上
  • TPS53513RVER
  • 数量28000 
  • 厂家TI/德州仪器 
  • 封装VQFN28 
  • 批号24+ 
  • 假一罚十,原装进口正品现货供应,价格优势。
  • QQ:198857245QQ:198857245 复制
  • 0755-82865294 QQ:198857245
  • TPS53513RVER图
  • 千层芯半导体(深圳)有限公司

     该会员已使用本站9年以上
  • TPS53513RVER
  • 数量85450 
  • 厂家TI 
  • 封装SMD 
  • 批号2018+ 
  • TI一级代理商原装进口现货
  • QQ:2685694974QQ:2685694974 复制
    QQ:2593109009QQ:2593109009 复制
  • 0755-83978748,0755-23611964,13760152475 QQ:2685694974QQ:2593109009
  • TPS53513RVER图
  • 集好芯城

     该会员已使用本站13年以上
  • TPS53513RVER
  • 数量19302 
  • 厂家TI/德州仪器 
  • 封装VQFN28 
  • 批号最新批次 
  • 原装原厂 现货现卖
  • QQ:3008092965QQ:3008092965 复制
    QQ:3008092965QQ:3008092965 复制
  • 0755-83239307 QQ:3008092965QQ:3008092965
  • TPS53513RVER图
  • 深圳市晶美隆科技有限公司

     该会员已使用本站14年以上
  • TPS53513RVER
  • 数量11631 
  • 厂家TI/德州仪器 
  • 封装VQFN28 
  • 批号23+ 
  • 全新原装正品现货热卖
  • QQ:2885348339QQ:2885348339 复制
    QQ:2885348317QQ:2885348317 复制
  • 0755-82519391 QQ:2885348339QQ:2885348317
  • TPS53513RVER图
  • 深圳市雅维特电子有限公司

     该会员已使用本站15年以上
  • TPS53513RVER
  • 数量6000 
  • 厂家原厂原装 
  • 封装SMD 
  • 批号23+ 
  • 原装现货!
  • QQ:767621813QQ:767621813 复制
    QQ:1152937841QQ:1152937841 复制
  • 0755-83975781 QQ:767621813QQ:1152937841
  • TPS53513RVER VQFN28图
  • 首天国际(深圳)科技有限公司

     该会员已使用本站16年以上
  • TPS53513RVER VQFN28
  • 数量638850 
  • 厂家TI 
  • 封装VQFN28 
  • 批号2024+ 
  • 百分百原装正品,现货库存
  • QQ:528164397QQ:528164397 复制
    QQ:1318502189QQ:1318502189 复制
  • 0755-82807802 QQ:528164397QQ:1318502189
  • TPS53513RVER图
  • 深圳市拓亿芯电子有限公司

     该会员已使用本站12年以上
  • TPS53513RVER
  • 数量30000 
  • 厂家TI/德州仪器 
  • 封装VQFN28 
  • 批号23+ 
  • 只做原装现货假一罚十
  • QQ:2103443489QQ:2103443489 复制
    QQ:2924695115QQ:2924695115 复制
  • 0755-82702619 QQ:2103443489QQ:2924695115
  • TPS53513RVER图
  • 深圳市得捷芯城科技有限公司

     该会员已使用本站11年以上
  • TPS53513RVER
  • 数量16048 
  • 厂家TI(德州仪器) 
  • 封装VQFN28 
  • 批号23+ 
  • 原厂可订货,技术支持,直接渠道。可签保供合同
  • QQ:3007947087QQ:3007947087 复制
    QQ:3007947087QQ:3007947087 复制
  • 0755-83061789 QQ:3007947087QQ:3007947087
  • TPS53513RVER图
  • 深圳市拓亿芯电子有限公司

     该会员已使用本站12年以上
  • TPS53513RVER
  • 数量12500 
  • 厂家TI/德州仪器 
  • 封装QFN 
  • 批号23+ 
  • 全新原装现货,假一赔十
  • QQ:1774550803QQ:1774550803 复制
    QQ:2924695115QQ:2924695115 复制
  • 0755-82777855 QQ:1774550803QQ:2924695115

产品型号TPS53513RVER的概述

TPS53513RVER芯片综述 TPS53513RVER 是Texas Instruments(德州仪器)推出的一款高性能同步 DC-DC 降压转换器,广泛应用于各种电子设备中,如计算机、通信设备、工业自动化装置和其他需要高效电源解决方案的产品。此芯片以其高效率、灵活性以及强大的控制特性而受到工程师的青睐。 背景 随着电子技术的迅猛发展,电源管理领域也在不断演变。传统的线性稳压器在能效和热管理方面受到限制,而开关稳压器则能够提供更高的转换效率和输出功率。TPS53513RVER 被设计为高效的降压型开关电源管理器,其专门针对高性能计算和复杂的负载变化进行优化。 详细参数 TPS53513RVER 提供了多项技术参数,使其能够在高负载条件下稳定运行。以下是其主要参数: - 输入电压范围:4.5V 至 17V - 输出电压调节范围:0.762V 至 5V - 最大输出电流:up to ...

产品型号TPS53513RVER的Datasheet PDF文件预览

TPS53513  
www.ti.com  
SLUSBP9A SEPTEMBER 2013REVISED DECEMBER 2013  
1.5 to 18 V (4.5 to 25 V bias) Input, 8-A Single Synchronous Step-Down SWIFT™  
Converter  
1
FEATURES  
APPLICATIONS  
2
Integrated 13.8 and 5.9 mΩ MOSFETs With 8-A  
Continuous Output Current  
Server and Cloud-Computing POLs  
Broadband, Networking, and Optical  
Communications Infrastructure  
Supports All Ceramic Output Capacitors  
Reference Voltage 600 mV ±0.5% Tolerance  
Output Voltage Range: 0.6 V to 5.5 V  
I/O Supplies  
Supported at the WEBENCH™ Design Center  
D-CAP3™ Control Mode With Fast Load-Step  
Response  
DESCRIPTION  
The TPS53513 is a small-sized, synchronous buck  
converter with an adaptive on-time D-CAP3 control  
mode. The device offers ease-of-use and low  
external-component count for space-conscious power  
systems.  
Auto-Skipping Eco-mode™ for High Light-  
Load Efficiency  
FCCM for Tight Output Ripple and Voltage  
Requirements  
Eight Selectable Frequency Settings from  
200 kHz to 1 MHz  
This device features high-performance integrated  
MOSFETs, accurate 0.5% 0.6-V reference, and an  
integrated boost switch. Competitive features include  
very-low external-component count, fast load-  
transient response, auto-skip mode operation,  
internal soft-start control, and no requirement for  
compensation  
Pre-Charged Startup Capability  
Built-in Output Discharge Circuit  
Open-Drain Power-Good Output  
3.5-mm × 4.5-mm, 28-Pin, QFN Package  
A forced continuous conduction mode helps meet  
tight voltage regulation accuracy requirements for  
performance DSPs and FPGAs. The TPS53513 is  
available in a 28-pin QFN package and is specified  
from –40°C to 85°C ambient temperature.  
PGOOD  
VIN  
23  
22 21 20  
19  
TPS53513  
5
18  
17  
16  
15  
24 VO  
.
.
