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  • 北京元坤伟业科技有限公司

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  • 深圳市恒达亿科技有限公司

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  • 数量12300 
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  • 封装SOT23 
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产品型号TPS73001DBVR的概述

TPS73001DBVR芯片的概述 TPS73001DBVR是一款低压低压差线性稳压器(LDO),由德州仪器(Texas Instruments)生产。该器件的设计用途广泛,特别适用于便携式设备、工控设备、通信设备和消费类电子产品等多个领域。TPS73001DBVR特别适合对电源供电要求较高且电流不大的应用,从而保证其可以在较低的输入电压下稳定输出所需的电压。 该器件的输出电压范围为1.8V至5.0V,适合多种常见的电源需求。其低压差特性使得它能够在输入和输出电压之间的差异较小的情况下仍能保持稳定的输出电压,这在电池供电的设备中尤其重要,可以有效延长设备的使用寿命,提升效率。 TPS73001DBVR的详细参数 TPS73001DBVR的关键技术参数如下: 1. 输入电压范围:2.7V到6V 2. 输出电压:1.8V、3.3V、3.6V、5.0V(固定输出版本可选) 3. 最大输出电流...

产品型号TPS73001DBVR的Datasheet PDF文件预览

TPS73001, TPS73018  
TPS73025  
D BV 6  
D
B
V
5
TPS73030, TPS73033  
www.ti.com  
SBVS054ANOVEMBER 2004REVISED NOVEMBER 2004  
LOW-NOISE, HIGH PSRR, RF 200-mA  
LOW-DROPOUT LINEAR REGULATORS  
FEATURES  
DESCRIPTION  
200-mA RF Low-Dropout Regulator  
With Enable  
The TPS730xx family of low-dropout (LDO)  
low-power linear voltage regulators features high  
power-supply rejection ratio (PSRR), ultralow-noise,  
fast start-up, and excellent line and load transient  
responses a small SOT23 package. Each device in  
the family is stable, with a small 2.2-µF ceramic  
capacitor on the output. The TPS730xx family uses  
an advanced, proprietary BiCMOS fabrication pro-  
cess to yield low dropout voltages (e.g., 120 mV at  
200 mA, TPS73030). Each device achieves fast  
start-up times (approximately 50 µs with a 0.001-µF  
bypass capacitor) while consuming low quiescent  
current (170 µA typical). Moreover, when the device  
is placed in standby mode, the supply current is  
reduced to less than 1 µA. The TPS73018 exhibits  
approximately 23 µVRMS of output voltage noise at  
2.8-V output with a 0.01-µF bypass capacitor. Appli-  
Available in 1.8-V, 2.5-V, 3-V, 3.3-V, and  
Adjustable (1.22-V to 5.5-V)  
High PSRR (68dB at 1 kHz)  
Ultralow-Noise (23 µVRMS, TPS73018)  
Fast Start-Up Time (50 µs)  
Stable With a 2.2-µF Ceramic Capacitor  
Excellent Load/Line Transient Response  
Very Low Dropout Voltage (120 mV at Full  
Load)  
5- and 6-Pin SOT23 (DBV) Package  
APPLICATIONS  
RF: VCOs, Receivers, ADCs  
Audio  
Cellular and Cordless Telephones  
Bluetooth™, Wireless LAN  
Handheld Organizers, PDAs  
cations with analog components  
that  
are  
noise-sensitive, such as portable RF electronics,  
benefit from the high PSRR and low-noise features  
as well as the fast response time.  
