UC3610DW各脚功能电路原理芯片引脚定义引脚图及功能IC贸易商-中国IC网-芯三七

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产品型号UC3610DW的概述

UC3610DW芯片概述 UC3610DW是一款高性能的电池监测和保护芯片，广泛应用于电池管理系统（BMS）中。这款芯片具备多种功能，使其成为电池管理和监测领域的重要组成部分。它能够监测电池的电压、温度及充放电过程，从而确保电池的安全与可靠性。UC3610DW通常用于锂离子电池组、锂聚合物电池及其它可充电电池中，以实现长效和安全的电池性能。 UC3610DW的详细参数 UC3610DW芯片拥有一系列的技术参数，这些参数使其在不同的应用中表现出卓越的性能。以下是一些关键参数： - 工作电压范围：2.7V 至 5.5V - 工作温度范围：-40°C 至 85°C - 电流消耗：典型值为 20µA（待机状态） - 监测电压范围：2.5V 至 5.5V - 温度监测：支持外部热电偶或PT100 - 过压保护阈值：可自定义设置 - 过流保护：能实时监测放电电流，并根据需要触发保护机制 - 保护延...

产品型号UC3610DW的Datasheet PDF文件预览

UC1610

UC3610

SLUS339B − JUNE 1993 − REVISED DECEMBER 2004

DUAL SCHOTTKY DIODE BRIDGE

FEATURES

DESCRIPTION

Monolithic Eight-Diode Array

This eight-diode array is designed for

Exceptional Efficiency

Low Forward Voltage

Fast Recovery Time

High Peak Current

Small Size

high-current, low duty-cycle applications typical of

flyback voltage clamping for inductive loads. The

dual bridge connection makes this device

particularly applicable to bipolar driven stepper

motors.

The use of Schottky diode technology features

high efficiency through lowered forward voltage

drop and decreased reverse recovery time.

This single monolithic chip is fabricated in both

hermetic CERDIP and copper-leaded plastic

packages. The UC1610 in ceramic is designed for

−55°C to 125°C environments but with reduced

peak current capability. The UC2610 in plastic and

ceramic is designed for −25°C to 125°C

environments also with reduced peak current

capability; while the UC3610 in plastic has higher

current rating over a 0°C to 70°C temperature

range.

AVAILABLE OPTIONS

Packaged Devices

= T

SOIC Wide (DW)

UC1610DW

DIL (J)

DIL (N)

−55°C to 125°C

−25°C to 125°C

0°C to 70°C

UC1610J

UC2610J

UC3610J

UC1610N

UC2610N

UC3610N

UC2610DW

UC3610DW

THERMAL INFORMATION

PACKAGE

SOIC (DW) 16 pin

DIP (J) 8 pin

θja

θjc

(1)

50 − 100

(2)

125 − 160

(1)

DIP (N) 8 pin

103

NOTES: 1. Specified θja (junction-to-ambient) is for devices mounted to 5-in FR4 PC board with one ounce copper where noted. When

resistance range is given, lower values are for 5-in aluminum PC board. Test PWB was 0.062 in thick and typically used 0.635-mm

trace widths for power packages and 1.3-mm trace widths for non-power packages with a 100-mil x 100-mil probe land area at the

end of each trace.

2. θjc data values stated were derived from MIL−STD−1835B. MIL−STD−1835B states that the baseline values shown are worst case

(mean + 2s) for a 60-mil x 60-mil microcircuit device silicon die and applicable for devices with die sizes up to 14400 square mils.

For device die sizes greater than 14400 square mils use the following values; dual-in-line, 11°C/W; flat pack, 10°C/W; pin grid array,

10°C/W.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of Texas Instruments

standard warranty. Production processing does not necessarily include

testing of all parameters.

www.ti.com

UC1610

UC3610

SLUS339B − JUNE 1993 − REVISED DECEMBER 2004

N OR J PACKAGE

TOP VIEW

DW PACKAGE

TOP VIEW

absolute maximum ratings over operating free-air temperature (unless otherwise noted)^†^}

Peak inverse voltage (per diode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 V

Peak forward current

UC1611 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 A

UC2610 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 A

UC3611 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 A

Power dissipation at T = 70°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 W

Storage temperature range, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C

stg

Lead temperature (soldering, 10 seconds) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C

†

Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

Consult packaging section of databook for thermal limitations and considerations of package.

