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CoolRunner-II CPLD Family

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DS090 (v3.1) September 11, 2008

Product Specification

-

SSTL2_1,SSTL3_1, and HSTL_1 on 128

macrocell and denser devices

Hot pluggable

Features

•

Optimized for 1.8V systems

-

Industry’s fastest low power CPLD

Densities from 32 to 512 macrocells

•

PLA architecture

-

Wide package availability including fine pitch:

-

Superior pinout retention

100% product term routability across function block

Industry’s best 0.18 micron CMOS CPLD

-

Optimized architecture for effective logic synthesis

Multi-voltage I/O operation — 1.5V to 3.3V

Chip Scale Package (CSP) BGA, Fine Line BGA,

TQFP, PQFP, VQFP, and QFN packages

Pb-free available for all packages

Advanced system features

-

Fastest in system programming

1.8V ISP using IEEE 1532 (JTAG) interface

-

·

•

Design entry/verification using Xilinx and industry

standard CAE tools

-

On-The-Fly Reconfiguration (OTF)

IEEE1149.1 JTAG Boundary Scan Test

Optional Schmitt trigger input (per pin)

Multiple I/O banks on all devices

Free software support for all densities using Xilinx®

WebPACK™ tool

Industry leading nonvolatile 0.18 micron CMOS

process

Unsurpassed low power management

·

DataGATE external signal control

-

Flexible clocking modes

-

Guaranteed 1,000 program/erase cycles

Guaranteed 20 year data retention

·

Optional DualEDGE triggered registers

Clock divider (÷ 2,4,6,8,10,12,14,16)

CoolCLOCK

Family Overview

-

Global signal options with macrocell control

Xilinx CoolRunner™-II CPLDs deliver the high speed and

ease of use associated with the XC9500/XL/XV CPLD fam-

ily with the extremely low power versatility of the XPLA3

family in a single CPLD. This means that the exact same

parts can be used for high-speed data communications/

computing systems and leading edge portable products,

with the added benefit of In System Programming. Low

power consumption and high-speed operation are com-

bined into a single family that is easy to use and cost effec-

tive. Clocking techniques and other power saving features

extend the users’ power budget. The design features are

supported starting with Xilinx ISE® 4.1i WebPACK tool.

Additional details can be found in Further Reading,

page 14.

·

Multiple global clocks with phase selection per

macrocell

Multiple global output enables

Global set/reset

·

-

Abundant product term clocks, output enables and

set/resets

Efficient control term clocks, output enables and

set/resets for each macrocell and shared across

function blocks

Advanced design security

Open-drain output option for Wired-OR and LED

drive

Optional bus-hold, 3-state or weak pullup on select

I/O pins

Optional configurable grounds on unused I/Os

Mixed I/O voltages compatible with 1.5V, 1.8V,

2.5V, and 3.3V logic levels on all parts

-

Table 1 shows the macrocell capacity and key timing

parameters for the CoolRunner-II CPLD family.

-

Table 1: CoolRunner-II CPLD Family Parameters

XC2C32A

32

XC2C64A

64

XC2C128

128

XC2C256

256

XC2C384

384

XC2C512

512

Macrocells

Max I/O

33

64

100

184

240

270

T

F

(ns)

3.8

4.6

5.7

7.1

PD

SU

CO

1.9

2.0

2.4

2.9

2.6

3.7

3.9

4.2

4.5

5.8

(MHz)

323

263

244

256

217

179

SYSTEM1

All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.

DS090 (v3.1) September 11, 2008

www.xilinx.com

1

Product Specification

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CoolRunner-II CPLD Family

Table 2: CoolRunner-II CPLD DC Characteristics

XC2C32A XC2C64A

XC2C128

XC2C256

XC2C384

XC2C512

I

(μA), 0 MHz, 25°C (typical)

16

17

5

19

10

21

27

23

45

25

55

CC

(mA), 50 MHz, 70°C (max)

2.5

CC

1. I_CCis dynamic current.

Table 2 shows key DC characteristics for the CoolRunner-II

family.

in CoolRunner-II CPLDs generates minimal heat, allowing

the use of tiny packages during high-speed operation.

Table 3 shows the CoolRunner-II CPLD package offering

with corresponding I/O count. All packages are surface

mount, with over half of them being ball-grid technologies.

The ultra tiny packages permit maximum functional capacity

in the smallest possible area. The CMOS technology used

With the exception of the Pb-free QF packages, there are at

least two densities present in each package with three in the

VQ100 (100-pin 1.0mm QFP), TQ144 (144-pin 1.4mm

QFP), and FT256 (256-ball 1.0mm spacing FLBGA). The

FT256 is particularly important for slim dimensioned porta-

ble products with mid- to high-density logic requirements.