TPS73028  
TPS73028  
RIPPLE REJECTION  
vs  
OUTPUT SPECTRAL NOISE DENSITY  
vs  
DBV PACKAGE  
(TOP VIEW)  
FREQUENCY  
FREQUENCY  
0.30  
100  
90  
OUT  
NR  
IN  
1
2
5
V
= 3.8 V  
IN  
I
= 200 mA  
OUT  
C
C
= 2.2 µF  
OUT  
= 0.1 µF  
0.25  
0.20  
GND  
80  
NR  
3
4
70  
EN  
60  
Fixed Option  
0.15  
50  
40  
30  
DBV PACKAGE  
(TOP VIEW)  
I
= 1 mA  
OUT  
I
= 10 mA  
OUT  
IN  
GND  
EN  
OUT  
FB  
0.10  
0.05  
1
2
6
5
I
= 200 mA  
OUT  
20  
10  
0
V
C
C
= 3.8 V  
= 10 µF  
IN  
OUT  
= 0.01 µF  
3
4
NR  
NR  
0
Adjustable Option  
100  
1 k  
10 k  
100 k  
10  
100  
1 k  
10 k 100 k 1 M 10 M  
Frequency (Hz)  
Frequency (Hz)  
Figure 1.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Bluetooth is a trademark of Bluetooth Sig, Inc.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2004, Texas Instruments Incorporated  
TPS73001, TPS73018  
TPS73025  
TPS73030, TPS73033  
www.ti.com  
SBVS054ANOVEMBER 2004REVISED NOVEMBER 2004  
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated  
circuits be handled with appropriate precautions. Failure to observe proper handling and installation  
procedures can cause damage.  
ESD damage can range from subtle performance degradation to complete device failure. Precision  
integrated circuits may be more susceptible to damage because very small parametric changes could  
cause the device not to meet its published specifications.  
AVAILABLE OPTIONS(1)(2)  
PRODUCT  
TPS73001  
TPS73018  
TPS73025  
TPS73030  
TPS73033  
VOLTAGE  
1.22 V to 5.5 V  
1.8 V  
PACKAGE  
SOT23 (DBV)  
SOT23 (DBV)  
SOT23 (DBV)  
SOT23 (DBV)  
SOT23 (DBV)  
TJ  
SYMBOL  
PGVI  
PART NUMBER  
TPS73001DBVR  
TPS73018DBVR  
TPS73025DBVR  
TPS73030DBVR  
TPS73033DBVR  
PHHI  
2.5 V  
-40°C to +125°C  
PGWI  
PGYI  
3 V  
3.3 V  
PHUI  
(1) For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet.  
(2) DBVR indicates tape and reel of 3000 parts.  
ABSOLUTE MAXIMUM RATINGS  
over operating temperature range (unless otherwise noted)(1)  
UNIT  
VIN range  
-0.3 V to 6 V  
-0.3 V to VIN + 0.3 V  
-0.3 V to 6 V  
VEN range  
VOUT range  
Peak output current  
ESD rating, HBM  
Internally limited  
2 kV  
ESD rating, CDM  
500 V  
Continuous total power dissipation  
Junction temperature range  
Storage temperature range, Tstg  
See Dissipation Ratings Table  
-40°C to 150°C  
-65°C to 150°C  
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings  
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating  
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
2
TPS73001, TPS73018  
TPS73025  
TPS73030, TPS73033  
www.ti.com  
SBVS054ANOVEMBER 2004REVISED NOVEMBER 2004  
DISSIPATION RATINGS TABLE  
T
A 25°C  
TA = 70°C  
POWER  
RATING  
TA = 85°C  
POWER  
RATING  
DERATING FACTOR  
POWER  
RATING  
BOARD  
Low-K(1)  
High-K(2)  
PACKAGE  
DBV  
RθJC  
RθJA  
ABOVE TA = 25°C  
65°C/W  
65°C/W  
255°C/W  
180°C/W  
3.9 mW/°C  
5.6 mW/°C  
390 mW  
560 mW  
215 mW  
310 mW  
155 mW  
225 mW  
DBV  
(1) The JEDEC low-K (1s) board design used to derive this data was a 3-inch x 3-inch, two layer board with 2 ounce copper traces on top  
of the board.  
