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  • 北京元坤伟业科技有限公司

         该会员已使用本站17年以上

  • TPS61045DRBR
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  • HECC GROUP CO.,LIMITED

     该会员已使用本站17年以上
  • TPS61045DRBR 现货库存
  • 数量5000 
  • 厂家TI 
  • 封装8-QFN 
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  • 深圳市拓亿芯电子有限公司

     该会员已使用本站12年以上
  • TPS61045DRBR 现货库存
  • 数量21000 
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     该会员已使用本站16年以上
  • TPS61045DRBR 现货库存
  • 数量3166 
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     该会员已使用本站14年以上
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  • 数量3000 
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  • 深圳市欧昇科技有限公司

     该会员已使用本站10年以上
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  • 数量9000 
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     该会员已使用本站15年以上
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  • 深圳市恒嘉威智能科技有限公司

     该会员已使用本站7年以上
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     该会员已使用本站8年以上
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  • 深圳市珩瑞科技有限公司

     该会员已使用本站2年以上
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  • 数量7166 
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  • 深圳市赛科世纪电子有限公司

     该会员已使用本站11年以上
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  • 数量63820 
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  • 深圳市芯脉实业有限公司

     该会员已使用本站11年以上
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  • 数量3000 
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  • 上海磐岳电子有限公司

     该会员已使用本站11年以上
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  • 数量9000 
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  • 深圳市拓森弘电子有限公司

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  • 数量5300 
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  • 深圳市芯福林电子有限公司

     该会员已使用本站15年以上
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  • 深圳市芯福林电子有限公司

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     该会员已使用本站8年以上
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  • 深圳市恒达亿科技有限公司

     该会员已使用本站12年以上
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  • 数量3000 
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  • 深圳市宏世佳电子科技有限公司

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  • 深圳市得捷芯城科技有限公司

     该会员已使用本站11年以上
  • TPS61045DRBR
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  • 深圳市晶美隆科技有限公司

     该会员已使用本站15年以上
  • TPS61045DRBRG4
  • 数量68000 
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  • 深圳市欧立现代科技有限公司

     该会员已使用本站12年以上
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  • 数量1900 
  • 厂家TI 
  • 封装SMD 
  • 批号24+ 
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  • 深圳市欧立现代科技有限公司

     该会员已使用本站12年以上
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  • 深圳市恒达亿科技有限公司

     该会员已使用本站12年以上
  • TPS61045DRBR
  • 数量3000 
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  • 深圳市拓亿芯电子有限公司

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  • 数量22000 
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  • 深圳市得捷芯城科技有限公司

     该会员已使用本站11年以上
  • TPS61045DRBR
  • 数量19048 
  • 厂家TI(德州仪器) 
  • 封装QFN8 
  • 批号23+ 
  • 原厂可订货,技术支持,直接渠道。可签保供合同
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  • 深圳市华科泰电子商行

     该会员已使用本站13年以上
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  • 数量6878 
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  • 深圳市西源信息科技有限公司

     该会员已使用本站9年以上
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  • 数量8800 
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  • 深圳市华斯顿电子科技有限公司

     该会员已使用本站16年以上
  • TPS61045DRBR
  • 数量59216 
  • 厂家TI 
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     该会员已使用本站16年以上
  • TPS61045DRBR
  • 数量12500 
  • 厂家TI/德州仪器 
  • 封装VSON-8 
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     该会员已使用本站5年以上
  • TPS61045DRBR
  • 数量6500 
  • 厂家ON/安森美 
  • 封装SMD 
  • 批号24+ 
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  • 深圳市晶美隆科技有限公司

     该会员已使用本站14年以上
  • TPS61045DRBR
  • 数量18530 
  • 厂家TI 
  • 封装QFN 
  • 批号23+ 
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产品型号TPS61045DRBR的概述

TPS61045DRBR的概述 TPS61045DRBR是一款由德州仪器(Texas Instruments)推出的高效升压转换器,广泛用于需要将低电压提升至更高电压的应用场景。该芯片能够处理多种输入电压范围,因此其适用性很广,尤为适合手持电子设备、便携式设备以及类似小型电子产品中,尤其在移动应用中表现出色。TPS61045DRBR的设计极为灵活,支持多种输出电压设置,使得其在电源管理领域成为一种理想选择。 该器件具有出色的宽输入范围,能够在2.3V至5.5V之间正常工作,适应多种电源输入场景。此外,该芯片的最大输出电流可达1A,表明其在功率输出方面的强大性能。在设计时,TPS61045DRBR的功率效率也值得关注,能够在负载范围内保持高效,避免了由于过热导致的能量损耗。其内置的补偿网络和低电阻开关,无疑为提升转换效率提供了良好的基础。 TPS61045DRBR的详细参数 1. 输入电...