PGND 14  
PGND 13  
PGND 12  
PGND 11  
PGND 10  
25 TRIP  
26 DNC  
27 GND1  
28 GND2  
EFFICIENCY  
100  
1
2
3
4
6
7
8
9
VOUT  
90  
80  
EN  
Thermal  
Pad  
VREG  
fSW = 500 KHz, VIN = 12 V, VDD = 5 V  
TA = 25°C, L OUT = 1 H, Mode = Auto-skip  
70  
60  
VOUT = 0.6 V  
VOUT = 1 V  
VOUT= 1.5 V  
V= 1.2 V  
OUT  
V
OUT  
= 1.8 V  
V
= 2.5 V  
OUT  
V
= 3.3 V  
V
= 5 V  
OUT
OUT  
0
2
4
6
8
10  
12  
Output Current (A)  
C003  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
SWIFT, D-CAP3, Eco-mode, WEBENCH are trademarks of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2013, Texas Instruments Incorporated  
 
 
 
 
TPS53513  
SLUSBP9A SEPTEMBER 2013REVISED DECEMBER 2013  
www.ti.com  
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with  
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.  
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more  
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.  
ABSOLUTE MAXIMUM RATINGS  
over operating free-air temperature range (unless otherwise noted)(1)  
VALUE  
MIN  
UNIT  
MAX  
7.7  
30  
32  
36  
6
EN  
–0.3  
–3  
DC  
SW  
Transient < 10 ns  
–5  
VBST  
–0.3  
–0.3  
Input voltage range(2)  
VBST(3)  
V
V
VBST when transient < 10 ns  
VDD  
38  
28  
30  
6
–0.3  
–0.3  
–0.3  
–0.3  
–0.3  
–40  
VIN  
VO, FB, MODE, RF  
PGOOD  
7.7  
6
Output voltage range  
Temperature  
VREG, TRIP  
Junction, TJ  
Storage, Tstg  
150  
150  
°C  
°C  
–55  
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings  
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating  
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods my affect device reliability.  
(2) All voltages are with respect to network ground terminal.  
(3) Voltage values are with respect to the SW terminal.  
THERMAL INFORMATION  
TPS53513  
THERMAL METRIC(1)  
RVE  
28 PINS  
37.5  
UNITS  
θJA  
Junction-to-ambient thermal resistance(2)  
Junction-to-case (top) thermal resistance(3)  
Junction-to-board thermal resistance(4)  
Junction-to-top characterization parameter(5)  
Junction-to-board characterization parameter(6)  
Junction-to-case (bottom) thermal resistance(7)  
θJCtop  
θJB  
34.1  
18.1  
°C/W  
ψJT  
1.8  
ψJB  
18.1  
θJCbot  
2.2  
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.  
(2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as  
specified in JESD51-7, in an environment described in JESD51-2a.  
(3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-  
standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.  
(4) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB  
temperature, as described in JESD51-8.  
(5) The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted  
from the simulation data for obtaining θJA, using a procedure described in JESD51-2a (sections 6 and 7).  
(6) The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted  
from the simulation data for obtaining θJA , using a procedure described in JESD51-2a (sections 6 and 7).  
(7) The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific  
JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.  
Spacer  
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TPS53513  
www.ti.com  
SLUSBP9A SEPTEMBER 2013REVISED DECEMBER 2013  
RECOMMENDED OPERATING CONDITIONS  
over operating free-air temperature range (unless otherwise noted)  
MIN  
–0.1  
–3  
MAX  
7
UNIT  
EN  
SW  
27  
28  
5.5  
25  
18  
5.5  
7
VBST  
VBST(1)  
–0.1  
–0.1  
4.5  
Input voltage range  
V
VDD  
VIN  
1.5  
VO, FB, MODE, RF  
PGOOD  
–0.1  
–0.1  
–0.1  
–40  
Output voltage range  
TA  
V
VREG, TRIP  
5.5  
85  
Operating free-air temperature  
°C  
(1) Voltage values are with respect to the SW pin.  
ELECTRICAL CHARACTERISTICS  
over operating free-air temperature range, VREG = 5 V, EN = 5 V (unless otherwise noted)  
PARAMETER  
SUPPLY CURRENT  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
TA = 25°C, No load  
Power conversion enabled (no switching)  
IVDD  
VDD bias current  
1350  
850  
1850  
µA  
TA = 25°C, No load  
Power conversion disabled  
IVDDSTBY  
IVIN(leak)  
VDD standby current  
VIN leakage current  
1150  
0.5  
µA  
µA  
VEN = 0 V  
VREF OUTPUT  
VVREF  
Reference voltage  
FB w/r/t GND, TA = 25°C  
597  
–0.6%  
–0.7%  
600  
603  
0.5%  
0.5%  
mV  
FB w/r/t GND, TJ = 0°C to 85°C  
FB w/r/t GND, TJ = –40°C to 85°C  
VVREFTOL Reference voltage tolerance  
OUTPUT VOLTAGE  
IFB  
FB input current  
VFB = 600 mV  
50  
12  
100  
15  
nA  
IVODIS  
VO discharge current  
VVO = 0.5 V, Power Conversion Disabled  
10  
mA  
SMPS FREQUENCY  
VIN = 12 V, VVO = 3.3 V, RDR < 0.041  
VIN = 12 V, VVO = 3.3 V, RDR = 0.096  
VIN = 12 V, VVO = 3.3 V, RDR = 0.16  
VIN = 12 V, VVO = 3.3 V, RDR = 0.229  
VIN = 12 V, VVO = 3.3 V, RDR = 0.297  
VIN = 12 V, VVO = 3.3 V, RDR = 0.375  
VIN = 12 V, VVO = 3.3 V, RDR = 0.461  
VIN = 12 V, VVO = 3.3 V, RDR > 0.557  
TA = 25°C(2)  
250  
300  
400  
500  
600  
750  
850  
1000  
60  
fSW  
VO switching frequency(1)  
kHz  
tON(min)  
Minimum on-time  
Minimum off-time  
ns  
ns  
tOFF(min)  
TA = 25°C  
175  
240  
310  
INTERNAL BOOTSTRAP SW  
VF  
Forward Voltage  
VVREG–VBST, TA = 25°C, IF = 10 mA  
TA = 25°C, VVBST = 33 V, VSW = 28 V  
0.15  
0.01  
0.25  
1.5  
V
IVBST  
VBST leakage current  
µA  
(1) Resistor divider ratio (RDR) is described in Equation 1.  
(2) Specified by design. Not production tested.  