Table 3: CoolRunner-II CPLD Family Packages and I/O Count

XC2C32A

XC2C64A

XC2C128

XC2C256

XC2C384 XC2C512

(1)

QFG32

VQ44

21

33

-

33

37

45

64

-

(1)

VQG44

-

(1)

QFG48

CP56

-

33

-

(1)

CPG56

VQ100

-

80

100

-

80

106

118

173

184

-

(1)

VQG100

CP132

-

(1)

CPG132

TQ144

-

118

173

212

240

-

TQG144

PQ208

-

173

212

270

PQG208

FT256

-

(1)

FTG256

FG324

-

(1)

FGG324

Notes:

-

1. The letter "G" as the third character indicates a Pb-free package.

Table 4 details the distribution of advanced features across

the CoolRunner-II CPLD family. The family has uniform

basic features with advanced features included in densities

where they are most useful. For example, it is very unlikely

that four I/O banks are needed on 32 and 64 macrocell

parts, but very likely they are for 384 and 512 macrocell

parts. The I/O banks are groupings of I/O pins using any

one of a subset of compatible voltage standards that share

2

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DS090 (v3.1) September 11, 2008

Product Specification

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CoolRunner-II CPLD Family

the same V

level. (See Table 5 for a summary of

CCIO

CoolRunner-II CPLD I/O standards.)

Table 4: CoolRunner-II CPLD Family Features

XC2C32A XC2C64A XC2C128 XC2C256 XC2C384 XC2C512

IEEE 1532

I/O banks

✓

2

-

✓

2

-

✓

2

✓

2

✓

4

✓

4

Clock division

✓

DualEDGE

Registers

✓

DataGATE

LVTTL

-

✓

LVCMOS33, 25,

18, and 15

(1)

SSTL2_1

SSTL3_1

HSTL_1

-

✓

-

Configurable

ground

✓

Quadruple data

security

✓

Open drain outputs

Hot plugging

✓

Schmitt Inputs

1. LVCMOS15 requires the use of Schmitt-trigger inputs.

industry’s highest pinout retention, under very broad design

conditions. The architecture is explained in more detail with

the discussion of the underlying FBs, logic and intercon-

nect.

Architecture Description

CoolRunner-II CPLD is a highly uniform family of fast, low

power CPLDs. The underlying architecture is a traditional

CPLD architecture combining macrocells into Function

Blocks (FBs) interconnected with a global routing matrix,

the Xilinx Advanced Interconnect Matrix (AIM). The FBs use

a Programmable Logic Array (PLA) configuration which

allows all product terms to be routed and shared among any

of the macrocells of the FB. Design software can efficiently

synthesize and optimize logic that is subsequently fit to the

FBs and connected with the ability to utilize a very high per-

centage of device resources. Design changes are easily

and automatically managed by the software, which exploits

the 100% routability of the Programmable Logic Array within

each FB. This extremely robust building block delivers the

The design software automatically manages these device

resources so that users can express their designs using

completely generic constructs without knowledge of these

architectural details. More advanced users can take advan-

tage of these details to more thoroughly understand the

software’s choices and direct its results.

Figure 1 shows the high-level architecture whereby FBs

attach to pins and interconnect to each other within the

internal interconnect matrix. Each FB contains 16 macro-

cells. The BSC path is the JTAG Boundary Scan Control

DS090 (v3.1) September 11, 2008

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3

Product Specification

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CoolRunner-II CPLD Family

path. The BSC and ISP block has the JTAG controller and

In-System Programming Circuits.

BSC Path

Clock and Control Signals

Function

Block 1

Function

Block n

MC1

MC2

MC1

MC2

I/O Pin

16 FB

16

PLA

AIM

40

MC16

I/O Pin

JTAG

I/O Pin

Direct Inputs

16

BSC and ISP

DS090_01_121201

Figure 1: CoolRunner-II CPLD Architecture

flexible, and very robust when compared to fixed or cas-

caded product term FBs.

Function Block

The CoolRunner-II CPLD FBs contain 16 macrocells, with

40 entry sites for signals to arrive for logic creation and con-

nection. The internal logic engine is a 56 product term PLA.

All FBs, regardless of the number contained in the device,

are identical. For a high-level view of the FB, see Figure 2.

Classic CPLDs typically have a few product terms available

for a high-speed path to a given macrocell. They rely on

capturing unused p-terms from neighboring macrocells to

expand their product term tally, when needed. The result of

this architecture is a variable timing model and the possibil-

ity of stranding unusable logic within the FB.

MC1

MC2

The PLA is different — and better. First, any product term

can be attached to any OR gate inside the FB macrocell(s).

Second, any logic function can have as many p-terms as

needed attached to it within the FB, to an upper limit of 56.

Third, product terms can be re-used at multiple macrocell

OR functions so that within a FB, a particular logical product

need only be created once, but can be re-used up to 16

times within the FB. Naturally, this plays well with the fitting

software, which identifies product terms that can be shared.