产品型号TPS61045DRBR的Datasheet PDF文件预览

TPS61045  
www.ti.com  
SLVS440AJANUARY 2003REVISED SEPTEMBER 2003  
DIGITALLY ADJUSTABLE LCD BOOST CONVERTER  
FEATURES  
DESCRIPTION  
Input Voltage Range . . . 1.8 V to 6.0 V  
The TPS61045 is a high frequency boost converter with  
digitally programmable output voltage and true shut-  
down. During shutdown the output is disconnected  
from the input by opening the internal input switch. This  
allows a controlled power up/down sequencing of the  
display. The output voltage can be increased or de-  
creased in digital steps by applying a logic signal to the  
CTRL pin. The output voltage range, as well as the  
output voltage step size, can be programmed with the  
feedback divider network. With a high switching fre-  
quency of up to 1 MHz the TPS61045 allows the use of  
small external components and together, with the small  
8-pin QFN package, a miminum system solution size is  
achieved.  
Up to 85% Efficiency  
Digitally Adjustable Output Voltage Control  
Disconnects Output From Input During Shut-  
down  
Switching Frequency . . . Up to 1 MHz  
No Load Quiescent Current . . . 40 µA Typ  
Thermal Shutdown Mode  
Shutdown Current . . . 0.1 µA Typ  
Available in Small 3mm × 3mm QFN package  
APPLICATIONS  
LCD Bias Supply For Small to Medium LCD  
Displays  
OLED Display Power Supply  
– PDA, Pocket PC, Smart Phones  
– Handheld Devices  
– Cellular Phones  
D1  
MBR0530  
L1  
4.7 mH  
V
O
16.2 V to 18.9 V/ 10 mA  
C2  
4.7uF  
R1  
2.2 MW  
C3  
1 mF  
Cff  
22 pF  
1
8
R3  
1 MW  
L
SW  
DO  
V
CC  
= 1.8 V to 6 V  
C1  
2
5
6
3
4
VIN  
CTRL  
FB  
7
PGND  
GND  
100 nF  
R2  
180 kW  
Enable / LCD bias control  
Figure 1. Typical Application  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments  
semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily in-  
cludetestingofallparameters.  
Copyright © 2003, Texas Instruments Incorporated  
TPS61045  
www.ti.com  
SLVS440AJANUARY 2003REVISED SEPTEMBER 2003  
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage to the MOS gates.  
(1)  
ORDERING INFORMATION  
TA  
8 PIN QFN PACKAGE (DRB)  
PACKAGE MARKING  
-40°C to 85°C  
TPS61045DRB  
BHT  
(1)  
The DRB package is available taped and reeled. Add R suffix (TPS61045DRBR) to order quantities of 3000 units per reel. Add T suffix  
(TPS61045DBRT) to order quaqntities of 250 units per reel.  
ABSOLUTE MAXIMUM RATINGS  
(1)  
over operating free-air temperature range (unless otherwise noted)  
TPS61045  
-0.3 V to 7 V  
(2)  
Supply voltage, V(VIN)  
Voltages, V(CTRL), V(FB), V(L), V(DO)  
(2)  
(2)  
-0.3 V to VI + 0.3 V  
30 V  
Voltage, V(SW)  
Continuous power dissipation  
See Dissipation Rating Table  
-40°C to 150°C  
-65°C to 150°C  
260°C  
Operating junction temperature range  
Storage temperature range, TSTG  
Lead temperature (soldering, 10 sec)  
(1)  
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings  
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating  
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
All voltage values are with respect to network ground terminal.  
(2)  
DISSIPATION RATING  
PACKAGE  
TA25°C POWER  
DERATING FACTOR  
TA = 70°C POWER  
TA = 85°C POWER  
RATING  
ABOVE TA = 25°C  
RATING  
RATING  
(1)  
8 pin QFN (DRB)  
(1)  
370 mW  
3.7 mW/°C  
204 mW  
148 mW  
The thermal resistance junction to ambient of the 8 pin QFN package is 270°C/W. Standard 2 layer PCB without vias for the thermal  
pad. See the appliction section on how to improve the thermal resistance RΘJA  
.
RECOMMENDED OPERATING CONDITIONS  
MIN  
1.8  
TYP  
MAX  
6.0  
UNIT  
V
V(VIN)  
V(SW)  
L
Input voltage range  
Switch voltage  
30  
V
(1)  
Inductor  
4.7  
µH  
MHz  
µF  
(1)  
(1)  
f
Switching frequency  
Input capacitor (C2)  
1
CI(C2)  
CO(C3)  
TA  
4.7  
1
(1)  
Output capacitor (C3)  
µF  
Operating ambient temperature  
Operating junction temperature  
-40  
-40  
85  
°C  
TJ  
125  
°C  
(1)  
See application section for further information.  
2
TPS61045  
www.ti.com  
SLVS440AJANUARY 2003REVISED SEPTEMBER 2003  
ELECTRICAL CHARACTERISTICS  
VI = 2.4 V, CTRL = VI, VO = 18.0 V, IO = 10 mA, TA = -40°C to 85°C, typical values are at TA = 25°C (unless otherwise noted)  
PARAMETER  
SUPPLY CURRENT  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
VI  
Input voltage range  
1.8  
6.0  
V
µA  
µA  
V
IQ  
Operating quiescent current  
Shutdown current  
IO = 0 mA, not switching  
40  
65  
1
IO(SD)  
VUVLO  
CTRL = GND  
VI falling  
0.1  
1.5  
Under-voltage lockout threshold  
1.7  
CTRL AND DAC OUTPUT  
VIH  
CTRL high level input voltage  
1.3  
0
V
V
VIL  
CTRL low level input voltage  
CTRL input leakage current  
DAC output voltage range  
DAC resolution  
0.3  
0.1  
Ilkg  
CTRL = GND or VIN  
µA  
V
VO(DO)  
1.233  
6 Bit  
19.6  
607  
mV  
mV  
µA  
µs  
µs  
µs  
µs  
VO(DO)  
DAC center output voltage  
CTRL = high  
IO(SINK) Maximum DAC sink current  
30  
60  
t(UP)  
t(DWN)  
td1  
Increase output voltage one step  
Decrease the output voltage one step  
Delay time between up/down steps  
Shutdown  
CTRL = high to low  
CTRL = high to low  
CTRL = low to high  
CTRL = high to low  
1
140  
1
240  
t(OFF)  
560  
INPUT SWITCH (Q1), MAIN SWITCH (Q2) AND CURRENT LIMIT  
VSW(Q2) Main switch maximum voltage (Q2)  
30  
800  
10  
V
mΩ  
µA  
mA  
rds(ON)  
Main switch MOSFET on-resistance  
VI = 2.4 V; IS = 200 mA  
VS = 28 V  
400  
0.1  
375  
1
Ilkg(MAIN) Main switch MOSFET leakage current  
I(LIM)  