‡

electrical characteristics, all specifications apply to each individual diode, T_J= 25°C, T_A= T_J,

(except as noted)

PARAMETER

Forward voltage drop

TEST CONDITIONS

MIN

0.35

0.8

TYP

0.5

MAX UNITS

I = 100 mA

0.7

1.3

0.1

1.0

I = 1 A

1.0

0.01

0.1

= 40 V

= 40 V,

Leakage current

T = 100°C

Reverse recovery

Forward recovery

Junction capacitance

0.5 A forward to 0.5 A reverse

1 A forward to 1.1 V recovery

= 5 V

NOTE: At forward currents of greater than 1.0 A, a parasitic current of approximately 10 mA may be collected by adjacent diodes.

PRODUCT PREVIEW information concerns products in the formative or

design phase of development. Characteristic data and other

specifications are design goals. Texas Instruments reserves the right to

change or discontinue these products without notice.

www.ti.com

UC1610

UC3610

SLUS339B − JUNE 1993 − REVISED DECEMBER 2004

APPLICATION INFORMATION

REVERSE CURRENT

FORWARD CURRENT

VOLTAGE

5.0

1000

500

3.0

2.0

300

200

1.0

0.5

= 125 °C

100

0.3

0.2

= −55 °C

°C

0.1

0.05

0.03

0.02

= 25

0.01

= 25 °C

= 75 °C

0.005

= 125

°C

0.003

0.002

0.001

0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0

Forward Voltage − V

Reverse Voltage − V

Figure 1

Figure 2

FORWARD RECOVERY CHARACTERISTICS

REVERSE RECOVERY CHARACTERISTICS

°C

T = 25

= 0.5 A

°C

T = 25

1.1 V

Diode Voltage

(6 ns)

0 A

I = 1 A

I = 0.5 A

Diode Current

0 A

(4.6 ns)

Time, 2 ns/DIV

Figure 3

Figure 4

www.ti.com

PACKAGE OPTION ADDENDUM

www.ti.com

18-Sep-2008

PACKAGING INFORMATION

Orderable Device

Status ⁽¹⁾

Package Package

Pins Package Eco Plan ⁽²⁾Lead/Ball Finish MSL Peak Temp ⁽³⁾

Qty

Type

CDIP

PDIP

Drawing

UC1610J

UC1610J883B

UC2610N

OBSOLETE

ACTIVE

TBD

Call TI

50 Green (RoHS & CU NIPDAU N / A for Pkg Type

no Sb/Br)

UC2610NG4

UC3610DW

ACTIVE

PDIP

SOIC

PDIP

50 Green (RoHS & CU NIPDAU N / A for Pkg Type

no Sb/Br)

40 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR

no Sb/Br)

UC3610DWG4

UC3610DWTR

UC3610DWTRG4

UC3610N

40 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR

no Sb/Br)

2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR

no Sb/Br)

2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR

no Sb/Br)

50 Green (RoHS & CU NIPDAU N / A for Pkg Type

no Sb/Br)

UC3610NG4

50 Green (RoHS & CU NIPDAU N / A for Pkg Type

no Sb/Br)

UC3610Q

OBSOLETE

PLCC

TBD

Call TI

UC3610QTR

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and

package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS

compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame

retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is

provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the

accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take

reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on

incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited

information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI

to Customer on an annual basis.

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

18-Sep-2008

Addendum-Page 2

PACKAGE MATERIALS INFORMATION

www.ti.com

14-Jul-2012

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package Package Pins

Type Drawing

SPQ

Reel

Pin1

Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant

(mm) W1 (mm)

UC3610DWTR

SOIC

2000

330.0

16.4

10.75 10.7

2.7

12.0

16.0

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

14-Jul-2012

*All dimensions are nominal

Device

Package Type Package Drawing Pins

SOIC DW 16

SPQ

Length (mm) Width (mm) Height (mm)

367.0 367.0 38.0

UC3610DWTR

2000

Pack Materials-Page 2

MECHANICAL DATA

MCER001A – JANUARY 1995 – REVISED JANUARY 1997

JG (R-GDIP-T8)

CERAMIC DUAL-IN-LINE

0.400 (10,16)

0.355 (9,00)

0.280 (7,11)

0.245 (6,22)

0.065 (1,65)

0.045 (1,14)

0.310 (7,87)

0.290 (7,37)

0.063 (1,60)

0.015 (0,38)

0.020 (0,51) MIN

0.200 (5,08) MAX

0.130 (3,30) MIN

Seating Plane

0.023 (0,58)

0.015 (0,38)

0°–15°

0.100 (2,54)

0.014 (0,36)

0.008 (0,20)

4040107/C 08/96

NOTES: A. All linear dimensions are in inches (millimeters).