(2) The JEDEC high-K (2s2p) board design used to derive this data was a 3-inch x 3-inch, multilayer board with 1 ounce internal power and  
ground planes and 2 ounce copper traces on top and bottom of the board.  
ELECTRICAL CHARACTERISTICS  
over recommended operating temperature range TJ = -40 to 125°C, VEN = VIN, VIN = VOUT(nom) + 1 V(1), IOUT = 1 mA,  
COUT = 10 µF, CNR = 0.01 µF (unless otherwise noted). Typical values are at 25°C.  
PARAMETER  
VIN Input voltage(1)  
TEST CONDITIONS  
MIN  
2.7  
0
TYP  
MAX  
5.5  
UNIT  
V
IOUT Continuous output current  
VFB Internal reference (TPS73001)  
200  
mA  
V
1.201 1.225  
1.250  
5.5 -  
VDO  
Output voltage range (TPS73001)  
VFB  
V
Output voltage accuracy  
0 µA IOUT200 mA,  
VOUT + 1 V VIN5.5 V  
0 µA IOUT200 mA,  
IOUT = 200 mA  
2.75 V VIN < 5.5 V  
TJ = 25°C  
-2%  
285  
VOUT(nom) +2%  
V
(1)  
Line regulation (VOUT%/VIN  
)
0.05  
5
%/V  
mV  
mV  
mA  
µA  
Load regulation (VOUT%/IOUT  
Dropout voltage(2)(VIN = VOUT(nom) - 0.1V)  
)
120  
210  
600  
250  
1
Output current limit  
VOUT = 0 V  
GND pin current  
Shutdown current(3)  
0 µA IOUT200 mA  
170  
VEN = 0 V, 2.7 V VIN5.5 V  
0.07  
µA  
FB pin current  
VFB = 1.8 V  
1
µA  
Power-supply ripple rejection TPS73028  
f = 1kHz, TJ = 25°C,  
IOUT = 200 mA  
68  
23  
50  
dB  
BW = 200 Hz to 100 kHz,  
IOUT = 200 mA  
Output noise voltage (TPS73018)  
CNR = 0.01 µF  
CNR = 0.001 µF  
µVRMS  
Time, start-up (TPS73018)  
High level enable input voltage  
Low level enable input voltage  
EN pin current  
RL = 14 , COUT = 1 µF  
2.7 V VIN5.5 V  
2.7 V VIN5.5 V  
VEN = 0  
µs  
V
1.7  
0
VIN  
0.7  
1
V
-1  
µA  
V
UVLO threshold  
VCC rising  
2.25  
2.65  
UVLO hysteresis  
100  
mV  
(1) Minimum VIN is 2.7 V or VOUT + VDO, whichever is greater.  
(2) Dropout is not measured for the TPS73018 and TPS73025 since minimum VIN = 2.7 V.  
(3) For adjustable versions, this applies only after VIN is applied; then VEN transitions high to low.  
3
TPS73001, TPS73018  
TPS73025  
TPS73030, TPS73033  
www.ti.com  
SBVS054ANOVEMBER 2004REVISED NOVEMBER 2004  
FUNCTIONAL BLOCK DIAGRAMS  
ADJUSTABLE VERSION  
IN  
OUT  
59 k  
UVLO  
2.45V  
Current  
Sense  
R1  
R2  
ILIM  
SHUTDOWN  
GND  
EN  
_
+
FB  
UVLO  
Thermal  
Shutdown  
External to  
the Device  
QuickStart  
Bandgap  
Reference  
1.22V  
250 k  
V
ref  
IN  
NR  
FIXED VERSION  
IN  
OUT  
UVLO  
2.45V  
Current  
Sense  
GND  
EN  
SHUTDOWN  
+
ILIM  
R1  
R2  
_
UVLO  
Thermal  
Shutdown  
R2 = 40 k  
QuickStart  
Bandgap  
Reference  
1.22V  
250 kΩ  
V
ref  
NR  
IN  
Terminal Functions  
TERMINAL  
SOT23 SOT23  
DESCRIPTION  
NAME  
NR  
ADJ  
FIXED  
Connecting an external capacitor to this pin bypasses noise generated by the internal bandgap. This  
improves power-supply rejection and reduces output noise.  