Main switch MOSFET current limit  
Input switch MOSFET on-resistance  
Input switch MOSFET leakage current  
300  
450  
2
rds(ON)  
Ilkg(IN)  
OUTPUT  
VO  
VI= 2.4 V; IS = 200 mA  
VL = GND, VI = 6 V  
0.1  
10  
µA  
Output voltage range  
Vin  
28  
V
V
Vref  
Internal voltage reference  
Feedback input bias current  
Feedback trip point voltage  
1.233  
30  
I(FB)  
VFB = 1.3 V  
100  
nA  
V
V(FB)  
1.8 V VI6.0 V; VO = 18 V, I(LOAD)= 10  
mA  
1.208  
1.233  
1.258  
DRB PACKAGE  
(TOP VIEW)  
1
8
7
6
5
SW  
L
Exposed  
Thermal  
Die Pad  
VIN 2  
DO 3  
PGND  
GND  
CTRL  
4
FB  
(A) The Exposed Thermal Die Pad is connected to PGND. Connect this pad directly with the GND pin.  
3
TPS61045  
www.ti.com  
SLVS440AJANUARY 2003REVISED SEPTEMBER 2003  
TERMINAL FUNCTIONS  
TERMINAL  
I/O  
DESCRIPTION  
NAME  
NO.  
CTRL  
5
I
Combined enable and digital output voltage programming pin. Pulling CTRL constantly high enables  
the device. When CTRL is pulled to GND, the device is disabled and the input is disconnected from  
the output by opening the integrated switch Q1. Pulsing CTRL low increases or decreases the output  
voltage. Refer to the application information section for further information.  
DO  
3
O
I
Internal DAC output. DO programs the output voltage via the CTRL pin. Refer to the application  
information section for further information.  
FB  
4
7
Feedback. FB must be connected to the output voltage-feedback divider.  
GND  
Analog ground. GND must be directly connected to the PGND pin. Refer to the application  
information section for further information.  
L
1
6
8
O
Drain of the internal switch (Q1). Connect L to the inductor.  
Power ground  
PGND  
SW  
I
I
Drain of the integrated switch Q2. SW is connected to the inductor and anode of the Schottky rectifier  
diode.  
VIN  
2
VIN  
FB  
Input supply pin  
FUNCTIONAL BLOCK DIAGRAM  
L
SW  
Q1  
Input switch  
400 ns Min  
Off Time  
Undervoltage  
Lockout  
Bias Supply  
Gate  
Driver  
CTRL  
Q2  
Main Switch  
ErrorComparator  
S
-
+
Gate  
Driver  
RS Latch  
Logic  
6 ms Max  
V
= 1.233 V  
Digital  
ref  
On Time  
R
Current Limit  
R
sense  
+
-
6 Bit DAC  
CTRL  
Interface  
Soft  
Start  
DO  
GND  
PGND  
4
TPS61045  
www.ti.com  
SLVS440AJANUARY 2003REVISED SEPTEMBER 2003  
TYPICAL CHARACTERISTICS  
Table #IMPLIED. Table of Graphs  
FIGURE  
Figure 2  
Figure 3  
Figure 4  
Figure 5  
Figure 6  
Figure 7  
Figure 8  
Figure 9  
Figure 10  
Figure 11  
Figure 12  
Figure 13  
Figure 14  
Figure 15  
η
Efficiency  
vs Load current  
vs Input voltage  
vs Input voltage  
vs Temperature  
vs Temperature  
vs Temperature  
vs Input voltage  
vs Temperature  
vs Input voltage  
vs CTRL input step  
IDD(Q)  
V(FB)  
I(FB)  
Quiescent current  
Feedback voltage  
Feedback current  
rds(on) Main switch Q2  
rds(on)  
rds(on) Input switch Q1  
V(DO)  
V(DO) Voltage  
Line transient response  
Load transient response  
PFM operation  
Soft start  
Efficiency  
vs  
Load Current  
Efficiency  
vs  
Input Voltage  
90  
88  
86  
84  
82  
80  
78  
76  
74  
72  
70  
L = 4.7 µH  
V = 5 V  
I
87  
84  
81  
78  
75  
72  
69  
66  
63  
60  
V
O
= 18 V  
I
O
= 10 mA  
V = 3.6 V  
I
V = 2.4 V  
I
L = 4.7 µH  
= 18 V  
I
O
= 5 mA  
V
O
1
2
3
4
5
6
0.1  
1
10  
100  
V - Input Voltage - V  
I
I
O
- Output Current - mA  
Figure 2.  
Figure 3.  
Quiescent Current  
vs  
Input Voltage  
Feedback Voltage  
vs  
Temperature  
1.238  
1.237  
1.236  
1.235  
1.234  
1.233  
60  
50  
40  
30  
20  
10  
0
V = 2.4 V  
I
T
= 85°C  
A
T
= 25°C  
A
T
A
= -40°C  
-40  
-15  
10  
35  
60  
85  
1.8  
2.4  
3.0  
3.6  
4.2  
4.8  
5.4  
6.0  
T
A
- Free-Air Temperature - °C  
V - Input Voltage - V  
I
Figure 4.  
Figure 5.  
5
TPS61045  
www.ti.com  
SLVS440AJANUARY 2003REVISED SEPTEMBER 2003  
Typical Characteristics (continued)  
Feedback Current  
rds(ON) Main Switch Q2  
vs  
vs  
Temperature  
Temperature  
100  
700  
600  
500  
400  
300  
200  
100  
0
V = 2.4 V  
I
90  
80  
V = 3.6 V  
I
70  
60  
50  
40  
30  
20  
10  
0
V = 2.4 V  
I
V = 5 V  
I
-40  
1.8  
1.8  
-15  
10  
35  
60  
85  
6.0  
6.0  
-40  
-40  
0
-15  
10  
35  
60  
85  
85  
64  
T
- Free-Air Temperature - ° C  
T
- Free-Air Temperature - ° C  
A
A
Figure 6.  
Figure 7.  
rds(ON) Main Switch Q2  
vs  
rds(ON) Input Switch Q1  
vs  
Input Voltage  
Temperature  
600  
500  
400  
300  
200  
100  
0
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
V = 2.4 V  
I
T
A
= 25° C  
2.4  
3.0  
3.6  
4.2  
4.8  
5.4  
-15  
10  
35  
60  
V - Input Voltage - V  
I
T
- Free-Air Temperature - ° C  
A
Figure 8.  
Figure 9.  
rds(ON) Input Switch Q1  
vs  
V(DO) Voltage  
vs  
CTRL Input Step  
Input Voltage  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
T
A
= 25° C  
V = 2.4 V  
I
2.4  
3.0  
3.6  
4.2  
4.8  
5.4  
8
16  
24  
32  
40  
48  
56  
V - Input Voltage - V  
I
Input Step Number  
Figure 10.  
Figure 11.  
6
TPS61045  
www.ti.com  
SLVS440AJANUARY 2003REVISED SEPTEMBER 2003  
Typical Characteristics (continued)  
V = 2.4 V to 3.4 V Step  
I
V
O
= 100 mV/Div  
250 µs/Div  
Figure 12 . Line Transient Response  
V
O
= 50 mV/Div  
I
= 1 mA to 11 mA Step  
(Load)  
50 µs/Div  
Figure 13 . Load Transient Response  
V
(SW)  
= 10 V/Div  
V
O
= 50 mV/Div  
I = 200 mA/Div  
L
1 µs/Div  
Figure 14 . PFM Operation  
7
TPS61045  
www.ti.com  
SLVS440AJANUARY 2003REVISED SEPTEMBER 2003  
Typical Characteristics (continued)  
V
O
= 5 V/Div  
CTRL 2 V/Div  