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TPS53513  
SLUSBP9A SEPTEMBER 2013REVISED DECEMBER 2013  
www.ti.com  
ELECTRICAL CHARACTERISTICS (continued)  
over operating free-air temperature range, VREG = 5 V, EN = 5 V (unless otherwise noted)  
PARAMETER  
LOGIC THRESHOLD  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
VENH  
EN enable threshold voltage  
EN disable threshold voltage  
EN hysteresis voltage  
1.3  
1.1  
1.4  
1.2  
0.22  
0
1.5  
1.3  
V
V
VENL  
VENHYST  
VENLEAK  
V
EN input leakage current  
–1  
1
µA  
SOFT START  
tSS  
Soft-start time  
1
ms  
PGOOD COMPARATOR  
PGOOD in from higher  
104%  
89%  
113%  
80%  
4
108%  
92%  
116%  
84%  
6
111%  
96%  
PGOOD in from lower  
PGOOD out to higher  
PGOOD out to lower  
VPGOOD = 0.5 V  
VPGTH  
VDDQ PGOOD threshold  
120%  
87%  
IPG  
PGOOD sink current  
PGOOD delay time  
mA  
ms  
µs  
Delay for PGOOD going in  
Delay for PGOOD coming out  
VPGOOD = 5 V  
0.8  
1.0  
2
1.2  
1
tPGDLY  
IPGLK  
PGOOD leakage current  
–1  
0
µA  
CURRENT DETECTION  
RTRIP TRIP pin resistance range  
20  
6.2  
50  
9.8  
kΩ  
RTRIP = 34.8 kΩ  
RTRIP = 25.5 kΩ  
RTRIP = 34.8 kΩ  
RTRIP = 25.5 kΩ  
8.0  
6.2  
IOCL  
Current limit threshold, valley  
A
4.2  
8.2  
–10.5  
–8.7  
–7.9  
–6.1  
0
–5.3  
–3.5  
Negative current limit threshold,  
valley  
IOCLN  
VZC  
A
Zero cross detection offset  
mV  
PROTECTIONS  
Wake-up  
3.25  
3.00  
3.34  
3.12  
3.41  
3.19  
VREG undervoltage-lockout  
(UVLO) threshold voltage  
VVREGUVLO  
V
V
Shutdown  
Wake-up (default)  
Shutdown  
4.15  
4.25  
4.35  
VVDDUVLO VDD UVLO threshold voltage  
3.95  
4.05  
4.15  
VOVP  
Overvoltage-protection (OVP)  
threshold voltage  
OVP detect voltage  
116%  
120%  
124%  
tOVPDLY  
VUVP  
OVP propagation delay  
With 100-mV overdrive  
UVP detect voltage  
300  
ns  
Undervoltage-protection (UVP)  
threshold voltage  
64%  
68%  
71%  
tUVPDLY  
UVP delay  
UVP filter delay  
1
ms  
°C  
THERMAL SHUTDOWN  
Shutdown temperature  
Hysteresis  
140  
40  
TSDN  
Thermal shutdown threshold(3)  
LDO VOLTAGE  
VREG  
LDO output voltage  
VIN = 12 V, ILOAD = 10 mA  
VIN = 4.5 V, ILOAD = 30 mA, TA = 25°C  
VIN = 12 V, TA = 25°C  
4.65  
170  
5
5.45  
365  
V
VDOVREG  
ILDOMAX  
LDO low droop drop-out voltage  
LDO over-current limit  
mV  
mA  
200  
INTERNAL MOSFETS  
RDS(on)H High-side MOSFET on-resistance  
RDS(on)L Low-side MOSFET on-resistance  
TA = 25°C  
TA = 25°C  
13.8  
5.9  
15.5  
7.0  
mΩ  
mΩ  
(3) Specified by design. Not production tested.  
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TPS53513  
www.ti.com  
SLUSBP9A SEPTEMBER 2013REVISED DECEMBER 2013  
DEVICE INFORMATION  
RVE PACKAGE  
28-PIN  
(TOP VIEW)  
28  
27  
26  
25  
24  
1
2
3
4
5
6
7
8
9
23  
22  
21  
20  
19  
18  
17  
16  
15  
RF  
PGOOD  
EN  
FB  
GND  
MODE  
VREG  
VDD  
NC  
VBST  
NC  
TPS53513  
SW  
SW  
VIN  
SW  
VIN  
Thermal Pad  
SW  
VIN  
10  
11  
12  
13  
14  
PIN DESCRIPTIONS  
PIN  
I/O(1) DESCRIPTION  
NAME  
EN  
NO.  
3
I
I
The enable pin turns on the DC-DC switching converter.  
FB  
23  
VOUT feedback input. Connect this pin to a resistor divider between the VOUT pin and GND.  
This pin is the ground of internal analog circuitry and driver circuitry. Connect GND to the PGND plane  
with a short trace (For example, connect this pin to the thermal pad with a single trace and connect the  
thermal pad to PGND pins and PGND plane).  
GND  
22  
G
GND1  
GND2  
27  
28  
I
I
Connect this pin to ground. GND1 is the input of unused internal circuitry and must connect to ground.  
Connect this pin to ground. GND2 is the input of unused internal circuitry and must connect to ground.  
The MODE pin sets the forced continuous-conduction mode (FCCM) or Skip-mode operation. It also  
selects the ramp coefficient of D-CAP3 mode.  
MODE  
21  
I
5
NC  
O
Not connected. These pins are floating internally.  
18  
26  
10  
11  
12  
13  
14  
DNC  
Do not connect. This pin is the output of unused internal circuitry and must be floating.  
PGND  
G
These ground pins are connected to the return of the internal low-side MOSFET.  
Open-drain power-good status signal which provides startup delay after the FB voltage falls within the  
specified limits. After the FB voltage moves outside the specified limits, PGOOD goes low within 2 µs.  
PGOOD  
RF  
2
1
O
I
RF is the SW-frequency configuration pin. Connect this pin to a resistor divider between VREG and  
GND to program different SW frequency settings.  
6
7
8
9
SW  
I/O SW is the output switching terminal of the power converter. Connect this pin to the output inductor.  
(1) I = Input, O = Output, P = Supply, G = Ground  
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TPS53513  
SLUSBP9A SEPTEMBER 2013REVISED DECEMBER 2013  
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PIN DESCRIPTIONS (continued)  
PIN  
I/O(1) DESCRIPTION  
NAME  
NO.  
TRIP is the OCL detection threshold setting pin. ITRIP = 10 µA at room temp, 3000 ppm/°C current is  
TRIP  
25  
I/O sourced and sets the OCL trip voltage. See the Current Sense and Overcurrent Protection section for  
detailed OCP setting.  
VBST is the supply rail for the high-side gate driver (boost terminal). Connect the bootstrap capacitor  
from this pin to the SW node. Internally connected to VREG via bootstrap PMOS switch.  
VBST  
VDD  
4
P
19  
15  
16  
17  
20  
24  
P
P
Power-supply input pin for controller. Input of the VREG LDO. The input range is from 4.5 to 25 V.  
VIN is the conversion power-supply input pins.  
VIN  
VREG  
VO  
O
I
VREG is the 5-V LDO output. This voltage supplies the internal circuitry and gate driver.  
VOUT voltage input to the controller.  
