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  • 北京元坤伟业科技有限公司

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产品型号UMK212BJ223MD-B的Datasheet PDF文件预览

大容量積層セクコデンサ  
HIGH VALUE MULTILAYER CERAMIC  
CAPACITORS  
K25VJ85C  
K55VJ125C  
K55VJ85C  
K25VJ85C  
K30VJ85C  
BJ  
X7R  
X5R  
F
BJ  
F
OPERATING TEMP.  
Y5V  
特長ꢀFEATURES  
Y電極にNi金属を使用し、端子電極部にメッキをしてあることにより、はん  
だ付け性および耐熱性にすぐれ、マイグレーションもほとんど発生せず、  
YThe use of Nickel(Ni) as material for both the internal and external elec-  
trodes improves the solderability and heat resistance characteristics. This  
高い信 almost completely eliminates migration and raises the level of reliability  
頼性を示します  
Y等価直  
列抵抗fESRgが小さく、ノイズ吸収性にすぐれています。特にタン  
タルおよびアルミ電解コンデンサに比較した場合  
Y高い許容リップル電流値  
significantly.  
YLow equivalent series resistance(ESR) provides excellent noise absorp-  
tion characteristics.  
Y高い定格電圧でありながら小型 形状  
YCompared to tantalum or aluminum electrolytic capacitors these ceramic  
Y絶縁抵抗、破壊電圧が高く信  
頼性にすぐれる  
capacitors offer a number of excellent features, including:  
等の特徴があります  
Higher permissible ripple current values  
Smaller case sizes relative to rated voltage  
Improved reliability due to higher insulation resistance and break-  
down voltage.  
用途ꢀAPPLICATIONS  
Yデジタル回路全般  
YGeneral digital circuit  
YPower supply bypass capacitors  
Y電源  
モジュール用 Liquid crystal modules  
駆動電圧ライン用 Liquid crystal drive voltage lines  
電圧の高いLSIICOPアンプ用  
Y平滑コンデンサ  
DC-DCコンバータf入力、出力側 用g  
バイパスコンデンサ  
電源  
LS I, I C, converters(both for input and output)  
YSmoothing capacitors  
DC-DC converters (both for input and output)  
スイッチング電源  
f2次側 用g  
Switching power supplies (secondary side)  
形名表記法ꢀORDERING CODE  
1
3
5
7
9
端子電極  
K
温度特性 fLg  
QF  
B J  
容量許容差  
別仕様  
K
定格電圧 fVDCg  
30  
A
4
メッキ品  
Mꢀ  
K
M
Z
M10  
%
%
%
標準  
80  
J
6.3  
10  
M10  
M20  
80  
L
M
20  
QW スペース  
10  
包装  
4
6
E
T
G
U
16  
25  
35  
50  
8
形状寸法 fEIAgLPWfmmg  
公称静電容量 fpFg  
B
単品 f 袋づめ g  
リールテーピング  
107f0603g  
212f0805g  
316f1206g  
325f1210g  
432f1812g  
1.6P0.8  
2.0P1.25  
3.2P1.6  
3.2P2.5  
4.5P3.2  
製品厚 み fmmg  
A
D
F
G
H
L
N
M
U
T
473  
105  
47,000  
1,000,000  
0.8  
0.85  
1.15  
1.25  
1.5  
1.6  
1.9  
11  
2
当社管理記号  
シリーズ名  
Q
標準品  
QW スペース  
M
積層コンデンサ  
2.5  
3.2  
_
J M K 3 1 6 B J 1 0 6 M L T Z  
1
2
3
4
5
6
7
8
9
10  
11  
1
3
5
7
9
Special code  
End termination  
Temperature characteristics code  
Capacitance tolerancesfLg  
Rated voltagefVDCg  
A
4
K
Plated  
K30VJ85C  
K
M
Z
M10  
K
Standard products  
QF  
B J  
B J  
Y5V  
X7R  
X5R  
J22NK82L  
K55VJ125C  
M15L  
K55VJ85C  
M15L  
J
6.3  
M20  
80  
M ꢀ  
20  
L
10  
10  
Packaging  
E
T
G
U
16  
25  
35  
50  
4
8
Dimensions(case size)fmmg  
B
Bulk  
QWBlank space  
Thicknessfmmg  
107f0603g  
212f0805g  
316f1206g  
325f1210g  
432f1812g  
1.6P0.8  
2.0P1.25  
3.2P1.6  
3.2P2.5  
4.5P3.2  
T
Tape & reel  
6
A
D
F
G
H
L
N
M
U
0.8  
0.85  
1.15  
1.25  
1.5  
1.6  
1.9  
11  
Nominal capacitancefpFg  
example  
2
Internal code  
473  
105  
47,000  
Q
Standard products  
Series name  
1,000,000  
Multilayer ceramic  
QWBlank space  
M
2.5  
3.2  
capacitors  
38  
外形寸法ꢀEXTERNAL DIMENSIONS  
TypefEIAg  
L
W
T
e
0.45M0.05  
f0.018M0.002g  
0.8M0.10  
f0.031M0.004g  
0.45M0.05  
f0.018M0.002g  
0.85M0.10  
f0.033M0.004g  
K
A
K
D
G
D
F
GMK107  
(0603)  
1.6M0.10  
f0.063M0.004g  
0.8M0.10  
f0.031M0.004g  
0.35M0.25  
f0.014M0.010g  
GMK212  
f0805g  
2.0M0.10  
f0.079M0.004g  
1.25M0.10  
f0.049M0.004g  
0.5M0.25  
f0.02M0.010g  
1  
1.25M0.10  
f0.049M0.004g  
0.85M0.10  
f0.033M0.004g  
1.15M0.10  
f0.045M0.004g  
1.25M0.10  
f0.049M0.004g  
1.6M0.20  
f0.063M0.008g  
0.85M0.10  
f0.033M0.004g  
1.15M0.10  
f0.045M0.004g  
1.5M0.10  
f0.059M0.004g  
1.9M0.20  
f0.075M0.008g  
2.5M0.20  
J0.35  
GMK316  
(1206)  
3.2M0.15  
f0.126M0.006g  
1.6M0.15  
f0.063M0.006g  
0.50000  
K0.25  
J0.014  
f0.020 ꢀꢀg  
K0.010  
G
L
4
D
F
GMK325  
(1210)  
3.2M0.30  
f0.126M0.012g  
2.5M0.20  
f0.098M0.008g  
0.6M0.3  
f0.024M0.012g  
H
N
M
M
U
f0.098M0.008g  
2.5M0.20  
f0.098M0.008g  
3.2M0.30  
f0.125M0.012g  
GMK432  
(1812)  
4.5M0.40  
f0.177M0.016g  
3.2M0.30  
f0.126M0.012g  
0.9M0.6  
f0.035M0.024g  
注:*1. M0.15mm公差あり  
Note: 1. Inclulding dimension tolerance M0.15mm (M0.006inch).  
UnitDmm finchg  
概略バリエーションꢀAVAILABLE CAPACITANCE RANGE  
汎用積層セラミックコンデンサꢀGeneral Multilayer Ceramic Capacitors  
低 積層セラミックコンデンサꢀLow profile Multilayer Ceramic Capacitors  
Cap Type  
Temp.Char  
VDC  
107  
BJ/X5R F/Y5V  
212  
BJ/X5R  
6.3  
316  
BJ/X7R BJ/X5R  
325  
BJ/X7R BJ/X7R BJ/X5R  
BJ/X7R  
16  
F/Y5V  
6.3  
F/Y5V  
6.3  
F/Y5V  
6.3  
6.3  
10  
D
10  
D
10  
6.3  
10  
25  
10  
6.3  
16  
10  
[AF] [pF:3digits]  
0.47 474  
0.68 684  
1.0 105  
2.2 225  
3.3 335  
4.7 475  
6.8 685  
10.0 106  
22.0 226  
K
D
D
D
K
K
D
F
D
D
F
D
F
D
D
F
D
D
F
F
温度特性  
Temperature characteristics  
温度特性コード  
静電容量許容差hLi  
tandhLi  
Temp. char.Code  
準拠規格  
温度範囲hCi  
Temperature range  
K25V85  
準温度hCi  
静電容量変化率hLi  
Capacitance change  
M10  
Capacitance tolerance  
Dissipation factor  
Applicable standard  
Ref. Temp.  