I = 50 mA/Div  
I
500 µs/Div  
Figure 15 . Soft Start  
DETAILED DESCRIPTION  
OPERATION  
The TPS61045 operates with an input voltage range of 1.8 V to 6.0 V and generates output voltages up to 28 V.  
The device operates in a pulse frequency modulation (PFM) scheme with constant peak current control. This  
control scheme maintains high efficiency over the entire load current range and, with a switching frequency of up  
to 1 MHz, the device enables the use of small external components.  
The converter monitors the output voltage and when the feedback voltage falls below the reference voltage of  
1.233 V (typ) the main switch turns on and the current ramps up. The main switch turns off when the inductor  
current reaches the internally set peak current of 375 mA (typ). Refer to the peak current controlsection for more  
information. The second criteria that turns off the main switch is the maximum on-time of 6 µs (typ). This limits  
the maximum on-time of the converter in extreme conditions. As the switch is turned off, the external Schottky  
diode is forward biased delivering the current to the output. The main switch remains off until the minimum off  
time of 400 ns (typ) has passed and the feedback voltage is below the reference voltage again. Using this PFM  
peak current control scheme, the converter operates in discontinuous conduction mode (DCM) where the  
switching frequency depends on the input voltage, output voltage and output current. This gives a high efficiency  
over the entire load current range. This regulation scheme is inherently stable which allows a wider range for the  
selection of the inductor and output capacitor.  
PEAK CURRENT CONTROL  
The internal switch is turned on until the inductor current reaches the typical dc current limit (ILIM) of 375 mA. Due  
to the internal current limit delay of 100 ns (typ) the actual current exceeds the dc current limit threshold by a  
small amount. The typical peak current limit can be calculated:  
V
I
I
+ I  
)
  100 ns  
P(typ)  
(LIM)  
L
(1)  
V
I
I
+ 400 mA )   100 ns  
P(typ)  
L
The higher the input voltage and the lower the inductor value, the greater the current limit overshoot.  
8
TPS61045  
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SLVS440AJANUARY 2003REVISED SEPTEMBER 2003  
DETAILED DESCRIPTION (continued)  
SOFTSTART  
All inductive step-up converters exhibit high inrush current during start up if no special precautions are taken.  
This can cause voltage drops at the input rail during start-up, which may result in an unwanted or premature  
system shut down.  
When the device is enabled, the internal input switch (Q1) is slowly turned on to reduce the in-rush current  
charging the capacitor (C2) connected to pin L. Furthermore, the TPS61045 limits this in-rush current during  
start-up by increasing the current limit in two steps starting from ILIM/4 for 256 switch cycles to ILIM/2 for the next  
256 switch cycles.  
ENABLE (CTRL PIN)  
The CTRL pin serves two functions. One is the enable and disable of the device. The other is the output voltage  
programming of the device. If the digital interface is not required, the CTRL pin is used as a standard enable pin  
for the device.  
Pulling the CTRL pin high enables the device beginning with the softstart cycle.  
Pulling the CTRL pin to ground for a period of 560 µs shuts down the device, reducing the shutdown current to  
0.1 µA (typ). During shutdown the internal input switch (Q1) remains open and disconnects the load from the  
input supply of the device.  
This pin must be terminated.  
DAC OUTPUT (DO)  
The TPS61045 allows digital adjustment of the output voltage using the digital CTRL interface as described in  
the next section. The DAC output pin (DO) drives an external resistor (R3) connected to the external feedback  
divider. The DO output has a typical output voltage range from 0 V to Vref (1.233V). If the DO output voltage is  
set to 0 V, the external resistor (R3) is more or less in parallel to the lower feedback resistor (R2) giving the  
highest output voltage. Programming the DO output to Vref gives the lowest output voltage. Internally, a 6-bit DAC  
is used with 64-steps and 0 as the first step. This gives a typical voltage step of 19.6 mV which is calculated as:  
V
ref  
V
+
ǒ Ǔ  
6
O(DO)  
2 –1  
See the sectionsetting the output voltage for further information.  
After start-up, when the CTRL pin is pulled high, the DO output voltage is set to its center voltage which is the  
32nd step of typically V(DO) = 607mV.  
DIGITAL INTERFACE (CTRL)  
When the CTRL pin is pulled high the device starts up with softstart and the DAC output voltage (DO) sets to its  
center voltage with a typical output voltage of 607 mV.  
The output voltage can be programmed by pulling the CTRL pin low for a certain period of time. Depending on  
this time period the internal DAC voltage increases or decreases one digital step, as outlined in Table 1 and  
Figure 16. Programming the DAC output V(DO) to 0 V places R3 in parallel to R2, which gives the maximum  
output voltage. If the DAC is programmed to its maximum output voltage equal to the internal reference voltage,  
typically V(DO)=1.233 V, then the output has its minimum output voltage.  
9
TPS61045  
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SLVS440AJANUARY 2003REVISED SEPTEMBER 2003  
DETAILED DESCRIPTION (continued)  
Table 1. Timing Table  
DAC OUTPUT DO  
TIME  
LOGIC LEVEL  
Increase one step  
