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W241024A

128K ´ 8 HIGH SPEED CMOS STATIC RAM

GENERAL DESCRIPTION

The W241024A is a high speed, low power CMOS static RAM organized as 131072 ´ 8 bits that

operates on a single 5-volt power supply. This device is manufactured using Winbond's high

performance CMOS technology.

FEATURES

· High speed access time: 12/15/20 nS (max.)

· Low power consumption:

- Active: 600 mW (typ.)

· All inputs and outputs directly TTL compatible

· Three-state outputs

· Available packages: 32-pin 300 mil SOJ, 400

mil SOJ, skinny DIP and standard type one

TSOP (8 mm ´ 20 mm), and small type one

TSOP (8 mm ´ 13.4 mm)

· Single +5V power supply

· Fully static operation

PIN CONFIGURATIONS

BLOCK DIAGRAM

V

DD

V

32

31

V

DD

NC

A16

A14

1

SS

A15

CS2

2

A0

.

30

3

4

29

28

27

26

25

24

23

22

21

20

19

18

17

A12

A7

A6

A5

A4

DECODER

CONTROL

WE

A13

A8

CORE

.

5

ARRAY

A16

6

A9

7

A11

8

CS2

CS1

OE

A3

A2

A1

A0

9

OE

I/O1

.

10

11

12

13

14

15

16

A10

DATA I/O

I/O8

WE

CS1

I/O 8

I/O 7

I/O 6

I/O5

I/O4

I/O 1

I/O 2

I/O 3

PIN DESCRIPTION

V

SS

SYMBOL

DESCRIPTION

Address Inputs

A0- A16

1

2

3

4

5

6

7

A11

A9

A8

32

31

30

29

28

27

26

25

24

23

22

21

20

19

18

17

OE

Data Inputs/Outputs

Chip Select Inputs

A10

I/O1- I/O8

CS1

I/O8

I/O7

I/O6

I/O5

I/O4

A13

WE

CS2

A15

CS1, CS2

WE

V

DD

8

9

Write Enable Input

Output Enable Input

Power Supply

Ground

32-pin

TSOP

NC

A16

A14

A12

A7

A6

A5

A4

V

SS

10

11

12

13

14

15

16

DQ3

DQ2

DQ1

A0

A1

A2

OE

VDD

VSS

NC

A3

No Connection

Publication Release Date: July 1998

Revision A9

- 1 -

W241024A

TRUTH TABLE

CS2

CS1

MODE

Not Selected

Output Disable

Read

VDD CURRENT

ISB, ISB1

IDD

I/O1-I/O8

OE

X

WE

X

H

X

L

X

L

High Z

X

H

L

H

Data Out

Data In

IDD

X

L

Write

IDD

DC CHARACTERISTICS

Absolute Maximum Ratings

PARAMETER

Supply Voltage to VSS Potential

Input/Output to VSS Potential

Allowable Power Dissipation

Storage Temperature

RATING

UNIT

V

-0.5 to +7.0

-0.5 to VDD +0.5

1.0

V

W

-65 to +150

0 to +70

°C

Operating Temperature

Note: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability of the

device.

Operating Characteristics

(VDD = 5V ±10%, VSS = 0V, TA = 0 to 70° C)

PARAMETER

Input Low Voltage

Input High Voltage

Input Leakage Current

SYM.

VIL

TEST CONDITIONS

MIN. TYP.

MAX.

+0.8

UNIT

V

-

-0.5

+2.2

-10

-

VIH

ILI

VDD +0.5

+10

V

VIN = VSS to VDD

mA

Output Leakage

Current

ILO

VI/O = VSS to VDD

-10

-

+10

mA

CS1 =VIH (min.) or CS2 = VIL (max.)

or OE = VIH (min.)

or WE = VIL (max.)

Output Low Voltage

Output High Voltage

Operating Power

Supply Current

VOL

VOH

IDD

IOL = +8.0 mA

IOH = -4.0 mA

-

2.4

-

0.4

-

V

12

200

mA

CS1 = VIL (max.), and

CS2 = VIH (min.)

I/O = 0 mA, Cycle = min.

Duty = 100%

15

20

-

200

170

30

mA

Standby Power

Supply Current

ISB

CS1 = VIH (min.),

or CS2 = VIL (max.) Cycle = min.

ISB1

-

10

mA

CS1 ³ VDD -0.2V or

CS2 £ 0.2V

Note: Typical characteristics are at VDD = 5V, TA = 25° C.