4
4
Driving the enable pin (EN) high turns on the regulator. Driving this pin low puts the regulator into shutdown  
mode. EN can be connected to IN if not used.  
EN  
3
3
FB  
GND  
IN  
5
2
1
6
N/A  
2
This terminal is the feedback input voltage for the adjustable device.  
Regulator ground  
1
Unregulated input to the device.  
OUT  
5
Output of the regulator.  
4
TPS73001, TPS73018  
TPS73025  
TPS73030, TPS73033  
www.ti.com  
SBVS054ANOVEMBER 2004REVISED NOVEMBER 2004  
TYPICAL CHARACTERISTICS (SOT23 PACKAGE)  
TPS73028  
OUTPUT VOLTAGE  
vs  
TPS73028  
OUTPUT VOLTAGE  
vs  
TPS73028  
GROUND CURRENT  
vs  
OUTPUT CURRENT  
JUNCTION TEMPERATURE  
JUNCTION TEMPERATURE  
2.805  
2.804  
2.803  
2.802  
2.801  
2.800  
2.799  
250  
200  
2.805  
2.800  
2.795  
2.790  
2.785  
V
= 3.8 V  
= 10 µF  
OUT  
= 25°C  
IN  
V
C
= 3.8 V  
IN  
C
T
= 10 µF  
I
= 1 mA  
OUT  
OUT  
J
I
= 1 mA  
OUT  
I
= 200 mA  
OUT  
150  
100  
50  
0
I
= 200 mA  
OUT  
2.798  
2.797  
2.780  
2.775  
V
C
= 3.8 V  
= 10 µF  
IN  
2.796  
2.795  
OUT  
−40 −25 −10 5 20 35 50 65 80 95 110 125  
(°C)  
0
50  
100  
(mA)  
150  
200  
−40 −2510 5 20 35 50 65 80 95 110 125  
I
T
J
(°C)  
T
J
OUT  
Figure 2.  
Figure 3.  
Figure 4.  
TPS73028 OUTPUT SPECTRAL  
ROOT MEAN SQUARE OUTPUT  
TPS73028  
DROPOUT VOLTAGE  
vs  
NOISE DENSITY  
vs  
NOISE  
vs  
FREQUENCY  
CNR  
JUNCTION TEMPERATURE  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0
180  
160  
140  
120  
100  
80  
60  
50  
40  
30  
20  
10  
V
C
= 2.7 V  
IN  
V
= 2.8 V  
= 200 mA  
= 10 µF  
V
I
C
= 3.8 V  
OUT  
IN  
= 10 µF  
I
= 200 mA  
OUT  
OUT  
C
OUT  
= 10 µF  
OUT  
= 0.001 µF  
OUT  
C
NR  
C
= 0.0047 µF  
I
= 200 mA  
NR  
C
OUT  
= 0.01 µF  
NR  
C
= 0.1 µF  
NR  
60  
40  
I
= 10 mA  
OUT  
20  
BW = 100 Hz to 100 kHz  
0.01  
0
0
100  
1 k  
10 k  
100 k  
−40 −2510 5 20 35 50 65 80 95 110 125  
0.001  
0.1  
Frequency (Hz)  
T
(°C)  
C
NR  
(µF)  
J
Figure 5.  
Figure 6.  
Figure 7.  