Decrease one step  
Shutdown  
t(UP) = 1 µs to 60 µs  
t(DWN) = 140 µs to 240 µs  
t(OFF) 560 µs  
Low  
Low  
Low  
High  
Delay between steps  
td1 = 1 µs  
t
d1  
t
d1  
High  
EN  
Low  
t
t
d1  
(UP)  
t
t
(OFF)  
(DWN)  
Device Enabled  
Device Disabled  
Figure 16. CTRL Timing Diagram  
UNDERVOLTAGE LOCKOUT  
An undervoltage lockout feature prevents misoperation of the device at input voltages below 1.5 V (typ). As long  
as the input voltage is below the undervoltage threshold the device remains off, with the input switch (Q1) and  
the main switch (Q2) open.  
THERMAL SHUTDOWN  
An internal thermal shutdown is implemented in the TPS61045 that shuts down the device if the typical junction  
temperature of 160°C is exceeded. If the device is in thermal shutdown mode, the input switch (Q1) and the main  
switch (Q2) are open.  
10  
TPS61045  
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SLVS440AJANUARY 2003REVISED SEPTEMBER 2003  
APPLICATION INFORMATION  
INDUCTOR SELECTION, MAXIMUM LOAD CURRENT  
Since the PFM peak current control scheme is inherently stable the inductor and capacitor value does not affect  
the stability of the regulator. The selection of the inductor together with the nominal load current, input, and  
output voltage of the application determines the switching frequency of the converter. Depending on the  
application, inductor values between 2.2 µH up to 47 µH are recommended. The maximum inductor value is  
determined by the maximum switch on-time of 6 µs (typ). The peak current limit of 375 mA (typ) must be reached  
within this 6 µs for proper operation.  
The inductor value determines the maximum switching frequency of the converter. Therefore, the inductor value  
must be selected for the maximum switching frequency, at maximum load current of the converter and should not  
be exceeded. A good inductor value to start with is 4.7 µH. The maximum switching frequency is calculated as:  
VI   ǒVO * V Ǔ  
I
f
+
s
(max)  
I
  L   V  
P
O
with:  
IP = peak current as described in the previous peak current control section.  
V
I
I
+ 375 mA )   100 ns  
P(typ)  
L
(2)  
L = selected inductor value  
If the selected inductor does not exceed the maximum switching frequency of the converter, as a next step, the  
switching frequency at the nominal load current is estimated as follows:  
  ǒVO–V ) VFǓ  
2   I  
LOAD  
I
f
+
s
2
(ILOAD)  
I
  L  
P
with:  
IP = peak current as described in the previous chapter peak current control section  
V
I
I
+ 375 mA )   100 ns  
P(typ)  
L
(3)  
L = selected inductor value  
I(LOAD) = nominal load current  
VF = rectifier diode forward voltage (typically 0.3 V)  
The smaller the inductor value, the higher the switching frequency of the converter but the lower the efficiency.  
The maximum load current of the converter is determined at the operation point where the converter starts to  
enter continuous conduction mode. The converter must always operate in discontinuous conduction mode to  
maintain regulation.  
Two conditions exist for determining the maximum output current of the converter. One is when the inductor  
current fall time is <400 ns, and the other is when the inductor current fall time is >400 ns.  
One way to calculate the maximum available load current under certain operation conditions is to estimate the  
expected converter efficiency at the maximum load current. This number can be taken out of the efficiency  
graphs shown in Figure 2 and Figure 3. Then the maximum load current can be estimated:  
Inductor fall time:  
11  
TPS61045  
www.ti.com  
SLVS440AJANUARY 2003REVISED SEPTEMBER 2003  
APPLICATION INFORMATION (continued)  
I
L
P
t
+
fall  
V –V  
O
I
For tf400 ns  
I
V
P
I
I
+ h  
load max  
2   V  
O
(4)  
(5)  
tf400 ns  
2
P
I
  L   V  
I
I
+ h   
load max  
  ǒ2   I   L ) 2   400 ns   V Ǔ  
ǒVO–VIǓ  
P
I
with:  
L = selected inductor value  
η = expected converter efficiency (typically between 70% to 85%)  
IP = peak current as described in the previous peak current control section.  
V
I
I
+ 300 mA )   100 ns  
P
2
(6)  
The above formula contains the expected converter efficiency that allows calculating the expected maximum load  
current the converter can support. The efficiency can be taken out of the efficiency graphs shown in Figures 2  
and 3 or 80% can be used as a good estimation.  
The selected inductor must have a saturation current which meets the maximum peak current of the converter as  
calculated in the peak current control section. Use the maximum value for ILim (450mA) for this calculation.  
Another important inductor parameter is the dc resistance. The lower the dc resistance, the higher the efficiency  
of the converter. Refer to the Table 1 and the inductor selection section under typical applications.  
Table 2. Possible Inductor Selection  
INDUCTOR VALUE  
COMPONENT SUPPLIER  
Sumida CR32-100  
COMMENTS  
10 µH  
10 µH  
10 µH  
High efficiency  
High efficiency  
Sumida CDRH3D16-100  
Murata LQH43CN100K01  
Sumida CDRH3D16-4R7  
muRata LQH32CN4R7M51  
4.7 µH  
4.7 µH  
Small solution size  
Small solution size  
SETTING THE OUTPUT VOLTAGE  
When the converter is programmed to the minimum output voltage, the DAC output (DO) equals the reference  
voltage of 1.233 V (typ). Therefore, only the feedback resistor network (R1) and (R2) determines the output  
voltage under these conditions. This gives the minimum output voltage possible and can be calculated as:  
R1  
R2  
ǒ Ǔ  
V
+ V  
 
