ULN2003AFWG应用文章市场行情现货热卖使用介绍供应商报价-中国IC网-芯三七

当前位置：IC37首页_>U字母起始型号索引_>U字母起始型号索引第148页更新时间：2024-10-25 18:00:02

产品型号ULN2003AFWG的概述

ULN2003AFWG的概述及详细参数 ULN2003AFWG是一种广泛使用的高电流继电器驱动器，常见于各类电子设备中。这个芯片属于ULN2000系列，专为直接驱动电机和其他高功率负载而设计。ULN2003AFWG包含七个独立的达林顿对（Darlington pairs），输入为低电平逻辑信号，能够驱动高达500mA的负载电流，适用于连接继电器、电机和其他高功率设备。该芯片的工作电压范围为5V到50V，因此在多种电源条件下均可使用。同时，ULN2003AFWG内置了保护二极管，能够有效防止因感性负载所产生的反向电流对芯片造成损害。由于其高效性和耐用性，这款芯片在工业控制、家用电器和机器人技术等多个领域中得到了广泛应用。 ULN2003AFWG的详细参数 - 工作电压范围：5V至50V - 最大输出电流：500mA（每通道） - 最大功耗：总功耗应小于或等于70W - 输入电流：1.5...

产品型号ULN2003AFWG的Datasheet PDF文件预览

ULN2003,04APG/AFWG

TOSHIBA Bipolar Digital Integrated Circuit Silicon Monolithic

ULN2003APG,ULN2003AFWG

ULN2004APG,ULN2004AFWG

7-ch Darlington Sink Driver

ULN2003APG

ULN2004APG

The ULN2003APG/AFWG Series are high−voltage, high−current

darlington drivers comprised of seven NPN darlington pairs.

All units feature integral clamp diodes for switching inductive

loads.

Applications include relay, hammer, lamp and display (LED)

drivers.

Features

ULN2003AFWG

ULN2004AFWG

z Output current (single output): 500 mA max

z High sustaining voltage output: 50 V min

z Output clamp diodes

z Inputs compatible with various types of logic

z Package Type-APG: DIP-16pin

z Package Type-AFWG: SOL-16pin

Weight

Input Base

Resistor

DIP16−P-300-2.54A : 1.11 g (typ.)

SOL16−P-150-1.27A: 0.15 g (typ.)

Type

Designation

ULN2003APG/AFWG

ULN2004APG/AFWG

2.7 kΩ

TTL, 5 V CMOS

10.5 kΩ

6 to 15 V PMOS, CMOS

Pin Connection (top view)

2010-12-03

ULN2003,04APG/AFWG

Schematics (each driver)

ULN2003APG/AFWG

ULN2004APG/AFWG

Note: The input and output parasitic diodes cannot be used as clamp diodes.

Absolute Maximum Ratings (Ta = 25°C)

Characteristic

Symbol

Rating

Unit

Output sustaining voltage

Output current

−0.5 to 50

500

mA/ch

CE (SUS)

OUT

Input voltage

−0.5 to 30

Clamp diode reverse voltage

Clamp diode forward current

500

APG

AFWG

1.47

Power dissipation

1.25 (Note)

−40 to 85

−55 to 150

Operating temperature

Storage temperature

opr

°C

stg

Note: On PCB (Test Board: JEDEC 2s2p)

2010-12-03

ULN2003,04APG/AFWG

Recommended Operating Conditions (Ta = −40 to 85°C)

Characteristic

Symbol

Test Condition

Min

Typ.

Max

Unit

Output sustaining voltage

⎯

350

100

300

CE (SUS)

Duty = 10%

Duty = 50%

Duty = 10%

Duty = 50%

⎯

APG

Output current

AFWG

= 25 ms

7 Circuits

Ta = 85°C

T = 120°C

mA/ch

OUT

Input voltage

ULN2003A

2.8

6.2

Input voltage

(output on)

= 400 mA

OUT

= 800

IN (ON)

ULN2004A

ULN2003A

ULN2004A

⎯

0.7

1.0

Input voltage

(output off)

IN (OFF)

Clamp diode reverse voltage

Clamp diode forward current

⎯

350

0.76

0.65

APG

Power dissipation

AFWG

Ta = 85°C

(Note)

Note: On PCB (Test Board: JEDEC 2s2p)

2010-12-03

ULN2003,04APG/AFWG

Electrical Characteristics (Ta = 25°C unless otherwise noted)

Test

Circuit

Characteristic

Symbol

Test Condition

Min

Typ.