- 2 -

W241024A

CAPACITANCE

(VDD = 5V, TA = 25° C, f = 1 MHz)

PARAMETER

SYM.

CIN

CONDITIONS

VIN = 0V

MAX.

UNIT

pF

Input Capacitance

8

Input/Output Capacitance

CI/O

VOUT = 0V

10

pF

Note: These parameters are sampled but not 100% tested.

AC CHARACTERISTICS

AC Test Conditions

PARAMETER

Input Pulse Levels

CONDITIONS

0V to 3V

5 nS

Input Rise and Fall Times

Input and Output Timing Reference Level

Output Load

1.5V

CL = 30 pF, IOH/IOL = -4 mA/8 mA

AC Test Loads and Waveform

R1 480 ohm

5V

R1 480 ohm

5V

OUTPUT

5pF

OUTPUT

R2

255 ohm

Including

Jig and

Scope

R2

255 ohm

30 pF

Including

Jig and

Scope

)

T_CHZ2,T_OHZ,T_WHZ,T_OW

T_CHZ1,

(For T

T

_CLZ2,T_OLZ,

CLZ1,

3.0V

90%

10%

0V

5 nS

Publication Release Date: July 1998

Revision A9

- 3 -

W241024A

AC Characteristics, continued

(VDD = 5V ±10%, VSS = 0V, TA = 0 to 70° C)

Read Cycle

W241024A-12 W241024A-15 W241024A-20

MIN. MAX. MIN. MAX. MIN. MAX.

PARAMETER

SYM.

UNIT

Read Cycle Time

TRC

12

-

15

-

20

-

nS

Address Access Time

Chip Select Access Time

TAA

12

15

20

TACS1

-

CS1

CS2

TACS2

TAOE

-

12

6

-

15

7

-

20

10

-

nS

Output Enable to Output Valid

Chip Selection to Output in Low Z

TCLZ1*

3

-

3

-

3

CS1

CS2

TCLZ2*

TOLZ*

3

0

-

3

0

-

3

0

-

nS

Output Enable to Output in Low Z

Chip Deselection to Output in

TCHZ1*

6

7

10

CS1

CS2

High Z

TCHZ2*

TOHZ*

TOH

-

6

-

7

-

10

-

nS

Output Disable to Output in High Z

Output Hold from Address Change

3

* These parameters are sampled but not 100% tested.

Write Cycle

W241024A-12 W241024A-15 W241024A-20

MIN. MAX. MIN. MAX. MIN. MAX.

PARAMETER

SYM.

UNIT

Write Cycle Time

TWC

12

10

-

15

13

-

20

17

-

nS

Chip Selection to End of Write

CS1

TCW1

CS2

Address Valid to End of Write

Address Setup Time

TCW2

TAW

TAS

10

0

-

13

0

-

17

0

-

nS

Write Pulse Width

TWP

TWR1

10

0

10

0

12

0

Write Recovery Time

CS1, WE

CS2

Data Valid to End of Write

TWR2

TDW

0

7

0

-

0

9

0

-

0

10

0

-

nS

Data Hold from End of Write

Write to Output in High Z

TDH

-

TWHZ*

TOHZ*

TOW

7

-

8

-

10

-

Output Disable to Output in High Z

Output Active from End of Write

-

0

* These parameters are sampled but not 100% tested.

- 4 -

W241024A

TIMING WAVEFORMS

Read Cycle 1

(Address Controlled)

T

RC

Address

T

AA

TOH

D

OUT

Read Cycle 2

(Chip Select Controlled)

CS1

CS2

T

ACS1

CHZ1

T

ACS2

T

CHZ2

T

CLZ1

D

OUT

T

CLZ2

Read Cycle 3

(Output Enable Controlled)

T

RC

Address

T

AA

OE

CS1

CS2

T

OH

AOE

T

OLZ

ACS1

T

CHZ1

T

CLZ1

T

ACS2

T

OHZ

T

CLZ2

TCHZ2

D

OUT

Publication Release Date: July 1998

Revision A9

- 5 -

W241024A

Timing Waveforms, continued

Write Cycle 1

(OE Clock)

TWC

Address

OE

WR1

T

CW1

CS1

CS2

WE

T

CW2

T

AW

WR2

T

WP

T

AS

T

OHZ

(1, 4)

D

OUT

T

DW

T

DH

D

IN

Write Cycle 2

(OE = VIL Fixed)

T

WC

Address

CS1

T

WR1

CW1

T

CW2

CS2

WE

T

AW

T

WR2

TWP

T

OH

T

AS

(3)

(2)

T

WHZ (1, 4)

T

OW

D

OUT

T

DH

T

DW

D

IN

Notes:

1. During this period, I/O pins are in the output state, so input signals of opposite phase to the outputs should not be applied.