) 1  
O(min)  
(FB)  
The maximum output voltage is determined as the DAC output (DO) is set to 0 V:  
R1  
R3  
R1  
R2  
ǒ Ǔ  
V
+ V  
 
) V  
 
) 1  
O(max)  
(FB)  
(FB)  
12  
TPS61045  
www.ti.com  
SLVS440AJANUARY 2003REVISED SEPTEMBER 2003  
APPLICATION INFORMATION (continued)  
The output voltage can be digitally programmed by pulling the CTRL pin low for a certain period of time as  
described in the Digital Interface section. Pulling the signal applied to the CTRL pin low increases or decreases  
the DAC output DO (pin 3) one-step where one step is typically 19.6 mV. A voltage step on DO of 19.6mV (typ)  
changes the output voltage by one step and is calculated as:  
19.6 mV R1  
V
+
O(step)  
R3  
The possible output voltage range is determined by selecting R1, R2 and R3. A possible larger output voltage  
range gives a larger output voltage step size. The smaller the possible output voltage range, the smaller the  
output voltage step size.  
To reduce the overall operating quiescent current in battery powered applications a high impedance voltage  
divider must be used with a typical value for R2 of 200 kand a maximum value for R1 of 2.2 M.  
Some applications may not need the digital interface to program the output voltage. In this case the output DO  
can be left open as shown in Figure 18 and the output voltage is calculated as for any standard boost converter:  
R1  
R2  
+ 1.233 V   ǒ1 ) Ǔ  
V
O
In such a configuration a high impedance voltage divider must also be used to minimize ground current and a  
typical value for R2 of 200 kand a maximum value for R1 of 2.2 Mare recommended.  
A feed-forward capacitor (C(FF)), across the upper feedback resistor (R1), is required to provide sufficient  
overdrive for the error comparator. Without a feed-forward capacitor or a too small feed-forward capacitor value,  
the device shows double pulses or a pulse burst instead of single pulses at the switch node (SW). This can  
cause higher output voltage ripple. If a higher output voltage ripple is acceptable, the feedforward capacitor can  
be left out too.  
The lower the switching frequency of the converter, the larger the feed-forward capacitor value needs to be. A  
good starting point is the use of a 10 pF feed-forward capacitor. As a first estimation, the required value for the  
feed-forward capacitor can be calculated at the operation point:  
1
C
[
FF  
f
s
2   p   
  R1  
20  
with:  
R1 = upper resistor of voltage divider  
fS = switching frequency of the converter at the nominal load current. (For the calculation of the switching  
frequency see previous section)  
For C(FF) choose a value which comes closest to the calculation result.  
The larger the feed-forward capacitor, the worse the line regulation of the device. Therefore, the feed-forward  
capacitor must be selected as small as possible if good line regulation is of concern.  
OUTPUT CAPACITOR SELECTION  
For better output voltage filtering a low ESR output capacitor is recommended. Ceramic capacitors have low  
ESR values but depending on the application, tantalum capacitors can also be used. Refer to Table 2 and typical  
applications for the selection of the output capacitor.  
Assuming the converter does not show double pulses or pulse bursts on the switch node (SW) the output voltage  
ripple is calculated as:  
13  
TPS61045  
www.ti.com  
SLVS440AJANUARY 2003REVISED SEPTEMBER 2003  
APPLICATION INFORMATION (continued)  
I
I
  L  
O
1
P
DV  
+
 