JIS  
EIA  
JIS  
EIA  
BJ  
20  
25  
20  
25  
M20fMg  
M10fKg  
BJ  
F
2.5%max.**  
7.0%max.***  
X7R*  
F
K55V125  
K25V85  
M15  
J
K
J
K
30  
80  
22  
82  
J80  
fZg  
K20  
Y5V  
K30V85  
H
Some exceptions apply, Refer to the available capacitance range table for the parts which are only available in X5R.  
10LmaxDJMKtype ; 107type fCX1.0AFg, 212type fCX0.47AFg, 316type fCX10AFg,  
325type fCX22AFg, 432type fCX47AFg  
HH3.5LmaxDLMKtype ; 107type fCT0.47AFg, 212type fCT1.0AFg, 316N325N432type  
EMKtype ; 107N212N316N325N432type  
H HH9.0LmaxDLMKtype ; 212type, 汎用316type fC10μFg, 低背  
316type fC4.7μFg  
TMKtype ; 316type fCX0.47AFg, 325type, 432type  
UMKtype ; 325type  
GMKtype ; 212type, 316type, 325type  
16%maxJMKtype ; 107212316325432type  
LMKtype ; 107325432, 汎用316type fC10μFg  
UMKtype ; 212type fCX0.1AFg, 316type fCU0.47AFg, 325type  
5.0LmaxDJMKtype ; 107type fCT1.0AFg, 212typefCT4.7AFg,  
316typefCT10AFg, 325typefCT22AFg, 432typefCT47AFg  
LMKtype ; 107type fCX0.47AFg, 212type fCU2.2AFg  
セレクションガイド  
Selection Guide  
アイテム一覧  
Part Numbers  
特性図  
Electrical Characteristics  
梱包  
Packaging  
頼性  
使用上の注意  
Reliability Data  
Precautions  
P.8  
etc  
P.40  
P.44  
P.78  
P.80  
P.86  
39  
汎用積層セラミックコンデンサGeneral Multilayer Ceramic Capacitors  
アイテム一覧 PART NUMBERS  
F107TYPE (0603 case size)  
静電容量  
許容差  
公ꢀꢀ称  
静電容量  
実装条件  
tanδ  
ꢀꢀみ  
温度特性  
Temperature  
characteristics  
定ꢀ格  
電ꢀ圧  
形ꢀꢀ名  
Soldering method  
Thickness  
Dissipation  
factor  
[L]Max.  
Capacitance  
tolerance  
Capacitance  
R:リフロー Reflow soldering  
W:フロー Wave soldering  
RatedVoltage  
Ordering code  
[mm] (inch)  
[AF]  
0.022  
0.1  
TMK107BJ223GA  
TMK107BJ104GA  
EMK107BJ333GA  
EMK107BJ473GA  
EMK107BJ683GA  
EMK107BJ104GA  
EMK107BJ154GA  
EMK107BJ224GA  
LMK107BJ334GA  
LMK107BJ474GA  
LMK107BJ684GA  
LMK107BJ105GA  
JMK107BJ225MA*  
EMK107F224ZA  
EMK107F474ZA  
LMK107F105ZA  
JMK107F225ZA  
BJ/X7R  
BJ/X5R  
2.5  
25V  
16V  
0.033  
0.047  
0.068  
0.1  
BJ/X7R  
R,W  
3.5  
M10L  
M20L  
0.8M0.10  
0.15  
0.22  
0.33  
0.47  
0.68  
1.0  
(0.031M0.004)  
BJ/X5R  
F/Y5V  
10V  
5
10  
7
R
6.3V  
16V  
2.2  
J20L  
0.22  
0.47  
1.0  
R,W  
R
0.8M0.10  
J80L  
K20L  
(0.031M0.004)  
10V  
16  
6.3V  
2.2  
形名のGには静電容量許容差記号が入ります。 G Please specify the capacitance tolerance code.  
*高温負荷試験の試験電圧は定格電圧の1.5倍  
* Test Voltage of Loading at high temperature test is 1.5 time of the rated voltage.  
F212TYPE (0805 case size)  
静電容量  
許容差  
公ꢀꢀ称  
静電容量  
実装条件  
tanδ  
ꢀꢀみ  
温度特性  
Temperature  
characteristics  
定ꢀ格  
電ꢀ圧  
形ꢀꢀ名  
Thickness  
Soldering method  
Dissipation  
factor  
[L]Max.  
Capacitance  
tolerance  
Capacitance  
R:リフロー Reflow soldering  
W:フロー Wave soldering  
(inch)  
RatedVoltage  
Ordering code  
[mm]  
[AF]  
0.022  
0.033  
0.047  
0.068  
0.1  
0.85M0.1  
UMK212BJ223GD  
UMK212BJ333GD  
UMK212BJ473GG  
UMK212BJ683GG  
UMK212BJ104GG  
UMK212BJ154GG  
UMK212BJ224GG  
GMK212BJ334GG  
GMK212BJ474GG  
TMK212BJ473GD  
TMK212BJ683GD  
EMK212BJ684GG  
EMK212BJ105GG  
LMK212BJ105GG  
LMK212BJ225MG  
JMK212BJ335MG  
JMK212BJ475MG  
JMK212BJ106MG*  
UMK212F224ZD  
UMK212F474ZG  
UMK212F105ZG  
EMK212F225ZG  
LMK212F475ZG  
JMK212F1 0 6 ZG  
(0.033M0.004)  
2.5  
3.5  
BJ/X7R  
50V  
1.25M0.1  
0.15  
0.22  
0.33  
0.47  
0.047  
0.068  
0.68  
1.0  
M10L  
M20L  
(0.049M0.004)  
BJ/X5R  
BJ/X7R  
BJ/X5R  
R,W  
35V  
25V  
16V  
10V  
6.3V  
0.85M0.1  
2.5  
3.5  
BJ/X7R  
(0.033M0.004)  
BJ/X5R  
BJ/X7R  
1.25M0.1  
1.0  
(0.049M0.004)  
2.2  
3.3  
5
BJ/X5R  
M20L  
R
1.25M0.15  
4.7  
(0.049M0.006)  
10  
10  
0.22  
0.47  
1.0  
0.85M0.1(0.033M0.004)  
50V  
7
R,W  
R
J80L  
K20L  
F/Y5R  
1.25M0.1  
2.2  
16V  
10V  
6.3V  
(0.049M0.004)  
4.7  
9
10  
16  
形名のGには静電容量許容差記号が入ります。 G Please specify the capacitance tolerance code.  
*高温負荷試験の試験電圧は定格電圧の1.5* Test Voltage of Loading at high temperature test is 1.5 time of the rated voltage.  
40  
アイテム一覧  
PART NUMBERS  
F316TYPE(1206 case size)  
静電容量  
許容差  
公ꢀꢀ称  
静電容量  
実装条件  
tanδ  
ꢀꢀみ  
定ꢀ格  
温度特性  
Temperature  
characteristics  
形ꢀꢀ名  
Soldering method  
Thickness  
電ꢀ圧  
Dissipation  
factor  
[L]Max.  
Capacitance  
tolerance  
Capacitance  
R:リフロー Reflow soldering  
W:フロー Wave soldering  
RatedVoltage  
Ordering code  
(inch)  
[AF]  
0.15  
0.22  
0.47  
0.68  
1.0  
UMK316BJ154GF  
1.15M0.1 (0.045M0.004)  
2.5  
3.5  
50V  
35V  
UMK316BJ224GL  
UMK316BJ474GL  
GMK316BJ684GL  
GMK316BJ105GL  
TMK316BJ154GD  
TMK316BJ224G F  
TMK316BJ334G F  
TMK316BJ684G L  
4
1.6M0.2 (0.063M0.008)  
M10L  
M20L  
0.15  
0.22  
0.33  
0.68  
0.68  
1.0  
0.85M0.1 (0.033M0.004)  
1.15M0.1 (0.045M0.004)  
BJ/X7R  
2.5  
3.5  
R,W  
25V  
16V  
1.6M0.2 (0.063M0.008)  
1.15M0.1 (0.045M0.004)  
EMK316BJ684  
EMK316BJ105  
G
G
F
F
EMK316BJ225ML  
EMK316BJ335ML  
EMK316BJ475ML  
LMK316BJ335ML  
LMK316BJ475ML  
JMK316BJ106ML  
JMK316BJ226ML*  
UMK316F225ZG  
GMK316F475ZG  
LMK316F106ZL  
LMK316F226ZL  
2.2  
3.3  
BJ/X5R  
BJ/X7R  
BJ/X5R  
4.7  
M20L  
3.3  
1.6M0.2 (0.063M0.008)  
10V  
4.7  
R
10  
5
6.3V  
22  
10  
50V  
35V  
2.2  
R,W  
R
7
1.25M0.1 (0.049M0.004)  
1.6M0.2 (0.063M0.008)  
J80L  
4.7  
F/Y5V  
K20L00  
10  
9
10V  
22  
16  
形名のGには静電容量許容差記号が入ります。 G Please specify the capacitance tolerance code.  