B. This drawing is subject to change without notice.

C. This package can be hermetically sealed with a ceramic lid using glass frit.

D. Index point is provided on cap for terminal identification.

E. Falls within MIL STD 1835 GDIP1-T8

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

MECHANICAL DATA

MPLC004A – OCTOBER 1994

FN (S-PQCC-J**)

PLASTIC J-LEADED CHIP CARRIER

20 PIN SHOWN

Seating Plane

0.004 (0,10)

0.180 (4,57) MAX

0.120 (3,05)

0.090 (2,29)

0.020 (0,51) MIN

0.032 (0,81)

0.026 (0,66)

D2/E2

0.021 (0,53)

0.013 (0,33)

0.050 (1,27)

0.007 (0,18)

0.008 (0,20) NOM

D/E

D1/E1

D2/E2

NO. OF

PINS

MIN

0.385 (9,78)

MAX

MIN

MAX

MIN

MAX

0.395 (10,03)

0.350 (8,89)

0.356 (9,04)

0.141 (3,58)

0.191 (4,85)

0.291 (7,39)

0.341 (8,66)

0.169 (4,29)

0.219 (5,56)

0.319 (8,10)

0.369 (9,37)

0.485 (12,32) 0.495 (12,57) 0.450 (11,43) 0.456 (11,58)

0.685 (17,40) 0.695 (17,65) 0.650 (16,51) 0.656 (16,66)

0.785 (19,94) 0.795 (20,19) 0.750 (19,05) 0.756 (19,20)

0.985 (25,02) 0.995 (25,27) 0.950 (24,13) 0.958 (24,33) 0.441 (11,20) 0.469 (11,91)

1.185 (30,10) 1.195 (30,35) 1.150 (29,21) 1.158 (29,41) 0.541 (13,74) 0.569 (14,45)

4040005/B 03/95

NOTES: A. All linear dimensions are in inches (millimeters).

B. This drawing is subject to change without notice.

C. Falls within JEDEC MS-018

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other

changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should

obtain the latest relevant information before placing orders and should verify that such information is current and complete. All

semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time

of order acknowledgment.

TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms

and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary

to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily

performed.

TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and

applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide

adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or

other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information

published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or

endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the

third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration

and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered

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Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service

voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.

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harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use

of any TI components in safety-critical applications.

In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to

help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and

requirements. Nonetheless, such components are subject to these terms.

No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties

have executed a special agreement specifically governing such use.

Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in

military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components

which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and

regulatory requirements in connection with such use.

TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which

have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such

components to meet such requirements.

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Applications

www.ti.com/audio

amplifier.ti.com

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UC3610DW相关文章

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UC3610DW产品参数

型号:	UC3610DW
Brand Name：	Texas Instruments
是否无铅：	不含铅
是否Rohs认证：	符合
生命周期：	Active
零件包装代码：	SOD
包装说明：	R-PDSO-G16
针数：	16
Reach Compliance Code：	compliant
ECCN代码：	EAR99
HTS代码：	8542.39.00.01
Factory Lead Time：	1 week
风险等级：	1.11
最小击穿电压：	50 V
配置：	COMPLEX
二极管元件材料：	SILICON
二极管类型：	BRIDGE RECTIFIER DIODE
最大正向电压 (VF)：	1.3 V
JEDEC-95代码：	MS-013AA
JESD-30 代码：	R-PDSO-G16
JESD-609代码：	e4
湿度敏感等级：	2
最大非重复峰值正向电流：	3 A
元件数量：	8
相数：	1
端子数量：	16
最高工作温度：	70 °C
最低工作温度：
最大输出电流：	3 A
封装主体材料：	PLASTIC/EPOXY
封装形状：	RECTANGULAR
封装形式：	SMALL OUTLINE
峰值回流温度（摄氏度）：	260
最大功率耗散：	1 W
认证状态：	Not Qualified
最大重复峰值反向电压：	50 V
最大反向电流：	1000 µA
反向测试电压：	40 V
子类别：	Other Diodes
表面贴装：	YES
技术：	SCHOTTKY
端子面层：	Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式：	GULL WING
端子位置：	DUAL
处于峰值回流温度下的最长时间：	NOT SPECIFIED
Base Number Matches：	1

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