*
) I   ESR  
ǒ
Ǔ
O
P
C
f
V
) V * V  
O
s(ILOAD)  
O
F
I
with:  
IP = peak current as described in the previous section peak current control  
V
I
I
+ 375 mA )   100 ns  
P
2
(7)  
L = selected inductor value  
IO(LOAD)=Nominal load current  
fS(ILoad) = switching frequency at the nominal load current as calaculated previously.  
VF = rectifier diode forward voltage (typically 0.3 V)  
CO = selected output capacitor  
ESR = output capacitor ESR value  
INPUT CAPACITOR SELECTION  
The input capacitor (C1) filters the high frequency noise to the control circuit and must be directly connected to  
the input pin (VIN) of the device. The capacitor (C2) connected to the L pin of the device is the input capacitor for  
the power stage.  
The main purpose of the capacitor (C2), that is connected directly to the L pin, is to smooth the inductor current.  
A larger capacitor reduces the inductor ripple current present at the L pin. The smaller the ripple current at the L  
pin, the higher the efficiency of the converter. If a sufficiently large capacitor is used, the input switch must carry  
only the DC current, filtered by the capacitor (C2), and not the high switching currents of the converter. A 4.7 µF  
or 10-µF ceramic capacitor (C2) is sufficient for most applications. For better filtering, this value can be increased  
without limit. Refer to Table 2 and typical applications for input capacitor recommendations.  
Table 3. Possible Input and Output Capacitor Selection  
CAPACITOR  
4.7 F/X5R/0805  
VOLTAGE RATING  
6.3 V  
COMPONENT SUPPLIER  
Tayo Yuden JMK212BY475MG  
COMMENTS  
CI/CO  
10 µF/X5R/0805  
1.0 µF/X7R/1206  
1.0 µF/X7R/1206  
4.7 µF/X5R/1210  
6.3 V  
25 V  
35 V  
25 V  
Tayo Yuden JMK212BJ106MG  
Tayo Yuden TMK316BJ105KL  
Tayo Yuden GMK316BJ105KL  
Tayo Yuden TMK325BJ475MG  
CI/CO  
CO  
CO  
CO  
DIODE SELECTION  
To achieve high efficiency a Schottky diode must be used. The current rating of the diode must meet the peak  
current rating of the converter as it is calculated in the peak current control section. Use the maximum value for  
I(LIM) (450mA) for this calculation. Refer to Table 3 and the typical applications for the selection of the Schottky  
diode.  
14  
TPS61045  
www.ti.com  
SLVS440AJANUARY 2003REVISED SEPTEMBER 2003  
APPLICATION INFORMATION (continued)  
Table 4. Possible Schottky Diode Selection  
COMPONENT SUPPLIER  
ON Semiconductor MBR0530  
ON Semiconductor MBR0520  
ON Semiconductor MBRM120L  
Toshiba CRS02  
REVERSE VOLTAGE  
30 V  
20 V  
20 V  
30 V  
40 V  
Zetex CHZS400  
LAYOUT CONSIDERATIONS  
As for all switching power supplies the layout is an important step in the design, especially at high peak currents  
and switching frequencies. If the layout is not carefully implemented the regulator can show noise problems and  
duty cycle jitter.  
The input capacitor must be placed as close as possible to the input pin for good input-voltage filtering. The  
inductor and diode must be placed as close as possible to the switch pin (SW) to minimize noise coupling into  
other circuits. Since the feedback pin and network is a high impedance circuit, the feedback network must be  
routed away from the inductor.  
THERMAL CONSIDERATIONS  
The TPS61045 is available in a thermally enhanced QFN package. The package includes a thermal pad,  
improving the thermal capabilities of the package. See QFN/SON PCB attachment application note (SLUA271).  
The thermal resistance junction to ambient (RΘJA) of the QFN package depends on the PCB layout. By using  
thermal vias and wide PCB, traces improve thermal resistance (RΘJA). Under normal operation conditions no  
PCB vias are required for the thermal pad. However, the thermal pad must be soldered to the PCB.  
15  
TPS61045  
www.ti.com  
SLVS440AJANUARY 2003REVISED SEPTEMBER 2003  
TYPICAL APPLICATIONS  
L1  
D1  
4.7 µH  
Zetex ZHZS400  
LQH32CN4R7M11  
V
O
16.2 V to 18.9 V/ 10 mA  
C2  
4.7 µF  
Cff  
22 pF  
C3  
1 µF  
R1  
2.2 M  
R3  
1 M  
L
SW  
DO  
FB  
V
CC  
= 1.8 V to 6 V  
Vin  
CTRL  
C1  
100 nF  
GND PGND  
R2  
180 kΩ  
Enable / LCD  
Bias Control  
Figure 17. Typical Application With Digital Adjusted Output Voltage  
L1  
D1  
4.7 µH  
Zetex ZHZS400  
LQH32CN4R7M11  
V
O
15 V to 18 V  
Adjustable / 10 mA  
C2  
4.7 µF  
Cff  
22 pF  
C3  
1 µF  
R1  
2.2 M  
L
SW  
DO  
FB  
V
CC  
= 1.8 V to 6 V  
Vin  
CTRL  
DAC or Analog Voltage  
0 V = 25 V  
1.233 V = 18 V  
C1  
100 nF  
R3  
390 kΩ  
GND PGND  
R2  
160 kΩ  
Enable  
Figure 18. Typical Application With Analog Adjusted Output Voltage  