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TPS53513  
www.ti.com  
SLUSBP9A SEPTEMBER 2013REVISED DECEMBER 2013  
BLOCK DIAGRAM  
PGOOD  
+
+
0.6 V + 8/16%  
0.6 V ± 32%  
+
UV  
+
Delay  
Delay  
OV  
0.6 V ± 8/16%  
0.6 V+20%  
VREG  
Internal Ramp  
Control Logic  
RF  
0.6 V  
SS  
UVP / OVP  
Logic  
+
+
PWM  
OCP  
VBST  
VIN  
VFB  
10 µA  
GND  
LL  
+
+
1 SHOT  
TRIP  
SW  
XCON  
+
ZC  
Control  
Logic  
PGND  
PGND  
VO  
SW  
xꢀ On/Off time  
xꢀ Minimum On/Off  
xꢀ Light load  
FCCM / SKIP  
RC time Constant  
MODE  
Fault  
Shut Down  
LDO  
VREG  
xꢀ OVP/UVP  
xꢀ FCCM/SKIP  
xꢀ Soft-Start  
+
VREGOK  
3.34 V /  
3.12 V  
+
VDD  
DNC  
+
EN  
VDDOK  
THOK  
Enable  
4.3 V /  
4.03 V  
1.4 V / 1.2 V  
+
GND  
GND1  
GND2  
140°C /  
100°C  
TPS53513  
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TPS53513  
SLUSBP9A SEPTEMBER 2013REVISED DECEMBER 2013  
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APPLICATION CIRCUIT DIAGRAM  
R1  
PGOOD  
6.65 NŸꢀ  
R2  
C3  
C4  
2 kŸꢀꢀ  
Thermal  
R6  
1 µF  
1 µF  
VIN  
Pad  
150 NŸꢀ  
CIN  
2.2 nF  
CIN  
3 × 22 µF  
23  
22  
21  
20  
19  
18  
17  
16  
15  
24 VO  
PGND 14  
PGND 13  
PGND 12  
PGND 11  
PGND 10  
25 TRIP  
26 DNC  
27 GND1  
28 GND2  
R8  
34.8 NŸꢀ  
TPS53513  
1
2
3
4
5
6
7
8
9
PIMB065T±1R0MS-63  
VOUT  
R4  
249 NŸꢀ  
R10  
100 NŸꢀ  
1 µH  
R7  
C2  
R3  
3 Ÿꢀ  
Thermal Pad  
0 Ÿꢀꢀ 0.1 µF  
COUT  
COUT  
4 × 10 µF  
6 × 22 µF  
R5  
105 NŸꢀ  
VREG  
EN  
C1  
470 pF  
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TPS53513  
www.ti.com  
SLUSBP9A SEPTEMBER 2013REVISED DECEMBER 2013  
TYPICAL CHARACTERISTICS  
100  
90  
100  
90  
80  
80  
fSW = 500 KHz, VIN = 12 V, VDD = 5 V  
fSW = 500 KHz, VIN = 12 V, VDD = 5 V  
TA = 25°C, L OUT = 1 H, Mode = Auto-skip  
TA = 25°C, L OUT = 1 H, Mode = FCCM  
70  
70  
V
VOUT = 0.6 V  
VOUT = 1 V  
V
VOUT = 0.6 V  
VOUT = 1 V  
V= 1.2 V  
VOUT= 1.5 V  
V= 1.2 V  
VOUT= 1.5 V  
OUT  
OUT  
V
OUT  
= 1.8 V  
V
= 2.5 V  
V
OUT  
= 1.8 V  
V
= 2.5 V  
OUT  
OUT  
V
= 3.3 V  
V
= 5 V  
V
= 3.3 V  
V
= 5 V  
OUT
OUT
OUT  
OUT  
60  
60  
0
0
0
2
4
6
8
10  
12  
0
0
0
2
4
6
8
10  
12  
Output Current (A)  
Output Current (A)  
C003  
C004  
Figure 1. Efficiency vs. Output Current  
Figure 2. Efficiency vs. Output Current  
100  
90  
80  
70  
60  
50  
100  
90  
80  
70  
60  
50  
f
SW = 1 MHz, VIN = 12 V, VDD = 5 V  
TA = 25°C, L OUT = 1 H, Mode = Auto-Skip  
f
SW = 1 MHz, VIN = 12 V, VDD = 5 V  
TA = 25°C, L OUT = 1 H, Mode = FCCM  
OUT
V = 2.5 V  
OUT
VOUT = 0.6 V VOUT = 1 V  
VOUT = 0.6 V VOUT = 1 V  
= 1.2 V  
OUT  
V
V
V
= 1.2 V  
V
V
V
= 1.5 V  
V
V
V
V
= 1.5 V  
OUT
= 2.5 V  
OUT  
= 1.8 V  
= 1.8 V  
OUT
OUT
OUT
= 3.3 V  
= 5 V  
= 3.3 V  
V
= 5 V  
OUT
OUT
OUT
OUT
2
4
6
8
10  
12  
2
4
6
8
10  
12  
Output Current (A)  
Output Current (A)  
C005  
C006  
Figure 3. Efficiency vs. Output Current  
Figure 4. Efficiency vs. Output Current  
1.3  
1.25  
1.2  
1.3  
1.25  
1.2  
fSW = 500 KHz  
VDD = 5 V  
VOUT = 1.2 V  
TA = 25°C  
LOUT = 1 H  
fSW = 1 MHz  
VDD = 5 V  
VOUT = 1.2 V  
TA = 25°C  
LOUT = 1 H  
Mode = Auto-skip  
Mode = Auto-skip  
1.15  
1.1  
1.15  
1.1  
VIN=5V
VIN=5V
VIN = 12 V  
VIN = 12 V  
VIN = 18 V  
VIN = 18 V  
10 12  
2
4
6
8
10  
12  
2
4
6
8
Output Current (A)  
Output Current (A)  
C007  
C008  
Figure 5. Output Voltage vs. Output Current  
Figure 6. Output Voltage vs. Output Current  
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TYPICAL CHARACTERISTICS (continued)  
1.3  
1.25  
1.2  
1.3  
1.25  
1.2  
fSW = 500 KHz  
VDD = 5 V  
TA = 25°C  
LOUT = 1 H  
Mode = FCCM  
VOUT = 1.2 V  
fSW = 1 MHz  
VDD = 5 V  
TA = 25°C  
LOUT = 1 H  
Mode = FCCM  
VOUT = 1.2 V  
1.15  
1.1  
1.15  
1.1  
VIN=5V
VIN=5V
VIN = 12 V  
VIN = 12 V  
VIN = 18 V  
VIN = 18 V  
0
2
4
6
8
10  
12  
0
2
4
6
8
10  
12  
Output Current (A)  
Output Current (A)  
C009  
C010  
Figure 7. Output Voltage vs. Output Current  
Figure 8. Output Voltage vs. Output Current  
1200  
1000  
800  
600  
550  
500  
450  
400  
fSW = 500 kHz  
VDD = 5 V  
VOUT = 1.2 V  
TA = 25°C  
LOUT = 1 H  
Mode = FCCM  
VIN = 12 V, VDD = 5 V, TA = 25°C  
LOUT = 1 H, Mode = FCCM, VOUT = 1.2 V  
fSW = 250 KHz  
fSW=500KHz
fSW=1MHz
600  
VIN=5V
400  
VIN = 12 V  
VIN = 18 V  
200  
1
2
3
4
5
6
7
8
9
10 11 12  
1
2
3
4
5
6
7
8
9
10 11 12  
Output Current (A)  
Output Current (A)  
C011  
C012  
Figure 9. Switching Frequency vs. Output Current  
Figure 10. Switching Frequency vs. Output Current  
100  
85  
100  
85  
70  
70  
55  
40  
25  
55  
40  
25  
V
IN = VDD = 18 V  
V
IN = VDD = 18 V  
VOUT = 1.2 V  
fSW = 1 MHz  
LOUT = 1 µH  
VOUT = 5 V  
fSW = 1 MHz  
LOUT = 1 µH  
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15  
Output Current (A)  
Figure 11. Safe Operating Area, VOUT = 1.2 V  
1
2
3
4
5
6
7
8
9
10 11 12 13 14 15  
Output Current (A)  
Figure 12. Safe Operating Area, VOUT = 5 V  
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TYPICAL CHARACTERISTICS (continued)  
VIN = 12 V  
VIN = 12 V  
VOUT = 1.2 V  
Fsw = 1 MHz  
VOUT = 1.2 V  
Fsw = 1 MHz  
Mode = Auto-skip  
IOUT = 0 A  
Mode = FCCM  
IOUT = 0 A  
Figure 13. Auto-Skip Steady-State Operation  
Figure 14. FCCM Steady-State Operation  
VIN = 12 V  
VIN = 12 V  
VOUT = 1.2 V  
Fsw = 1 MHz  
VOUT = 1.2 V  
Fsw = 1 MHz  
Mode = Auto-skip  
IOUT = 0.1 A  
Mode = FCCM  
IOUT = 0.1 A  
Figure 15. Auto-Skip Steady-State Operation  
Figure 16. FCCM Steady-State Operation  
VIN = 12 V  
VIN = 12 V  
VOUT = 1.2 V  
Fsw = 1 MHz  
VOUT = 1.2 V  
Fsw = 1 MHz  
Mode = Auto-skip  
IOUT = 6 A  
Mode = FCCM  
IOUT = 6 A  
Figure 17. Auto-Skip Steady-State Operation  
Figure 18. FCCM Steady-State Operation  
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TYPICAL CHARACTERISTICS (continued)  
VIN = 12 V  
VIN = 12 V  
VOUT = 1.2 V  
Fsw = 1 MHz  
VOUT = 1.2 V  
Fsw = 1 MHz  
Mode = Auto-skip  
Idyn = 0 A to 6 A  
Mode = FCCM  
Idyn = 0 A to 6 A  
Figure 19. Auto-Skip Mode Load Transient  
Figure 20.  