5
TPS73001, TPS73018  
TPS73025  
TPS73030, TPS73033  
www.ti.com  
SBVS054ANOVEMBER 2004REVISED NOVEMBER 2004  
TYPICAL CHARACTERISTICS (SOT23 PACKAGE) (continued)  
TPS73028  
RIPPLE REJECTION  
vs  
TPS73028 OUTPUT VOLTAGE,  
ENABLE VOLTAGE  
vs  
TPS73028  
LINE TRANSIENT RESPONSE  
FREQUENCY  
TIME (START-UP)  
100  
90  
4.8  
3.8  
4
I
= 200 mA  
OUT  
80  
V
V
= 3.8 V  
2
0
IN  
70  
= 2.8 V  
OUT  
I
= 200 mA  
OUT  
60  
C
T
= 2.2 µF  
I
= 200 mA  
OUT  
OUT  
= 25°C  
50  
40  
30  
C
C
= 2.2 µF  
= 0.01 µF  
J
OUT  
C
NR  
= 0.001 µF  
dv  
dt  
0µ.4sV  
NR  
+
20  
0
3
2
1
0
I
= 10 mA  
OUT  
C
= 0.0047 µF  
= 0.01 µF  
20  
NR  
V
= 3.8 V  
= 10 µF  
IN  
-20  
C
C
OUT  
= 0.01 µF  
10  
0
C
NR  
NR  
10  
100  
1 k  
10 k 100 k 1 M 10 M  
0
20 40 60 80 100 120 140 160 180 200  
0
10 20 30 40 50 60 70 80 90 100  
Frequency (Hz)  
Time (µs)  
Time (µs)  
Figure 8.  
Figure 9.  
Figure 10.  
DROPOUT VOLTAGE  
vs  
OUTPUT CURRENT  
TPS73028  
LOAD TRANSIENT RESPONSE  
POWER-UP / POWER-DOWN  
250  
200  
150  
100  
V
C
= 3.8 V  
IN  
V
R
= 3 V  
= 15  
OUT  
20  
= 10 µF  
OUT  
L
0
T
= 125°C  
J
−20  
T
J
= 25°C  
−40  
300  
di  
dt  
0.02A  
µs  
+
V
IN  
V
OUT  
200  
100  
T
= −55°C  
J
50  
0
1mA  
0
0
50 100 150200 250 300 350 400 450 500  
0
20 40 60 80 100 120 140 160 180 200  
(mA)  
1s/div  
I
Time (µs)  
OUT  
Figure 11.  
Figure 12.  
Figure 13.  
TYPICAL REGIONS OF STABILITY  
TYPICAL REGIONS OF STABILITY  
EQUIVALENT SERIES RESISTANCE  
EQUIVALENT SERIES RESISTANCE  
(ESR)  
vs  
OUTPUT CURRENT  
(ESR)  
vs  
OUTPUT CURRENT  
100  
10  
100  
10  
C
= 2.2 µF  
OUT  
C
= 10 µF  
OUT  
= 5.5 V  
V
= 5.5 V, V  
1.5 V  
IN  
OUT  
V
IN  
= −40°C to 125°C  
T
J
= −40°C to 125°C  
T
J
Region of Instability  
Region of Instability  
1
1
0.1  
0.1  
Region of Stability  
Region of Stability  
0.01  
0.01  
0.20  
0
0.02  
0.04  
0.06  
(A)  
0.08  
0.20  
0
0.02  
0.04  
0.06  
(A)  
0.08  
I
I
OUT  
OUT  
Figure 14.  
Figure 15.  
6
TPS73001, TPS73018  
TPS73025  
TPS73030, TPS73033  
www.ti.com  
SBVS054ANOVEMBER 2004REVISED NOVEMBER 2004  
APPLICATION INFORMATION  
The TPS730xx family of low-dropout (LDO) regulators has been optimized for use in noise-sensitive  
battery-operated equipment. The device features extremely low dropout voltages, high PSRR, ultralow output  
noise, low quiescent current (170 µA typically), and enable-input to reduce supply currents to less than 1 µA  
when the regulator is turned off.  
A typical application circuit is shown in Figure 16.  
