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  • UC3638DWTR图
  • 深圳市宏捷佳电子科技有限公司

     该会员已使用本站12年以上
  • UC3638DWTR 现货库存
  • 数量60030 
  • 厂家TI/德州仪器 
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  • UC3638DW
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  • 数量3940 
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  • 北京耐芯威科技有限公司

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  • 数量4000 
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  • 封装 
  • 批号21+ 
  • 原装正品,公司现货
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  • 数量26800 
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  • 封装SOIC20 
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  • 假一罚十,原装进口正品现货供应,价格优势。
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  • UC3638DW
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  • 封装SOP20 
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  • 原装现货零成本有接受价格就出
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  • UC3638DWTR
  • 数量6500 
  • 厂家TI/德州仪器 
  • 封装SOIC-20 
  • 批号24+ 
  • 原装进口正品现货,假一罚十价格优势
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  • 数量3124 
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  • 数量876500 
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  • 数量4155 
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  • 数量72282 
  • 厂家TI/德州仪器 
  • 封装N/A 
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  • UC3638Q
  • 数量7116 
  • 厂家TI 
  • 封装N/A 
  • 批号2024 
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  • UC3638NG4
  • 数量3000 
  • 厂家TI/德州仪器 
  • 封装PDIP-20 
  • 批号22+ 
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  • UC3638N
  • 数量817 
  • 厂家TI 
  • 封装DIP 
  • 批号22+ 
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     该会员已使用本站14年以上
  • UC3638DW
  • 数量18530 
  • 厂家TI 
  • 封装SOP20 
  • 批号23+ 
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  • 数量920 
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  • 批号21+ 
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  • UC3638NG4
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  • UC3638DW
  • 数量1200 
  • 厂家TI 
  • 封装只做原装 
  • 批号23+ 
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产品型号UC3638的Datasheet PDF文件预览

PACKAGE OPTION ADDENDUM  
www.ti.com  
11-Apr-2013  
PACKAGING INFORMATION  
Orderable Device  
UC2638DW  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
0 to 70  
Top-Side Markings  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4)  
NRND  
SOIC  
SOIC  
SOIC  
SOIC  
PDIP  
PDIP  
SOIC  
SOIC  
SOIC  
SOIC  
PDIP  
PDIP  
DW  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
25  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
N / A for Pkg Type  
UC2638DW  
UC2638DWG4  
UC2638DWTR  
UC2638DWTRG4  
UC2638N  
NRND  
NRND  
DW  
DW  
DW  
N
25  
2000  
2000  
20  
Green (RoHS  
& no Sb/Br)  
UC2638DW  
UC2638DW  
UC2638DW  
UC2638N  
Green (RoHS  
& no Sb/Br)  
NRND  
Green (RoHS  
& no Sb/Br)  
NRND  
Green (RoHS  
& no Sb/Br)  
UC2638NG4  
UC3638DW  
NRND  
N
20  
Green (RoHS  
& no Sb/Br)  
N / A for Pkg Type  
UC2638N  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
DW  
DW  
DW  
DW  
N
25  
Green (RoHS  
& no Sb/Br)  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
N / A for Pkg Type  
UC3638DW  
UC3638DW  
UC3638DW  
UC3638DW  
UC3638N  
UC3638DWG4  
UC3638DWTR  
UC3638DWTRG4  
UC3638N  
25  
Green (RoHS  
& no Sb/Br)  
0 to 70  
2000  
2000  
20  
Green (RoHS  
& no Sb/Br)  
0 to 70  
Green (RoHS  
& no Sb/Br)  
0 to 70  
Green (RoHS  
& no Sb/Br)  
0 to 70  
UC3638NG4  
N
20  
Green (RoHS  
& no Sb/Br)  
N / A for Pkg Type  
0 to 70  
UC3638N  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
11-Apr-2013  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4)  
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a  
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
OTHER QUALIFIED VERSIONS OF UC3638 :  
Military: UC1638  
NOTE: Qualified Version Definitions:  
Military - QML certified for Military and Defense Applications  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
26-Jan-2013  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
UC2638DWTR  
UC3638DWTR  
SOIC  
SOIC  
DW  
DW  
20  
20  
2000  
2000  
330.0  
330.0  
24.4  
24.4  
10.8  
10.8  
13.0  
13.0  
2.7  
2.7  
12.0  
12.0  
24.0  
24.0  
Q1  
Q1  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
26-Jan-2013  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
UC2638DWTR  
UC3638DWTR  
SOIC  
SOIC  
DW  
DW  
20  
20  
2000  
2000  
367.0  
367.0  
367.0  
367.0  
45.0  
45.0  
Pack Materials-Page 2  
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