VIN = 12 V  
VIN = 12 V  
VOUT = 1.2 V  
Fsw = 1 MHz  
VOUT = 1.2 V  
Fsw = 1 MHz  
Mode = Auto-skip  
IOUT = 0 A  
Mode = FCCM  
IOUT = 0 A  
Figure 21. Start-Up  
Figure 22. Start-Up  
VIN = 12 V  
VIN = 12 V  
VOUT = 1.2 V  
Fsw = 1 MHz  
VOUT = 1.2 V  
Fsw = 1 MHz  
Mode = Auto-skip  
IOUT = 6 A  
Mode = FCCM  
IOUT = 6 A  
Figure 23. Start-Up  
Figure 24. Start-Up  
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TYPICAL CHARACTERISTICS (continued)  
VIN = 12 V  
VIN = 12 V  
VOUT = 1.2 V  
Fsw = 1 MHz  
VOUT = 1.2 V  
Fsw = 1 MHz  
Mode = Auto-skip  
IOUT = 0 A  
Mode = FCCM  
IOUT = 0 A  
Figure 25. Shut-Down Operation  
Figure 26. Shut-Down Operation  
VIN = 12 V  
VIN = 12 V  
VOUT = 1.2 V  
Fsw = 1 MHz  
VOUT = 1.2 V  
Fsw = 1 MHz  
Mode = Auto-skip  
IOUT = 6 A  
Mode = FCCM  
IOUT = 6 A  
Figure 27. Shut-Down Operation  
Figure 28. Shut-Down Operation  
VIN = 12 V  
VOUT = 1.2 V  
Fsw = 500 KHz  
Mode = Auto-skip  
IOUT = 0 A  
VIN = 12 V  
VOUT = 1.2 V  
Fsw = 1 MHz  
Mode = Auto-skip  
IOUT = 0 A  
Pre-bias = 0.6 V  
Figure 29. Pre-Bias Operation  
Figure 30. Overvoltage Protection  
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TYPICAL CHARACTERISTICS (continued)  
VIN = 12 V  
VOUT = 1.2 V  
Fsw = 500 MHz  
Mode = FCCM  
Figure 31. Overcurrent Protection  
.
.
.
THERMAL PERFORMANCE  
TA = 23°C, fSW = 500 kHz, VIN = 12 V, VOUT = 1.24 V, IOUT = 8 A, RBOOT= 0 Ω, SNB = 3 Ω + 470 pF  
Inductor: LOUT = 1 µH, PIMB103T-1R0MS-63, 10 mm × 11.2 mm × 3 mm, 5.3 mΩ  
Figure 32. SP1: 43(TPS53513), SP2: 35.1(Inductor)  
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APPLICATION INFORMATION  
General Description  
The TPS53513 is a high-efficiency, single-channel, synchronous-buck converter. The device suits low-output  
voltage point-of-load applications with 8-A or lower output current in computing and similar digital consumer  
applications. The TPS53513 features proprietary D-CAP3 mode control combined with adaptive on-time  
architecture. This combination builds modern low-duty-ratio and ultra-fast load-step-response DC-DC converters  
in an ideal fashion. The output voltage ranges from 0.6 V to 5.5 V. The conversion input voltage ranges from  
1.5 V to 18 V and the VDD input voltage ranges from 4.5 V to 25 V. The D-CAP3 mode uses emulated current  
information to control the modulation. An advantage of this control scheme is that it does not require a phase-  
compensation network outside which makes the device easy-to-use and also allows low-external component  
count. Adaptive on-time control tracks the preset switching frequency over a wide range of input and output  
voltage while increasing switching frequency as needed during load-step transient.  
Frequency Selection  
TPS53513 allows users to select the switching frequency by using the RF pin. Table 1 lists the divider ratio and  
some example resistor values for the switching frequency selection. The 1% tolerance resistors with a typical  
temperature coefficient of ±100 ppm/ºC are recommended. If the design requires a tighter noise margin for more  
reliable SW-frequency detection, use higher performance resistors.  
Table 1. Switching Frequency Selection  
SWITCHING  
FREQUENCY  
(fSW) (kHz)  
RESISTOR  
EXAMPLE RF FREQUENCY COMBINATIONS  
DIVIDER RATIO(1)  
RRF_H (kΩ)  
RRF_L (kΩ)  
(RDR  
)
1000  
850  
750  
600  
500  
400  
300  
250  
> 0.557  
0.461  
0.375  
0.297  
0.229  
0.16  
1
300  
154  
120  
105  
71.5  
47.5  
27  
180  
200  
249  
240  
249  
255  
270  
0.096  
< 0.041  
11.5  
(1) Resistor divider ratio (RDR) is described in Equation 1.  
space  
RDR  
RRF _L  
=
R
(
+ RRF _H  
)
RF _L  
where  
RRF_L is the low-side resistance of the RF pin resistor divider  
RRF_H is the high-side resistance of the RF pin resistor divider  
(1)  
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D-CAP3 Control and Mode Selection  
RR  
SW  
To comparator  
CR  
VOUT  
Figure 33. Internal RAMP Generation Circuit  
The TPS53513 uses D-CAP3 mode control to achieve fast load transient while maintaining the ease-of-use  
feature. An internal RAMP is generated and fed to the VFB pin to reduce jitter and maintain stability. The  
amplitude of the ramp is determined by the R-C time-constant as shown in Figure 33. At different switching  
frequencies, (fSW) the R-C time-constant varies to maintain relatively constant RAMP amplitude.  
D-CAP3 Mode  
From small-signal loop analysis, a buck converter using the D-CAP3 mode control architecture can be simplified  
as shown in Figure 34.  
VO  
SW  
CC1  
RC1  
VIN  
CC2  
RC2  
Sample  
and Hold  
DRVH  
PWM  
Comparator  
Lx  
RFBH  
Control  
Logic  
and  
G
+
+
VRAMP  
VOUT  
FB  
DRVL  
Driver  
RCO  
+
VREF  
RLOAD  
COUT  
RFBL  
Figure 34. D-CAP3 Mode  
The D-CAP3 control architecture includes an internal ripple generation network enabling the use of very low-ESR  
output capacitors such as multi-layered ceramic capacitors (MLCC). No external current sensing network or  
voltage compensators are required with D-CAP3 control architecture. The role of the internal ripple generation  
network is to emulate the ripple component of the inductor current information and then combine it with the  
voltage feedback signal to regulate the loop operation. For any control topologies supporting no external  
compensation design, there is a minimum and/or maximum range of the output filter it can support. The output  
filter used with the TPS53513 is a lowpass L-C circuit. This L-C filter has double pole that is described in  
Equation 2.  
1
f =  
P
2´ p´ L  
´ C  
OUT  
OUT  
(2)  
At low frequencies, the overall loop gain is set by the output set-point resistor divider network and the internal  
gain of the TPS53513. The low frequency L-C double pole has a 180 degree in phase. At the output filter  
frequency, the gain rolls off at a –40dB per decade rate and the phase drops rapidly. The internal ripple  
generation network introduces a high-frequency zero that reduces the gain roll off from –40dB to –20dB per  
decade and increases the phase to 90 degree one decade above the zero frequency.  