V
IN  
VIN  
VOUT  
IN  
OUT  
NR  
TPS730xx  
V
OUT  
EN  
GND  
µ
µ
F
0.1  
F
2.2  
µ
0.01  
F
Figure 16. Typical Application Circuit  
External Capacitor Requirements  
A 0.1-µF or larger ceramic input bypass capacitor, connected between IN and GND and located close to the  
TPS730xx, is required for stability and improves transient response, noise rejection, and ripple rejection. A  
higher-value input capacitor may be necessary if large, fast-rise-time load transients are anticipated or the device  
is located several inches from the power source.  
Like most low dropout regulators, the TPS730xx requires an output capacitor connected between OUT and GND  
to stabilize the internal control loop. The minimum recommended capacitance is 2.2 µF. Any 2.2-µF or larger  
ceramic capacitor is suitable, provided the capacitance does not vary significantly over temperature. If load  
current is not expected to exceed 100 mA, a 1.0-µF ceramic capacitor can be used.  
The internal voltage reference is a key source of noise in an LDO regulator. The TPS730xx has an NR pin which  
is connected to the voltage reference through a 250-kinternal resistor. The 250-kinternal resistor, in  
conjunction with an external bypass capacitor connected to the NR pin, creates a low pass filter to reduce the  
voltage reference noise and, therefore, the noise at the regulator output. In order for the regulator to operate  
properly, the current flow out of the NR pin must be at a minimum, because any leakage current creates an IR  
drop across the internal resistor thus creating an output error. Therefore, the bypass capacitor must have  
minimal leakage current. The bypass capacitor should be no more than 0.1-µF to ensure that it is fully charged  
during the quickstart time provided by the internal switch shown in the Functional Block Diagrams  
As an example, the TPS73018 exhibits only 23 µVRMS of output voltage noise using a 0.01-µF ceramic bypass  
capacitor and a 2.2-µF ceramic output capacitor. Note that the output starts up slower as the bypass capacitance  
increases due to the RC time constant at the NR pin that is created by the internal 250-kresistor and external  
capacitor.  
Board Layout Recommendation to Improve PSRR and Noise Performance  
To improve ac measurements like PSRR, output noise, and transient response, it is recommended that the board  
be designed with separate ground planes for VIN and VOUT, with each ground plane connected only at the GND  
pin of the device. In addition, the ground connection for the bypass capacitor should connect directly to the GND  
pin of the device.  
7
 
TPS73001, TPS73018  
TPS73025  
TPS73030, TPS73033  
www.ti.com  
SBVS054ANOVEMBER 2004REVISED NOVEMBER 2004  
APPLICATION INFORMATION (continued)  
Power Dissipation and Junction Temperature  
Specified regulator operation is assured to a junction temperature of 125°C; the maximum junction temperature  
should be restricted to 125°C under normal operating conditions. This restriction limits the power dissipation the  
regulator can handle in any given application. To ensure the junction temperature is within acceptable limits,  
calculate the maximum allowable dissipation, PD(max), and the actual dissipation, PD, which must be less than or  
equal to PD(max)  
.
The maximum power dissipation limit is determined using Equation 1:  
TJ max TA  
PD max  
+
(
)
RQJA  
(1)  
Where:  
TJmax is the maximum allowable junction temperature.  
RθJA is the thermal resistance junction-to-ambient for the package (see the Dissipation Ratings Table).  
TA is the ambient temperature.  
The regulator dissipation is calculated using Equation 2:  
ǒ
Ǔ
PD + VIN*VOUT   IOUT  
(2)  
Power dissipation resulting from quiescent current is negligible. Excessive power dissipation triggers the thermal  
protection circuit.  