*高温負荷試験の試験電圧は定格電圧の1.5倍  
* Test Voltage of Loading at high temperature test is 1.5 time of the rated voltage.  
F325TYPE(1210 case size)  
静電容量  
許容差  
公ꢀꢀ称  
静電容量  
Capacitance  
[AF]  
実装条件  
tanδ  
ꢀꢀみ  
定ꢀ格  
温度特性  
Temperature  
characteristics  
形ꢀꢀ名  
Soldering method  
Thickness  
電ꢀ圧  
Dissipation  
factor  
[L]Max.  
Capacitance  
tolerance  
R:リフロー Reflow soldering  
W:フロー Wave soldering  
RatedVoltage  
Ordering code  
[mm] (inch)  
1.5M0.1 (0.059M0.004)  
M10L M 20L  
50V  
35V  
UMK325BJ105GH  
GMK325BJ225MN  
TMK325BJ225MH  
TMK325BJ335MN  
TMK325BJ475MN  
TMK325BJ106MM*  
EMK325BJ475MN  
EMK325BJ106MN  
LMK325BJ106MN  
JMK325BJ226MM  
JMK325BJ476MM*  
UMK325F475ZH  
GMK325F106ZH  
LMK325F226ZN  
JMK325F476ZN  
JMK325F107ZM*  
1.0  
2.2  
2.2  
3.3  
4.7  
10  
BJ/X7R  
BJ/X5R  
R,W  
1.9M0.2 (0.075M0.008)  
1.5M0.1 (0.059M0.004)  
BJ/X7R  
25V  
1.9M0.2 (0.075M0.008)  
2.5M0.2 (0.098M0.008)  
BJ/X5R  
3.5  
M20L  
4.7  
10  
BJ/X7R  
BJ/X5R  
BJ/X7R  
R
16V  
1.9M0.2 (0.075M0.008)  
10V  
10  
22  
5
10  
9
2.5M0.2 (0.098M0.008)  
1.5M0.1 (0.059M0.004)  
6.3V  
BJ/X5R  
47  
50V  
35V  
10V  
4.7  
10  
7
J80L  
K20L  
22  
F/Y5V  
R
1.9M0.2 (0.075M0.008)  
2.5M0.2 (0.098M0.008)  
47  
16  
6.3V  
100  
形名のGには静電容量許容差記号が入ります。 G Please specify the capacitance tolerance code.  
*高温負荷試験の試験電圧は定格電圧の1.5* Test Voltage of Loading at high temperature test is 1.5 time of the rated voltage.  
41  
アイテム一覧  
PART NUMBERS  
F432TYPE(1812 case size)  
静電容量  
許容差  
公ꢀꢀ称  
静電容量  
Capacitance  
[AF]  
実装条件  
tanδ  
ꢀꢀみ  
定ꢀ格  
温度特性  
Temperature  
characteristics  
形ꢀꢀ名  
Soldering method  
Thickness  
電ꢀ圧  
Dissipation  
factor  
[L]Max.  
Capacitance  
tolerance  
R:リフロー Reflow soldering  
W:フロー Wave soldering  
RatedVoltage  
Ordering code  
[mm] (inch)  
TMK432BJ106MM  
EMK432BJ226MM*  
LMK432BJ226MM  
JMK432BJ476MM*  
JMK432BJ107MU*  
LMK432F476ZM*  
JMK432F107ZM*  
25V  
16V  
10V  
10  
22  
3.5  
M20L  
22  
BJ/X5R  
F/Y5V  
R
R
2.5M0.2 (0.098M0.008)  
47  
5
6.3V  
100  
47  
10  
3.2M0.3 (0.125M0.012)  
2.5M0.2 (0.098M0.08)  
10V  
J80L  
K20L  
16  
6.3V  
100  
*高温負荷試験の試験電圧は定格電圧の1.5倍  
* Test voltage of Loading at high temperature test is 1.5 times of the rated voltage.  
42  
低 積層セラミックコンデンサLow profile Multilayer Ceramic Capacitors  
アイテム一覧 PART NUMBERS  
F107TYPE(0603 case size)  
静電容量  
許容差  
公ꢀꢀ称  
静電容量  
Capacitance  
[AF]  
実装条件  
tanδ  
ꢀꢀみ  
定ꢀ格  
電ꢀ圧  
温度特性  
Temperature  
characteristics  
形ꢀꢀ名  
Soldering method  
Thickness  
Dissipation  
factor  
[L]Max.  
Capacitance  
tolerance  
R:リフロー Reflow soldering  
W:フロー Wave soldering  
RatedVoltage  
(inch)  
Ordering code  
[mm]  
0.45M0.05  
JMK107BJ474K  
0.47  
1.0  
BJ/X5R  
F/Y5V  
5
M10L,M20L  
J80L,K20L  
6.3V  
R
(0.018M0.002)  
JMK107F105ZK  
16  
4
形名のGには静電容量許容差記号が入ります。  
F212TYPE(0805 case size)  
静電容量  
許容差  
公ꢀꢀ称  
静電容量  
Capacitance  
[AF]  
実装条件  
tanδ  
ꢀꢀみ  
定ꢀ格  
温度特性  
Temperature  
characteristics  
形ꢀꢀ名  
Soldering method  
Thickness  
電ꢀ圧  
Dissipation  
factor  
[L]Max.  
Capacitance  
tolerance  
R:リフロー Reflow soldering  
W:フロー Wave soldering  
RatedVoltage  
16V  
Ordering code  
[mm] (inch)  
EMK212BJ474D  
EMK212BJ684D  
LMK212BJ105D  
JMK212BJ105K  
LMK212F225ZD  
JMK212F475ZD  
0.47  
0.68  
1.0  
R, W  
R
M10L  
M20L  
0.85M0.1 (0.033M0.004)  
BJ/X7R  
3.5  
10V  
6.3V  
10V  
6.3V  
M10L  
0.45M0.05 (0.018M0.002)  
0.85M0.1 (0.033M0.004)  
1.0  
BJ/X5R  
F/Y5V  
5
9
2.2  
J80L  
K20L  
R
4.7  
16  
形名のGには静電容量許容差記号が入ります。  
F316TYPE(1206 case size)  
静電容量  
許容差  
公ꢀꢀ称  
静電容量  
Capacitance  
[AF]  
実装条件  
ꢀꢀみ  
tanδ  
定ꢀ格  
温度特性  
Temperature  
characteristics  
形ꢀꢀ名  
Thickness  
Soldering method  
電ꢀ圧  
Dissipation  
factor  
[L]Max.  
Capacitance  
tolerance  
R:リフロー Reflow soldering  
W:フロー Wave soldering  
RatedVoltage  
Ordering code  
[mm] (inch)  
0.85M0.1 (0.033M0.004)  
1.15M0.1 (0.045M0.004)  
LMK316BJ225MD  
10V  
2.2  
3.3  
3.3  
4.7  
6.8  
4.7  
10  
BJ/X7R  
BJ/X5R  
3.5  
5
LMK316BJ335MF  
JMK316BJ335MD  
R
R
M20L  
0.85M0.1 (0.033M0.004)  
JMK316BJ475MD  
JMK316BJ685MF  
LMK316F475ZD  
LMK316F106ZF  
JMK316F106ZD  
6.3V  
1.15M0.1 (0.045M0.004)  
0.85M0.1 (0.033M0.004)  
1.15M0.1 (0.045M0.004)  
0.85M0.1 (0.033M0.004)  
9
10V  
J80L  
K20L  
F/Y5V  
16  
6.3V  
10  
F325TYPE(1210 case size)  
静電容量  
許容差  
公ꢀꢀ称  
静電容量  
Capacitance  
[AF]  
実装条件  
tanδ  
ꢀꢀみ  
定ꢀ格  
温度特性  
Temperature  
characteristics  
形ꢀꢀ名  
Soldering method  
Thickness  
電ꢀ圧  
Dissipation  
factor  
[L]Max.  