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The inductor and capacitor selected for the output filter must be such that the double pole of Equation 2 is  
located close enough to the high-frequency zero so that the phase boost provided by the high-frequency zero  
provides adequate phase margin for the stability requirement.  
Table 2. Locating the Zero  
SWITCHING  
FREQUENCIES  
(fSW) (kHz)  
ZERO (fZ) LOCATION (kHz)  
250 and 300  
400 and 500  
600 and 750  
850 and 1000  
6
7
9
12  
After identifying the application requirements, the output inductance should be designed so that the inductor  
peak-to-peak ripple current is approximately between 25% and 35% of the ICC(max) (peak current in the  
application). Use Table 2 to help locate the internal zero based on the selected switching frequency. In general,  
where reasonable (or smaller) output capacitance is desired, Equation 3 can be used to determine the necessary  
output capacitance for stable operation.  
1
f =  
= f  
Z
P
2´ p´ L  
´ C  
OUT  
OUT  
(3)  
If MLCC is used, consider the derating characteristics to determine the final output capacitance for the design.  
For example, when using an MLCC with specifications of 10-µF, X5R and 6.3 V, the deratings by DC bias and  
AC bias are 80% and 50% respectively. The effective derating is the product of these two factors, which in this  
case is 40% and 4-µF. Consult with capacitor manufacturers for specific characteristics of the capacitors to be  
used in the system/applications.  
Table 3 shows the recommended output filter range for an application design with the following specifications:  
Input voltage, VIN = 12 V  
Switching frequency, fSW = 600 kHz  
Output current, IOUT = 8 A  
The minimum output capacitance is verified by the small signal measurement conducted on the EVM using the  
following two criteria:  
Loop crossover frequency is less than one-half the switching frequency (300 kHz)  
Phase margin at the loop crossover is greater than 50 degrees  
For the maximum output capacitance recommendation, simplify the procedure to adopt an unrealistically high  
output capacitance for this type of converter design, then verify the small signal response on the EVM using the  
following one criteria:  
Phase margin at the loop crossover is greater than 50 degrees  
As indicated by the phase margin, the actual maximum output capacitance (COUT(max)) can continue to go higher.  
However, small signal measurement (bode plot) should be done to confirm the design.  
Select a MODE pin configuration as shown in Table 3 to double the R-C time-constant option for the maximum  
output capacitance design and application. Select a MODE pin configuration to use single R-C time constant  
option for the normal (or smaller) output capacitance design and application.  
The MODE pin also selects Skip-mode or FCCM-mode operation.  
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Table 3. Recommended Component Values  
COUT(min) CROSS- PHASE COUT(max) INTERNAL  
VOUT RLOWER RUPPER  
LOUT  
(µH)  
INDUCTOR  
ΔI/ICC(max)  
ICC(max)  
(A)  
(µF)  
OVER  
(kHz)  
MARGIN  
(°)  
(µF)  
RC SETTING  
(µs)  
(V)  
(kΩ)  
(kΩ)  
(1)  
(1)  
3 × 100  
9 × 22  
4 × 22  
3 × 22  
2 × 22  
247  
48  
70  
62  
53  
84  
57  
63  
57  
59  
51  
58  
40  
80  
40  
80  
40  
80  
40  
80  
40  
80  
0.36  
0.6  
0
33%  
33%  
34%  
33%  
28%  
PIMB065T-R36MS  
30 x 100  
30 x 100  
30 x 100  
30 x 100  
30 x 100  
207  
25  
0.68  
1.2  
2.5  
3.3  
5.5  
10  
PIMB065T-R68MS  
185  
11  
1.2  
10  
31.6  
45.3  
82.5  
8
PIMB065T-1R2MS  
185  
9
1.5  
PIMB065T-1R5MS  
185  
7
2.2  
PIMB065T-2R2MS  
(1) All COUT(min) and COUT(max) capacitor specifications are 1206, X5R, 10 V.  
For higher output voltage at or above 2.0 V, additional phase boost might be required in order to secure sufficient  
phase margin due to phase delay/loss for higher output voltage (large on-time (tON)) setting in a fixed on time  
topology based operation.  
A feedforward capacitor placing in parallel with RUPPER is found to be very effective to boost the phase margin at  
loop crossover. Refer to TI application note SLVA289 for details.  
Table 4. Mode Selection and Internal RAMP R-C Time Constant  
SWITCHING  
FREQUENCIES  
fSW (kHz)  
MODE  
SELECTION  
RMODE  
(kΩ)  
R-C TIME  
CONSTANT (µs)  
ACTION  
60  
50  
275  
and  
and  
and  
325  
425  
625  
850  
275  
425  
625  
850  
275  
425  
625  
850  
275  
425  
625  
850  
275  
425  
625  
850  
525  
750  
0
40  
30  
and 1000  
Skip Mode  
Pull down to GND  
120  
100  
80  
and  
and  
and  
325  
525  
750  
150  
20  
150  
0
60  
and 1000  
60  
and  
and  
and  
325  
525  
750  
50  
40  
30  
and 1000  
Connect to  
PGOOD  
FCCM(1)  
120  
100  
80  
and  
and  
and  
325  
525  
750  
60  
and 1000  
120  
100  
80  
and  
and  
and  
325  
525  
750  
FCCM  
Connect to VREG  
60  
and 1000  
(1) Device goes into Forced CCM (FCCM) after PGOOD becomes high.  
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Sample and Hold Circuitry  
CSP  
Sampled_CSP  
Buffer 2  
C1  
C2  
Buffer 1  
Figure 35. Sample and Hold Logic Circuitry (Patent Pending)  
The sample and hold circuitry is the difference between D-CAP3 and D-CAP2. The sample and hold circuitry,  
which is an advance control scheme to boost output voltage accuracy higher on the TPS53513, is one of  
features of the TPS53513. The sample and hold circuitry generates a new DC voltage of CSN instead of the  
voltage which is produced by RC2 and CC2 which allows for tight output-voltage accuracy and makes the  
TPS53513 more competitive.  
CSP  
CSN  
CSP  
CSN  
CSN_NEW  
(sample at valley of CSP)  
CSN_NEW  
(sample at valley of CSP)  
Figure 36. Continuous Conduction Mode (CCM)  
With Sample and Hold Circuitry  
Figure 37. Discontinuous Conduction Mode (DCM)  
With Sample and Hold Circuitry  
CSP  
CSN  
CSP  
CSN  
Figure 38. Continuous Conduction Mode (CCM)  
Without Sample and Hold Circuitry  
Figure 39. Discontinuous Conduction Mode (DCM)  
Without Sample and Hold Circuitry  
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1.25  
1.25  
1.23  
1.21  
1.19  
1.17  
1.15  
1.23  
1.21  
VIN = 12 V  
1.19  
VIN = 12 V  
VDD = 5 V  
VDD = 5 V  
VOUT = 1.2 V  
fSW = 500 kHz  
TA = 25°C  
LOUT = 1 H  
VOUT = 1.2 V  
fSW = 500 kHz  
TA = 25°C  
LOUT = 1 H  
Mode = Auto-skip  
1.17  
D-CAP3  
D-CAP2  
D-CAP3  
D-CAP2  
Mode = FCCM  
1.15  
1
2
3
4
5
6
7
8
9
10 11 12  
1
2
3
4
5
6
7
8
9
10 11 12  
Output Current (A)  
Output Current (A)  
C013  
C014  
Figure 40. Output Voltage vs Output Current  
Figure 41. Output Voltage vs Output Current  
Auto-Skip Eco-mode™ Light Load Operation  
While the MODE pin is pulled to GND directly or via 150-kΩ resistor, the TPS53513 automatically reduces the  
switching frequency at light-load conditions to maintain high efficiency. This section describes the operation in  
detail.  