16

40

PLA

Out

To AIM

The software places as many of those functions as it can

into FBs, so it happens for free. There is no need to force

macrocell functions to be adjacent or any other restriction

save residing in the same FB, which is handled by the soft-

ware. Functions need not share a common clock, common

set/reset, or common output enable to take full advantage of

the PLA. Also, every product term arrives with the same

time delay incurred. There are no cascade time adders for

putting more product terms in the FB. When the FB product

term budget is reached, there is a small interconnect timing

penalty to route signals to another FB to continue creating

logic. Xilinx design software handles all this automatically.

MC16

3

Global Global

Set/Reset Clocks

DS090_02_101001

Figure 2: CoolRunner-II CPLD Function Block

At the high level, the product terms (p-terms) reside in a

programmable logic array (PLA). This structure is extremely

4

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DS090 (v3.1) September 11, 2008

Product Specification

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CoolRunner-II CPLD Family

resets, and output enables. Each macrocell flip-flop is con-

figurable for either single edge or DualEDGE clocking, pro-

viding either double data rate capability or the ability to

distribute a slower clock (thereby saving power). For single

edge clocking or latching, either clock polarity can be

selected per macrocell. CoolRunner-II CPLD macrocell

details are shown in Figure 3. Note that in Figure 4, stan-

dard logic symbols are used except the trapezoidal multi-

plexers have input selection from statically programmed

configuration select lines (not shown). Xilinx application

note XAPP376 gives a detailed explanation of how logic is

created in the CoolRunner-II CPLD family.

Macrocell

The CoolRunner-II CPLD macrocell is extremely efficient

and streamlined for logic creation. Users can develop sum

of product (SOP) logic expressions that comprise up to 40

inputs and span 56 product terms within a single function

block. The macrocell can further combine the SOP expres-

sion into an XOR gate with another single p-term expres-

sion. The resulting logic expression’s polarity is also

selectable. As well, the logic function can be pure combina-

torial or registered, with the storage element operating

selectably as a D or T flip-flop, or transparent latch. Avail-

able at each macrocell are independent selections of global,

function block level or local p-term derived clocks, sets,

From AIM

40

49 P-terms

To PTA, PTB, PTC of

other macrocells

Direct Input

from

I/O Block

4 P-terms

Feedback

to AIM

CTC, CTR,

CTS, CTE

PTA

PTB

PTC

PTA

CTS

GSR

GND

V

CC

GND

To I/O Block

S

D/T

CE

Q

FIF

Latch

PLA OR Term

PTC

DualEDGE

CK

GCK0

GCK1

GCK2

R

CTC

PTC

PTA

CTR

GSR

GND

DS090_03_121201

Figure 3: CoolRunner-II CPLD Macrocell

When configured as a D-type flip-flop, each macrocell has

an optional clock enable signal permitting state hold while a

clock runs freely. Note that Control Terms (CT) are available

to be shared for key functions within the FB, and are gener-

ally used whenever the exact same logic function would be

repeatedly created at multiple macrocells. The CT product

terms are available for FB clocking (CTC), FB asynchro-

nous set (CTS), FB asynchronous reset (CTR), and FB out-

put enable (CTE).

tional functionality is retained for use as a buried logic node

if needed. F is the maximum clock frequency to which

a T flip-flop can reliably toggle.

Toggle

Advanced Interconnect Matrix (AIM)

The Advanced Interconnect Matrix is a highly connected

low power rapid switch. The AIM is directed by the software

to deliver up to a set of 40 signals to each FB for the cre-

ation of logic. Results from all FB macrocells, as well as, all

pin inputs circulate back through the AIM for additional con-

nection available to all other FBs as dictated by the design

Any macrocell flip-flop can be configured as an input regis-

ter or latch, which takes in the signal from the macrocell’s

I/O pin, and directly drives the AIM. The macrocell combina-

DS090 (v3.1) September 11, 2008

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5

Product Specification

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CoolRunner-II CPLD Family

software. The AIM minimizes both propagation delay and

power as it makes attachments to the various FBs.

also available. Table 5 summarizes various supported volt-

age standards associated with specific part capacities. All

inputs and disabled outputs are voltage tolerant up to 3.3V.

I/O Block

The CoolRunner-II family supports SSTL2-1, SSTL3-1 and

HSTL-1 high-speed I/O standards in the 128-macrocell and

larger devices. Figure 4 details the I/O pin, where it is noted

that the inputs requiring comparison to an external refer-

ence voltage are available. These I/O standards all require

I/O blocks are primarily transceivers. However, each I/O is

either automatically compliant with standard voltage ranges

or can be programmed to become so. See XAPP382 for

detailed information on CoolRunner-II I/Os.

V

pins for proper operation. The CoolRunner-II CPLD

REF

In addition to voltage levels, each input can selectively

arrive through Schmitt-trigger inputs. This adds a small time

delay, but substantially reduces noise on that input pin.