Programming the TPS73001 Adjustable LDO Regulator  
The output voltage of the TPS73001 adjustable regulator is programmed using an external resistor divider as  
shown in Figure 17. The output voltage is calculated using Equation 3:  
R1  
R2  
ǒ1 ) Ǔ  
VOUT + VREF  
 
(3)  
Where:  
VREF = 1.225 V typ (the internal reference voltage)  
Resistors R1 and R2 should be chosen for approximately 50-µA divider current. Lower value resistors can be  
used for improved noise performance, but the solution consumes more power. Higher resistor values should be  
avoided as leakage current into/out of FB across R1/R2 creates an offset voltage that artificially in-  
creases/decreases the feedback voltage and thus erroneously decreases/increases VOUT. The recommended  
design procedure is to choose R2 = 30.1 kto set the divider current at 50 µA, C1 = 15 pF for stability, and then  
calculate R1 using Equation 4:  
VOUT  
ǒ Ǔ  
R1 +  
  R2  
Vref * 1  
(4)  
In order to improve the stability of the adjustable version, it is suggested that a small compensation capacitor be  
placed between OUT and FB. For voltages < 1.8 V, the value of this capacitor should be 100 pF. For voltages >  
1.8 V, the approximate value of this capacitor can be calculated as shown in Equation 5:  
*7  
(3 x 10 ) x (R1 ) R2)  
C1  
+
(R1 x R2)  
(5)  
The suggested value of this capacitor for several resistor ratios is shown in the table below. If this capacitor is  
not used (such as in a unity-gain configuration) or if an output voltage < 1.8 V is chosen, then the minimum  
recommended output capacitor is 4.7 µF instead of 2.2 µF.  
8
TPS73001, TPS73018  
TPS73025  
TPS73030, TPS73033  
www.ti.com  
SBVS054ANOVEMBER 2004REVISED NOVEMBER 2004  
APPLICATION INFORMATION (continued)  
OUTPUT VOLTAGE  
PROGRAMMING GUIDE  
VIN  
VOUT  
IN  
OUT  
FB  
TPS730xx  
OUTPUT  
R1  
R2  
µ
1 F  
C1  
R1  
R2  
C1  
EN  
NR  
VOLTAGE  
1.22 V  
2.5 V  
µ
1 F  
GND  
short  
31.6 k  
51 k  
open  
0 pF  
µ
0.01 F  
30.1 k  
30.1 k  
30.1 k  
22 pF  
15 pF  
15 pF  
3.3 V  
3.6 V  
59 k  
Figure 17. TPS73001 Adjustable LDO Regulator Programming  
Regulator Protection  
The TPS730xx PMOS-pass transistor has a built-in back diode that conducts reverse current when the input  
voltage drops below the output voltage (e.g., during power-down). Current is conducted from the output to the  
input and is not internally limited. If extended reverse voltage operation is anticipated, external limiting might be  
appropriate.  
The TPS730xx features internal current limiting and thermal protection. During normal operation, the TPS730xx  
limits output current to approximately 400 mA. When current limiting engages, the output voltage scales back  
linearly until the overcurrent condition ends. While current limiting is designed to prevent gross device failure,  
care should be taken not to exceed the power dissipation ratings of the package or the absolute maximum  
voltage ratings of the device. If the temperature of the device exceeds approximately 165°C, thermal-protection  
circuitry shuts it down. Once the device has cooled down to below approximately 140°C, regulator operation  
resumes.  
9
PACKAGE OPTION ADDENDUM  
www.ti.com  
30-Mar-2005  
PACKAGING INFORMATION  
Orderable Device  
TPS73001DBVR  
TPS73001DBVRG4  
TPS73001DBVT  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
SOT-23  
DBV  
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
TPS73001DBVTG4  
TPS73018DBVR  
TPS73018DBVRG4  
TPS73018DBVT  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
TPS73018DBVTG4  
TPS73025DBVR  
TPS73025DBVRG4  
TPS73025DBVT  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
TPS73025DBVTG4  
TPS73030DBVR  
TPS73030DBVRG4  
TPS73030DBVT  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
TPS73030DBVTG4  
TPS73033DBVR  
TPS73033DBVRG4  
TPS73033DBVT  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
TPS73033DBVTG4  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan  
-
The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS  
&
no Sb/Br)  
-
please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
30-Mar-2005  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 2  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,  
enhancements, improvements, and other changes to its products and services at any time and to discontinue  
any product or service without notice. Customers should obtain the latest relevant information before placing  
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms  
and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI  
deems necessary to support this warranty. Except where mandated by government requirements, testing of all  
parameters of each product is not necessarily performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for  
their products and applications using TI components. To minimize the risks associated with customer products  
and applications, customers should provide adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,  
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process  
in which TI products or services are used. Information published by TI regarding third-party products or services  
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.  