As the output current decreases from heavy load condition, the inductor current also decreases until the rippled  
valley of the inductor current touches zero level. Zero level is the boundary between the continuous-conduction  
and discontinuous-conduction modes. The synchronous MOSFET turns off when this zero inductor current is  
detected. As the load current decreases further, the converter runs into discontinuous-conduction mode (DCM).  
The on-time is maintained to a level approximately the same as during continuous-conduction mode operation so  
that discharging the output capacitor with a smaller load current to the level of the reference voltage requires  
more time. The transition point to the light-load operation IO(LL) (for example: the threshold between continuous-  
and discontinuous-conduction mode) is calculated as shown in Equation 4.  
V
- V  
´ V  
)
OUT OUT  
V
IN  
(
1
IN  
I
=
´
OUT LL  
( )  
2´L ´ f  
SW  
where  
fSW is the PWM switching frequency  
(4)  
Using only ceramic capacitors is recommended for Auto-skip mode.  
Adaptive Zero-Crossing  
The TPS53513 uses an adaptive zero-crossing circuit to perform optimization of the zero inductor-current  
detection during skip-mode operation. This function allows ideal low-side MOSFET turn-off timing. The function  
also compensates the inherent offset voltage of the Z-C comparator and delay time of the Z-C detection circuit.  
Adaptive zero-crossing prevents SW-node swing-up caused by too-late detection and minimizes diode  
conduction period caused by too-early detection. As a result, the device delivers better light-load efficiency.  
Forced Continuous-Conduction Mode  
When the MODE pin is tied to the PGOOD pin through a resistor, the controller operates in continuous  
conduction mode (CCM) during light-load conditions. During CCM, the switching frequency maintained to an  
amost constant level over the entire load range which is suitable for applications requiring tight control of the  
switching frequency at the cost of lower efficiency.  
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Power-Good  
The TPS53513 has power-good output that indicates high when switcher output is within the target. The power-  
good function is activated after the soft-start operation is complete. If the output voltage becomes within ±8% of  
the target value, internal comparators detect the power-good state and the power-good signal becomes high  
after a 1-ms internal delay. If the output voltage goes outside of ±16% of the target value, the power-good signal  
becomes low after a 2-μs internal delay. The power-good output is an open-drain output and must be pulled-up  
externally.  
Current Sense and Overcurrent Protection  
The TPS53513 has cycle-by-cycle overcurrent limiting control. The inductor current is monitored during the OFF  
state and the controller maintains the OFF state during the period that the inductor current is larger than the  
overcurrent trip level. In order to provide good accuracy and a cost-effective solution, the TPS53513 supports  
temperature compensated MOSFET RDS(on) sensing. Connect the TRIP pin to GND through the trip-voltage  
setting resistor, RTRIP. The TRIP terminal sources ITRIP current, which is 10 μA typically at room temperature, and  
the trip level is set to the OCL trip voltage VTRIP as shown in Equation 5.  
VTRIP = RTRIP ´ITRIP  
where  
VTRIP is in mV  
RTRIP is in kΩ  
ITRIP is in µA  
(5)  
The inductor current is monitored by the voltage between the GND pin and SW pin so that the SW pin is properly  
connected to the drain terminal of the low-side MOSFET. ITRIP has a 3000-ppm/°C temperature slope to  
compensate the temperature dependency of RDS(on). The GND pin acts as the positive current-sensing node.  
Connect the GND pin to the proper current sensing device, (for example, the source terminal of the low-side  
MOSFET.)  
Because the comparison occurs during the OFF state, VTRIP sets the valley level of the inductor current. Thus,  
the load current at the overcurrent threshold, IOCP, is calculated as shown in Equation 6.  
I
V
- V  
´ V  
)
OUT OUT  
V
IN  
(
V
V
TRIP  
1
IND(ripple)  
IN  
TRIP  
I
=
+
=
+
´
OCP  
2
2´L ´ f  
8´R  
8´R  
DS(on)L  
SW  
(
)
(
)
DS(on)  
where  
RDS(on)L is the on-resistance of the low-side MOSFET  
RTRIP is in kΩ  
(6)  
Equation 6 calculates the typical DC OCP level (typical low-side on-resistance [RDS(on)] of 5.9 mΩ should be  
used); in order to design for worst case minimum OCP, maximum low-side on-resistance value of 8 mΩ should  
be used.  
During an overcurrent condition, the current to the load exceeds the current to the output capacitor thus the  
output voltage tends to decrease. Eventually, the output voltage crosses the undervoltage-protection threshold  
and shuts down.  
For the TPS53513, the overcurrent protection maximum is recommended up to 12 A only.  
Overvoltage and Undervoltage Protection  
The TPS53513 monitors a resistor-divided feedback voltage to detect overvoltage and undervoltage. When the  
feedback voltage becomes lower than 68% of the target voltage, the UVP comparator output goes high and an  
internal UVP delay counter begins counting. After 1 ms, the TPS53513 latches OFF both high-side and low-side  
MOSFETs drivers. The UVP function enables after soft-start is complete.  
When the feedback voltage becomes higher than 120% of the target voltage, the OVP comparator output goes  
high and the circuit latches OFF the high-side MOSFET driver and turns on the low-side MOSFET until reaching  
a negative current limit. Upon reaching the negative current limit, the low-side FET is turned off and the high-side  
FET is turned on again for a minimum on-time. The TPS53513 operates in this cycle until the output voltage is  
pulled down under the UVP threshold voltage for 1 ms. After the 1-ms UVP delay time, the high-side FET is  
latched off and low-side FET is latched on. The fault is cleared with a reset of VDD or by re-toggling EN pin.  
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Out-Of-Bounds Operation (OOB)  
The TPS53513 has an out-of-bounds (OOB) overvoltage protection that protects the output load at a much lower  
overvoltage threshold of 8% above the target voltage. OOB protection does not trigger an overvoltage fault, so  
the device is not latched off after an OOB event. OOB protection operates as an early no-fault overvoltage-  
protection mechanism. During the OOB operation, the controller operates in forced PWM mode only by turning  
on the low-side FET. Turning on the low-side FET beyond the zero inductor current quickly discharges the output  
capacitor thus causing the output voltage to fall quickly towards the setpoint. During the operation, the cycle-by-  
cycle negative current limit is also activated to ensure the safe operation of the internal FETs.  
UVLO Protection  
The TPS53513 monitors the voltage on the VDD pin. If the VDD pin voltage is lower than the UVLO off-threshold  
voltage, the switch mode power supply shuts off. If the VDD voltage increases beyond the UVLO on-threshold  
voltage, the controller turns back on. UVLO is a non-latch protection.  
Thermal Shutdown  
The TPS53513 monitors internal temperature. If the temperature exceeds the threshold value (typically 140°C),  
TPS53513 shuts off. When the temperature falls approximately 40°C below the threshold value, the device turns  
on. Thermal shutdown is a non-latch protection.  
22  
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TPS53513  
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SLUSBP9A SEPTEMBER 2013REVISED DECEMBER 2013  
External Parts Selection  
The external components selection is a simple process using D-CAP3™ Mode. Select the external components  
using the following steps  
1. CHOOSE THE SW FREQUENCY  
The SW frequency is configured by the resistor divider on the RF pin. Select one of eight SW frequencies  
from 250 kHz to 1 MHz. Refer Table 1 for the relationship between the SW frequency and resistor-divider  
configuration.  