Approximately 500 mV of hysteresis is added when

Schmitt-trigger inputs are selected. All LVCMOS inputs can

have hysteresis input. Hysteresis also allows easy genera-

tion of external clock circuits. The Schmitt-trigger path is

best seen in Figure 4. See Table 5 for Schmitt-trigger com-

patibility with I/O standards.

allows any I/O pin to act as a V

layout engineer extra freedom when laying out the pins.

However, if V pin placement is not done properly, addi-

pin, granting the board

REF

tional V

pins might be required, resulting in a loss of

REF

potential I/O pins or board re-work. See XAPP399 for

details regarding V pins and their placement.

REF

V

has pin-range requirements that must be observed.

REF

The Xilinx software aids designers in remaining within the

proper pin range.

Outputs can be directly driven, 3-stated or open-drain con-

figured. A choice of slow or fast slew rate output signal is

Available on 128 Macrocell Devices and Larger

To AIM

Global termination

Pullup/Bus-Hold

V

REF

Hysteresis

To Macrocell

Direct Input

Enabled

CTE

PTB

GTS[0:3]

CGND

V

CCIO

4

Open Drain

Disabled

From Macrocell

DS090_04_121201

Figure 4: CoolRunner-II CPLD I/O Block Diagram

Table 5 summarizes the single ended I/O standard support

and shows which standards require V values and board

REF

termination. V

detail is given in specific data sheets.

REF

Table 5: CoolRunner-II CPLD I/O Standard Summary

IOSTANDARD

Board Termination Voltage

(V

Attribute

V

Input V

N/A

)

TT

Schmitt-trigger Support

Optional

CCIO

REF

LVTTL

3.3

N/A

0.75

1.25

1.5

LVCMOS33

LVCMOS25

LVCMOS18

LVCMOS15

HSTL_1

3.3

2.5

1.8

1.5

2.5

3.3

N/A

Optional

N/A

Optional

N/A

Optional

N/A

Not optional

0.75

1.25

1.5

SSTL2_1

SSTL3_1

6

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DS090 (v3.1) September 11, 2008

Product Specification

R

CoolRunner-II CPLD Family

DataGATE, designers can approach zero power, should

they choose to, in their designs.

Output Banking

CPLDs are widely used as voltage interface translators. To

that end, the output pins are grouped in large banks. The

XC2C32A, XC2C64A, XC2C128 and XC2C256 devices

support two output banks. With two, the outputs switch to

one of two selected output voltage levels, unless both banks

are set to the same voltage. The larger parts (384 and 512

macrocell) support four output banks split evenly. They can

support groupings of one, two, three, or four separate output

voltage levels. This kind of flexibility permits easy interfacing

to 3.3V, 2.5V, 1.8V, and 1.5V in a single part.

I

CC

0

Frequency

DataGATE

DS090_05_101001

Low power is the hallmark of CMOS technology. Other

CPLD families use a sense amplifier approach to creating

product terms, which always has a residual current compo-

nent being drawn. This residual current can be several hun-

dred milliamps, making them unusable in portable systems.

CoolRunner-II CPLDs use standard CMOS methods to cre-

ate the CPLD architecture and deliver the corresponding

low current consumption, without doing any special tricks.

However, sometimes designers want to reduce their system

current even more by selectively disabling circuitry not

being used.

Figure 5: CMOS I vs. Switching Frequency Curve

CC

Figure 6 shows how DataGATE basically works. One I/O pin

drives the DataGATE Assertion Rail. It can have any

desired logic function on it. It can be as simple as mapping

an input pin to the DataGATE function or as complex as a

counter or state machine output driving the DataGATE I/O

pin through a macrocell. When the DataGATE rail is

asserted High, any pass transistor switch attached to it is

blocked. Each pin has the ability to attach to the AIM

through a DataGATE pass transistor, and thus be blocked. A

latch automatically captures the state of the pin when it

becomes blocked. The DataGATE Assertion Rail threads

throughout all possible I/Os, so each can participate if cho-

sen. Note that one macrocell is singled out to drive the rail,

and that macrocell is exposed to the outside world through a

pin, for inspection. If DataGATE is not needed, this pin is an

ordinary I/O.

The patented DataGATE technology to permits a straight-

forward approach to additional power reduction. Each I/O

pin has a series switch that can block the arrival of free run-

ning signals that are not of interest. Signals that serve no

use might increase power consumption, and can be dis-

abled. Users are free to do their design, then choose sec-

tions to participate in the DataGATE function. DataGATE is

a logic function that drives an assertion rail threaded

through the medium and high-density CoolRunner-II CPLD

parts. Designers can select inputs to be blocked under the

control of the DataGATE function, effectively blocking con-

trolled switching signals so they do not drive internal chip

capacitances. Output signals that do not switch are held by

the bus hold feature. Any set of input pins can be chosen to

participate in the DataGATE function. Figure 5 shows the

There are two attributes associated with the DataGATE fea-

ture in CoolRunner-II CPLDs. The first attribute specifies if

an input is affected by DataGATE and the second desig-

nates the DataGATE control signal.

