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产品型号UCC5618DWP的概述

UCC5618DWP 概述 UCC5618DWP 是由德州仪器（Texas Instruments）制造的一款专用高压增益放大器。它广泛应用于电源管理、信号调理以及其他需要高效和高精度信号处理的领域。该芯片具有高速响应、低失真以及广泛的工作电压范围，使其成为众多电子设计的理想选择。 UCC5618DWP 的主要功能是将微弱信号放大成可以进行处理的可用信号。凭借其出色的性能，该芯片在自动化控制系统、工业仪器、通信设备以及医疗设备等应用中展现出了良好的适应性。 UCC5618DWP 详细参数在了解 UCC5618DWP 的基本特性后，以下是该芯片的一些详细参数： - 工作电压范围：4.5V 到 17V - 输出电流能力：最大 1.5A - 增益带宽产品：大约 25 MHz - 输入失调电压：通常小于 2 mV - 输入共模电压范围：从 V- 到 V+ (根据接入的源电压而异) - 功耗：...

产品型号UCC5618DWP的Datasheet PDF文件预览

UCC5618

18-Line SCSI Terminator

FEATURES

DESCRIPTION

• Complies with SCSI, SCSI-2, SCSI-3, The UCC5618 provides 18 lines of active termination for a SCSI (Small

SPI and FAST-20 Standards

Computers Systems Interface) parallel bus. The SCSI standard recom-

mends and Fast-20 (Ultra) requires active termination at both ends of the

cable.

• 2pF Channel Capacitance During

Disconnect

Pin for pin compatible with the UC5601 and UC5608, the UCC5618 is ideal

for high performance 5V SCSI systems, Termpwr 4.0-5.25V. During discon-

nect the supply current is only 50µA typical, which makes the IC attractive

for lower powered systems.

• 50µA Supply Current in Disconnect

Mode

• 110Ω Termination

• SCSI Hot Plugging Compliant, 10nA

Typical

The UCC5618 is designed with a low channel capacitance of 2pF, which

eliminates effects on signal integrity from disconnected terminators at in-

terim points on the bus.

• +400mA Sinking Current for Active

Negation

The power amplifier output stage allows the UCC5618 to source full termi-

nation current and sink active negation current when all termination lines

are actively negated.

• –650mA Sourcing Current for

Termination

The UCC5618, as with all Unitrode terminators, is completely hot pluggable

and appears as high impedance at the terminating channels with

TRMPWR=0V or open.

• Trimmed Impedance to 5%

• Thermal Shutdown

• Current Limit

Internal circuit trimming is utilized, first to trim the 110Ω impedance, and

then most importantly, to trim the output current as close to the max

SCSI-3 spec as possible, which maximizes noise margin in fast SCSI op-

eration.

This device is offered in low thermal resistance versions of the industry

standard 28 pin wide body SOIC, TSSOP and PLCC.

BLOCK DIAGRAM

UDG-96005-1

Patented Circuit Design

6/98

UCC5618

ABSOLUTE MAXIMUM RATINGS

TEMPWR. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +7V

Signal Line Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . 0V to +7V

Regulator Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . 1A

Storage Temperature . . . . . . . . . . . . . . . . . . . –65°C to +150°C

Operating Junction Temperature . . . . . . . . . . –55°C to +150°C

Lead Temperature (Soldering, 10 Seconds) . . . . . . . . . . 300°C

All currents are positive into, negative out of the specified

terminal. Consult Packaging Section of Databook for thermal

limitations and considerations of packages.

CONNECTION DIAGRAMS

PLCC-28 (Top View)

QP Package

TSSOP-28 (Top View)

PWP Package

* DWP package pins 12–18 serve as both heatsink and signal

ground.

* PWP package pin 23 serves as signal ground; pins 7, 8, 9,

20, 21, and 22 serve as heatsink ground.

DIL-24 (Top View)

N Package

SOIC-28 (Top View)

DWP Package

* DWP package pin 28 serves as signal ground; pins 7, 8, 9,

20, 21, 22 serve as heatsink/ground.

Note: Drawings are not to scale.

UCC5618

ELECTRICAL CHARACTERISTICS: Unless otherwise stated these specifications apply for T_A= 0°C to 70°C,

TRMPWR = 4.75V, DISCNCT = 0V, T_A= T_J.

PARAMETER

Supply Current Section

TEST CONDITIONS

MIN

TYP

MAX UNITS

TERMPWR Supply Current

All Termination Lines = Open

µA

All Termination Lines = 0.2V

DISCNCT = TRMPWR

420

440

100

Power Down Mode

Output Section (Termination Lines)

Termination Impedance

Output High Voltage

See Figure 1

104.5

2.6

110

2.8

115.5

Ω

V_TRMPWR= 4V (Note 1)

V_LINE= 0.2V, T_J= 25°C

V_LINE= 0.2V

Max Output Current

–22.1 –23.3

–20.7 –23.3

–24

V_LINE= 0.2V, TERMPWR = 4V, T_J= 25°C

(Note 1)

–21

–23.3

V_LINE= 0.2V, TRMPWR = 4V (Note 1)

V_LINE= 0.5V

–20

–23

–24

–22.4

400

Output Leakage

DISCNCT = 2.4V, TRMPWR = 0V to 5.25V,

REG = 0.2V, V_LINE= 5.25V

Output Capacitance

Regulator Section

DISCNCT = 2.4V (Note 2)

3.5

Regulator Output Voltage

Drop Out Voltage

2.6

2.8

0.4

All Termination Lines = 0.2V

V_REG= 0V

0.8

Short Circuit Current

Sinking Current Capability

Thermal Shutdown

–475 –650 –950

°C

V_REG= 3.5V

200

400

170

800

Thermal Shutdown Hysteresis

Disconnect Section

Disconnect Threshold

Input Current

0.8

1.5

DISCNCT = 0V

–10

–30

µA

Note 1: Measuring each termination line while other 17 are low (0.2V).