Capacitance  
tolerance  
R:リフロー Reflow soldering  
W:フロー Wave soldering  
RatedVoltage  
Ordering code  
[mm] (inch)  
25V  
TMK325BJ105MD  
LMK325BJ335MD  
LMK325BJ475MF  
JMK325BJ106MD  
EMK325F106ZF  
LMK325F226ZF  
1.0  
3.3  
4.7  
10  
0.85M0.1 (0.033M0.004)  
BJ/X7R  
3.5  
R
R
10V  
M20L  
1.15M0.1 (0.045M0.004)  
0.85M0.1 (0.033M0.004)  
5
7
6.3V  
16V  
10V  
BJ/X5R  
F/Y5V  
J80L  
K20L  
10  
1.15M0.1 (0.045M0.004)  
16  
22  
43  
特性図ꢀELECTRICAL CHARACTERISTICS  
インピーダンスYESR–周 波数特性例 Example of Impedance ESR vs. Frequency characteristics  
Y当社積層セラミックコンデンサ例 (Taiyo Yuden multilayer ceramic capacitor)  
LMK107F105Z  
JMK107F225Z  
LMK212F475Z  
LMK316F106Z  
LMK316F226Z  
LMK432F476Z  
JMK432F107Z  
44  
特性図ꢀELECTRICAL CHARACTERISTICS  
LMK212BJ105K  
LMK212BJ225M  
4
JMK212BJ106M  
LMK432BJ226M  
45  
1/3  
RELIABILITY DATA  
Multilayer Ceramic Capacitor Chips  
Specified Value  
Temperature Compensating (Class 1)  
Standard High Frequency Type  
Item  
High Permitivity (Class 2)  
Standard Note1 High Value  
BDK55 to J125C  
Test Methods and Remarks  
High Capacitance Type BJfX7RgDK55 to J125C  
BJfX5RgDK55 to J85C  
BFfY5VgDK30 to J85C  
High Capacitance Type BJfX7RgDK55 to J125C  
BJfX5RgDK55 to J85C  
1.Operating Temperature K55 to J125C  
K25 to J85C  
Range  
FDK25 to J85C  
BDK55 to J125C  
FDK25 to J85C  
50VDC,25VDC  
2.Storage Temperature K55 to J125C  
K25 to J85C  
Range  
BFfY5VgDK30 to J85C  
4
3.Rated Voltage  
50VDC,25VDC,  
16VDC  
16VDC  
50VDC,35VDC,25VDC  
16VDC,10VDC,6.3VDC  
4DVC  
4.Withstanding Voltage  
Between terminals  
No breakdown or dam- No abnormality  
age  
No breakdown or damage  
Applied voltage: Rated voltageP3 (Class 1)  
Rated voltageP2.5 (Class 2)  
Duration: 1 to 5 sec.  
Charge/discharge current: 50mA max. (Class 1,2)  
5.Insulation Resistance  
10000 ME min.  
500 MEAF. or 10000 ME., whichever is the Applied voltage: Rated voltage  
smaller.  
Note 4  
Duration: 60M5 sec.  
Charge/discharge current: 50mA max.  
Measuring frequencyD  
6.Capacitance (Tolerance)  
0.5 to 5 pF: M0.25 pF  
1 to 10pF: M0.5 pF  
5 to 10 pF: M1 pF  
11 pF or over: M 5%  
M10%  
0.5 to 2 pF : M0.1 pF  
2.2 to 5.1 pF : M5%  
B: M10%, M20%  
J80  
BJDM10L, M20L  
J80  
K20  
Class1D 1HzM10%fCT1000pFg  
1HzM10%fCX1000pFg  
FD  
%
FD  
%
K20  
Class2D 1HzM10%fCT22 Fg  
A
120HzM10HzfCX22 Fg  
A
Measuring voltageD  
Class1D0.5V5VrmsfCT1000pFg  
1M0.2VrmsfCX1000pFg  
105TYPERQ, SQ, TQ, UQ only  
0.52pF: M0.1pF  
Class2D 1M0.2VrmsfCT22 Fg  
A
0.5M0.1VrmsfCX22 Fg  
A
2.220pF: M5%  
Bias application: None  
7.Q or Tangent of Loss Angle  
Under 30 pF  
Refer to detailed speci- B: 2.5% max.(50V, 25V)  
Multilayer:  
BJ: 2.5% max.(50V, 35V, 25V)  
3.5% max. F  
5.0% max. F  
10.0% max. F  
F: 7.0% max.  
Measuring frequencyD  
(tan d)  
: QU400 + 20C  
fication  
F: 5.0% max. (50V, 25V)  
Class1D 1HzM10%fCT1000pFg  
1HzM10%fCX1000pFg  
30 pF or over : QU1000  
C= Nominal capacitance  
Class2D 1HzM10%fCT22 Fg  
A
120HzM10HzfCX22 Fg  
A
Measuring voltageD  
5.0% max. F  
9.0% max. F  
11.0% max. F  
16.0% max. F  
20.0% max. F  
F See Table.1  
ꢀꢀꢀꢀꢀꢀ  
Class1D0.5V5VrmsfCT1000pFg  
1M0.2VrmsfCX1000pFg  
Class2D 1M0.2VrmsfCT22AFg  
0.5M0.1VrmsfCX22 Fg  
A
Bias application: None  
High-Frequency-Multilayer:  
Measuring frequency: 1GHz  
Measuring equipment: HP4291A  
Measuring jig: HP16192A  
8.Temperature  
(Without  
CKD0M250  
CHD0M60  
RHDK220M60  
fppm/Cg  
BDM10LfK25V85Cg  
J30  
According to JIS C 5102 clause 7.12.  
Temperature compensating:  
BJDM10LfK25V85Cg  
J30  
K80ꢀ  
Characteristic  
voltage  
CJD0M120  
FD  
LfK25V85Cg  
K80  
FD  
L fK25V85Cg  
of Capacitance  
application)  
CHD0M60  
BfX7RgDM15L  
J22  
Measurement of capacitance at 20C and 85C shall be made  
to calculate temperature characteristic by the following  
equation.  
BJfX7R,X5RgDM15L  
J22  
CGD0M30  
FfY5VgDꢀꢀL  
K82  
FfY5VgDꢀꢀL  
K82  
PKDK150M250  
PJDK150M120  
PHDK150M60  
RKDK220M250  
RJDK220M120  
RHDK220M60  
SKDK330M250  
SJDK330M120  
SHDK330M60  
TKDK470M250  
TJDK470M120  
THDK470M60  
UKDK750M250  
UJDK750M120  
SLD +350 to -1000 (ppm/C)  
Appearance:  
20  
(C85 - C)  
6
P 10 (ppm/C)  
C20 P QT ꢀ  
High permitivity:  
Change of maximum capacitance deviation in step 1 to 5  
Temperature at step 1: +20C  
Temperature at step 2: minimum operating temperature  
Temperature at step 3: +20C (Reference temperature)  
Temperature at step 4: maximum operating temperature  
Temperature at step 5: +20C  
Reference temperature for X7R, X5R and Y5V shall be +25C  
9.Resistance to Flexure of  
Substrate  
Appearance:  
Appearance:  
Warp: 2mm  
Testing board: paper-phenol substrate  
Thickness: 1.6mm  
No abnormality  
Capacitance change:  
No abnormality  
No abnormality  
Capacitance change: Capacitance change:  
The measurement shall be made with board in the bent position.  
Within M5% or M0.5 pF, WithinM0.5 pF  
B, BJ: Within M12.5%  
F: Within M30%  
whichever is larger.  
81  
2/3  
RELIABILITY DATA  
Multilayer Ceramic Capacitor Chips  
Specified Value  
Temperature Compensating (Class 1)  
Standard High Frequency Type  
Item  
High Permittivity (Class 2)  
Standard Note1 High Value  
Test Methods and Remarks  
10.Body Strength  
No mechanical dam-  
age.  
High Frequency Multilayer:  
Applied force: 5N  
Duration: 10 sec.  
4
11.Adhesion of Electrode  
No separation or indication of separation of electrode.  
Applied force: 5N  
Duration: 30M5 sec.  
12.Solderability  
At least 95% of terminal electrode is covered by new solder.  
Solder temperature: 230M5C  
Duration: 4M1 sec.  
13.Resistance to soldering  
Appearance: No abnor- Appearance: No abnor- Appearance: No abnormality  
Preconditioning: Thermal treatment (at 150C for 1 hr)  
(Applicable to Class 2.)  
mality  
mality  
Capacitance change: Within M7.5% (B, BJ)  
Within M20% (F)  
Capacitance change: Capacitance change:  
Within M 2.5% or Within M2.5%  
M0.25pF, whichever is Q: Initial value  
Solder temperature: 270M5C  
tan d: Initial value  
Duration: 3M0.5 sec.  
Insulation resistance: Initial value  
Preheating conditions: 80 to 100C, 2 to 5 min. or 5 to 10 min.  