2. The data output from DOUT are the same as the data written to DIN during the write cycle.

3. Dout provides the read data for the next address.

4. Transition is measured ±500 mV from steady state with CL = 5 pF. This parameter is guaranteed but not 100% tested.

- 6 -

W241024A

ORDERING INFORMATION

PART NO.

ACCESS OPERATING

STANDBY

CURRENT

MAX. (mA)

PACKAGE

TIME

(nS)

CURRENT

MAX. (mA)

W241024AI-12

W241024AI-15

W241024AI-20

W241024AJ-12

W241024AJ-15

W241024AJ-20

W241024AK-12

W241024AK-15

W241024AK-20

W241024AQ-12

W241024AQ-15

W241024AQ-20

W241024AT-12

W241024AT-15

W241024AT-20

12

15

20

12

15

20

12

15

20

12

15

20

12

15

20

200

170

200

170

200

170

200

170

200

170

10

400 mil SOJ

300 mil SOJ

300 mil skinny DIP

Small type one TSOP

Standard type one TSOP

Notes:

1. Winbond reserves the right to make changes to its products without prior notice.

2. Purchasers are responsible for performing appropriate quality assurance testing on products intended for use in applications

where personal injury might occur as a consequence of product failure.

Publication Release Date: July 1998

- 7 -

Revision A9

W241024A

PACKAGE DIMENSIONS

32-pin P-DIP Skinny (300 mil)

Dimension in mm

Dimension in Inches

Symbol

A

Min. Nom. Max. Min. Nom. Max.

5.08

0.200

0.015

0.145

0.38

3.68

0.41

1.47

0.20

A

B

c

1

0.150 0.155

3.81

0.46

1.52

0.25

3.94

0.56

1.63

0.36

2

0.016 0.018

0.022

0.064

D

0.060

0.058

0.008

1

32

17

0.010 0.014

1.60

1.62

0.335

0.294

0.110

0.140

15

40.64 41.15

D

E

0.295

0.286

7.49

7.26

2.29

3.05

8.50

7.46

2.79

3.56

0.315

0.290

8.00

7.36

2.54

3.30

1

E

1

0.090 0.100

0.120 0.130

0

e₁

L

1

16

°

15

0

a

0.430

0.470 10.92

0.065

11.94

1.65

0.450

11.43

e

S

A

Notes:

E

S

1. Dimension D Max. & S include mold flash or

tie bar burrs.

2. Dimension E1 does not include interlead flash.

c

Base Plane

1

A

L

A²

3. Dimension D & E1 include mold mismatch and

are determined at the mold parting line.

4. Dimension B1 does not include dambar

protrusion/intrusion.

Mounting Plane

1

e

B ₁

B

e_A

5. Controlling dimension: Inches.

6. General appearance spec. should be based on

final visual inspection spec.

a

32-pin SOJ (300 mil)

Dimension in Inches

Dimension in mm

Symbol

17

32

Min.

__

Min. Nom.

Nom. Max.

Max.

__

0.140

A

3.556

__

0.020

0.095

0.026

0.016

0.008

0.815

0.295

0.044

0.247

0.325

0.508

2.413

0.660

0.406

0.203

A ¹

0.100

0.028

0.018

0.010

0.825

0.300

0.050

0.267

0.105

0.032

0.022

0.014

0.835

0.305

0.056

0.287

2.540

0.711

0.457

0.254

2.667

0.813

0.559

0.356

2

A

B

b

c

E

H

e

20.701 20.955 21.209

D

7.493

1.118

6.274

8.255

7.620

1.270

6.782

7.747

1.422

7.290

E

e

1

e

H

L

1

16

0.335

__

0.345

__

8.509

__

8.763

__

0.080

__

2.032

__

0.045

0.004

10

1.143

0.102

S

Y

__

0

__

°

0

°

10

q

D

c

A

2

A

L

e₁

B

b

e

S

A

1

q

Y

Seating Plane

- 8 -

W241024A

Package Dimensions, continued

32-pin SOJ (400 mil)

Dimension in mm

Min. Nom. Max.

Dimension in inches

Symbol

A

Min.

Nom. Max.