16  
TPS61045  
www.ti.com  
SLVS440AJANUARY 2003REVISED SEPTEMBER 2003  
TYPICAL APPLICATIONS (continued)  
L1  
D1  
4.7 µH  
Zetex ZHZS400  
LQH32CN4R7M23  
V
O
16.2 V to 18.9 V/  
20 mA  
C2  
4.7 µF  
Cff  
22 pF  
C3  
1 µF  
R1  
2.2 M  
L
SW  
DO  
FB  
R3  
1 M  
V
CC  
= 2.7 V to 6 V  
Vin  
CTRL  
C1  
100 nF  
GND PGND  
R2  
180 kΩ  
Enable / LCD  
Bias Control  
Figure 19. OLED Supply Providing Higher Output Current  
17  
PACKAGE OPTION ADDENDUM  
www.ti.com  
11-Feb-2005  
PACKAGING INFORMATION  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
SON  
SON  
Drawing  
TPS61045DRBR  
TPS61045DRBT  
ACTIVE  
ACTIVE  
DRB  
8
8
3000  
250  
None  
None  
CU NIPDAU Level-2-235C-1 YEAR  
CU NIPDAU Level-2-235C-1 YEAR  
DRB  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional  
product content details.  
None: Not yet available Lead (Pb-Free).  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,  
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 1  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,  
enhancements, improvements, and other changes to its products and services at any time and to discontinue  
any product or service without notice. Customers should obtain the latest relevant information before placing  
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms  
and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI  
deems necessary to support this warranty. Except where mandated by government requirements, testing of all  
parameters of each product is not necessarily performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for  
their products and applications using TI components. To minimize the risks associated with customer products  
and applications, customers should provide adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,  
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process  
in which TI products or services are used. Information published by TI regarding third-party products or services  
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.  
Use of such information may require a license from a third party under the patents or other intellectual property  
of the third party, or a license from TI under the patents or other intellectual property of TI.  
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without  
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction  
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for  
such altered documentation.  
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that  
product or service voids all express and any implied warranties for the associated TI product or service and  
is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.  
Following are URLs where you can obtain information on other Texas Instruments products and application  
solutions:  
Products  
Applications  
Audio  
Amplifiers  
amplifier.ti.com  
www.ti.com/audio  
Data Converters  
dataconverter.ti.com  
Automotive  
www.ti.com/automotive  
DSP  
dsp.ti.com  
Broadband  
Digital Control  
Military  
www.ti.com/broadband  
www.ti.com/digitalcontrol  
www.ti.com/military  
Interface  
Logic  
interface.ti.com  
logic.ti.com  
Power Mgmt  
Microcontrollers  
power.ti.com  
Optical Networking  
Security  
www.ti.com/opticalnetwork  
www.ti.com/security  
www.ti.com/telephony  
www.ti.com/video  
microcontroller.ti.com  
Telephony  
Video & Imaging  
Wireless  
www.ti.com/wireless  
Mailing Address:  
Texas Instruments  
Post Office Box 655303 Dallas, Texas 75265  
Copyright 2005, Texas Instruments Incorporated  
配单直通车
TPS61045DRBRG4产品参数
型号:TPS61045DRBRG4
Brand Name:Texas Instruments
是否无铅:不含铅
是否Rohs认证:符合
生命周期:Active
IHS 制造商:TEXAS INSTRUMENTS INC
零件包装代码:SON
包装说明:SON-8
针数:8
Reach Compliance Code:compliant
ECCN代码:EAR99
HTS代码:8542.39.00.01
Factory Lead Time:1 week
风险等级:0.89
Is Samacsys:N
模拟集成电路 - 其他类型:SWITCHING REGULATOR
控制模式:CURRENT-MODE
控制技术:PULSE FREQUENCY MODULATION
最大输入电压:6 V
最小输入电压:1.8 V
标称输入电压:2.4 V
JESD-30 代码:S-PDSO-N8
JESD-609代码:e4
长度:3 mm
湿度敏感等级:2
功能数量:1
端子数量:8
最高工作温度:85 °C
最低工作温度:-40 °C
最大输出电流:0.45 A
最大输出电压:28 V
最小输出电压:1.8 V
封装主体材料:PLASTIC/EPOXY
封装代码:HVSON
封装等效代码:SOLCC8,.12,25
封装形状:SQUARE
封装形式:SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度(摄氏度):260
认证状态:Not Qualified
座面最大高度:1 mm
子类别:Switching Regulator or Controllers
表面贴装:YES
切换器配置:BOOST
最大切换频率:1000 kHz
温度等级:INDUSTRIAL
端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式:NO LEAD
端子节距:0.65 mm
端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:3 mm
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