150 to 200C, 2 to 5 min. or 5 to 10 min.  
Recovery: Recovery for the following period under the stan-  
dard condition after the test.  
larger.  
Insulation resistance: Withstanding voltage (between terminals): No  
Initial value abnormality  
Q: Initial value  
Insulation resistance: Withstanding voltage  
Initial value (between terminals): No  
24M2 hrs (Class 1)  
Withstanding voltage abnormality  
(between terminals): No  
abnormality  
48M4 hrs (Class 2)  
14.Thermal shock  
Appearance: No abnor- Appearance: No abnor- Appearance: No abnormality  
Preconditioning: Thermal treatment (at 150C for 1 hr)  
(Applicable to Class 2.)  
mality  
mality  
Capacitance change: Within M7.5% (B, BJ)  
Within M20% (F)  
Capacitance change: Capacitance change:  
Within M 2.5% or Within M0.25pF  
M0.25pF, whichever is Q: Initial value  
Conditions for 1 cycle:  
tan d: Initial value  
Step 1: Minimum operating temperature 30M3 min.  
Insulation resistance: Initial value  
Step 2: Room temperature  
15 min.  
larger.  
Insulation resistance: Withstanding voltage (between terminals): No Step 3: Maximum operating temperature 30M3 min.  
Q: Initial value  
Initial value  
abnormality  
Step 4: Room temperature  
Number of cycles: 5 times  
15 min.  
Insulation resistance: Withstanding voltage  
Initial value (between terminals): No  
Recovery after the test: 24M2 hrs (Class 1)  
48M4 hrs (Class 2)  
Withstanding voltage abnormality  
(between terminals): No  
abnormality  
15.Damp Heat (steady state)  
Appearance: No abnor- Appearance: No abnor- Appearance: No abnor- Appearance: No abnor- MultilayerD  
mality  
mality  
mality  
mality  
Preconditioning: Thermal treatment (at 150C for 1 hr)  
(Applicable to Class 2.)  
Capacitance change: Capacitance change: Capacitance change:  
Capacitance change:  
BJ: Within M12.5%  
F: Within M30%  
tan d: BJ: 5.0% max.  
7.5% max.F  
Within M5% or M0.5pF, Within M0.5pF,  
B: Within M12.5%  
F: Within M30%  
tan d: B: 5.0% max.  
F: 7.5% max.  
Temperature: 40M2C  
whichever is larger.  
Q:  
Insulation resistance:  
1000 ME min.  
Humidity: 90 to 95% RH  
+24  
Duration: 500 K hrs  
0
CU30 pF : QU350  
10TC30 pF: QU275  
+ 2.5C  
Recovery: Recovery for the following period under the stan-  
dard condition after the removal from test chamber.  
24M2 hrs (Class 1)  
20.0% max.F  
Insulation resistance: 50  
ME A F or 1000 ME  
whichever is smaller.  
F: 11.0% max.  
7.5% max.F  
C10 pF : QU200 +  
10C  
48M4 hrs (Class 2)  
16.0% max.F  
High-Frequency Multilayer:  
C: Nominal capacitance  
Insulation resistance:  
1000 ME min.  
19.5% max.F  
Temperature: 60M2C  
25.0% max.F  
Humidity: 90 to 95% RH  
+24  
FSee Table.2  
Duration: 500 K hrs  
0
Insulation resistance: Recovery: Recovery for the following period under the stan-  
50 MEAF or 1000 ME dard condition after the removal from test chamber.  
whichever is smaller.  
24M2 hrs (Class 1)  
83  
3/3  
RELIABILITY DATA  
Multilayer Ceramic Capacitor Chips  
Specified Value  
Temperature Compensating (Class 1)  
Item  
High Permittivity (Class 2)  
Test Methods and Remarks  
Standard  
High Frequency Type  
Standard Note1  
High Value  
16.Loading under Damp Heat Appearance: No abnor- Appearance: No abnor- Appearance: No abnor- Appearance: No abnor- According to JIS C 5102 Clause 9. 9.  
mality  
mality  
mality  
mality  
Multilayer:  
Capacitance change: Capacitance change:  
Capacitance change:  
Capacitance change: Preconditioning: Voltage treatment (Class 2)  
Within M 7.5% or CT2 pF: Within M0.4 pF B: Within M12.5%  
M0.75pF, whichever is CX2 pF: Within M0.75 F: Within M30%  
BJ: Within M 12.5% Temperature: 40M2C  
4
(50V, 35V, 25V)  
Within M 15.0% (16V Duration: 500 K hrs  
Humidity: 90 to 95% RH  
+24  
0
larger.  
pF  
tan d: B: 5.0% max.  
Q: CU30 pF: QU200  
CD Nominal capaci-  
F: 7.5% max.  
and under)  
Applied voltage: Rated voltage  
Charge and discharge current: 50mA max. (Class 1,2)  
C30 pF: QU 100 + tance  
10C/3  
F: Within M30%  
Insulation resistance: Insulation resistance: tan d: BJ: 5.0% max.  
Recovery: Recovery for the following period under the standard  
condition after the removal from test chamber.  
24M2 hrs (Class 1)  
CD Nominal capaci- 500 ME min.  
tance  
25 MEAF or 500 ME,  
7.5% max.F  
20.0% max.F  
F: 11.0% max.  
7.5% max.F  
whichever is the smaller.  
Insulation resistance:  
500 ME min.  
48M4 hrs (Class 2)  
High-Frequency Multilayer:  
16.0% max.F Temperature: 60M2C  
19.5% max.F Humidity: 90 to 95% RH  
+24  
25.0% max.F Duration: 500  
hrs  
0
K
FSee Table.2 Applied voltage: Rated voltage  
Insulation resistance: Charge and discharge current: 50mA max.  
25 MEAF or 500 ME, Recovery: 24M2 hrs of recovery under the standard condi-  
whichever is the smaller.  
tion after the removal from test chamber.  
17.Loading at High Tempera- Appearance: No abnor- Appearance: No abnor- Appearance: No abnor- Appearance: No abnormality According to JIS C 5102 clause 9.10.  
ture  
mality  
mality  
mality  
Capacitance change:  
BJ: Within M12.5%  
F: Within M30%  
tan d: 5.0% max.  
7.5% max.F  
Multilayer:  
Capacitance change:  
Within M3% or  
M0.3pF, whichever is  
larger.  
Capacitance change:  
Within M3% or  
M0.3pF, whichever is  
larger.  
Capacitance change:  
B: Within M12.5%  
F: Within M30%  
tan d:  
Preconditioning: Voltage treatment (Class 2)  
Temperature:125M3CfClass 1, Class 2: B, BJfX7Rgg  
85M2C (Class 2: BJ,F)  
+48  
Duration: 1000 K hrs  
0
Q: CU30 pF : QU350  
Insulation resistance:  
B: 4.0% max.  
20.0% max.F  
Applied voltage: Rated voltageP2, , P1.5Table.4)  
Recovery: Recovery for the following period under the stan-  
dard condition after the removal from test chamber.  
As for Ni product, thermal treatment shall be performed  
prior to the recovery.  
10TC30 pF: QU275 1000 ME min.  
+ 2.5C  
F: 7.5% max.  
F: 11.0% max.  
Insulation resistance:  
50 MEAF or 1000 ME,  
whichever is smaller.  
7.5% max.F  
16.0% max.F  
19.5% max.F  
25.0% max.F  
FSee Table.2  
C10 pF: QU200 +  
10C  
CD Nominal  
24M2 hrs (Class 1)  
capacitance  
48M4 hrs (Class 2)  
Insulation resistance:  
1000 ME min.  
Insulation resistance: 50 High-Frequency Multilayer:  
MEAF or 1000 ME, which- Temperature: 125M3C (Class 1)  
+48  
0
ever is smaller.  
Duration: 1000 K hrs  
Applied voltage: Rated voltageP2  
Recovery: 24M2 hrs of recovery under the standard condi-  
tion after the removal from test chamber.  
Note 1: For 105 type, specified in "High value".  
Note 2: Thermal treatment (Multilayer): 1 hr of thermal treatment at 150 J0 /K10 C followed by 48M4 hrs of recovery under the standard condition shall be performed before the measurement.  
Note 3: Voltage treatment (Multilayer): 1 hr of voltage treatment under the specified temperature and voltage for testing followed by 48M4 hrs of recovery under the standard condition shall be performed before the measurement.  
Note on standard condition: "standard condition" referred to herein is defined as follows: 5 to 35C of temperature, 45 to 85% relative humidity, and 86 to 106kPa of air pressure.  