Use of such information may require a license from a third party under the patents or other intellectual property  
of the third party, or a license from TI under the patents or other intellectual property of TI.  
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without  
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction  
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for  
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Resale of TI products or services with statements different from or beyond the parameters stated by TI for that  
product or service voids all express and any implied warranties for the associated TI product or service and  
is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.  
Following are URLs where you can obtain information on other Texas Instruments products and application  
solutions:  
Products  
Applications  
Audio  
Amplifiers  
amplifier.ti.com  
www.ti.com/audio  
Data Converters  
dataconverter.ti.com  
Automotive  
www.ti.com/automotive  
DSP  
dsp.ti.com  
Broadband  
Digital Control  
Military  
www.ti.com/broadband  
www.ti.com/digitalcontrol  
www.ti.com/military  
Interface  
Logic  
interface.ti.com  
logic.ti.com  
Power Mgmt  
Microcontrollers  
power.ti.com  
Optical Networking  
Security  
www.ti.com/opticalnetwork  
www.ti.com/security  
www.ti.com/telephony  
www.ti.com/video  
microcontroller.ti.com  
Telephony  
Video & Imaging  
Wireless  
www.ti.com/wireless  
Mailing Address:  
Texas Instruments  
Post Office Box 655303 Dallas, Texas 75265  
Copyright 2005, Texas Instruments Incorporated  
配单直通车
TPS73001DBVR产品参数
型号:TPS73001DBVR
Brand Name:Texas Instruments
是否无铅: 不含铅
是否Rohs认证: 符合
生命周期:Active
IHS 制造商:TEXAS INSTRUMENTS INC
零件包装代码:SOT-23
包装说明:SOT-23, 6 PIN
针数:6
Reach Compliance Code:compliant
ECCN代码:EAR99
HTS代码:8542.39.00.01
Factory Lead Time:6 weeks
风险等级:0.71
Samacsys Confidence:3
Samacsys Status:Released
Samacsys PartID:253945
Samacsys Pin Count:6
Samacsys Part Category:Integrated Circuit
Samacsys Package Category:SOT23 (6-Pin)
Samacsys Footprint Name:DBV0006A-_
Samacsys Released Date:2020-02-25 13:39:34
Is Samacsys:N
可调性:ADJUSTABLE
最大回动电压 1:0.21 V
标称回动电压 1:0.12 V
最大输入电压:5.5 V
最小输入电压:2.7 V
JESD-30 代码:R-PDSO-G6
JESD-609代码:e4
长度:2.9 mm
湿度敏感等级:1
功能数量:1
输出次数:1
端子数量:6
工作温度TJ-Max:125 °C
工作温度TJ-Min:-40 °C
最高工作温度:125 °C
最低工作温度:-40 °C
最大输出电流 1:0.2 A
最大输出电压 1:5.5 V
最小输出电压 1:1.22 V
封装主体材料:PLASTIC/EPOXY
封装代码:LSSOP
封装等效代码:TSOP6,.11,37
封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
包装方法:TR
峰值回流温度(摄氏度):260
认证状态:Not Qualified
调节器类型:ADJUSTABLE POSITIVE SINGLE OUTPUT LDO REGULATOR
座面最大高度:1.45 mm
子类别:Other Regulators
表面贴装:YES
技术:BICMOS
端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式:GULL WING
端子节距:0.95 mm
端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:1.6 mm
Base Number Matches:1
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