Note 2: Guaranteed by design. Not 100% tested in production.

Procedure:

1) Measure V

N.L.

REG

2) Set V = 0.2V

3) Measure I

at 0.2V

MAX

4) Impedance =

UDG-96102-1

Figure 1. Termline Impedance Measurement Circuit

UCC5618

PIN DESCRIPTIONS

DISCNCT: Taking this pin high or leaving it open causes

the 18 channels to become high impedance and the chip

to go into low-power mode; a low state allows the

channels to provide normal termination.

LINE1–LINE18: 110Ω termination channels.

REG: Output of the internal 2.8V regulator.

TRMPWR: Power for the IC.

GND: Ground reference for the IC.

APPLICATION INFORMATION

UDG-96012-1

UNITRODE CORPORATION

7 CONTINENTAL BLVD. • MERRIMACK, NH 03054

TEL. (603) 424-2410 • FAX (603) 424-3460

PACKAGE OPTION ADDENDUM

www.ti.com

7-Oct-2013

PACKAGING INFORMATION

Orderable Device

UCC5618DWP

Status Package Type Package Pins Package

Eco Plan Lead/Ball Finish

MSL Peak Temp

Op Temp (°C)

0 to 70

Device Marking

Samples

Drawing

Qty

(1)

(2)

(3)

(4/5)

LIFEBUY

SOIC

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

Level-3-260C-168 HR

UCC5618DWP

UCC5618DWPG4

UCC5618DWPTR

UCC5618DWPTRG4

UCC5618PWP

LIFEBUY

1000

Green (RoHS

& no Sb/Br)

0 to 70

UCC5618DWP

UCC5618PWP

UCC5618QP

SOIC

Green (RoHS

& no Sb/Br)

0 to 70

SOIC

Green (RoHS

& no Sb/Br)

0 to 70

TSSOP

PLCC

Green (RoHS

& no Sb/Br)

0 to 70

UCC5618PWPG4

UCC5618PWPTR

UCC5618PWPTRG4

UCC5618QP

Green (RoHS

& no Sb/Br)

0 to 70

2000

Green (RoHS

& no Sb/Br)

0 to 70

Green (RoHS

& no Sb/Br)

0 to 70

Green (RoHS

& no Sb/Br)

0 to 70

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

⁽²⁾Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

7-Oct-2013

⁽³⁾MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

⁽⁴⁾There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

⁽⁵⁾Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2

PACKAGE MATERIALS INFORMATION

www.ti.com

5-Feb-2013

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package Package Pins

Type Drawing

SPQ

Reel

Pin1

Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant

(mm) W1 (mm)

UCC5618DWPTR

SOIC

1000

330.0

32.4

11.35 18.67

3.1

16.0

32.0

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

5-Feb-2013

*All dimensions are nominal

Device

Package Type Package Drawing Pins

SOIC DW 28

SPQ

Length (mm) Width (mm) Height (mm)

367.0 367.0 55.0

UCC5618DWPTR

1000

Pack Materials-Page 2

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other

changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest

issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and

complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale

supplied at the time of order acknowledgment.

TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms

and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary

to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily

performed.

TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and

applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide

adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or

other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information

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Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration

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No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties

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Applications

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www.ti.com/audio

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UCC5618DWP相关文章

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UCC5618DWPG4产品参数

型号:	UCC5618DWPG4
Brand Name：	Texas Instruments
是否无铅：	含铅
是否Rohs认证：	符合
生命周期：	Obsolete
IHS 制造商：	TEXAS INSTRUMENTS INC
零件包装代码：	SOIC
包装说明：	SOP, SOP28,.4
针数：	28
Reach Compliance Code：	unknown
ECCN代码：	EAR99
HTS代码：	8542.39.00.01
风险等级：	5.64
差分输出：	NO
接口集成电路类型：	SCSI BUS TERMINATOR
JESD-30 代码：	R-PDSO-G28
JESD-609代码：	e4
长度：	17.9 mm
湿度敏感等级：	2
功能数量：	1
信号线数量：	18
端子数量：	28
最高工作温度：	70 °C
最低工作温度：
封装主体材料：	PLASTIC/EPOXY
封装代码：	SOP
封装等效代码：	SOP28,.4
封装形状：	RECTANGULAR
封装形式：	SMALL OUTLINE
峰值回流温度（摄氏度）：	260
电源：	4.75 V
标称上拉电阻：	110 Ω
认证状态：	Not Qualified
座面最大高度：	2.65 mm
子类别：	Bus Terminators
最大供电电压：	5.25 V
最小供电电压：	4 V
标称供电电压：	4.75 V
表面贴装：	YES
技术：	BICMOS
温度等级：	COMMERCIAL
端子面层：	Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式：	GULL WING
端子节距：	1.27 mm
端子位置：	DUAL
处于峰值回流温度下的最长时间：	NOT SPECIFIED
宽度：	7.5 mm
Base Number Matches：	1

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产品型号UCC5618DWP的概述

产品型号UCC5618DWP的Datasheet PDF文件预览

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