The DataGATE feature is selectable on a per pin basis.

Each input pin that uses DataGATE must be assigned a

DATA_GATE attribute.

familiar CMOS I versus switching frequency graph. With

The DataGATE assertion rail can be driven from either an

I/O pin or internal logic. The DataGATE enable signal is a

dedicated DGE/I/O pin for each package in CoolRunner-II

CPLDs. Upon implementation, the software recognizes a

design using DataGATE and automatically assigns this I/O

pin to the DataGATE enable control function, DGE. Inter-

CC

DS090 (v3.1) September 11, 2008

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7

Product Specification

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CoolRunner-II CPLD Family

nally generated DataGATE control logic can be assigned to

this I/O pin with the BUFG=DATA_GATE attribute.

DataGATE Assertion Rail

MC1

MC2

MC1

MC2

Latch

To AIM

PLA

Latch

To AIM

MC16

AIM

MC1

MC2

MC1

MC2

PLA

Latch

To AIM

MC16

DS090_06_111201

Figure 6: DataGATE Architecture (output drivers not shown)

purpose I/Os if they are not needed as global signals. The

DataGATE assertion rail is also a global signal.

Global Signals

Global signals, clocks (GCK), sets/resets (GSR), and output

enables (GTS), are designed to strongly resemble each

other. This approach enables design software to make the

best utilization of their capabilities. Each global capability is

supplemented by a corresponding product term version.

Figure 7 shows the common structure of the global signal

trees. The pin input is buffered, then drives multiple internal

global signal traces to deliver low skew and reduce loading

delays. GCK, GSR, and GTS can also be used as general

DS090_07_101001

Figure 7: Global Clocks (GCK), Sets/Resets (GSR), and

Output Enables (GTS)

8

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DS090 (v3.1) September 11, 2008

Product Specification

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CoolRunner-II CPLD Family

DualEDGE

Additional Clock Options: Division,

DualEDGE, and CoolCLOCK

Each macrocell has the ability to double its input clock

switching frequency. Figure 9 shows the macrocell flip-flop

with the DualEDGE option (doubled clock) at each macro-

cell. The source to double can be a control term clock, a

product term clock or one of the available global clocks. The

ability to switch on both clock edges, also known as dual

edge triggered (DET), is vital for a number of synchronous

memory interface applications as well as certain double

data rate I/O applications.

Clock Divider

A

clock divider circuit has been included in the

CoolRunner-II CPLD architecture to divide one externally

supplied global clock by standard values. The allowable val-

ues for the division are 2, 4, 6, 8, 10, 12, 14, and 16 (see

Figure 8). This capability is supplied on the GCK2 pin. The

resulting clock produced has a 50% duty cycle for all possi-

ble divisions. The output of the clock divider is on global

routing. If the clock divider is used, the undivided clock is

available internally. If the undivided clock is required inter-

nally it is input through a separate clock pin.

CoolRunner-II CPLD DET registers can be used for logic

functions that include shift registers, counters, comparators,

and state machines. Designers must evaluate the desired

performance of the CPLD logic to determine use of DET

registers.

The clock divider circuit encompasses a synchronous reset

(CDRST) to guarantee no spurious clocks can carry

through on to the global clock nets. When the CDRST signal

is asserted, the clock divider output is disabled after the cur-

rent cycle. When the CDRST signal is deasserted the clock

divider output becomes active upon the first edge of GCK2.

The CDRST pin functions as a reset pin regardless of which

CLK_DIV primitive is used. If a clock divider is used in the

design, the CDRST pin is reserved and if it is driven High

the clock divider is reset. If a reset port of a clock divider is

not used, it is tied Low on the board. The clock divider circuit

includes an active High synchronous reset, referred to as

CDRST.

The DET register can be inferred in any ABEL, HDL, or

schematic design. A designer can infer a single-edge trig-

gered (SET) register in any HDL design. The DET register is

available with all macrocells in all devices of the

CoolRunner-II family.

CoolCLOCK

In addition to the DualEDGE flip-flop, power savings can

occur by combining the clock division circuitry with the

DualEDGE circuitry. This capability is called CoolCLOCK

and is designed to reduce clocking power within the CPLD.

Because the clock net can be an appreciable power drain,

the clock power can be reduced by driving the net at half fre-

quency, then doubling the clock rate using DualEDGE trig-

gering at the macrocells. Figure 10 shows how CoolCLOCK

is created by internal clock cascading with the divider and

DualEDGE flip-flop working together.

The CoolRunner-II CPLD clock divider includes a built-in

delay circuit. With the delay feature enabled, the output of

the clock divider is delayed for one full count cycle. When

used, the clock divider does not output a rising clock edge

until after the divider reaches the delay value. The delay fea-

ture is either enabled or disabled upon configuration.