When there are questions concerning measurement results: In order to provide correlation data, the test shall be conducted under condition of 20M2C of temperature, 65 to 70% relative humidity,  
and 86 to 106kPa of air pressure. Unless otherwise specified, all the tests are conducted under the "standard condition."  
Note 4: Specified value for Instration Resistance of Table.3 only: 100MEAF or more.  
Table. 2tand(D. F.)  
Table. 4  
Table. 1tand(D. F.)  
Item  
BJ: LMK type; 063 type  
105 type (CT0.047AF)  
Item  
Item  
tand  
tand  
BJ: JMK type; 107 type (C > 2.2AF)  
212type (C > 10AF)  
BJ: 105(C0.1μF)  
107(C1.0μF)  
212(C4.7μF)  
316(C10μF)  
325(C22μF)  
432(C47μF)  
F: 105(C0.47μF)  
212(C4.7μF)  
325(C22μF)  
432(C47μF)  
107 type (CT0.47AF)  
212 type (CT1AF)  
316 / 325 / 432 type  
316type (C > 22AF)  
325type (C > 47AF)  
EMK type; 105 / 107/ 212 / 316 / 325 type  
TMK type; 316 type(C > 0.47AF)  
325 / 432 type  
GMK type;212 type (CU0.22AF)  
316 type (CU0.68AF)  
325 type  
UMK type;212 type (C > 0.1AF)  
316 type (CU0.47AF)  
325 type (C T1AF)  
432type (C > 100AF)  
LMK type; 063 type  
3.5%max.  
7.5% max.  
105 type (CU0.056AF)  
107 type (CU0.47AF)  
212 type (C > 1AF)  
J4K, E4K, L4K, J2K, L2K type  
F: 105 type(50V, 25V)  
F: LMK type; 105 type (CW0.22AF)  
F: JMK type; 105 / 107 / 212 / 316 / 325 / 432 type  
LMK type; 107 type  
16.0% max.  
19.5% max.  
BJ: JMK type; 063 type  
107 type (C > 2.2AF)  
212type (C > 10AF)  
316type (C > 22AF)  
325type (C > 47AF)  
432type (C > 100AF)  
432 type  
BJ: Tabie.3  
20.0% max.  
25.0% max.  
5.0% max.  
F: JMK type; 105 type (C W1AF)  
AMK type; 063 type  
LMK type; 105 type (CU0.056AF)  
107 type (C > 0.47AF)  
212 type (C > 1AF)  
J4K, E4K, L4K, J2K, L2K type  
F: 105 type (50V, 25V)  
F: LMK type; 212 type  
Table. 3  
Item  
316 type (CW10AF)D汎用  
BJ: JMK type; 105 type (C W1AF)  
CW4.7AF)D低背  
(
107(C1.0μF)  
212(C4.7μF)  
316(C10μF)  
325(C22μF)  
432(C4.7μF)  
325 type (C > 10AF)  
EMK type;105 type (C U0.068AF)  
UMK type;325 type (C U4.7AF)  
BJ: Table. 3  
F: LMK type; 105 type (C W0.22AF)  
F: JMK type; 105 / 107 / 212 / 316 / 325 / 432 type  
LMK type; 107 type,325 type  
432 type,316 type (C > 10AF)  
F: JMK type; 105 type (C W1AF)  
AMK type; 063 type  
9.0% max.  
10.0% max.  
11.0% max.  
16.0% max.  
20.0% max.  
85  
梱包ꢀPACKAGING  
1標準数量 Standard quantity  
F袋づめ梱包 Bulk packagingꢀ  
2テーピング材質ꢀTaping material  
製品厚  
標準数量  
Standard  
quantity  
形式fEIAg  
Thickness  
Type  
mmfinchg  
0.5  
code  
[pcs]  
GMK105f0402g  
V
f0.020g  
E VK105f0402g  
GMK107f0603g  
W
A
Z
0.8  
f0.031g  
0.85  
D
G
D
D
D
F
f0.033g  
1.25  
f0.049g  
0.85  
f0.033g  
0.85  
f0.033g  
0.85  
f0.033g  
1.15  
f0.045g  
1.25  
f0.049g  
1.6  
f0.063g  
1.15  
f0.045g  
0.85  
f0.033g  
1.15  
f0.045g  
1.5  
f0.059g  
1.9  
GMK212f0805g  
G4K212f0805g  
G2K212f0805g  
1000  
GMK316f1206g  
G4K316f1206g  
G
L
F
D
F
GMK325f1210g  
H
N
M
f0.075g  
2.5  
f0.098g  
Fテーピング梱包ꢀTaped packagingꢀ  
標準数量  
Standard quantity  
[pcs]  
製品厚  
形式fEIAg  
Type  
Thickness  
紙テープ  
paper  
エンボステープ  
Embossed tape  
code  
mmfinchg  
0.3  
f0.012g  
GMK063f0201g  
P
E
E
15000  
10000  
GMK105f0402g  
E VK105f0402g  
0.5  
f0.020g  
V
W
0.45  
f0.018g  
0.8  
f0.031g  
0.45  
f0.018g  
0.85  
f0.033g  
1.25  
f0.049g  
0.85  
f0.033g  
0.85  
f0.033g  
0.85  
f0.033g  
1.15  
f0.045g  
1.25  
f0.049g  
1.6  
E
E
K
4000  
4000  
4000  
4000  
E
GMK107f0603g  
A
Z
3バルクカセットꢀBulk Cassette  
E
K
D
G
D
D
D
F
GMK212f0805g  
E
3000  
E
G4K212f0805g  
G2K212f0805g  
4000  
4000  
4000  
E
E
GMK316f1206g  
G4K316f1206g  
3000  
E
G
L
2000  
3000  
E
E
f0.063g  
1.15  
f0.045g  
F
0.85  
f0.033g  
1.15  
D
F
f0.045g  
2000  
E
1.5  
f0.059g  
1.9  
f0.075g  
2.5  
f0.098g  
2.5  
f0.098g  
2.5  
f0.098g  
GMK325f1210g  
H
N
M
M
M
500  
500  
500  
E
E
E
UnitDmm finchg  
GMK432f1812g  
GMK550f2220g  
105, 107, 212形状で個 別対応致しますのでお問い合せ下さい。  
Please contact any of our offices for accepting your requirement according  
to dimensions 0402, 0603, 0805.(inch)  
78  
梱包ꢀPACKAGING  
3テーピング寸法ꢀTaping dimensionsꢀ  
エンボステープꢀEmbossed tape12mmf0.472inches wideg  
ꢀ紙テープꢀPaper Tape8mmf0.315inches widegꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ  
4
Type  
Type  
チップ挿入部  
Chip Cavity  
B
挿入ピッチ テープ厚  
チップ挿入部  
挿入ピッチ テープ厚 み  
fEIAg  
Insertion Pitch Tape Thickness  
fEIAg  
Chip cavity  
Insertion Pitch Tape Thickness  
A
F
T
A
B
F
K
T
0.37M0.065 0.67M0.065 52.0M0.05  
f0.06M0.002g f0.027M0.002g f0.079M0.002g  
0.45max.  
0.018max.g  
0.8max.  
GMK063f0201g  
f
3.7M0.2  
4.9M0.2  
8.0M0.1  
3.4max. 0.6max.  
GMK432f1812g  
GMK550f2220g  
GMK105f0402g 0.65M0.15  
1.15M0.15 52.0M0.05  
f0.146M0.008g  
f0.193M0.008g  
f0.315M0.004g  
f0.134max.g f0.024max.g  
VK105f0402g f0.026M0.004g f0.045M0.004g f0.079M0.002g  
f0.031max.g  
1.0M0.2  
1.8M0.2  
4.0M0.1  
1.1max.  
5.4M0.2  
6.1M0.2  
8.0M0.1  
3.5max. 0.6max.  
GMK107f0603g  
f0.039M0.008g f0.071M0.008g f0.157M0.004g  
f0.043max.g  
f0.213M0.008g  
f0.240M0.008g  
f0.315M0.004g  
f0.138max.g f0.024max.g  
GMK212f0805g  
G4K212f0805g  
G2K212f0805g  
UnitDmmfinchg  
1.65M0.25  
2.4M0.2  
f0.065M0.008g f0.094M0.008g  
4.0M0.1  
1.1max.  