2. CHOOSE THE OPERATION MODE  
Select the operation mode using Table 4.  
3. CHOOSE THE INDUCTOR  
Determine the inductance value to set the ripple current at approximately ¼ to ½ of the maximum output  
current. Larger ripple current increases output ripple voltage, improves S/N ratio, and helps stable operation.  
V
- V  
´ V  
V
- V  
max  
)
´ V  
OUT  
(
IN  
OUT  
)
)
OUT  
(
IN  
OUT  
)
max  
(
)
(
1
3
L =  
´
=
´
I
´ f  
V
I
´ f  
OUT  
max  
( )  
V
IN(max)  
SW  
IN  
SW  
IND ripple  
max  
(
(
)
(7)  
The inductor requires a low DCR to achieve good efficiency. The inductor also requires enough room above  
peak inductor current before saturation. The peak inductor current is estimated using Equation 8.  
V
- V  
´ V  
OUT  
)
)
(
IN  
OUT  
max  
(
)
V
1
TRIP  
I
=
+
´
IND peak  
(
)
8´R  
L ´ f  
V
IN  
SW  
DS on  
max  
( )  
(
(8)  
4. CHOOSE THE OUTPUT CAPACITOR  
The output capacitor selection is determined by output ripple and transient requirement. When operating in  
CCM, the output ripple has two components as shown in Equation 9. Equation 10 and Equation 11 define  
these components.  
VRIPPLE = VRIPPLE(C) + VRIPPLE(ESR)  
(9)  
I
L ripple  
(
)
V
=
RIPPLE C  
( )  
8´ C  
´ f  
SW  
OUT  
(10)  
(11)  
VRIPPLE ESR = IL ripple ´ESR  
(
)
(
)
5. DETERMINE THE VALUE OF R1 AND R2  
The output voltage is programmed by the voltage-divider resistors, R1 and R2, shown in APPLICATION  
CIRCUIT DIAGRAM. R1 is connected between the VFB pin and the output, and R2 is connected between  
the VFB pin and GND. The recommended R2 value is from 1 kΩ to 20 kΩ. Determine R1 using Equation 12.  
VOUT - 0.6  
R1=  
´R2  
0.6  
(12)  
LAYOUT CONSIDERATIONS  
Before beginning a design using the TPS53513, consider the following:  
Place the power components (including input and output capacitors, the inductor, and the TPS53513) on the  
solder side of the PCB. In order to shield and isolate the small signal traces from noisy power lines, insert and  
connect at least one inner plane to ground.  
All sensitive analog traces and components such as VFB, PGOOD, TRIP, MODE, and RF must be placed  
away from high-voltage switching nodes such as SW and VBST to avoid coupling. Use internal layers as  
ground planes and shield the feedback trace from power traces and components.  
GND (pin 22) must be connected directly to the thermal pad. Connect the thermal pad to the PGND pins and  
then to the GND plane.  
The GND1 pin (pin 27) and the GND2 pin (pin 28) are not actual GND pins and neither of these pins should  
be used for dedicated ground connection. The recommendation is to connect GND1 pin (pin 27) and the  
GND2 pin (pin 28) to the nearby ground.  
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Place the VIN decoupling capacitors as close to the VIN and PGND pins as possible to minimize the input  
AC-current loop.  
Place the feedback resistor near the device to minimize the VFB trace distance.  
Place the frequency-setting resistor (RRF), OCP-setting resistor (RTRIP) and mode-setting resistor (RMODE  
close to the device. Use the common GND via to connect the resistors to the GND plane if applicable.  
)
Place the VDD and VREG decoupling capacitors as close to the device as possible. Provide GND vias for  
each decoupling capacitor and ensure the loop is as small as possible.  
The PCB trace is defined as switch node, which connects the SW pins and high-voltage side of the inductor.  
The switch node should be as short and wide as possible.  
Use separated vias or trace to connect SW node to the snubber, bootstrap capacitor, and ripple-injection  
resistor. Do not combine these connections.  
Place one more small capacitor (2.2 nF- 0402 size) between the VIN and PGND pins. This capacitor must be  
placed as close to the device as possible.  
TI recommends placing a snubber between the SW shape and GND shape for effective ringing reduction.  
The value of snubber design starts at 3 Ω + 470 pF.  
Consider R,C,Cc network (Ripple injection network) component placement and place the AC coupling  
capacitor, Cc, close to the device, and R and C close to the power stage.  
See Figure 42 for the layout recommendation.  
VIN Shape  
To inner GND plane  
CIN  
HF cap.  
Cc  
2
3
2
1
2
0
1
9
1
8
1
7
1
6
1
5
To VOUT Shape  
VO  
TRIP  
PGND  
PGND  
PGND  
PGND  
PGND  
DNC  
GND Shape  
GND1  
GND2  
COUT  
1
2
3
4
5
6
7
8
9
VOUT Shape  
SW Shape  
LOUT  
To VREG Pin  
Cap.  
Res.  
Trace on bottom layer  
Trace of top layer  
RCC On Bottom layer  
Trace of bottom layer  
Trace on inner layer  
Figure 42. Layout Recommendation  
24  
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TPS53513  
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SLUSBP9A SEPTEMBER 2013REVISED DECEMBER 2013  
REVISION HISTORY  
Changes from Original (SEPTEMBER 2013) to Revision A  
Page  
Added updates to FEATURES, APPLICATIONS, DESCRIPTION and front page graphics ............................................... 1  
Changed device dimensions from 3,5 mm × 4,5 mm to 3.5 mm × 4.5 mm ......................................................................... 1  
Added updates to Electrical Specifications ........................................................................................................................... 2  
Added updates to Electrical Specifications ........................................................................................................................... 3  
Added updates to PIN DESCRIPTIONS ............................................................................................................................... 5  
Added updates to BLOCK DIAGRAM ................................................................................................................................... 7  
Added THERMAL PERFORMANCE section ...................................................................................................................... 14  
Added updates to APPLICATION INFORMATION section ................................................................................................ 15  
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PACKAGE OPTION ADDENDUM  
www.ti.com  
28-Nov-2013  
PACKAGING INFORMATION  
Orderable Device  
TPS53513RVER  
TPS53513RVET  
Status Package Type Package Pins Package  
Eco Plan  
Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
-40 to 85  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(6)  
(3)  
(4/5)  
ACTIVE  
VQFN  
VQFN  
RVE  
28  
28  
3000 Pb-Free (RoHS  
Exempt)  
CU NIPDAU  
Level-2-260C-1 YEAR  
TPS53513  
TPS53513  
ACTIVE  
RVE  
250  
Pb-Free (RoHS  
Exempt)  
CU NIPDAU  
Level-2-260C-1 YEAR  
-40 to 85  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish  
value exceeds the maximum column width.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
28-Nov-2013  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
28-Nov-2013  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
TPS53513RVER  
TPS53513RVET  
VQFN  
VQFN  
RVE  
RVE  
28  
28  
3000  
250  
330.0  
180.0  
12.4  
12.4  
3.8  
3.8  
4.8  
4.8  
1.6  
1.6  
8.0  
8.0  
12.0  
12.0  
Q1  
Q1  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
28-Nov-2013  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
TPS53513RVER  
TPS53513RVET  
VQFN  
VQFN  
RVE  
RVE  
28  
28  
3000  
250  
367.0  
210.0  
367.0  
185.0  
35.0  
35.0  
Pack Materials-Page 2  
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