GCK2 is the only clock network that can be divided, the

CoolCLOCK feature is only available on GCK2. The Cool-

CLOCK feature can be implemented by assigning an

attribute to an input clock. The CoolCLOCK attribute

replaces the need to instantiate the clock divider and infer

DET registers. The CoolCLOCK feature is available on

CoolRunner-II 128 macrocell devices and larger. See

XAPP378 for more detail.

Xilinx Synthesis Technology (XST) allows a clock divider

component to be instantiated directly in the HDL source

code. See XAPP378 for instantiation examples in VHDL,

Verilog, and ABEL.

÷2

÷4

÷6

÷8

GCK2

Clock

In

÷10

÷12

÷14

÷16

CDRST

DS090_08_121201

Figure 8: Clock Division Circuitry for GCK2

DS090 (v3.1) September 11, 2008

Product Specification

www.xilinx.com

9

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CoolRunner-II CPLD Family

D/T

CE

Q

FIF

Latch

PTC

✓

DualEDGE

CK

GCK0

GCK1

GCK2

CLK_CT

PTC

DS090_09_121201

Figure 9: Macrocell Clock Chain with DualEDGE Option Shown

D/T

CE

Q

FIF

Latch

✓

PTC

DualEDGE

CK

GCK0

GCK1

GCK2

CTC

PTC

÷2

÷4

÷6

÷8

GCK2

Clock

In

÷10

÷12

÷14

÷16

Synch Rst

Synch Reset

Figure 10: CoolCLOCK Created by Cascading Clock Divider and DualEDGE Option

eliminating any electrical or visual detection of configuration

patterns. These security bits can be reset only by erasing

the entire device. See WP170 for more detail.

Design Security

Designs can be secured during programming to prevent

either accidental overwriting or pattern theft via readback.

Four independent levels of security are provided on-chip,

10

www.xilinx.com

DS090 (v3.1) September 11, 2008

Product Specification

R

CoolRunner-II CPLD Family

specific part, and knows the specific delay values for a given

speed grade. Equations for the higher level timing values

Timing Model

Figure 11 shows the CoolRunner-II CPLD timing model. It

represents one aspect of the overall architecture from a tim-

ing viewpoint. Each little block is a time delay that a signal

incurs if the signal passes through such a resource. Timing

reports are created by tallying the incremental signal delays

as signals progress within the CPLD. Software creates the

timing reports after a design has been mapped onto the

(i.e., T and F

) are available. Table 6 summarizes

PD

SYSTEM

the individual parameters and provides a brief definition of

their associated functions. Xilinx application note XAPP375

details the CoolRunner-II CPLD family timing with several

examples.

T_F

T_LOGI2

T_PDI

T_IN

T_LOGI1

D/T

T

COI

T

SUI

HI

T_SLEW

T_HYS

T

ECSU

T_DIN

T_GCK

T_GSR

T_GTS

T_OUT

T

ECHO

T

T_CT

CE

S/R

AOI

T_EN

T_OEM

XAPP375_03_010303

Figure 11: CoolRunner-II CPLD Timing Model

Note: Always refer to the timing report in ISE Software for accurate timing values for paths.

Table 6: Timing Parameter Definitions

Table 6: Timing Parameter Definitions (Continued)

Symbol

Parameter

Symbol

Parameter

Buffer Delays

Macrocell Delays

T

Input Buffer Delay

T

Macrocell input to output valid

lN

PDI

Direct data register input delay

Global clock (GCK) buffer delay

Global set/reset (GSR) buffer delay

Global output enable (GTS) buffer delay

Output buffer delay

Macro register setup before clock

Macro register hold after clock

DIN

SUI

GCK

GSR

GTS

OUT

EN

HI

Macro register enable clock setup time

Macro register enable clock hold time

Macro register clock to output valid

Macro register set/reset to output valid

Hysteresis selection delay adder

ECSU

ECHO

COI

Output buffer enable/disable delay

Output buffer slew rate control delay

T

AOI

T

SLEW

HYS

P-term Delays

Feedback Delays

T

Control Term delay (single PT or FB-CT)

Single P-term logic delay

T

Feedback delay

CT

F

Macrocell to Global OE delay

LOGI1

LOGI2

OEM

Multiple P-term logic delay adder

DS090 (v3.1) September 11, 2008

www.xilinx.com

11

Product Specification

R

CoolRunner-II CPLD Family

as well. The internal controllers can operate as fast as

66 MHz.

Programming

The programming data sequence is delivered to the device

using either Xilinx iMPACT software and a Xilinx download

Table 7: JTAG Instructions

cable,

a

third-party JTAG development system,

a

Code

Instruction

Description

JTAG-compatible board tester, or a simple microprocessor

interface that emulates the JTAG instruction sequence. The

iMPACT software also outputs serial vector format (SVF)

files for use with any tools that accept SVF format, including

automatic test equipment. See CoolRunner-II CPLD

Application Notes for more information on how to program.