4リーダ部/空部ꢀLeader and Blank portionꢀ  
f0.157M0.004g  
f0.043max.g  
2.0M0.2  
3.6M0.2  
GMK316f1206g  
f0.079M0.008g f0.142M0.008g  
UnitDmmfinchg  
ꢀエンボステープꢀEmbossed tape8mmf0.315inches wideg  
5リール寸法ꢀReel sizeꢀ  
Type  
チップ挿入部  
挿入ピッチ テープ厚 み  
fEIAg  
Chip cavity  
Insertion Pitch Tape Thickness  
A
B
F
K
T
1.65M0.25  
2.4M0.2  
GMK212f0805g  
GMK316f1206g  
G4K316f1206g  
GMK325f1210g  
f0.065M0.008g f0.094M0.008g  
2.0M0.2  
3.6M0.2  
4.0M0.1 2.5max. 0.6max  
6トップテープ強度ꢀTop Tape Strengthꢀ  
f0.079M0.008g f0.142M0.008g f0.157M0.004g f0.098max.g f0.024max.g  
トップテープのはがし力は下図矢印方向にて0.10.7Nとなります。  
The top tape requires a peel-off force of 0.1V0.7N in the direction of the  
arrow as illustrated below.  
2.8M0.2  
3.6M0.2  
3.4max.  
f0.110M0.008g f0.142M0.008g  
f0.134max.g  
UnitDmmfinchg  
79  
1/6  
PRECAUTIONS  
Precautions on the use of Multilayer Ceramic Capacitors  
Stages  
Precautions  
Technical considerations  
1.Circuit Design  
Verification of operating environment, electrical rating and per-  
formance  
1. A malfunction in medical equipment, spacecraft, nuclear re-  
actors, etc. may cause serious harm to human life or have  
severe social ramifications. As such, any capacitors to be  
used in such equipment may require higher safety and/or reli-  
ability considerations and should be clearly differentiated from  
components used in general purpose applications.  
4
Operating Voltage (Verification of Rated voltage)  
1. The operating voltage for capacitors must always be lower  
than their rated values.  
If an AC voltage is loaded on a DC voltage, the sum of the two  
peak voltages should be lower than the rated value of the ca-  
pacitor chosen. For a circuit where both an AC and a pulse  
voltage may be present, the sum of their peak voltages should  
also be lower than the capacitor's rated voltage.  
2. Even if the applied voltage is lower than the rated value, the  
reliability of capacitors might be reduced if either a high fre-  
quency AC voltage or a pulse voltage having rapid rise time is  
present in the circuit.  
1.The following diagrams and tables show some examples of recommended patterns to  
prevent excessive solder amourts.flarger fillets which extend above the component end  
terminationsg  
2.PCB Design  
Pattern configurations  
(Design of Land-patterns)  
1. When capacitors are mounted on a PCB, the amount of sol-  
der used (size of fillet) can directly affect capacitor performance.  
Therefore, the following items must be carefully considered in  
the design of solder land patterns:  
Examples of improper pattern designs are also shown.  
(1) Recommended land dimensions for a typical chip capacitor land patterns for PCBs  
(1) The amount of solder applied can affect the ability of chips  
to withstand mechanical stresses which may lead to break-  
ing or cracking. Therefore, when designing land-patterns  
it is necessary to consider the appropriate size and con-  
figuration of the solder pads which in turn determines the  
amount of solder necessary to form the fillets.  
(2) When more than one part is jointly soldered onto the same  
land or pad, the pad must be designed so that each  
component's soldering point is separated by solder-re-  
sist.  
Recommended land dimensions for wave-soldering (unit: mm)  
Type  
107  
1.6  
0.8  
212  
2.0  
316  
3.2  
1.6  
325  
3.2  
2.5  
L
Size  
W
51.25  
A
B
0.8V1.0 1.0V1.4 1.8V2.5 1.8V2.5  
0.5V0.8 0.8V1.5 0.8V1.7 0.8V1.7  
0.6V0.8 0.9V1.2 1.2V1.6 1.8V2.5  
C
Recommended land dimensions for reflow-soldering (unit: mm)  
Type  
063  
0.6  
0.3  
105  
1.0  
0.5  
107  
1.6  
0.8  
212  
2.0  
316  
3.2  
1.6  
325  
3.2  
2.5  
432  
4.5  
3.2  
550  
5.7  
5.0  
L
Size  
W
51.25  
A
0.20V0.30 0.45V0.55 0.6V0.8 0.8V1.2 1.8V2.5 1.8V2.5 2.5V3.5 3.7V4.7  
0.20V0.30 0.40V0.50 0.6V0.8 0.8V1.2 1.0V1.5 1.0V1.5 1.5V1.8 1.5V2.3  
0.25V0.40 0.45V0.55 0.6V0.8 0.9V1.6 1.2V2.0 1.8V3.2 2.3V3.5 3.5V5.5  
B
C
Excess solder can affect the ability of chips to withstand mechanical stresses. Therefore,  
please take proper precautions when designing land-patterns.  
Type  
L
3164 circuits2124 circuits)  
3.2  
1.6  
2.0  
1.25  
W
a
0.7V0.9  
1
0.5V0.6  
0.5V0.6  
0.2V0.3  
0.5  
b
c
0.4V0.5  
0.8  
d
Type  
L
2122 circuits)  
2.0  
1.25  
W
a
0.5V0.6  
0.5V0.6  
0.5V0.6  
1.0  
b
c
d
87  
2/6  
PRECAUTIONS  
Precautions on the use of Multilayer Ceramic Capacitors  
Stages  
Precautions  
Technical considerations  
2.PCB Design  
(2) Examples of good and bad solder application  
Not recommended  
Recommended  
Items  
Mixed mounting  
of SMD and  
leaded  
components  
4
Component  
placement close  
to the chassis  
Hand-soldering  
of leaded  
components  
near mounted  
components  
Horizontal  
component  
placement  
Pattern configurations  
1-1. The following are examples of good and bad capacitor layout; SMD capacitors should  
be located to minimize any possible mechanical stresses from board warp or deflection.  
(Capacitor layout on panelized [breakaway] PC boards)  
1. After capacitors have been mounted on the boards, chips can  
be subjected to mechanical stresses in subsequent manufac-  
turing processes (PCB cutting, board inspection, mounting of  
additional parts, assembly into the chassis, wave soldering  
the reflow soldered boards etc.) For this reason, planning  
pattern configurations and the position of SMD capacitors  
should be carefully performed to minimize stress.  
Not recommended  
Recommended  
Deflection of  
the board  
1-2. To layout the capacitors for the breakaway PC board, it should be noted that the amount  
of mechanical stresses given will vary depending on capacitor layout. The example  
below shows recommendations for better design.  
1-3. When breaking PC boards along their perforations, the amount of mechanical stress on  
the capacitors can vary according to the method used. The following methods are listed  
in order from least stressful to most stressful: push-back, slit, V-grooving, and perfora-  
tion. Thus, any ideal SMD capacitor layout must also consider the PCB splitting proce-  
dure.  
89  
3/6  
PRECAUTIONS  
Precautions on the use of Multilayer Ceramic Capacitors  
Stages  
Precautions  
Technical considerations  
3.Considerations for auto-  
matic placement  
Adjustment of mounting machine  
1. If the lower limit of the pick-up nozzle is low, too much force may be imposed on the  
capacitors, causing damage. To avoid this, the following points should be considered  
before lowering the pick-up nozzle:  
1. Excessive impact load should not be imposed on the capaci-  
tors when mounting onto the PC boards.  
2. The maintenance and inspection of the mounters should be  
conducted periodically.  
(1)The lower limit of the pick-up nozzle should be adjusted to the surface level of the PC  
board after correcting for deflection of the board.  
(2)The pick-up pressure should be adjusted between 1 and 3 N static loads.  
(3)To reduce the amount of deflection of the board caused by impact of the pick-up nozzle,  
supporting pins or back-up pins should be used under the PC board. The following dia-  
grams show some typical examples of good pick-up nozzle placement:  
4
Not recommended  
Recommended  
Single-sided  
mounting  
Double-sided  
mounting  
2. As the alignment pin wears out, adjustment of the nozzle height can cause chipping or  
cracking of the capacitors because of mechanical impact on the capacitors. To avoid  
this, the monitoring of the width between the alignment pin in the stopped position, and  
maintenance, inspection and replacement of the pin should be conducted periodically.  
Selection of Adhesives  
1. Some adhesives may cause reduced insulation resistance. The difference between the  
shrinkage percentage of the adhesive and that of the capacitors may result in stresses  
on the capacitors and lead to cracking. Moreover, too little or too much adhesive applied  
to the board may adversely affect component placement, so the following precautions  
should be noted in the application of adhesives.  