32

17

3.51

3.68

0.138 0.145 3.33

0.635

0.131

0.025

1

A

2

0.105 0.110 0.115

2.67

0.66

2.79

0.71

2.91

0.81

0.026 0.028

0.016 0.018

0.006 0.008

0.820

0.032

0.020

b

c

1

H _E

E

0.41

0.46

0.51

0.28

0.011 0.15 0.20

0.825 0.830

20.96

10.16

20.83

10.03

21.08

10.29

1.42

D

E

e

0.400

0.395

0.405

1

16

1.12

9.15

11.05

2.08

0.050 0.056

1.27

9.40

0.044

0.360

0.435

0.082

0.37

9.65

0.380

1

e

H

L

S

y

0.440 0.445

11.18 11.31

E

1.14

0.10

0.045

0.004

D

-5

2

6

2

6

-5

q

c

2

A

Notes:

A

y

L

1. Dimension D Max & S include mold flash

or tie bar burrs.

2. Dimension b does not include dambar

protrusion/intrusion.

3. Dimension D & E include mold mismatch

and are determined at the mold parting line.

b

b 1

s

e₁

e

1

A

Seating Plane

4. Controlling dimension: Inches

5. General appearance spec. should be based

on final visual inspection spec.

32-pin Standard Type One TSOP

H_D

D

Dimension in Inches

Min. Nom. Max.

Dimension in mm

Symbol

Min.

__

Max.

Nom.

__

A

1.20

0.15

1.05

0.23

0.047

c

__

0.002

0.037

0.006 0.05

A ¹

0.95

2

0.041

0.009

1.00

A

0.039

M

e

b

c

0.007 0.008

0.17 0.20

0.12 0.15

E

0.005 0.006

0.720 0.724

0.17

0.007

0.728

0.10(0.004)

D

E

18.30 18.40 18.50

b

0.311 0.315

0.780 0.787

7.90 8.00

8.10

0.319

19.80

__

20.00 20.20

0.795

__

H_D

e

__

0.020

0.50

0.016 0.020

0.40 0.50

0.60

__

0.024

__

L

__

1

L

0.031

0.80

A

__

0.10

5

0.000

0.004

5

0.00

Y

A2

1

3

1

3

q

L

1

A

Y

L1

Note:

Controlling dimension: Millimeter

Publication Release Date: July 1998

Revision A9

- 9 -

W241024A

Package Dimensions, continued

32-pin Small Type One TSOP

D

H

Dimension in Inches

Min. Nom. Max.

Dimension in mm

Symbol

Nom.

Min.

Max.

D

c

A

1.25

0.15

1.05

0.049

0.002

0.006

0.05

1

A

1

2

1.00

0.037 0.039 0.041 0.95

A

e

0.008 0.009 0.17 0.20 0.27

0.007

0.0056 0.0059 0.0062 0.14 0.15 0.16

b

c

E

D

E

0.461

0.311

0.520

0.469 11.70 11.80 11.90

0.319 7.90 8.00 8.10

0.536 13.20 13.40 13.60

0.50

0.465

0.315

b

0.528

H

e

D

0.020

L

0.012

0.027

0.000

0

0.028

0.50 0.70

0.30

0.675

0.00

L₁

2

A

0.004

5

0.10

Y

q

A

q

1

L

3

0

3

5

Y

1

L

Controlling dimension: Millimeters

- 10 -

W241024A

VERSION HISTORY

VERSION

DATE

Jul. 1998

PAGE

DESCRIPTION

Add small type one TSOP (8 mm ´ 13.4 mm) package

A9

1, 7, 10

Winbond Electronics (H.K.) Ltd.

Winbond Electronics North America Corp.

Winbond Memory Lab.

Winbond Microelectronics Corp.

Winbond Systems Lab.

Headquarters

No. 4, Creation Rd. III,

Science-Based Industrial Park,

Hsinchu, Taiwan

TEL: 886-3-5770066

FAX: 886-3-5792647

http://www.winbond.com.tw/

Voice & Fax-on-demand: 886-2-7197006

Rm. 803, World Trade Square, Tower II,

123 Hoi Bun Rd., Kwun Tong,

Kowloon, Hong Kong

TEL: 852-27513100

FAX: 852-27552064

2730 Orchard Parkway, San Jose,

CA 95134, U.S.A.

TEL: 1-408-9436666

FAX: 1-408-9436668

Taipei Office

11F, No. 115, Sec. 3, Min-Sheng East Rd.,

Taipei, Taiwan

TEL: 886-2-7190505

FAX: 886-2-7197502

Note: All data and specifications are subject to change without notice.

Publication Release Date: July 1998

Revision A9

- 11 -

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