Max

Unit

= 50 V, Ta = 25°C

= 50 V, Ta = 85°C

⎯

100

1.6

1.3

1.1

⎯

Output leakage current

μA

CEX

= 350 mA, I = 500 μA

⎯

1.3

1.1

0.9

⎯

OUT

Collector−emitter saturation voltage

= 200 mA, I = 350 μA

⎯

CE (sat)

OUT

= 100 mA, I = 250 μA

⎯

OUT

DC Current transfer ratio

= 2 V, I = 350 mA

OUT

1000

⎯

μA

ULN2003A

= 2.4 V, I

= 9.5 V, I

= 350 mA

0.4

0.8

⎯

0.7

1.2

⎯

OUT

Input current

(output on)

IN (ON)

ULN2004A

⎯

Input current (output off)

ULN2003A

= 500 μA, Ta = 85°C

⎯

IN (OFF)

OUT

= 350 mA

= 200 mA

= 350 mA

= 200 mA

2.6

2.0

4.7

4.4

OUT

⎯

Input voltage

(output on)

= 2 V

= 800

IN (ON)

⎯

ULN2004A

⎯

= 50 V, Ta = 25°C

= 50 V, Ta = 85°C

⎯

Clamp diode reverse current

μA

⎯

100

2.0

⎯

Clamp diode forward voltage

Input capacitance

= 350 mA

⎯

= 50 V, R = 125 Ω

OUT

Turn−on delay

Turn−off delay

⎯

0.1

0.2

⎯

= 15 pF

μs

= 50 V, R = 125 Ω

= 15 pF

OUT

OFF

2010-12-03

ULN2003,04APG/AFWG

Test Circuit

1. I

2. V

3. I

IN (ON)

CEX

CE (sat), FE

4. I

5. V

6. I

IN (OFF)

IN (ON)

7. V

2010-12-03

ULN2003,04APG/AFWG

8. t , t

ON OFF

Note 1: Pulse width 50 μs, duty cycle 10%

Output impedance 50 Ω, t ≤ 5 ns, t ≤ 10 ns

Note 2: See below

Input Condition

Type Number

ULN2003A

ULN2004A

3 V

8 V

Note 3: C includes probe and jig capacitance.

Precautions for Using

This IC does not include built-in protection circuits for excess current or overvoltage.

If this IC is subjected to excess current or overvoltage, it may be destroyed.

Hence, the utmost care must be taken when systems which incorporate this IC are designed.

Utmost care is necessary in the design of the output line, COMMON and GND line since IC may be destroyed

due to short−circuit between outputs, air contamination fault, or fault by improper grounding.

2010-12-03

ULN2003,04APG/AFWG

2010-12-03

ULN2003,04APG/AFWG

– Ta

2.00

1.75

1.50

1.25

1.00

0.75

0.50

0.25

(1) Type-APG free air

(2) Type-AFWG on PCB

(Test Board: JEDEC 2s2p)

(1)

(2)

100

125

150

Ambient temperature Ta (°C)

2010-12-03

ULN2003,04APG/AFWG

Package Dimensions

Weight: 1.11 g (typ.)

2010-12-03

ULN2003,04APG/AFWG

Package Dimensions

Weight: 0.15 g (typ.)

2010-12-03

ULN2003,04APG/AFWG

Notes on Contents

1. Equivalent Circuits

The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory

purposes.

2. Test Circuits

Components in the test circuits are used only to obtain and confirm the device characteristics. These

components and circuits are not guaranteed to prevent malfunction or failure from occurring in the

application equipment.

IC Usage Considerations

Notes on Handling of ICs

(1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be

exceeded, even for a moment. Do not exceed any of these ratings.

Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result

injury by explosion or combustion.

(2) Use an appropriate power supply fuse to ensure that a large current does not continuously flow in

case of over current and/or IC failure. The IC will fully break down when used under conditions that

exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal

pulse noise occurs from the wiring or load, causing a large current to continuously flow and the

breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of

breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are

required.

(3) If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the

design to prevent device malfunction or breakdown caused by the current resulting from the inrush

current at power ON or the negative current resulting from the back electromotive force at power OFF.

IC breakdown may cause injury, smoke or ignition.

Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable,

the protection function may not operate, causing IC breakdown. IC breakdown may cause injury,

smoke or ignition.

(4) Do not insert devices in the wrong orientation or incorrectly.

Make sure that the positive and negative terminals of power supplies are connected properly.

Otherwise, the current or power consumption may exceed the absolute maximum rating, and

exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result

injury by explosion or combustion.

In addition, do not use any device that is applied the current with inserting in the wrong orientation

or incorrectly even just one time.