00000000

EXTEST

Force boundary scan data onto

outputs

00000011 PRELOAD Latch macrocell data into

boundary scan cells

11111111

00000010

00000001

BYPASS

INTEST

IDCODE

Insert bypass register between

TDI and TDO

In System Programming

All CoolRunner-II CPLD parts are 1.8V in system program-

mable. This means they derive their programming voltage

and currents from the 1.8V V

pins on the part. The V

Force boundary scan data onto

inputs and feedbacks

(internal supply voltage)

pins do not participate in this

Read IDCODE

CC

CCIO

11111101 USERCODE Read USERCODE

operation, as they might assume another voltage ranging as

high as 3.3V down to 1.5V (however, all V

, V

,

11111100

HIGHZ

Force output into high

impedance state

CCIO

CCINT

V

, and GND pins must be connected for the device to

CCAUX

be programmed, and operate correctly). A 1.8V V

is

CC

11111010

CLAMP

Latch present output state

required to properly operate the internal state machines and

charge pumps that reside within the CPLD to do the nonvol-

atile programming operations. I/O pins are not in user mode

during JTAG programming; they are held in 3-state with a

weak pullup. The JTAG interface buffers are powered by a

Power-Up Characteristics

CoolRunner-II CPLD parts must operate under the

demands of both the high-speed and the portable market

places; therefore, they must support hot plugging for the

high-speed world and tolerate most any power sequence to

its various voltage pins. They must also not draw excessive

current during power-up initialization. To those ends, the

general behavior is summarized as follows:

dedicated power pin, V

, which is independent of all

CCAUX

other supply pins. V

must be connected. Xilinx soft-

CCAUX

ware is provided to deliver the bitstream to the CPLD and

drive the appropriate IEEE 1532 protocol. To that end, there

is a set of IEEE 1532 commands that are supported in the

CoolRunner-II CPLD parts. Programming times are less

than one second for 32 to 256 macrocell parts. Program-

ming times are less than four seconds for 384 and 512 mac-

rocell parts. Programming of CoolRunner-II CPLDs is only

guaranteed when operating in the commercial temperature

and voltage ranges as defined in the device-specific data

sheets.

1. I/O pins are disabled until the end of power-up.

2. As supply rises, configuration bits transfer from

nonvolatile memory to SRAM cells.

3. As power up completes, the outputs become as

configured (input, output, or I/O).

4. For specific configuration times and power up

requirements, see XAPP389.

On-The-Fly Reconfiguration (OTF)

CoolRunner-II CPLD I/O pins are well behaved under all

operating conditions. During power-up, CoolRunner-II

devices employ internal circuitry which keeps the devices in

The Xilinx ISE 5.2i tool supports OTF for CoolRunner-II

CPLDs. This permits programming a new nonvolatile pat-

tern into the part while another pattern is currently in use.

OTF has the same voltage and temperature specifications

as system programming. During pattern transition I/O pins

the quiescent state until the V

supply voltage is at a

CCINT

safe level (approximately 1.3V). In the quiescent state,

JTAG pins are disabled, and all device outputs are disabled

with the pins weakly pulled High, as shown in Table 8. When

the supply voltage reaches a safe level, all user registers

become initialized, and the device is immediately available

for operation, as shown in Figure 12. Best results are

are in high impedance with a weak pullup to V

. Transi-

CCIO

tion time typically lasts between 50 and 300 μs, depending

on density. See XAPP388 for more information.

JTAG Instructions

Table 7 shows the commands available to users. These

same commands can be used by third party ATE products,

obtained with a smooth V rise in less than 4 ms. Final

CC

V

value should occur within 1 second.

CC

If the device is in the erased state (before any user pattern

is programmed), the device outputs remain disabled with a

weak pull-up. The JTAG pins are enabled to allow the device

12

www.xilinx.com

DS090 (v3.1) September 11, 2008

Product Specification

R

CoolRunner-II CPLD Family

to be programmed at any time. All devices are shipped in

the erased state from the factory.

V

CCINT

Applying power to a blank part might result in a higher cur-

rent flow as the part initializes. This behavior is normal and

might persist for approximately 2 seconds, depending on

the power supply ramp.

1.3V

3.8 V

(Typ)

If the device is programmed, the device inputs and outputs

take on their configured states for normal operation. The

JTAG pins are enabled to allow device erasure or bound-

ary-scan tests at any time.

0V

No

Power

Quiescent

State

Quiescent

State

No

Power

User Operation

Initialization Transition of User Array

x382_10

Figure 12: Device Behavior During Power Up

Table 8: I/O Power-Up Characteristics

Device Circuitry

IOB Bus-Hold/Weak Pullup

Device Outputs

Quiescent State

Weak Pull-up

Disabled

Erased Device Operation

Valid User Operation

Bus-Hold/Weak Pullup

As Configured

Weak Pull-up

Disabled

Enabled

Device Inputs and Clocks

Function Block

Disabled

As Configured

Disabled

As Configured

JTAG Controller

Disabled

Enabled

and the CoolRunner-II CPLD will not be damaged. For best

results, Xilinx recommends that V be applied before

I/O Banking

CoolRunner-II CPLD XC2C32A and XC2C64A macrocell

parts support two V rails that can range from 3.3V

down to 1.5V operation. Two V

the 128 and 256 macrocell parts where outputs on each rail

can independently range from 3.3V down to 1.5V operation.

