UC2573D现货热卖使用介绍供应商报价哪里找芯片批发报价-中国IC网-芯三七

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产品型号UC2573D的概述

UC2573D芯片概述 UC2573D是一款专为高效能DC-DC转换器设计的集成电路（IC）。该芯片采用现代化的控制技术，广泛应用于开关电源、LED驱动器和电池管理等领域。UC2573D的设计允许在高频操作下保持出色的效率，这使得它在追求性能和能效的电子设计中成为了首选。 UC2573D的详细参数 UC2573D的主要功能是实现电压转换，通常用于从较高的直流电压生成较低的直流电压。其输入电压范围一般在5V到60V之间，具体取决于设计需求。该芯片的开关频率可调，通常在100kHz到1MHz之间，提供了高效能和设计的灵活性。其典型的转换效率可达到90%以上，这对于减少热量产生和提高系统整体性能至关重要。在输出端，UC2573D可以提供高达3A的输出电流，适用于多种负载要求。由于内部集成了多个保护功能，如过流保护、过温保护和欠压锁定（UVLO），UC2573D在安全性方面表现优异，能够确保...

产品型号UC2573D的Datasheet PDF文件预览

PACKAGE OPTION ADDENDUM

www.ti.com

16-Jul-2010

PACKAGING INFORMATION

Status ⁽¹⁾

Eco Plan ⁽²⁾

MSL Peak Temp ⁽³⁾

Samples

Orderable Device

Package Type Package

Drawing

Pins

Package Qty

Lead/

Ball Finish

(Requires Login)

Samples Not Available

Request Free Samples

UC1573J

UC2573D

OBSOLETE

ACTIVE

CDIP

SOIC

TBD

Call TI

Green (RoHS

& no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM

CU NIPDAU N / A for Pkg Type

CU NIPDAU Level-1-260C-UNLIM

CU NIPDAU N / A for Pkg Type

UC2573DG4

UC2573DTR

UC2573DTRG4

UC2573N

ACTIVE

SOIC

PDIP

SOIC

PDIP

Green (RoHS

& no Sb/Br)

Request Free Samples

Purchase Samples

2500

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

Purchase Samples

Green (RoHS

& no Sb/Br)

Request Free Samples

Purchase Samples

UC2573NG4

UC3573D

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

UC3573DG4

UC3573DTR

UC3573DTRG4

UC3573N

Green (RoHS

& no Sb/Br)

2500

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

Purchase Samples

Green (RoHS

& no Sb/Br)

Request Free Samples

UC3573NG4

Green (RoHS

& no Sb/Br)

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

⁽²⁾Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

16-Jul-2010

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

⁽³⁾MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF UC1573, UC3573 :

Catalog: UC3573

•

Military: UC1573

•

NOTE: Qualified Version Definitions:

Catalog - TI's standard catalog product

•

Military - QML certified for Military and Defense Applications

•

Addendum-Page 2

PACKAGE MATERIALS INFORMATION

www.ti.com

15-Jul-2010

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package Package Pins

Type Drawing

SPQ

Reel

Pin1

Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant

(mm) W1 (mm)

UC2573DTR

UC3573DTR

SOIC

2500

330.0

12.4

6.4

5.2

2.1

8.0

12.0

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

15-Jul-2010

*All dimensions are nominal

Device

Package Type Package Drawing Pins

SPQ

Length (mm) Width (mm) Height (mm)

UC2573DTR

UC3573DTR

SOIC

2500

533.4

340.5

338.1

36.0

20.6

Pack Materials-Page 2

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other

changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest

issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and

complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale

supplied at the time of order acknowledgment.

TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms

and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary

to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily

performed.

TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and

applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide

adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or

other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information

published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or

endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the

third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration

and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered

documentation. Information of third parties may be subject to additional restrictions.

Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service

voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.

TI is not responsible or liable for any such statements.

Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements

concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support

that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which

anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause

harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use

of any TI components in safety-critical applications.

In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to

help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and

requirements. Nonetheless, such components are subject to these terms.

No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties

have executed a special agreement specifically governing such use.

Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in

military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components

which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and

regulatory requirements in connection with such use.

TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which

have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such

components to meet such requirements.

Products

Applications

Audio

www.ti.com/audio

amplifier.ti.com

dataconverter.ti.com

www.dlp.com

Automotive and Transportation www.ti.com/automotive

Communications and Telecom www.ti.com/communications

Amplifiers

Data Converters

DLP® Products

DSP

Computers and Peripherals

Consumer Electronics

Energy and Lighting

Industrial

www.ti.com/computers

www.ti.com/consumer-apps

www.ti.com/energy

dsp.ti.com

Clocks and Timers

Interface

www.ti.com/clocks

interface.ti.com

logic.ti.com

www.ti.com/industrial

www.ti.com/medical

Medical

Logic

Security

www.ti.com/security

Power Mgmt

Microcontrollers

RFID

power.ti.com

Space, Avionics and Defense

Video and Imaging

www.ti.com/space-avionics-defense

www.ti.com/video

microcontroller.ti.com

www.ti-rfid.com

www.ti.com/omap

OMAP Applications Processors

Wireless Connectivity

TI E2E Community

e2e.ti.com

www.ti.com/wirelessconnectivity

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

UC2573D相关文章

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UC2573D产品参数

型号:	UC2573D
是否无铅：	含铅
是否Rohs认证：	符合
生命周期：	Active
IHS 制造商：	ROCHESTER ELECTRONICS LLC
零件包装代码：	SOIC
包装说明：	GREEN, PLASTIC, SOIC-8
针数：	8
Reach Compliance Code：	unknown
风险等级：	5.27
模拟集成电路 - 其他类型：	SWITCHING CONTROLLER
控制模式：	VOLTAGE-MODE
控制技术：	PULSE WIDTH MODULATION
最大输入电压：	30 V
最小输入电压：	4.75 V
标称输入电压：	5 V
JESD-30 代码：	R-PDSO-G8
JESD-609代码：	e4
长度：	4.9 mm
湿度敏感等级：	1
功能数量：	1
端子数量：	8
最高工作温度：	85 °C
最低工作温度：	-40 °C
最大输出电流：	0.7 A
封装主体材料：	PLASTIC/EPOXY
封装代码：	SOP
封装形状：	RECTANGULAR
封装形式：	SMALL OUTLINE
峰值回流温度（摄氏度）：	260
座面最大高度：	1.75 mm
表面贴装：	YES
切换器配置：	SINGLE
最大切换频率：	115 kHz
温度等级：	INDUSTRIAL
端子面层：	NICKEL PALLADIUM GOLD
端子形式：	GULL WING
端子节距：	1.27 mm
端子位置：	DUAL
处于峰值回流温度下的最长时间：	NOT SPECIFIED
宽度：	3.9 mm

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