(5) Carefully select external components (such as inputs and negative feedback capacitors) and load

components (such as speakers), for example, power amp and regulator.

If there is a large amount of leakage current such as input or negative feedback condenser, the IC

output DC voltage will increase. If this output voltage is connected to a speaker with low input

withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause

smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied

Load (BTL) connection type IC that inputs output DC voltage to a speaker directly.

2010-12-03

ULN2003,04APG/AFWG

Points to Remember on Handling of ICs

(1) Heat Radiation Design

In using an IC with large current flow such as power amp, regulator or driver, please design the

device so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at

any time and condition. These ICs generate heat even during normal use. An inadequate IC heat

radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In

addition, please design the device taking into considerate the effect of IC heat radiation with

peripheral components.

(2) Back-EMF

When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to

the motor’s power supply due to the effect of back-EMF. If the current sink capability of the power

supply is small, the device’s motor power supply and output pins might be exposed to conditions

beyond absolute maximum ratings. To avoid this problem, take the effect of back-EMF into

consideration in system design.

About solderability, following conditions were confirmed

• Solderability

(1) Use of Sn-37Pb solder Bath

· solder bath temperature = 230°C

· dipping time = 5 seconds

· the number of times = once

· use of R-type flux

(2) Use of Sn-3.0Ag-0.5Cu solder Bath

· solder bath temperature = 245°C

· dipping time = 5 seconds

· the number of times = once

· use of R-type flux

2010-12-03

ULN2003,04APG/AFWG

RESTRICTIONS ON PRODUCT USE

•

Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information

in this document, and related hardware, software and systems (collectively “Product”) without notice.

This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with

TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.

Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are

responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and

systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily

injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the

Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of

all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes

for Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the

instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their

own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such

design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,

diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating

parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR

APPLICATIONS.

•

Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring

equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.

Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or

reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious

public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used

in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling

equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric

power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this

document.

•

Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.

Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any

applicable laws or regulations.

•

The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any

infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to

any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.

ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE

FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY

WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR

LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND

LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO

SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS

FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.

•

Do not use or otherwise make available Product or related software or technology for any military purposes, including without

limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile

technology products (mass destruction weapons). Product and related software and technology may be controlled under the

Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product

or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.

Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.

Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,

including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of

noncompliance with applicable laws and regulations.

2010-12-03

ULN2003AFWG相关文章

配单直通车

柒号芯城电子商务（深圳）有限公司服务专线: 0755-83209937 在线联系:

QQ：2881677436 复制

QQ：2881620402 复制

深圳市芯福林电子有限公司服务专线: 13418564337 在线联系:

QQ：2881495808 复制

QQ：308365177 复制

首天国际（深圳）科技有限公司服务专线: 0755-82807802/82807803 在线联系:

QQ：528164397 复制

QQ：1318502189 复制

北京元坤伟业科技有限公司服务专线: 010-62104931621064316210489162104791 在线联系:

QQ：857273081 复制

QQ：1594462451 复制

深圳市中利达电子科技有限公司服务专线: 0755-83200645/13686833545 在线联系:

QQ：1902134819 复制

QQ：2881689472 复制

ULN2003AFWG产品参数

型号:	ULN2003AFWG
是否无铅：	不含铅
是否Rohs认证：	符合
生命周期：	Obsolete
IHS 制造商：	TOSHIBA CORP
零件包装代码：	SOIC
包装说明：	SMALL OUTLINE, R-PDSO-G16
针数：	16
Reach Compliance Code：	unknown
ECCN代码：	EAR99
风险等级：	5.34
其他特性：	LOGIC LEVEL COMPATIBLE
最大集电极电流 (IC)：	0.5 A
集电极-发射极最大电压：	50 V
配置：	COMPLEX
最小直流电流增益 (hFE)：	1000
JESD-30 代码：	R-PDSO-G16
元件数量：	7
端子数量：	16
封装主体材料：	PLASTIC/EPOXY
封装形状：	RECTANGULAR
封装形式：	SMALL OUTLINE
峰值回流温度（摄氏度）：	NOT SPECIFIED
极性/信道类型：	NPN
认证状态：	Not Qualified
表面贴装：	YES
端子形式：	GULL WING
端子位置：	DUAL
处于峰值回流温度下的最长时间：	NOT SPECIFIED
晶体管应用：	SWITCHING
晶体管元件材料：	SILICON
Base Number Matches：	1

电子百科

产品导航

产品型号ULN2003AFWG的概述

产品型号ULN2003AFWG的Datasheet PDF文件预览

ULN2003AFWG相关产品

ULN2003AFWG相关文章

IC37:专业IC行业平台