CCINT

V

To ensure that the internal logic is correct before the

CCIO

I/Os are active. CoolRunner-II CPLDs can reside on boards

where the board is inserted into a “live” connector (hot

plugged) and the parts will be well-behaved as if powering

up in a standard way.

rails are supported on

CCIO

Four V

rails are supported on the 384 and 512 macro-

CCIO

cell parts. Any of the V

rails can assume any one of the

CCIO

Development System Support

V

values of 1.5V, 1.8V, 2.5V, or 3.3V. Designers should

CCIO

Xilinx CoolRunner-II CPLDs are supported by all configura-

tions of Xilinx standard release development software as

well as the freely available ISE WebPACK software avail-

able from www.xilinx.com. Third party development tools

include synthesis tools from Cadence, Exemplar, Mentor

Graphics, Synplicity, and Synopsys.

assign input and output voltages to a bank with V

the voltage range of that input or output voltage. The V

(internal supply voltage) for a CoolRunner-II CPLD must be

maintained within 1.8V 5% for correct speed operation and

proper in system programming.

set at

CCIO

CC

Mixed Voltage, Power Sequencing, and

Hot Plugging

As mentioned in I/O Banking, CoolRunner-II CPLD parts

support mixed voltage I/O signals. It is important to assign

signals to an I/O bank with the appropriate I/O voltage. Driv-

ing a high voltage into a low voltage bank can result in neg-

ative current flow through the power supply pins. The power

ATE Support

Third party ATE development support is available for both

programming and board/chip level testing. Vendors provid-

ing this support include Agilent, GenRad, and Teradyne.

Other third party providers are expected to deliver solutions

in the future.

applied to the V

and V

pins can occur in any order

CCIO

CC

DS090 (v3.1) September 11, 2008

www.xilinx.com

13

Product Specification

R

CoolRunner-II CPLD Family

Absolute Maximum Ratings

(1)

Symbol

Parameter

Supply voltage relative to GND

Min.

–0.5

0

Max.

2.0

4.0

70

Unit

V

(2)

V

CC

(3)

V

Input voltage relative to GND

Ambient Temperature (C-grade)

Ambient Temperature (I-grade)

Maximum junction temperature

Storage temperature

V

I

T

°C

A

–40

–65

85

(4)

T

150

J

T

STR

Notes:

1. Stresses above those listed might cause malfunction or permanent damage to the device. This is a stress rating only. Functional

operation at these or any other condition above those indicated in the operational and programming specification is not implied.

2. The chip supply voltage should rise monotonically.

3. Maximum DC undershoot below GND must be limited to either 0.5V or 10 mA, whichever is easier to achieve. During transitions, the

device pins might undershoot to –2.0V or overshoot to 4.5 V, provided this overshoot or undershoot lasts less than 10 ns and with the

forcing current being limited to 200 mA. The I/O voltage can never exceed 4.0V.

4. For soldering guidelines and thermal considerations, see the Device Packaging information on the Xilinx website. For Pb-free

packages, see XAPP427.

Quality and Reliability Parameters

Symbol

Parameter

Min

20

Max

Units

Years

Cycles

Volts

T

Data retention

-

DR

N

Program/erase cycles (Endurance)

Electrostatic discharge(1)

1,000

2,000

PE

V

ESD

Notes:

1. ESD is measured to 2000V using the human body model. Pins exposed to this limit can incur additional leakage current to

a maximum of 10 μA when driven to 3.9V.

Warranty Disclaimer

THESE PRODUCTS ARE SUBJECT TO THE TERMS OF THE XILINX LIMITED WARRANTY WHICH CAN BE VIEWED

AT http://www.xilinx.com/warranty.htm. THIS LIMITED WARRANTY DOES NOT EXTEND TO ANY USE OF THE

PRODUCTS IN AN APPLICATION OR ENVIRONMENT THAT IS NOT WITHIN THE SPECIFICATIONS STATED ON THE

THEN-CURRENT XILINX DATA SHEET FOR THE PRODUCTS. PRODUCTS ARE NOT DESIGNED TO BE FAIL-SAFE

AND ARE NOT WARRANTED FOR USE IN APPLICATIONS THAT POSE A RISK OF PHYSICAL HARM OR LOSS OF

LIFE. USE OF PRODUCTS IN SUCH APPLICATIONS IS FULLY AT THE RISK OF CUSTOMER SUBJECT TO

APPLICABLE LAWS AND REGULATIONS.

http://www.xilinx.com/support/documenta-

tion/application_notes/xapp317.pdf

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