1. Mounting capacitors with adhesives in preliminary assembly,  
before the soldering stage, may lead to degraded capacitor  
characteristics unless the following factors are appropriately  
checked; the size of land patterns, type of adhesive, amount  
applied, hardening temperature and hardening period. There-  
fore, it is imperative to consult the manufacturer of the adhe-  
sives on proper usage and amounts of adhesive to use.  
(1)Required adhesive characteristics  
a. The adhesive should be strong enough to hold parts on the board during the mounting &  
solder process.  
b. The adhesive should have sufficient strength at high temperatures.  
c. The adhesive should have good coating and thickness consistency.  
d. The adhesive should be used during its prescribed shelf life.  
e. The adhesive should harden rapidly  
f. The adhesive must not be contaminated.  
g. The adhesive should have excellent insulation characteristics.  
h. The adhesive should not be toxic and have no emission of toxic gasses.  
(2)The recommended amount of adhesives is as follows;  
Figure  
212/316 case sizes as examples  
0.3mm min  
a
b
c
100 V120 Am  
Adhesives should not contact the pad  
91  
4/6  
PRECAUTIONS  
Precautions on the use of Multilayer Ceramic Capacitors  
Stages  
Precautions  
Technical considerations  
Selection of Flux  
1-1. When too much halogenated substance (Chlorine, etc.) content is used to activate the  
flux, or highly acidic flux is used, an excessive amount of residue after soldering may  
lead to corrosion of the terminal electrodes or degradation of insulation resistance on  
the surface of the capacitors.  
4. Soldering  
1. Since flux may have a significant effect on the performance of  
capacitors, it is necessary to verify the following conditions  
prior to use;  
(1)Flux used should be with less than or equal to 0.1 wt%  
(equivelent to chroline) of halogenated content. Flux hav-  
ing a strong acidity content should not be applied.  
(2)When soldering capacitors on the board, the amount of  
flux applied should be controlled at the optimum level.  
(3)When using water-soluble flux, special care should be taken  
to properly clean the boards.  
1-2. Flux is used to increase solderability in flow soldering, but if too much is applied, a large  
amount of flux gas may be emitted and may detrimentally affect solderability. To mini-  
mize the amount of flux applied, it is recommended to use a flux-bubbling system.  
1-3. Since the residue of water-soluble flux is easily dissolved by water content in the air, the  
residue on the surface of capacitors in high humidity conditions may cause a degrada-  
tion of insulation resistance and therefore affect the reliability of the components. The  
cleaning methods and the capability of the machines used should also be considered  
carefully when selecting water-soluble flux.  
4
Soldering  
1-1. Preheating when soldering  
Temperature, time, amount of solder, etc. are specified in accor-  
dance with the following recommended conditions.  
Heating: Ceramic chip components should be preheated to within 100 to 130C of the sol-  
dering.  
Cooling: The temperature difference between the components and cleaning process should  
not be greater than 100C.  
Ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concen-  
trated heating or rapid cooling. Therefore, the soldering process must be conducted with  
great care so as to prevent malfunction of the components due to excessive thermal shock.  
Recommended conditions for soldering  
[Reflow soldering]  
Temperature profile  
Caution  
1. The ideal condition is to have solder mass (fillet) controlled to 1/2 to 1/3 of the thick-  
ness of the capacitor, as shown below:  
2. Because excessive dwell times can detrimentally affect solderability, soldering dura-  
tion should be kept as close to recommended times as possible.  
[Wave soldering]  
Temperature profile  
Caution  
1. Make sure the capacitors are preheated sufficiently.  
2. The temperature difference between the capacitor and melted solder should not be  
greater than 100 to130C  
3. Cooling after soldering should be as gradual as possible.  
4. Wave soldering must not be applied to the capacitors designated as for reflow solder-  
ing only.  
93  
5/6  
PRECAUTIONS  
Precautions on the use of Multilayer Ceramic Capacitors  
Stages  
Precautions  
Technical considerations  
[Hand soldering]  
4. Soldering  
Temperature profile  
4
Caution  
1. Use a 20W soldering iron with a maximum tip diameter of 1.0 mm.  
2. The soldering iron should not directly touch the capacitor.  
5.Cleaning  
Cleaning conditions  
1. The use of inappropriate solutions can cause foreign substances such as flux residue to  
adhere to the capacitor or deteriorate the capacitor's outer coating, resulting in a degra-  
dation of the capacitor's electrical properties (especially insulation resistance).  
2. Inappropriate cleaning conditions (insufficient or excessive cleaning) may detrimentally  
affect the performance of the capacitors.  
1. When cleaning the PC board after the capacitors are all  
mounted, select the appropriate cleaning solution according  
to the type of flux used and purpose of the cleaning (e.g. to  
remove soldering flux or other materials from the production  
process.)  
2. Cleaning conditions should be determined after verifying,  
through a test run, that the cleaning process does not affect  
the capacitor's characteristics.  
(1)Excessive cleaning  
In the case of ultrasonic cleaning, too much power output can cause excessive vibration of  
the PC board which may lead to the cracking of the capacitor or the soldered portion, or  
decrease the terminal electrodes' strength. Thus the following conditions should be  
carefully checked;  
Ultrasonic output  
Below 20 W/b  
Ultrasonic frequency  
Below 40 kHz  
Ultrasonic washing period 5 min. or less  
6.Post cleaning processes  
1. With some type of resins a decomposition gas or chemical  
reaction vapor may remain inside the resin during the harden-  
ing period or while left under normal storage conditions result-  
ing in the deterioration of the capacitor's performance.  
2. When a resin's hardening temperature is higher than the  
capacitor's operating temperature, the stresses generated by  
the excess heat may lead to capacitor damage or destruction.  
The use of such resins, molding materials etc. is not recom-  
mended.  
Breakaway PC boards (splitting along perforations)  
1. When splitting the PC board after mounting capacitors and  
other components, care is required so as not to give any  
stresses of deflection or twisting to the board.  
7.Handling  
2. Board separation should not be done manually, but by using  
the appropriate devices.  
Mechanical considerations  
1. Be careful not to subject the capacitors to excessive mechani-  
cal shocks.  
(1)If ceramic capacitors are dropped onto the floor or a hard  
surface, they should not be used.  
(2)When handling the mounted boards, be careful that the  
mounted components do not come in contact with or bump  
against other boards or components.  
95  
6/6  
PRECAUTIONS  
Precautions on the use of Multilayer Ceramic Capacitors  
Stages  
Precautions  
Technical considerations  
8.Storage conditions  
Storage  
1. If the parts are stored in a high temperature and humidity environment, problems such  
as reduced solderability caused by oxidation of terminal electrodes and deterioration of  
taping/packaging materials may take place. For this reason, components should be used  
within 6 months from the time of delivery. If exceeding the above period, please check  
solderability before using the capacitors.  
1. To maintain the solderability of terminal electrodes and to keep  
the packaging material in good condition, care must be taken  
to control temperature and humidity in the storage area. Hu-  
midity should especially be kept as low as possible.  
YRecommended conditions  
4
Ambient temperature  
Humidity  
Below 40C  
Below 70% RH  
The ambient temperature must be kept below 30C. Even un-  
der ideal storage conditions capacitor electrode solderability  
decreases as time passes, so ceramic chip capacitors should  
be used within 6 months from the time of delivery.  
YThe packaging material should be kept where no chlorine or  
sulfur exists in the air.  
2. The capacitance value of high dielectric constant capacitors  
(type 2 &3) will gradually decrease with the passage of time,  
so this should be taken into consideration in the circuit design.  
If such a capacitance reduction occurs, a heat treatment of  
150C for 1hour will return the capacitance to its initial level.  
97  
配单直通车
UMK212BJ223MD-B产品参数
型号:UMK212BJ223MD-B
是否无铅: 不含铅
是否Rohs认证: 符合
生命周期:Obsolete
IHS 制造商:TAIYO YUDEN CO LTD
包装说明:CHIP
Reach Compliance Code:unknown
ECCN代码:EAR99
HTS代码:8532.24.00.20
风险等级:5.34
电容:0.022 µF
电容器类型:CERAMIC CAPACITOR
介电材料:CERAMIC
制造商序列号:M
安装特点:SURFACE MOUNT
多层:Yes
负容差:20%
端子数量:2
最高工作温度:125 °C
最低工作温度:-55 °C
封装形状:RECTANGULAR PACKAGE
包装方法:BULK
正容差:20%
额定(直流)电压(URdc):50 V
尺寸代码:0805
表面贴装:YES
温度特性代码:X7R
温度系数:15% ppm/ °C
端子形状:WRAPAROUND
Base Number Matches:1
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